CN111922764A

CN111922764A - Depth-controlled milling compensation depth detection mechanism and circuit board depth-controlled milling device

Info

Publication number: CN111922764A
Application number: CN202010999176.8A
Authority: CN
Inventors: 黄齐齐; 孟凡辉
Original assignee: Vega CNC Technology Suzhou Co Ltd
Current assignee: Suzhou Vega Technology Co Ltd
Priority date: 2020-09-22
Filing date: 2020-09-22
Publication date: 2020-11-13
Anticipated expiration: 2040-09-22
Also published as: CN111922764B

Abstract

The invention discloses a depth control milling compensation depth detection mechanism and a circuit board depth control milling device. The depth control milling compensation depth detection mechanism comprises a linear driving piece, a length meter mounting piece, a presser foot mechanism and a spring, wherein the linear driving piece can drive the length meter mounting piece to do linear reciprocating motion, and the length meter mounting piece comprises an abutting part; the length meter is arranged on the length meter mounting piece, the presser foot mechanism is in sliding fit with the length meter mounting piece and is arranged opposite to the abutting part, and the presser foot mechanism is provided with a channel; the spring is located between butt portion and the presser foot mechanism, and the one end butt portion of spring, other end connection or butt presser foot mechanism, and butt portion, spring and passageway are worn to locate in proper order by the probe end of length meter, and the probe terminal surface of length meter contracts the passageway and predetermines the distance, and the straight reciprocating motion direction of the flexible direction of spring, passageway axis direction and length meter installed part is parallel. The invention can adjust the pressure foot force through the spring to be suitable for soft boards and hard boards, and improve the detection precision of depth control milling compensation depth.

Description

Depth-controlled milling compensation depth detection mechanism and circuit board depth-controlled milling device

Technical Field

The invention relates to the field of circuit board processing equipment, in particular to a depth control milling compensation depth detection mechanism and a circuit board depth control milling device.

Background

Currently, 5G (fifth generation mobile communication technology) is leading to the trend of everything interconnection, and 5G communication will surpass two major application markets of current intelligent terminals and automotive electronics in three to five years in the future, becoming the first engine driving the growth of circuit board industry. However, 5G also places more stringent manufacturing process requirements on the manufacture of circuit boards. A typical circuit board production process is: blanking → inner layer making → pressing → drilling → copper plating → outer layer making → solder mask printing → character printing → surface treatment → shape processing. Because some products need to install part of components in the circuit board, in the appearance processing process of the circuit boards, the circuit boards need to be subjected to groove routing, namely depth control milling processing, and the circuit board depth control milling refers to cutting required patterns according to the processing program of engineering design through a routing tool.

The circuit board depth control milling processing has very high precision requirements on circuit board depth control milling equipment, wherein the key is the detection of depth control milling compensation depth, the precision of a detection mechanism is required to be ensured, and the detection precision is also ensured to be applicable to different circuit boards, particularly flexible circuit boards. When depth control milling compensation depth measurement is carried out, if the pressure of the presser foot is overlarge, the circuit board deforms; if the pressure of the pressure foot is too small, the warping deformation possibly existing in the circuit board can not be corrected, and the high-precision detection of the depth control milling compensation depth of the circuit board can not be ensured.

Disclosure of Invention

One object of the present invention is to provide a depth-control milling compensation depth detection mechanism capable of improving the detection accuracy of the depth-control milling compensation depth.

Another objective of the present invention is to provide a circuit board depth-control milling device, which can precisely control the depth of the routing groove.

To achieve the purpose, on one hand, the invention adopts the following technical scheme:

a depth-controlled milling compensation depth detection mechanism, comprising: a linear drive; the length meter mounting piece is connected to the output end of the linear driving piece, the linear driving piece can drive the length meter mounting piece to do linear reciprocating motion, and the length meter mounting piece comprises a butting part; a length gauge mounted on the length gauge mounting member; a presser foot mechanism in sliding fit with the length gauge mounting member and disposed opposite the abutting portion, the presser foot mechanism having a channel; and the spring is arranged between the abutting part and the presser foot mechanism, one end of the spring abuts against the abutting part, the other end of the spring is connected with or abuts against the presser foot mechanism, the probe end of the length gauge sequentially penetrates through the abutting part, the spring and the channel, the probe end face of the length gauge is retracted into the channel for a preset distance, and the extension direction of the spring, the axial direction of the channel and the linear reciprocating direction of the length gauge mounting part are parallel.

In some embodiments, the presser foot mechanism includes a presser foot mount in sliding engagement with the length gauge mount and a presser foot mount removably attached to an end of the presser foot mount remote from the abutment.

In some embodiments, the depth control milling compensation depth detection mechanism further comprises a guide sleeve detachably connected to the abutting part, and the guide sleeve is sleeved on the periphery of the presser foot mounting part; the inner wall of the guide sleeve is provided with a circle of first flanges, the outer wall of the presser foot mounting piece is provided with a circle of second flanges, and the outer diameter of each second flange is equal to the inner diameter of the guide sleeve.

In some embodiments, a circle of third flange is arranged on an inner wall of one end of the presser foot mounting piece close to the presser foot, a limit groove is arranged on one surface of the abutting part facing the presser foot mechanism, one end of the spring abuts against a bottom wall of the limit groove, the other end of the spring abuts against the third flange, and the outer diameter of the spring, the inner diameter of the limit groove and the outer diameter of the third flange are equal.

In some embodiments, the depth-control milling compensation depth detection mechanism further comprises a mounting plate for mounting to the depth-control milling mechanism, the linear drive being mounted on the mounting plate.

In some embodiments, the linear driving element is a sliding table cylinder, the sliding table cylinder comprises a sliding table and a cylinder, the cylinder is mounted on the mounting plate, the sliding table is connected to the output shaft of the cylinder, the cylinder can drive the sliding table to do linear reciprocating motion, and the length gauge mounting element is connected to the sliding table.

In some embodiments, a magnetic switch for judging whether the sliding table moves in place or not is arranged on the cylinder; and/or, the slip table cylinder still includes spacing piece, spacing piece and dog down, go up spacing piece and spacing piece down follow the output shaft length direction interval of cylinder set up in on the slip table, the dog set up in on the cylinder and be located go up spacing piece with between the spacing piece down.

On the other hand, the invention adopts the following technical scheme:

a circuit board depth control milling device comprises an X-axis moving mechanism, a Y-axis moving mechanism, a Z-axis moving mechanism, a depth control milling mechanism and a depth control milling compensation depth detection mechanism provided by the invention; the Y-axis moving mechanism is provided with a reference surface and can drive the circuit board to be depth-controlled to be milled to move along the Y-axis direction; the Z-axis moving mechanism is arranged on the X-axis moving mechanism, and the X-axis moving mechanism can drive the Z-axis moving mechanism to move along the X-axis direction; the depth control milling mechanism comprises a main shaft and a depth control milling tool for routing grooves of a circuit board to be depth controlled milled, the main shaft is arranged on the Z-axis moving mechanism, the Z-axis moving mechanism can drive the main shaft to move along the Z-axis direction, and the depth control milling tool and the depth control milling compensation depth detection mechanism are arranged on the main shaft along the X-axis direction.

In some embodiments, a pressure sensor is arranged on the reference surface, and the pressure sensor can detect the pressure of a probe of a length meter of the depth control milling compensation depth detection mechanism on the reference surface.

In some embodiments, the Y-axis moving mechanism includes a Y-axis moving plate and a Y-axis driver capable of driving the Y-axis moving plate to move along a Y-axis direction; the Y-axis moving plate is provided with a bearing surface used for bearing the circuit board to be controlled for deep milling, and the reference surface is arranged on the bearing surface.

The invention has at least the following beneficial effects:

the depth control milling compensation depth detection mechanism of the invention is characterized in that a spring is arranged between a butting part and a presser foot mechanism, one end of the spring is butted with the butting part of a length meter mounting part, the other end of the spring is connected with or butted with the presser foot mechanism, the probe end of the length meter is sequentially arranged in a passage of the butting part, the spring and the presser foot mechanism in a penetrating way, the probe end surface of the length meter is contracted into the passage of the presser foot mechanism for a preset distance, the expansion direction of the spring, the passage axis direction of the presser foot mechanism and the linear reciprocating direction of the length meter mounting part are parallel, when a linear driving part drives the length meter mounting part to linearly move towards a circuit board to be depth controlled milling until the spring is compressed, the elastic restoring force of the spring provides a presser foot pressure of the presser foot mechanism to be pressed on the circuit board to be depth controlled milling, different compression quantities of the spring correspond to different presser foot, the pressure of the presser foot with proper size is obtained, so that the depth control milling compensation depth detection mechanism can be suitable for soft boards and hard boards; meanwhile, the detection precision of depth control milling compensation depth is improved, and the high-precision depth control milling compensation depth detection requirement of the circuit board, particularly the warping deformation circuit board, is met.

According to the depth control milling device for the circuit board, the depth of the routing groove can be accurately controlled by using the depth control milling compensation depth detection mechanism provided by the invention, and the routing groove with the specified depth can be accurately machined on the circuit board.

Drawings

Fig. 1 is a schematic structural diagram of a depth-control milling compensation depth detection mechanism according to an embodiment of the present invention;

FIG. 2 is a front view of the depth-control milling compensated depth detection mechanism shown in FIG. 1;

FIG. 3 is a left side view of the depth-controlled milling compensated depth detection mechanism shown in FIG. 2;

FIG. 4 is a cross-sectional view of the depth-control milling compensated depth detection mechanism of FIG. 3 along the direction A-A;

FIG. 5 is a top view of the depth-control milling compensated depth detection mechanism shown in FIG. 2;

fig. 6 is a front view of a circuit board depth milling control device according to an embodiment of the present invention;

FIG. 7 is a left side view of the depth milling control apparatus for the circuit board shown in FIG. 6;

FIG. 8 is a top view of the depth milling control apparatus for the circuit board shown in FIG. 6;

fig. 9 is a schematic view of a spring controlled presser foot pressure provided by an embodiment of the present invention.

The reference numbers illustrate:

10. a depth control milling compensation depth detection mechanism; 11. a linear drive; 12. a length meter mounting member; 13. a length meter; 131. a probe; 14. a spring; 15. a presser foot; 16. a presser foot mounting member; 17. a guide sleeve; 18. mounting a plate; 20. an X-axis moving mechanism; 30. a Y-axis moving mechanism; 31. a reference surface; 40. a Z-axis moving mechanism; 51. depth control milling cutters; 111. a sliding table; 112. a cylinder; 113. a magnetic switch; 114. an upper limiting member; 115. a lower retainer; 116. a stopper; 121. an abutment portion.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

The embodiment provides a depth-control milling compensation depth detection mechanism which can be applied to depth-control milling compensation depth detection in a circuit board depth-control milling process.

As shown in fig. 1 to 5, the depth-control milling compensation depth detection mechanism 10 provided in this embodiment includes a linear driving element 11, a length gauge 13, a length gauge mounting element 12, a pressure foot mechanism, and a spring 14, wherein the length gauge mounting element 12 is connected to an output end of the linear driving element 11, the linear driving element 11 can drive the length gauge mounting element 12 to perform a linear reciprocating motion, and the length gauge mounting element 12 includes a contact part 121; the length gauge 13 is arranged on the length gauge mounting piece 12, the presser foot mechanism is matched with the length gauge mounting piece 12 in a sliding way and is arranged opposite to the abutting part 121, and the presser foot mechanism is provided with a channel; the spring 14 is arranged between the abutting part 121 and the presser foot mechanism, one end of the spring 14 abuts against the abutting part 121, the other end of the spring 14 is connected with or abuts against the presser foot mechanism, the probe end of the length gauge 13 sequentially penetrates through the passages of the abutting part 121, the spring 14 and the presser foot mechanism, the end face of the probe 131 of the length gauge 13 is retracted into the passage of the presser foot mechanism for a preset distance, and the stretching direction of the spring 14, the axial direction of the passage of the presser foot mechanism and the linear reciprocating direction of the length gauge mounting part 12 are parallel.

The depth-control milling compensation depth detection mechanism 10 is characterized in that the spring 14 is arranged between the abutting part 121 and the presser foot mechanism, one end of the spring 14 abuts against the abutting part 121 of the length meter mounting part 12, the other end of the spring 14 is connected with or abuts against the presser foot mechanism, the probe end of the length meter 13 sequentially penetrates through the abutting part 121, the spring 14 and the passage of the presser foot mechanism, the end face of the probe 131 of the length meter 13 is retracted into the passage of the presser foot mechanism for a preset distance, the stretching direction of the spring 14, the axial direction of the passage of the presser foot mechanism is parallel to the linear reciprocating direction of the length meter mounting part 12, when the linear driving part 11 drives the length meter mounting part 12 to linearly move towards the circuit board to be depth-controlled milled until the spring 14 is compressed, the elastic restoring force of the spring 14 provides a presser foot pressure of the presser foot mechanism to be pressed on the circuit board to be depth-controlled milled, different compression amounts of the spring 14 correspond to different So as to obtain the pressure of the presser foot with proper size, and the depth control milling compensation depth detection mechanism can be suitable for a soft board (namely a flexible circuit board) and a hard board (namely a PCB); meanwhile, the detection precision of depth control milling compensation depth is improved, and the high-precision depth control milling compensation depth detection requirement of the circuit board, particularly the warping deformation circuit board, is met.

Meanwhile, the depth-control milling compensation depth detection mechanism 10 provided by the embodiment further has the following advantages: the structure is simple, only one linear driving piece 11 is needed, the front routing of the depth control milling compensation depth detection mechanism 10 is simplified, the overall structure is more attractive, and the later maintenance and management are facilitated; and because a linear driving piece 11 is adopted, the cost is lower, and the structure is more compact.

In some embodiments, the presser foot mechanism includes a presser foot 15 and a presser foot mount 16, the presser foot mount 16 being slidably engaged with the length gauge mount 12, the presser foot 15 being removably attached to an end of the presser foot mount 16 remote from the abutment 121. The presser foot 15 is detachably connected with the presser foot mounting member 16, so that the new presser foot 15 can be conveniently replaced when the presser foot 15 is damaged, the damaged presser foot 15 is detached from the presser foot mounting member 16 during replacement, and the new presser foot 15 is mounted again. Alternatively, the presser foot 15 may be designed as a cylindrical structure; the presser foot 15 is snap-fit connected to the presser foot mount 16.

In some embodiments, the depth-control milling compensation depth detection mechanism 10 further includes a guide sleeve 17, the guide sleeve 17 is detachably connected to the abutting portion 121 of the length meter mounting member 12, and the guide sleeve 17 is sleeved on the periphery of the presser foot mounting member 16; the inner wall of the guide sleeve 17 is provided with a ring of first flanges and the outer wall of the presser foot mounting 16 is provided with a ring of second flanges, the outer diameter of which is equal to the inner diameter of the guide sleeve 17. Through design guide sleeve 17, can realize the sliding fit of presser foot mechanism and length meter installed part 12, can be simultaneously for the relative motion direction of presser foot mechanism and length meter installed part 12 when spring 14 is compressed, make length meter installed part 12 and the length meter 13 on it move more steadily, prevent length meter 13 and move and control the skew, first flange and second flange can prevent that presser foot installed part 16 from deviating from guide sleeve 17. Alternatively, the guide sleeve 17 may be attached to the abutment 121 using screws.

In some embodiments, a circle of third flange is arranged on the inner wall of one end of the presser foot mounting piece 16 close to the presser foot 15, a limit groove is arranged on one surface of the abutting part 121 facing the presser foot mechanism, one end of the spring 14 abuts against the bottom wall of the limit groove, the other end of the spring 14 abuts against the third flange, the outer diameter of the spring 14, the inner diameter of the limit groove and the outer diameter of the third flange are equal, the spring 14 is limited by the limit groove and the third flange, and therefore left and right displacement is not easy, collision and interference between the spring 14 and the length gauge 13 are avoided, and reliability of.

In some embodiments, the depth-control milling compensated depth detection mechanism 10 further comprises a mounting plate 18 for mounting to the depth-control milling mechanism, the linear drive 11 being mounted on the mounting plate 18. The depth control milling compensation depth detection mechanism 10 can be integrally and once installed on the depth control milling mechanism through the installation plate 18, and installation is convenient. Specifically, the mounting plate 18 is provided with a mounting hole, and the mounting plate 18 is mounted on the depth-control milling mechanism by means of threaded connection with a corresponding threaded hole in the depth-control milling mechanism after the threaded fastener penetrates through the mounting hole. Alternatively, the mounting plate 18 may be mounted to the depth control milling mechanism by a snap-fit arrangement.

Alternatively, the linear driving member 11 may be, but not limited to, an air cylinder 112, a hydraulic cylinder, an electric push rod, or a motor, as long as it can drive the length gauge mounting member 12 to reciprocate linearly.

Preferably, the linear driving member 11 is a sliding table cylinder, the sliding table cylinder includes a sliding table 111 and a cylinder 112, the cylinder 112 is mounted on the mounting plate 18, the sliding table 111 is connected to an output shaft of the cylinder 112, the cylinder 112 can drive the sliding table 111 to make a linear reciprocating motion, and the length gauge mounting member 12 is connected to the sliding table 111. The sliding table cylinder has the characteristics of high guiding precision, torque resistance, strong load capacity, stable work, and simplicity and convenience in assembly. Optionally, a magnetic switch 113 for judging whether the sliding table 111 moves in place is arranged on the air cylinder 112, the magnetic switch 113 can be used as a limit switch, and whether the sliding table 111 moves in place is judged through the magnetic switch 113, so that more reliable control is realized.

Further, the sliding table cylinder further comprises an upper limiting piece 114, a lower limiting piece 115 and a stop block 116, the upper limiting piece 114 and the lower limiting piece 115 are arranged on the sliding table 111 at intervals along the length direction of the output shaft of the cylinder 112, and the stop block 116 is arranged on the cylinder 112 and located between the upper limiting piece 114 and the lower limiting piece 115. The stopper 116 is used to make the sliding table 111 move only between the upper limiting member 114 and the lower limiting member 115, and prevent the moving distance of the sliding table 111 from exceeding the distance between the upper limiting member 114 and the lower limiting member 115, so as to perform a limiting function. The initial position and the end position of the slide table 111 can be adjusted by the upper stopper 114 and the lower stopper 115, thereby adjusting the initial height of the length gauge 13 in the Z-axis direction. Specifically, the positions of the upper and

lower stoppers

114 and 115 can be adjusted by adjusting the position of the cylinder 112 on the mounting plate 18, thereby achieving adjustment of the initial and final positions of the slide table 111.

Of course, in other embodiments, the linear actuator 11 may be a motor, and the upper and lower limiting

members

114 and 115 may be replaced by an optoelectronic switch and an encoder.

It should be noted that the elastic modulus of the spring 14 is greater than that of the probe 131 of the length meter 13 (one end of the probe 131 of the length meter 13 is provided with a return spring for controlling the return of the probe 131, and the structure of the length meter 13 can refer to the prior art specifically); in a natural state, the spring 14 should keep a certain compression amount, the distance of the probe end of the length meter 13 retracting into the presser foot 15 determines the initial presser foot pressure of the presser foot 15, and the distance (namely the compression amount) of the spring 14 continuing to compress can be set through a software system so as to control the final presser foot pressure; the elastic restoring force of the spring 14 should be smaller than the maximum pushing force of the linear actuator 11 when the compression amount of the spring 14 is maximum.

The present embodiment further provides a circuit board depth control milling device, as shown in fig. 6 to 8, the circuit board depth control milling device includes an X-axis moving mechanism 20, a Y-axis moving mechanism 30, a Z-axis moving mechanism 40, a depth control milling mechanism, and the depth control milling compensation depth detection mechanism 10 provided in the present embodiment. A reference surface 31 is arranged on the Y-axis moving mechanism 30, and the Y-axis moving mechanism 30 can drive the circuit board to be depth-controlled to move along the Y-axis direction; the Z-axis moving mechanism 40 is arranged on the X-axis moving mechanism 20, and the X-axis moving mechanism 20 can drive the Z-axis moving mechanism 40 to move along the X-axis direction; the depth control milling mechanism comprises a main shaft and a depth control milling tool 51 used for routing grooves of a circuit board to be depth controlled, the main shaft is arranged on the Z-axis moving mechanism 40, the Z-axis moving mechanism 40 can drive the main shaft to move along the Z-axis direction, and the depth control milling tool 51 and the depth control milling compensation depth detection mechanism 10 are arranged on the main shaft along the X-axis direction.

The depth control milling compensation depth detection mechanism 10 provided by the embodiment can accurately control the depth of the milling groove, so that the milling groove with the specified depth can be accurately processed on the circuit board.

In some embodiments, the X-axis moving mechanism 20 includes an X-axis moving plate and an X-axis driving member capable of driving the X-axis moving plate to move along the X-axis direction, and the Z-axis moving mechanism 40 is mounted on the X-axis moving plate. When the X-axis moving plate moves in the X-axis direction, the Z-axis moving mechanism 40 and the depth-control milling compensation depth detection mechanism 10 thereon are driven to move in the X-axis direction.

In some embodiments, the Y-axis moving mechanism 30 includes a Y-axis moving plate and a Y-axis driver capable of driving the Y-axis moving plate to move along the Y-axis direction; the Y-axis moving plate is provided with a bearing surface for bearing the circuit board to be controlled for deep milling, and the reference surface 31 is arranged on the bearing surface. When the Y-axis moving plate moves in the Y-axis direction, the circuit board to be controlled for deep milling is driven to move in the Y-axis direction.

In some embodiments, the reference surface 31 is provided with a pressure sensor, and the pressure sensor can detect the pressure of the probe 131 of the length gauge 13 of the depth control milling compensation depth detection mechanism 10 on the reference surface 31. The pressure sensor is used for carrying out pressure calibration on the probe 131 of the length meter 13 and providing a data basis for quantitative analysis for the optimization of the processing technological parameters of the circuit board. Alternatively, the pressure sensor may be a piezoresistive pressure sensor or a piezoelectric pressure sensor.

In some embodiments, the Z-axis moving mechanism 40 includes a Z-axis moving plate and a Z-axis driving member, the Z-axis driving member can drive the Z-axis moving plate to move along the Z-axis direction, a main shaft of the depth control milling mechanism is mounted on the Z-axis moving plate, and the linear driving member 11 of the depth control milling compensation depth detection mechanism 10 is mounted on the main shaft. When the Z-axis moving plate moves in the Z-axis direction, the depth-control milling mechanism and the depth-control milling compensation depth detection mechanism 10 are driven to move in the Z-axis direction.

The circuit board depth control milling device provided by the embodiment has the following working principle:

and when the zero position is calibrated normally, adjusting the initial height position of the length meter 13 in the Z-axis direction according to the plate thicknesses of different circuit boards to be controlled and milled deeply. And then, the Z-axis moving mechanism 40 is driven by the X-axis moving mechanism 20 to move to a proper position along the X-axis direction, so that the reference surface 31 is positioned under the length gauge 13, the main shaft is driven by the Z-axis moving mechanism 40 to move downwards, the length gauge 13 moves downwards along with the main shaft at the moment, the movement is stopped when the probe 131 of the length gauge 13 contacts the reference surface 31, the zero position is used as the zero position of the length gauge 13, the zero position calibration is completed at the moment, and the circuit board to be controlled and deeply milled can be processed.

During processing, the linear driving piece 11 pushes the length meter 13 mounting block, the length meter 13 and the presser foot mechanism to move downwards together, and the presser foot 15 contacts the processing surface of the circuit board to be depth-controlled and milled firstly because the position of the presser foot 15 is lower than that of the probe 131 of the length meter 13; the linear driving piece 11 continues to drive the length gauge 13 mounting block, the length gauge 13 and the presser foot mechanism to move downwards, the spring 14 is compressed, at the moment, the presser foot 15 to-be-controlled deep milling circuit board is pressed on the processing surface and is not moved, the length gauge 13 mounting block and the length gauge 13 continue to move downwards, the spring 14 continues to be compressed, and after the probe 131 of the length gauge 13 contacts the processing surface, the length gauge 13 generates a first detection signal; and then, the X-axis moving mechanism 20 drives the Z-axis moving mechanism 40 to move in the X-axis direction and/or the Y-axis moving mechanism 30 drives the circuit board to be deeply milled to move in the Y-axis direction, and the steps are continued, so that different detection point positions on the processing surface of the circuit board to be deeply milled are in contact with the probe 131 of the length meter 13, the length meter 13 generates an Nth detection signal (N is more than or equal to 2), each detection signal corresponds to one Z-axis position, and the difference of the Z-axis positions corresponding to the two detection signals of the length meter 13 is the depth control milling compensation depth. The depth control milling mechanism can perform groove milling on corresponding detection points on the processing surface of the circuit board to be depth controlled milled according to the obtained depth control milling compensation depth.

In the processing process, the pressure foot forces of different detection points on the circuit board to be controlled and deeply milled are different: referring to fig. 9, (a) is a state when the presser foot 15 just touches the circuit board, as shown in (b) of fig. 9, the presser foot 15 moves downwards continuously in the state (a), when the spring 14 is compressed until the probe 131 of the length gauge 13 just touches the surface of the circuit board, the spring 14 is compressed by L1 in relation to the state (a), and L1 can be flexibly adjusted according to the relative position between the end of the probe and the bottom of the presser foot 15; as shown in fig. 9 (c), the spring 14 is further compressed by L2 by moving downward in the state (b), the compression L2 is greater than the height difference between the highest point and the lowest point of the circuit board, L2 can be precisely set and controlled by a software system, and the pressure F of the pressure foot is F = k (L1+ L2), and the surface of the circuit board contacted by the probe 131 in the state (c) is the same as the height of the reference surface 31 (i.e., the index point); as shown in fig. 9 (d), taking the position of the point to be measured of the circuit board lower than the calibration point as an example, assuming that the height difference between the point to be measured of the circuit board and the calibration point is H, the difference between the readings of the state length meter 13 in (d) and the state length meter 13 in (c) is the low point position, and the low point position can be fed back to the software system, at this time, the compression amount of the spring 14 is released, and the pressure of the presser foot at this time should be F = k (L1+ L2-H); similarly, when the position of the point to be measured of the circuit board is higher than the calibration point, assuming that the height difference between the position to be measured of the circuit board and the calibration point is H, the pressure of the presser foot at this time should be F = k (L1+ L2+ H). K is the elastic coefficient of the spring 14, L1 can be adjusted manually, and L2 can be adjusted through a software system, so that the accurate control of the pressure foot is realized, and the high-precision detection requirement of a circuit board, particularly a warping deformation circuit board, is met. Further, in order to be suitable for soft boards and hard boards, springs with different elastic coefficients can be replaced, so that the application range is further expanded.

It should be noted that when one portion is referred to as being "secured to" another portion, it may be directly on the other portion or there may be an intervening portion. When a portion is said to be "connected" to another portion, it may be directly connected to the other portion or intervening portions may be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The utility model provides a accuse deep milling compensation depth detection mechanism which characterized in that accuse deep milling compensation depth detection mechanism includes:

a linear drive (11);

the length meter mounting piece (12), the length meter mounting piece (12) is connected to the output end of the linear driving piece (11), the linear driving piece (11) can drive the length meter mounting piece (12) to do linear reciprocating motion, and the length meter mounting piece (12) comprises an abutting part (121);

a length gauge (13), the length gauge (13) mounted on the length gauge mount (12);

a presser foot mechanism slidably engaged with the length gauge mounting member (12) and disposed opposite to the abutting portion (121), the presser foot mechanism having a passage; and

the spring (14) is arranged between the abutting part (121) and the presser foot mechanism, one end of the spring (14) abuts against the abutting part (121), the other end of the spring (14) is connected with or abuts against the presser foot mechanism, the probe end of the length gauge (13) sequentially penetrates through the passages of the abutting part (121), the spring (14) and the presser foot mechanism, the end face of the probe (131) of the length gauge (13) retracts into the passage for a preset distance, and the stretching direction of the spring (14) and the axial direction of the passage are parallel to the linear reciprocating direction of the length gauge mounting part (12).

2. The depth-controlled milling compensation depth detection mechanism of claim 1, wherein the foot-pressing mechanism comprises a foot-pressing (15) and a foot-pressing mounting (16), the foot-pressing mounting (16) being in sliding engagement with the length-gauge mounting (12), the foot-pressing (15) being detachably connected to an end of the foot-pressing mounting (16) remote from the abutment portion (121).

3. The depth-control milling compensation depth detection mechanism as claimed in claim 2, further comprising a guide sleeve (17), wherein the guide sleeve (17) is detachably connected to the abutting part (121), and the guide sleeve (17) is sleeved on the periphery of the presser foot mounting part (16); the inner wall of the guide sleeve (17) is provided with a circle of first flanges, the outer wall of the presser foot mounting piece (16) is provided with a circle of second flanges, and the outer diameter of each second flange is equal to the inner diameter of the guide sleeve (17).

4. The depth-control milling compensation depth detection mechanism according to claim 3, wherein a ring of third flanges is arranged on the inner wall of one end of the presser foot mounting piece (16) close to the presser foot (15), a limit groove is arranged on one surface of the abutting part (121) facing the presser foot mechanism, one end of the spring (14) abuts against the bottom wall of the limit groove, the other end of the spring abuts against the third flanges, and the outer diameter of the spring (14), the inner diameter of the limit groove and the outer diameter of the third flanges are equal.

5. The depth-control milling compensated depth detection mechanism of claim 1, further comprising a mounting plate (18) for mounting to the depth-control milling mechanism, the linear drive (11) being mounted on the mounting plate (18).

6. The depth-control milling compensation depth detection mechanism according to claim 5, wherein the linear driving element (11) is a sliding table cylinder, the sliding table cylinder comprises a sliding table (111) and a cylinder (112), the cylinder (112) is mounted on the mounting plate (18), the sliding table (111) is connected to an output shaft of the cylinder (112), the cylinder (112) can drive the sliding table (111) to do linear reciprocating motion, and the length gauge mounting element (12) is connected to the sliding table (111).

7. The depth-controlled milling compensation depth detection mechanism according to claim 6, wherein a magnetic switch (113) for judging whether the sliding table (111) moves in place is arranged on the cylinder (112); and/or

The slip table cylinder still includes spacing piece (114), spacing piece (115) and dog (116) down, go up spacing piece (114) and spacing piece (115) down follow the output shaft length direction interval of cylinder (112) set up in on slip table (111), dog (116) set up in on cylinder (112) and be located go up spacing piece (114) with between spacing piece (115) down.

8. A circuit board depth control milling device, which is characterized by comprising an X-axis moving mechanism (20), a Y-axis moving mechanism (30), a Z-axis moving mechanism (40), a depth control milling mechanism and a depth control milling compensation depth detection mechanism as claimed in any one of claims 1 to 7;

a reference surface (31) is arranged on the Y-axis moving mechanism (30), and the Y-axis moving mechanism (30) can drive the circuit board to be depth-controlled to move along the Y-axis direction;

the Z-axis moving mechanism (40) is arranged on the X-axis moving mechanism (20), and the X-axis moving mechanism (20) can drive the Z-axis moving mechanism (40) to move along the X-axis direction;

the depth control milling mechanism comprises a main shaft and a depth control milling tool (51) used for routing grooves of a circuit board to be depth controlled milled, the main shaft is arranged on the Z-axis moving mechanism (40), the Z-axis moving mechanism (40) can drive the main shaft to move along the Z-axis direction, and the depth control milling tool (51) and the depth control milling compensation depth detection mechanism are arranged on the main shaft along the X-axis direction.

9. The circuit board depth control milling device according to claim 8, wherein a pressure sensor is arranged on the reference surface (31), and the pressure sensor can detect the pressure of a probe (131) of a length gauge (13) of the depth control milling compensation depth detection mechanism on the reference surface (31).

10. The device for controlled deep milling of circuit boards as claimed in claim 8, wherein the Y-axis moving mechanism (30) comprises a Y-axis moving plate and a Y-axis driving member, the Y-axis driving member can drive the Y-axis moving plate to move along the Y-axis direction; the Y-axis moving plate is provided with a bearing surface used for bearing the circuit board to be controlled in the deep milling process, and the reference surface (31) is arranged on the bearing surface.