CN111917316A - Submodule temperature adjusting and balancing method based on centralized control of modular multilevel converter - Google Patents
Submodule temperature adjusting and balancing method based on centralized control of modular multilevel converter Download PDFInfo
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- CN111917316A CN111917316A CN202010502592.2A CN202010502592A CN111917316A CN 111917316 A CN111917316 A CN 111917316A CN 202010502592 A CN202010502592 A CN 202010502592A CN 111917316 A CN111917316 A CN 111917316A
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
- H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M7/483—Converters with outputs that each can have more than two voltages levels
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J3/00—Circuit arrangements for ac mains or ac distribution networks
- H02J3/36—Arrangements for transfer of electric power between ac networks via a high-tension dc link
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/32—Means for protecting converters other than automatic disconnection
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
- H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M7/53—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M7/537—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
- H02M7/5387—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/32—Means for protecting converters other than automatic disconnection
- H02M1/327—Means for protecting converters other than automatic disconnection against abnormal temperatures
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/60—Arrangements for transfer of electric power between AC networks or generators via a high voltage DC link [HVCD]
Abstract
The invention discloses a submodule temperature adjusting and balancing method based on centralized control of a modular multilevel converter, which comprises the following steps: collecting the temperature of each submodule radiator, the bridge arm current, the capacitance voltage of each submodule on the bridge arm and a switching function; calculating the average junction temperature of each submodule according to the acquired data, and calculating the virtual voltage bias coefficient of each submodule according to the average junction temperature; calculating the virtual capacitor voltage of each submodule according to the virtual voltage bias coefficient of each submodule, sequencing the submodules in the bridge arm in an ascending order according to the virtual capacitor voltage and establishing a submodule index list; the number of the submodules needing to be conducted is determined in real time by modulating the reference signal, and then the submodules to be conducted are determined in real time according to the submodule index table and the bridge arm current direction, so that the temperature balance of the submodules in the bridge arm is achieved. The invention is not limited by the number of the sub-modules, does not influence the grid-connected electric energy quality of the converter, has simple control algorithm and is easy to understand and implement.
Description
Technical Field
The invention belongs to the technical field of multi-level power electronic converters.
Background
Modular multilevel converters have become a promising topology for application in high voltage direct current transmission technology. Compared with the traditional two-level and three-level voltage source converters, the modular multilevel converter has the characteristic that the cascaded sub-modules in each bridge arm do not need to be connected with power devices in series, so that the modular multilevel converter draws more attention in a high-voltage transmission system.
In addition to efficiency, reliable operation of high power converters is also a key indicator, and power devices play an important role in converter reliability. The modular multilevel converter comprises a number of sub-modules, each sub-module comprising a plurality of power devices. In the event of overloading, parameter mismatch due to long-term operation of the submodules or partial cooling failure, large temperature differences between one or more submodules may result. Since the power devices in power electronic converters are considered to be most susceptible to failure, which is mainly caused by overheating, the large temperature difference of the power devices in the sub-modules poses a great threat to the safe and reliable operation of the modular multilevel converter.
Aiming at the problem of temperature balance adjustment and control of a modular multilevel converter sub-module power switch tube, in the prior art, the temperature between sub-modules is adjusted by changing the switching frequency of the converter switch tube, adjusting the idle work, changing the switching strategy between the continuous pulse width modulation and the discontinuous pulse width modulation of a driving signal, changing the gate driving voltage and the like, but the method can increase the complexity of a hardware system and an algorithm, influence the output quality of electric energy and increase the operation cost of the system. Therefore, a new temperature balance control method for the sub-modules of the modular multilevel converter is needed, which on one hand does not increase the complexity of a hardware system and an algorithm of the system on the premise of ensuring that the output performance of the power quality is not affected, and on the other hand realizes the safe and reliable operation of the modular multilevel converter on the premise of ensuring that the cost of the system is not increased.
Disclosure of Invention
In order to solve the technical problems mentioned in the background art, the invention provides a submodule temperature adjusting and balancing method based on the centralized control of a modular multilevel converter.
In order to achieve the technical purpose, the technical scheme of the invention is as follows:
the submodule temperature adjusting and balancing method based on the modularized multi-level converter centralized control comprises the following steps:
(1) collecting the temperature of each sub-module radiator, the bridge arm current, the capacitance voltage of each sub-module on the bridge arm and a switching function;
(2) calculating the average junction temperature of each sub-module according to the data collected in the step (1), and calculating the virtual voltage bias coefficient of each sub-module according to the average junction temperature;
(3) calculating the virtual capacitor voltage of each submodule according to the virtual voltage bias coefficient of each submodule, sequencing the submodules in the bridge arm in an ascending order according to the virtual capacitor voltage and establishing a submodule index list;
(4) the number of the submodules needing to be conducted is determined in real time by modulating the reference signal, and then the submodules to be conducted are determined in real time according to the submodule index table and the bridge arm current direction, so that the temperature balance of the submodules in the bridge arm is achieved.
Further, in step (2), the virtual voltage offset coefficient is calculated as follows:
ki=ucauave-Vref((Tjm-Th)/(Rthjhi)-Pconave)
in the above formula, kiIs the virtual voltage offset coefficient of the ith sub-module, ucauave、Vref、Tjm、Th、Rthjhi、PconaveThe average value of the capacitance and the voltage of the sub-module, the test voltage of the switch energy consumption in a switch device manual, the average junction temperature of the sub-module in the bridge arm, the temperature of a radiating fin, the thermal resistance of the ith sub-module and the average conduction loss of the sub-module in the bridge arm are respectively.
Further, in step (3), the virtual capacitor voltage is calculated as follows:
u’caui=ki+ucaui
u 'in the above formula'cauiIs the virtual capacitor voltage, k, of the ith sub-moduleiIs the virtual voltage offset coefficient of the ith sub-module, ucauiIs the capacitance voltage of the ith sub-module.
Further, in the step (4), firstly, a modulation wave is determined according to an active power control algorithm, a reactive power control algorithm and a circulating current suppression control algorithm; secondly, obtaining the number n of submodules to be put into the bridge arm through modulationon(ii) a And finally, determining the sub-modules to be conducted in real time by combining the virtual capacitor voltage of the sub-modules in the bridge arm and the current direction of the bridge arm, and inputting n with the lowest virtual capacitor voltage when the current of the bridge arm is positiveonA submodule for switching in n with the highest virtual capacitor voltage when the bridge arm current is negativeonAnd a sub-module.
Adopt the beneficial effect that above-mentioned technical scheme brought:
1. the invention has wide adaptability to topology and working conditions and high practical value: in the prior art, the temperature difference between the parallel converters is compensated by adjusting the reactive circulating current, but the method is only suitable for the structural configuration of the parallel converters; in the prior art, redundant submodule active bypass and neutral point offset are used for regulating the temperature of a submodule, but the method is only limited to a submodule structure with parallel thyristors and under the condition of an unbalanced power grid. Compared with the two technologies, the method is suitable for temperature balance of the submodules in the bridge arm under any topology and any working condition.
2. The algorithm of the invention is simple, the calculation is convenient, and the invention is easy to understand and implement: by introducing the virtual voltage bias coefficient, the virtual capacitor voltage generated by the virtual voltage bias coefficient is balanced, and the temperatures of the respective modules are consistent. On the one hand, the proposed control algorithm is based on aged power devices, while the sub-module power devices are typically aged very slowly, which means that the virtual voltage bias coefficients do not need to be updated every control cycle, thereby simplifying the calculations and reducing the amount of calculations; on the other hand, the virtual voltage bias coefficient and the temperature of each submodule present a clear corresponding relation, the value of the virtual voltage bias coefficient is convenient, and the calculation is simple.
3. The invention does not need to change hardware circuit, and does not increase hardware complexity of the system and cost of the system.
4. The invention realizes the safe and reliable operation of the modular multilevel converter on the premise of ensuring that the output performance of the power quality is not influenced.
Drawings
FIG. 1 is a three-phase MMC and sub-module topology block diagram;
FIG. 2 is a flow chart of a method designed by the present invention.
Detailed Description
The technical scheme of the invention is explained in detail in the following with the accompanying drawings.
The invention provides a submodule temperature adjusting and balancing method suitable for MMC aiming at the problem of submodule temperature distribution unevenness caused by thermal resistance aging of a submodule power device, wherein an MMC topological structure consists of six bridge arms as shown in figure 1,each bridge arm comprises n identical Submodules (SM) and a bridge arm inductor LsThe submodules adopt a half-bridge structure, and each submodule is composed of two power switches T1、T2Two diodes D1、D2And a DC capacitor, the capacitor voltage balancing method comprises: obtaining the number n of the submodules needing to be put into one bridge arm according to the comparison between the reference voltage of the bridge arm and the carrier waveonSorting the obtained virtual capacitor voltages in ascending order, and when the bridge arm current is positive, inputting n with the lowest virtual capacitor voltageonA submodule for switching in n with the highest virtual capacitor voltage when the bridge arm current is negativeonAnd a sub-module.
The invention discloses a submodule temperature adjusting and balancing method based on centralized control of a modular multilevel converter, which comprises the following steps as shown in figure 2:
step 1: collecting the temperature of each submodule radiator and the bridge arm current iarmThe capacitor voltage u of each submodule on the bridge armcauiAnd a switching function Saui。
Step 2: and (3) calculating the average junction temperature of each sub-module according to the data collected in the step (1), and calculating the virtual voltage bias coefficient of each sub-module according to the average junction temperature.
In this embodiment, the virtual voltage offset coefficient is preferably calculated by the following method:
ki=ucauave-Vref((Tjm-Th)/(Rthjhi)-Pconave)
in the above formula, kiIs the virtual voltage offset coefficient of the ith sub-module, ucauave、Vref、Tjm、Th、Rthjhi、PconaveThe average value of the capacitance and the voltage of the sub-module, the test voltage of the switch energy consumption in a switch device manual, the average junction temperature of the sub-module in the bridge arm, the temperature of a radiating fin, the thermal resistance of the ith sub-module and the average conduction loss of the sub-module in the bridge arm are respectively.
And step 3: and calculating the virtual capacitance voltage of each submodule according to the virtual voltage bias coefficient of each submodule, sequencing the submodules in the bridge arm in an ascending order according to the virtual capacitance voltage and establishing a submodule index list.
In this embodiment, the virtual capacitor voltage is preferably calculated by the following method:
u’caui=ki+ucaui
u 'in the above formula'cauiIs the virtual capacitor voltage, k, of the ith sub-moduleiIs the virtual voltage offset coefficient of the ith sub-module, ucauiIs the capacitance voltage of the ith sub-module.
And 4, step 4: the number of the submodules needing to be conducted is determined in real time by modulating the reference signal, and then the submodules to be conducted are determined in real time according to the submodule index table and the bridge arm current direction, so that the temperature balance of the submodules in the bridge arm is achieved.
Specifically, first, the modulation wave y is determined according to the active power control, the reactive power control and the circulating current suppression control algorithmau(ii) a Secondly, obtaining the number n of submodules to be put into the bridge arm through modulationon(ii) a And finally, determining the sub-modules to be conducted in real time by combining the virtual capacitor voltage of the sub-modules in the bridge arm and the current direction of the bridge arm, and inputting n with the lowest virtual capacitor voltage when the current of the bridge arm is positiveonA submodule for switching in n with the highest virtual capacitor voltage when the bridge arm current is negativeonAnd a sub-module.
The invention is especially suitable for MMC systems with numerous submodules, compared with the traditional temperature balance method, on one hand, the complexity of a hardware system and an algorithm of the system is not increased on the premise of ensuring that the output performance of the power quality is not influenced, and on the other hand, the safe and reliable operation of the modular multilevel converter is realized on the premise of ensuring that the cost of the system is not increased.
The embodiments are only for illustrating the technical idea of the present invention, and the technical idea of the present invention is not limited thereto, and any modifications made on the basis of the technical scheme according to the technical idea of the present invention fall within the scope of the present invention.
Claims (4)
1. The submodule temperature adjusting and balancing method under the centralized control based on the modular multilevel converter is characterized by comprising the following steps of:
(1) collecting the temperature of each sub-module radiator, the bridge arm current, the capacitance voltage of each sub-module on the bridge arm and a switching function;
(2) calculating the average junction temperature of each sub-module according to the data collected in the step (1), and calculating the virtual voltage bias coefficient of each sub-module according to the average junction temperature;
(3) calculating the virtual capacitor voltage of each submodule according to the virtual voltage bias coefficient of each submodule, sequencing the submodules in the bridge arm in an ascending order according to the virtual capacitor voltage and establishing a submodule index list;
(4) the number of the submodules needing to be conducted is determined in real time by modulating the reference signal, and then the submodules to be conducted are determined in real time according to the submodule index table and the bridge arm current direction, so that the temperature balance of the submodules in the bridge arm is achieved.
2. The method for regulating and balancing the temperature of sub-modules under centralized control based on a modular multilevel converter according to claim 1, wherein in the step (2), the virtual voltage offset coefficient is calculated according to the following formula:
ki=ucauave-Vref((Tjm-Th)/(Rthjhi)-Pconave)
in the above formula, kiIs the virtual voltage offset coefficient of the ith sub-module, ucauave、Vref、Tjm、Th、Rthjhi、PconaveThe average value of the capacitance and the voltage of the sub-module, the test voltage of the switch energy consumption in a switch device manual, the average junction temperature of the sub-module in the bridge arm, the temperature of a radiating fin, the thermal resistance of the ith sub-module and the average conduction loss of the sub-module in the bridge arm are respectively.
3. The method for regulating and balancing the temperature of sub-modules under centralized control based on a modular multilevel converter according to claim 1, wherein in step (3), the virtual capacitor voltage is calculated according to the following formula:
u’caui=ki+ucaui
u 'in the above formula'cauiIs the virtual capacitor voltage, k, of the ith sub-moduleiIs the virtual voltage offset coefficient of the ith sub-module, ucauiIs the capacitance voltage of the ith sub-module.
4. The method for regulating and balancing the temperature of sub-modules under the centralized control of the modular multilevel converter according to claim 1, wherein in the step (4), firstly, a modulation wave is determined according to an active power control algorithm, a reactive power control algorithm and a circulating current suppression control algorithm; secondly, obtaining the number n of submodules to be put into the bridge arm through modulationon(ii) a And finally, determining the sub-modules to be conducted in real time by combining the virtual capacitor voltage of the sub-modules in the bridge arm and the current direction of the bridge arm, and inputting n with the lowest virtual capacitor voltage when the current of the bridge arm is positiveonA submodule for switching in n with the highest virtual capacitor voltage when the bridge arm current is negativeonAnd a sub-module.
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