CN111909117A - Phthalic anhydride diisopropanol amide epoxy resin and preparation method and application thereof - Google Patents
Phthalic anhydride diisopropanol amide epoxy resin and preparation method and application thereof Download PDFInfo
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- CN111909117A CN111909117A CN202010883841.7A CN202010883841A CN111909117A CN 111909117 A CN111909117 A CN 111909117A CN 202010883841 A CN202010883841 A CN 202010883841A CN 111909117 A CN111909117 A CN 111909117A
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
- C07D303/02—Compounds containing oxirane rings
- C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
- C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
- C07D303/20—Ethers with hydroxy compounds containing no oxirane rings
- C07D303/24—Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds
- C07D303/27—Ethers with hydroxy compounds containing no oxirane rings with polyhydroxy compounds having all hydroxyl radicals etherified with oxirane containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
Abstract
The invention provides a phthalic anhydride diisopropanol amide epoxy resin and a preparation method and application thereof, belonging to the technical field of organic synthesis, wherein the main component is phthalic anhydride diisopropanol amide polyglycidyl ether, and the mass percentage content of the phthalic anhydride diisopropanol amide polyglycidyl ether in the phthalic anhydride diisopropanol amide epoxy resin is more than or equal to 70%. The phthalic anhydride diisopropanol amide epoxy resin provided by the invention has an epoxy value of 0.42-0.49 eq/100g, has low viscosity, and can enhance the rigidity, toughness and high temperature resistance of an E-51 epoxy resin condensate. The invention also provides a preparation method of the epoxy resin in the technical scheme, which ensures the epoxidation degree of the raw materials by controlling the temperature, time and proportion of the reaction, so that the final epoxy resin has higher epoxy value and lower viscosity; can improve the high temperature resistance, rigidity and toughness of the cured epoxy resin.
Description
Technical Field
The invention relates to the technical field of organic synthesis, in particular to phthalic anhydride diisopropanol amide epoxy resin and a preparation method and application thereof.
Background
The epoxy resin is an organic compound containing two or more than two epoxy groups in molecules, the molecular structure of the epoxy resin is characterized in that active epoxy groups are contained in a molecular chain, and the epoxy resin and various curing agents can generate cross-linking reaction to form insoluble high polymers with a three-dimensional network structure due to the active epoxy groups contained in the molecular structure. The cured epoxy resin has good physical and chemical properties, excellent bonding strength, good dielectric property, small deformation shrinkage, good product dimensional stability, high hardness, good flexibility and stability to alkali and most solvents, and is widely applied to various departments of national defense and national economy for casting, impregnation, laminating materials, adhesives, coatings and the like. However, the epoxy resin in the prior art has the problems of low epoxy value and high viscosity.
Disclosure of Invention
In view of the above, the present invention aims to provide a phthalic anhydride diisopropanol amide epoxy resin, and a preparation method and an application thereof. The phthalic anhydride diisopropanol amide epoxy resin provided by the invention has high epoxy value and low viscosity, and can enhance the toughness, rigidity and high temperature resistance of the epoxy resin.
The invention provides a phthalic anhydride diisopropanol amide epoxy resin, which comprises phthalic anhydride diisopropanol amide polyglycidyl ether, wherein the structure of the phthalic anhydride diisopropanol amide polyglycidyl ether is shown as a formula I:
the mass percentage of the phthalic anhydride diisopropanol amide polyglycidyl ether in the phthalic anhydride diisopropanol amide epoxy resin is more than or equal to 70 percent.
Preferably, the phthalic anhydride diisopropanol amide epoxy resin also comprises:
preferably, the epoxy value of the phthalic anhydride diisopropanol amide epoxy resin is 0.42-0.49 eq/100 g.
The invention also provides a preparation method of the phthalic anhydride diisopropanol amide epoxy resin, which comprises the following steps:
mixing phthalic anhydride, diisopropanolamine, a dehydrating agent and an organic solvent, performing an amidation reaction, removing a byproduct water, and removing the organic solvent and the dehydrating agent after the amidation reaction is finished to obtain phthalic anhydride diisopropanolamine;
the phthalic anhydride diisopropanol amide, the epoxy chloropropane and the inorganic base are subjected to open-close ring reaction by a one-step method under the action of a phase transfer catalyst, and after the reaction is finished, the phthalic anhydride diisopropanol amide epoxy resin is obtained by refining.
Preferably, the molar ratio of the phthalic anhydride to the diisopropanolamine is 1: (2-2.3).
Preferably, the temperature of the amidation reaction is 110-160 ℃, and the time is 5-9 h.
Preferably, the molar ratio of the hydroxyl group of the phthalic anhydride diisopropanol amide, the epichlorohydrin and the inorganic base is 1: (6-20): (0.75 to 1.15); the mass of the phase transfer catalyst is 0.05-0.5% of the total mass of the phthalic anhydride diisopropanol amide, the epoxy chloropropane and the inorganic base.
Preferably, the phase transfer catalyst is benzyltriethylammonium chloride, benzyltrimethylammonium chloride, tetrabutylammonium bromide, tetrabutylammonium chloride, tetrabutylammonium hydrogen sulfate, trioctylmethylammonium chloride, dodecyltrimethylammonium chloride or tetradecyltrimethylammonium chloride.
Preferably, the temperature of the one-step open-close loop reaction is 30-80 ℃, the pressure is normal pressure, and the time is 2-6 h.
The invention also provides the application of the phthalic anhydride diisopropanol amide epoxy resin in the technical scheme or the phthalic anhydride diisopropanol amide epoxy resin prepared by the preparation method in the technical scheme as a reinforcing material in epoxy resin.
The invention provides a phthalic anhydride diisopropanol amide epoxy resin, which mainly comprises phthalic anhydride diisopropanol amide polyglycidyl ether, wherein the mass percentage content of the phthalic anhydride diisopropanol amide polyglycidyl ether in the phthalic anhydride diisopropanol amide epoxy resin is more than or equal to 70%. The phthalic anhydride diisopropanol amide epoxy resin provided by the invention has an epoxy value of 0.42-0.49 eq/100g, has low viscosity, and can enhance the rigidity, toughness and high temperature resistance of an epoxy resin condensate.
The invention also provides a preparation method of the phthalic anhydride diisopropanol amide epoxy resin in the technical scheme, and the invention ensures the glycidyl etherification degree of the raw material by controlling the temperature, time and pressure of the one-step ring opening and closing reaction, so that the final phthalic anhydride diisopropanol amide epoxy resin has higher epoxy value and lower viscosity.
Drawings
FIG. 1 is an infrared spectrum of phthalic anhydride (a) and phthalic anhydride diisopropanolamide (b);
FIG. 2 is a nuclear magnetic resonance hydrogen spectrum of phthalic anhydride diisopropanolamine;
FIG. 3 is an IR spectrum of phthalic anhydride diisopropanol amide (a) and phthalic anhydride diisopropanol amide epoxy resin (b) prepared in example 1;
FIG. 4 is a nuclear magnetic hydrogen spectrum of the phthalic anhydride diisopropanol amide epoxy resin obtained in example 1;
FIG. 5 is a scanning electron microscope image of the fracture surface impact resistance of a pure E-51 epoxy resin cured product (a) and a cured product (b) of phthalic anhydride diisopropanolamide amide epoxy resin with a 10 wt% incorporation amount;
FIG. 6 is a graph showing the thermogravimetric curves of a pure E-51 epoxy resin cured product and a cured product of 10 wt% of phthalic anhydride diisopropanol amide epoxy resin.
Detailed Description
The invention provides a phthalic anhydride diisopropanol amide epoxy resin, which comprises phthalic anhydride diisopropanol amide polyglycidyl ether, wherein the structure of the phthalic anhydride diisopropanol amide polyglycidyl ether is shown as a formula I:
the mass percentage of the phthalic anhydride diisopropanol amide polyglycidyl ether in the phthalic anhydride diisopropanol amide epoxy resin is more than or equal to 70 percent.
In the present invention, the above-mentioned phthalic anhydride diisopropanol amide epoxy resin preferably further comprises:
in the invention, the epoxy value of the phthalic anhydride diisopropanol amide polyglycidyl ether in the phthalic anhydride diisopropanol amide epoxy resin is 0.42-0.49 eq/100 g.
The phthalic anhydride diisopropanol amide epoxy resin provided by the invention contains phthalic anhydride diisopropanol amide polyglycidyl ether with the mass percentage of more than or equal to 70%, so that the epoxy resin has a higher epoxy value and a lower viscosity, and can be used for enhancing the toughness, rigidity and high temperature resistance of the epoxy resin.
The invention also provides a preparation method of the phthalic anhydride diisopropanol amide epoxy resin, which comprises the following steps:
mixing phthalic anhydride, diisopropanolamine, a dehydrating agent and an organic solvent, performing an amidation reaction, removing a byproduct water, and removing the organic solvent and the dehydrating agent after the amidation reaction is finished to obtain phthalic anhydride diisopropanolamine;
the phthalic anhydride diisopropanol amide, the epoxy chloropropane and the inorganic base are subjected to open-close ring reaction by a one-step method under the action of a phase transfer catalyst, and after the reaction is finished, the phthalic anhydride diisopropanol amide epoxy resin is obtained by refining.
The invention mixes phthalic anhydride, diisopropanolamine, dehydrating agent and organic solvent, carries out amidation reaction, removes water as by-product, and removes organic solvent and dehydrating agent after the amidation reaction, thus obtaining phthalic anhydride diisopropanolamine.
In the present invention, the molar ratio of the phthalic anhydride to the diisopropanolamine is preferably 1: (2 to 2.3), more preferably 1: (2.03-2.2), most preferably 1: (2.05-2.1). In the present invention, the dehydrating solvent preferably comprises toluene and/or xylene, and further preferably xylene; the dosage of the dehydrating agent is preferably 10-30% of the total mass of the phthalic anhydride and the diisopropyl alcohol, more preferably 15-25%, and even more preferably 18-20%. In the present invention, the organic solvent preferably includes one or more of dimethylsulfoxide, dimethylformamide, dimethylacetamide, diethylene glycol dimethyl ether and N, N 'Dimethylformamide (DMF), and more preferably N, N' Dimethylformamide (DMF); the ratio of the total mass of the phthalic anhydride and the diisopropanolamine to the mass of the organic solvent is preferably 1: (0.5 to 3), and more preferably 1: (1.0 to 2.0), more preferably 1: (1.2-1.5).
In the invention, the temperature of the amidation reaction is preferably 110-160 ℃, and more preferably 120-150 ℃; the time of the amidation reaction is preferably 5 to 9 hours.
In the present invention, during the amidation reaction, it is preferable to remove water, which is a by-product generated during the amidation reaction, through a water separator.
In the present invention, the manner of removing the organic solvent and the dehydrating solvent is preferably distillation under reduced pressure.
In the present invention, the amidation reaction is preferably carried out in a four-necked flask, and the specific process of the amidation reaction is described in detail below in conjunction with the four-necked flask as follows: adding phthalic anhydride, diisopropanolamine, an organic solvent and a dehydrating agent into a four-neck flask provided with a mechanical stirrer, a reflux condenser, a water separator and a thermometer which are mechanically sealed, heating to the temperature of amidation reaction for amidation reaction, and separating water through the water separator in the amidation reaction process; and after the amidation reaction is finished, removing the organic solvent and the dehydrating agent by reduced pressure distillation to obtain the phthalic anhydride diisopropanol amide.
After obtaining the phthalic anhydride diisopropanol amide, the epoxy chloropropane and the inorganic base of the invention carry out a one-step open-close ring reaction under the action of a phase transfer catalyst, and after the reaction is finished, the phthalic anhydride diisopropanol amide epoxy resin is obtained by refining.
In the present invention, the molar ratio of the hydroxyl group of the phthalic anhydride diisopropanol amide, Epichlorohydrin (ECH) and inorganic base is preferably 1: (6-20): (0.75 to 1.15), and more preferably 1: (7-15): (0.9 to 1.1); the hydroxyl value of the said phthalic anhydride diisopropanol amide is measured by phthalic anhydride method. In the invention, the mass of the phase transfer catalyst is preferably 0.05-0.5% of the total mass of the phthalic anhydride diisopropanol amide, the epoxy chloropropane and the inorganic base, and more preferably 0.1-0.2%.
In the present invention, the inorganic base is preferably NaOH or KOH. In the present invention, the phase transfer catalyst is preferably benzyltriethylammonium chloride (BTEAC), benzyltrimethylammonium chloride (BTMAC), tetrabutylammonium bromide (TBAB), tetrabutylammonium chloride (TBAC), tetrabutylammonium hydrogen sulfate, trioctylmethylammonium chloride, dodecyltrimethylammonium chloride or tetradecyltrimethylammonium chloride, and is more preferably benzyltriethylammonium chloride (TEBA), tetrabutylammonium bromide (TBAB) or tetrabutylammonium chloride.
In the present invention, the pressure of the "one-step" open-close ring reaction is preferably normal pressure; the temperature is preferably 30-80 ℃, and more preferably 40-60 ℃; the time is preferably 2 to 6 hours, and more preferably 4 hours. According to the invention, the pressure of the one-step method opening and closing ring reaction is set as normal pressure, the temperature is set as 30-80 ℃, and the time is set as 2-6 hours, so that the epoxy value of the finally obtained phthalic anhydride diisopropanol amide epoxy resin is 0.42-0.49 eq/100 g; the epoxy value is preferably detected by a hydrochloric acid-acetone method.
In the present invention, the refining process preferably includes: and filtering the obtained reaction solution, and sequentially washing, neutralizing and distilling the obtained filtrate to obtain the phthalic anhydride diisopropanol amide epoxy resin. In the present invention, the number of times of the water washing, the neutralizing agent and the process of the distillation are conventional operations in the art.
In the present invention, the "one-step" open-close loop reaction is preferably carried out in a four-neck flask, and the specific process of the "one-step" open-close loop reaction is described in detail below with reference to the four-neck flask as follows: adding phthalic anhydride diisopropanol amide, epoxy chloropropane, inorganic base and a phase transfer catalyst into a four-neck flask provided with a mechanical stirrer, a reflux condenser and a thermometer which are mechanically sealed, and heating to the open-close ring reaction temperature of the one-step method to carry out the one-step open-close ring reaction.
The preparation method provided by the invention has the advantages of wide raw material source and simple operation, and can obtain the phthalic anhydride diisopropanol amide epoxy resin with the target epoxy value by controlling the one-step method to open and close the ring reaction condition; meanwhile, the prepared phthalic anhydride diisopropanol amide epoxy resin has lower viscosity.
The invention also provides the application of the phthalic anhydride diisopropanol amide epoxy resin in the technical scheme or the phthalic anhydride diisopropanol amide epoxy resin prepared by the preparation method in the technical scheme as a reinforcing material in epoxy resin.
In the present invention, the epoxy resin is preferably bisphenol A type E-51 epoxy resin.
According to the invention, the phthalic anhydride diisopropanol amide epoxy resin is added into the bisphenol A type E-51 epoxy resin, so that the toughness, rigidity and high temperature resistance of a cured E-51 epoxy resin can be obviously enhanced.
The present invention provides a phthalic anhydride diisopropanol amide epoxy resin, a preparation method and applications thereof, which are described in detail below with reference to the following examples, but they should not be construed as limiting the scope of the present invention.
The raw materials used in the examples: phthalic Anhydride (PA), tetrabutylammonium bromide, tetrabutylammonium chloride, benzyltriethylammonium chloride, sodium hydroxide, potassium hydroxide, Epichlorohydrin (ECH), E-51 bisphenol A epoxy resin and diethylenetriamine are provided by the New and Telecommunications, Anhui, Industrial-grade company; diisopropanolamine (DiPA), technical grade, produced by Nanjing Red Baoli GmbH; hydrochloric acid, acetone, xylene, N' -Dimethylformamide (DMF) and pyridine were all analytical grade, produced by Nanjing chemical reagents GmbH.
The hydroxyl value of the phthalic anhydride diisopropanol amide is measured by a phthalic anhydride method.
The epoxy value of the phthalic anhydride diisopropanol amide epoxy resin is detected by a hydrochloric acid-acetone method.
FTIR tests were performed using a U.S. NicoletFTIR-360 Fourier transform Infrared spectrometer: the potassium bromide coating method has the determination range of 400-4000 cm-1。
The structure of the polymer is characterized by a BurkerFourierTrnasofmraVANCE600 spectrometer, and the solvent is deuterated chloroform.
And (3) testing a scanning electron microscope: after the fracture surface of the sample was punched and plated with gold, the cell morphology was observed by using a scanning electron microscope in the United states Quanta200 environment.
The thermal stability of the cured product was measured and analyzed by using a TGA/DSCl/1100SF thermogravimetric analyzer, and the measurement parameters of the thermogravimetric analyzer were set as follows: the temperature rise range is 30-700 ℃, the temperature rise rate is 10 ℃/min, the carrier gas is nitrogen, and the flow rate is 40 mL/min.
And (3) viscosity testing: selecting a rotor with a proper size to perform viscosity test on a sample by using a Brookfield DV-I rotational viscometer at the room temperature of 25 ℃, wherein the unit is as follows: mPa · s.
Example 1
Adding phthalic anhydride, diisopropanolamine, DMF and xylene into a 500mL four-neck flask provided with a mechanical stirrer with a mechanical seal, a reflux condenser, a water separator and a thermometer, wherein the molar ratio of the phthalic anhydride to the diisopropanolamine is 1:2.05, the mass of the DMF is 140 percent of that of reactants (the phthalic anhydride and the diisopropanolamine), the mass of the xylene is 20 percent of that of the reactants (the phthalic anhydride and the diisopropanolamine), heating to 150 ℃, carrying out amidation reaction for 7 hours, and separating water through the water separator in the reaction process; then carrying out reduced pressure distillation, and recovering DMF and xylene to obtain phthalic anhydride diisopropanol amide which is a brown yellow glassy solid, has a hydroxyl value of 459.6mgKOH/g and an acid value of 1.9 mgKOH/g.
FIG. 1 is an infrared spectrum of phthalic anhydride (a) and phthalic anhydride diisopropanolamide (b). As can be seen from fig. 1: (a) 1847.44cm in the figure-1、1768.37cm-1The absorption peak of C ═ O stretching vibration infrared of the acid anhydride is located at 1255.41cm-1And 1108.85cm-1，713.52cm-1Is the absorption peak of the benzene ring; in the diagram (b), 1847.44cm-1、1768.37cm-1C ═ O stretching vibration infrared absorption peak of the anhydride does not exist, which indicates that the phthalic anhydride has completely reacted; while at about 1687.38cm-1Characteristic absorption peak of C ═ O stretching vibration at which strong tertiary amide appears, 1585.17cm-1The absorption peak is C-N, which shows that amidation reaction has already occurred, and the amidation reaction degree is very high, and the absorption peak is 1338.33-1039.42 cm-1Stretching in the range of C-O at 3282.20cm-1The broad and strong band at (B) is the stretching vibration absorption band of the multiple association-OH, indicating that the compound has many hydroxyl groups. FIG. 2 is the NMR spectrum of phthalic anhydride diisopropanolamine, with the following results: a singlet peak near 1.15 and 1.28 is hydrogen of a methyl group on an alcohol amine chain, a peak near 3.43 to 4.0 is hydrogen of a methylene group on an alcohol amine chain, a peak near 4.75 is a peak of a hydroxyl group position on an alcohol amine terminal, and a peak 2.50 is a peak of a deuteration reagent DMSO; therefore, the existence of the product is verified according to the analysis result of the spectrogram.
Adding the prepared phthalic anhydride diisopropanol amide, epoxy chloropropane, sodium hydroxide and benzyl triethyl ammonium chloride into a four-neck flask provided with a mechanical stirrer with a mechanical seal, a reflux condenser and a thermometer, wherein n (hydroxyl in the phthalic anhydride diisopropanol amide) is (ECH) and n (NaOH) is (1: 8: 1.1), the mass of the benzyl triethyl ammonium chloride is 0.3 percent of that of reactants (phthalic anhydride diisopropanol amide, epoxy chloropropane and sodium hydroxide), reacting for 4 hours at 40 ℃, filtering by suction after the reaction is finished, neutralizing by water washing, distilling and recovering an ECH low-boiling-point substance to obtain the phthalic anhydride diisopropanol amide epoxy resin, wherein the epoxy value is 0.49eq/100g, and the viscosity is 2000mPa & s.
FIG. 3 is an IR spectrum of phthalic anhydride diisopropoxide amide (a) and phthalic anhydride diisopropoxide amide epoxy resin (b); as can be seen from FIG. 3, 909cm-1A characteristic absorption peak of an epoxy group appeared in the vicinity of the peak at 3361.3cm-1The absorption peak of hydroxyl is weakened, thereby proving that the surface grafting modification is successful and preparing the polyglycidyl ether of which the main component is phthalic anhydride diisopropanol amide.
FIG. 4 is a nuclear magnetic hydrogen spectrum of the obtained phthalic anhydride diisopropanol amide epoxy resin, and it can be seen from FIG. 4 that: (ppm) (-3.45, 3.68, 3.82) the singlet peaks are hydrogen on methylene on ethoxy chain and hydrogen on methylene on non-ring-closed alcohol ether, (ppm) (-2.64, 2.82, 3.19) the peaks are hydrogen on methylene and methine connected with epoxy group, and (ppm) (-7.28) the deuterated reagent CDCl3Peak of (2).
By integrating the data analysis of infrared spectrum and nuclear magnetic hydrogen spectrum, the structural formula of the main component of the phthalic anhydride diisopropanol amide epoxy resin is shown as formula I:
example 2
The phthalic anhydride diisopropanol amide, epichlorohydrin, sodium hydroxide and tetrabutylammonium bromide obtained in example 1 were charged into a four-neck flask equipped with a mechanical stirrer with mechanical seal, a reflux condenser and a thermometer, n (phthalic anhydride diisopropanol amide hydroxyl group): n (ECH): n (naoh): 1:10: 1.15), the mass of tetrabutylammonium bromide was 0.2% of the mass of the reactants (phthalic anhydride diisopropanol amide, epichlorohydrin and sodium hydroxide), and the reaction was carried out at 60 ℃ for 5 hours, after the completion of the reaction, filtration was carried out, neutralization was carried out with water, and then the low boiling point substances of ECH were removed by distillation to obtain a phthalic anhydride diisopropanol amide type epoxy resin having an epoxy value of 0.42eq/100g and a viscosity of 3500mPa · s.
Example 3
The phthalic anhydride diisopropanol amide, epichlorohydrin, sodium hydroxide and tetrabutyl ammonium chloride obtained in example 1 were charged into a four-neck flask equipped with a mechanical stirrer with mechanical seal, reflux condenser and thermometer, n (phthalic anhydride diisopropanol amide hydroxyl group): n (ECH): n (naoh): 1:7: 0.95), the mass of tetrabutyl ammonium chloride was 0.5% of the mass of the reactants (phthalic anhydride diisopropanol amide, epichlorohydrin and sodium hydroxide), reacted at 50 ℃ for 4 hours, after the reaction was completed, the reaction was filtered, neutralized, washed with water, and then distilled to remove the ECH low boiling point substance to obtain a phthalic anhydride diisopropanol amide type epoxy resin having an epoxy value of 0.46eq/100g and a viscosity of 2700mPa · s.
Example 4
The phthalic anhydride diisopropanol amide, epichlorohydrin, sodium hydroxide and benzyltriethylammonium chloride obtained in example 1 were charged into a four-necked flask equipped with a mechanical stirrer with mechanical seal, reflux condenser and thermometer, n (phthalic anhydride diisopropanol amide hydroxyl group): n (ECH): n (naoh): 1:6:1.1, benzyltriethylammonium chloride mass was 0.4% of the total mass of the reactants (phthalic anhydride diisopropanol amide, epichlorohydrin and sodium hydroxide), reacted at 60 ℃ for 4 hours, after the reaction was completed, the reaction mixture was subjected to suction filtration, neutralized with water, and then distilled to remove the ECH low boiling substance, thereby obtaining a phthalic anhydride diisopropanol amide type epoxy resin having an epoxy value of 0.43eq/100g and a viscosity of 3300mPa · s.
Example 5
The phthalic anhydride diisopropanol amide, epichlorohydrin, potassium hydroxide and benzyltriethylammonium chloride obtained in example 1 were charged into a four-necked flask equipped with a mechanical stirrer with mechanical seal, a reflux condenser and a thermometer, n (phthalic anhydride diisopropanol amide hydroxyl group): n (ECH): n (koh): 1:8:1.0, benzyltriethylammonium chloride mass was 0.5% of the total mass of the reactants (phthalic anhydride diisopropanol amide, epichlorohydrin and sodium hydroxide), reacted at 50 ℃ for 5 hours, after the reaction was completed, the reaction mixture was subjected to suction filtration, washed with water to neutralize, and then distilled to remove the ECH low boiling substance, thereby obtaining a phthalic anhydride diisopropanol amide type epoxy resin having an epoxy value of 0.45eq/100g and a viscosity of 3100mPa · s.
Application example
The phthalic anhydride diisopropanol amide epoxy resin prepared in the embodiment 1 is blended into E-51 epoxy resin, and then diethylenetriamine curing agent with the theoretically required amount is added for curing to obtain a cured product, wherein the curing conditions comprise: curing at room temperature for 12h, curing at 80 ℃ for 3h, and aging at normal temperature for 10 days. The tensile strength, elongation at break, flexural strength and impact strength of the resulting cured product were measured by the method of GB/T2567-2008, and the results are shown in Table 1. As can be seen from Table 1: the addition of the phthalic anhydride diisopropanol amide epoxy resin can obviously improve the tensile strength, the elongation at break, the bending strength and the impact strength of a cured E-51 epoxy resin. When the addition amount of the phthalic anhydride diisopropanol amide epoxy resin is 10 wt%, the tensile strength of a cured product is 90.94MPa, the bending strength is 139.88MPa, and the impact strength is 32.10kJ/m2(ii) a The improvement of tensile strength and impact strength respectively reflects the improvement of rigidity and toughness of the material. In combination with the data in Table 1, the performance of the cured product is optimal when 10 wt% of the phthalic anhydride diisopropanol amide epoxy resin is added.
TABLE 1 Performance test of cured product of E-51 epoxy resin doped with phthalic anhydride, diisopropanol amide epoxy resin
When the incorporation amount of the phthalic anhydride diisopropanol amide type epoxy resin is tested to be 10 wt%, the impact-resistant fracture surface of the obtained cured product is shown in FIG. 5, which is a scanning electron microscope image of the impact-resistant fracture surface of the pure E-51 epoxy resin cured product (a) and the phthalic anhydride diisopropanol amide type epoxy resin cured product (b) with the incorporation amount of 10 wt%, and can be seen from FIG. 5: the impact fracture surface of the cured product of the pure E-51 epoxy resin is relatively smooth; when 10 wt% of phthalic anhydride diisopropanol amide epoxy resin is added, the fracture surface of an impact sample of the obtained cured product is rougher, and fibers appear, so that the toughness of the obtained cured product is enhanced after the phthalic anhydride diisopropanol amide epoxy resin is added.
The thermogravimetric curves of the cured product of 10 wt% of the phthalic anhydride diisopropanol amide epoxy resin and the cured product of the E-51 epoxy resin obtained by adopting a Japanese Shimadzu DTG-60 thermogravimetric analyzer are tested, and the results are shown in FIG. 6, and can be seen from FIG. 6: although the initial decomposition temperature of the cured product with 10 wt% of the phthalic anhydride diisopropanol amide epoxy resin is slightly lower than that of the cured product with pure E-51 epoxy resin, the mass loss rate is also reduced, and when the temperature exceeds 450 ℃, the carbon formation rate of the cured product with 10 wt% of the phthalic anhydride diisopropanol amide epoxy resin is increased, which shows that the cured product with 10 wt% of the phthalic anhydride diisopropanol amide epoxy resin is more resistant to high temperature.
From the above embodiments it can be seen that: the phthalic anhydride diisopropanol amide epoxy resin provided by the invention has a high epoxy value, and can improve the toughness, rigidity and high temperature resistance of a cured product after being doped into E-51 resin.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (10)
1. The phthalic anhydride diisopropanol amide epoxy resin is characterized by comprising phthalic anhydride diisopropanol amide polyglycidyl ether, wherein the structure of the phthalic anhydride diisopropanol amide polyglycidyl ether is shown as a formula I:
the mass percentage of the phthalic anhydride diisopropanol amide polyglycidyl ether in the phthalic anhydride diisopropanol amide epoxy resin is more than or equal to 70 percent.
2. The phthalic anhydride diisopropanol amide epoxy resin according to claim 1, further comprising:
3. the phthalic anhydride diisopropanol amide epoxy resin as claimed in claim 1 or 2, wherein the phthalic anhydride diisopropanol amide epoxy resin has an epoxy value of 0.42 to 0.49eq/100 g.
4. The method for preparing the phthalic anhydride diisopropanol amide epoxy resin as claimed in any one of claims 1 to 3, comprising the steps of:
mixing phthalic anhydride, diisopropanolamine, a dehydrating agent and an organic solvent, performing an amidation reaction, removing a byproduct water, and removing the organic solvent and the dehydrating agent after the amidation reaction is finished to obtain phthalic anhydride diisopropanolamine;
the phthalic anhydride diisopropanol amide, the epoxy chloropropane and the inorganic base are subjected to open-close ring reaction by a one-step method under the action of a phase transfer catalyst, and after the reaction is finished, the phthalic anhydride diisopropanol amide epoxy resin is obtained by refining.
5. The method according to claim 4, wherein the molar ratio of the phthalic anhydride to the diisopropanolamine is 1: (2-2.3).
6. The method according to claim 4 or 5, wherein the temperature of the amidation reaction is 110 to 160 ℃ and the time is 5 to 9 hours.
7. The preparation process according to claim 4, wherein the molar ratio of the hydroxyl group of the phthalic anhydride diisopropanol amide, the epichlorohydrin and the inorganic base is 1: (6-20): (0.75 to 1.15); the mass of the phase transfer catalyst is 0.05-0.5% of the total mass of the phthalic anhydride diisopropanol amide, the epoxy chloropropane and the inorganic base.
8. The production method according to claim 4 or 7, wherein the phase transfer catalyst is benzyltriethylammonium chloride, benzyltrimethylammonium chloride, tetrabutylammonium bromide, tetrabutylammonium chloride, tetrabutylammonium hydrogen sulfate, trioctylmethylammonium chloride, dodecyltrimethylammonium chloride or tetradecyltrimethylammonium chloride.
9. The preparation method according to claim 4 or 7, wherein the temperature of the one-step open-close loop reaction is 30-80 ℃, the pressure is normal pressure, and the time is 2-6 h.
10. Use of the phthalic anhydride diisopropanol amide epoxy resin according to any one of claims 1 to 3 or the phthalic anhydride diisopropanol amide epoxy resin prepared by the preparation method according to any one of claims 4 to 9 as a reinforcing material in epoxy resins.
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| EP4299656A1 (en) | 2022-07-01 | 2024-01-03 | Evonik Operations GmbH | Preparation of propoxylated benzenedicarboxylic acid amides and corresponding polyurethane foam |
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