CN111908953B - Thermosensitive phase change protective film, preparation method thereof and laminated ceramic capacitor - Google Patents
Thermosensitive phase change protective film, preparation method thereof and laminated ceramic capacitor Download PDFInfo
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- CN111908953B CN111908953B CN202010916671.8A CN202010916671A CN111908953B CN 111908953 B CN111908953 B CN 111908953B CN 202010916671 A CN202010916671 A CN 202010916671A CN 111908953 B CN111908953 B CN 111908953B
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- 239000003985 ceramic capacitor Substances 0.000 title claims description 29
- 238000002360 preparation method Methods 0.000 title abstract description 6
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- 239000011159 matrix material Substances 0.000 claims abstract description 46
- 239000002245 particle Substances 0.000 claims abstract description 42
- 239000002775 capsule Substances 0.000 claims abstract description 27
- 239000012790 adhesive layer Substances 0.000 claims abstract description 23
- 239000003292 glue Substances 0.000 claims description 30
- 239000006185 dispersion Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 16
- 239000000919 ceramic Substances 0.000 claims description 15
- 239000007788 liquid Substances 0.000 claims description 15
- 150000001540 azides Chemical class 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- 230000003197 catalytic effect Effects 0.000 claims description 5
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- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 9
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- 239000000853 adhesive Substances 0.000 description 2
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Classifications
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Laminated Bodies (AREA)
Abstract
The application provides a thermosensitive phase change protective film and a preparation method thereof, comprising the following steps: the release film layer, the thermosensitive phase change layer and the support film layer are stacked; the thermosensitive phase change layer comprises a matrix adhesive layer and thermosensitive phase change capsules dispersed in the matrix adhesive layer, and the thermosensitive phase change capsules comprise a shell and phase change particles positioned in the shell. The debonding temperature of the thermosensitive phase change protective film can be increased by selecting phase change particles of a suitable phase change temperature.
Description
Technical Field
The application relates to the technical field of manufacturing of laminated ceramic capacitors, in particular to a thermosensitive phase change protective film and a preparation method thereof.
Background
Multilayer ceramic capacitors (MLCCs) are new generations of miniature and reliable capacitive elements, with the popularity of 5G high frequency flux and more miniaturized electronic devices becoming increasingly important. However, because of the increased lamination density, the MLCCs are smaller in size, and the process fineness and reliability become the primary problems to be solved in the industry. Most of the current MLCC manufacturing technologies are mastered by Japanese and Korean large-scale electron groups, so that the development of special material technologies is quickened, and the method is beneficial to the breakthrough of the domestic MLCC manufacturing process.
In the MLCC processing process, the process protection film is adhered to the MLCC, and after the process is finished, the process protection film needs to be debonded so as to complete the MLCC processing process. The existing protective film for the thermal adhesion process does not have enough structure holding capability, can generate high-proportion failure when processing the MLCC with smaller thickness, and can change or foam in advance under the condition of the temperature required in the processing process, thereby the phenomenon of MLCC falling occurs. Although the prior art thermal bonding process protective film can be debonded at high temperature, the working temperature before debonding must be lower than 100 ℃, otherwise failure occurs. Therefore, the traditional protective film for the thermal adhesion process has poor operability and high reject ratio of the produced product.
Disclosure of Invention
The application mainly solves the technical problem of providing a thermosensitive phase change protective film and a preparation method thereof, which can improve the debonding temperature of the thermosensitive phase change protective film by selecting phase change particles with proper phase change temperature.
In order to solve the technical problems, the application adopts the following scheme: provided is a thermosensitive phase change protective film including: a support film layer and a thermosensitive phase change layer which are laminated; the thermosensitive phase change layer comprises a matrix adhesive layer and thermosensitive phase change capsules positioned in the matrix adhesive layer, wherein the thermosensitive phase change capsules comprise a shell and phase change particles positioned in the shell.
Wherein the phase change particles comprise at least one of paraffin ester particles, azide prepolymer particles, and pressurized liquid gas particles.
Wherein, the shell also comprises thermosensitive catalytic particles.
Wherein the diameter of the thermosensitive phase change capsule is 2-35 mu m.
Wherein, the matrix glue layer is a ceramic affinity glue layer, and the ceramic affinity glue layer comprises an acrylic resin glue layer.
Wherein the thickness of the thermosensitive phase-change layer is 25-100 μm, and the thickness of the supporting film layer is 38-175 μm.
Wherein the thermosensitive phase change protective film further comprises: and the release film layer covers one side of the thermosensitive phase change layer far away from the support film layer.
Wherein the thickness of the release film layer is 25-175 mu m; and/or the number of the groups of groups,
Wherein the total thickness of the supporting film layer and the thermosensitive phase change layer is 60-275 μm.
In order to solve the technical problems, the application adopts another scheme that: provided is a multilayer ceramic capacitor including: a die; and the thermosensitive phase change protective film wraps the tube core.
In order to solve the technical problems, the application adopts another scheme that: a preparation method of a thermosensitive phase change protective film is provided, which comprises the following steps: dispersing the thermosensitive phase change capsules in a solution containing a matrix gel layer to form a first dispersion;
continuously adding a matrix glue layer into the first dispersion liquid to obtain a second dispersion liquid;
coating the second dispersion liquid roller on the supporting film layer;
Drying the solvent in the second dispersion liquid, and forming a thermosensitive phase change layer by the thermosensitive phase change capsule and the matrix adhesive layer;
and a release film layer is arranged on one side of the thermosensitive phase change layer, which is far away from the support film layer.
Unlike the prior art, the application has the beneficial effects that: the thermosensitive phase change protective film of the present application comprises: a support film layer and a thermosensitive phase change layer which are laminated; the thermosensitive phase change layer comprises a matrix adhesive layer and thermosensitive phase change capsules positioned in the matrix adhesive layer, wherein the thermosensitive phase change capsules comprise a shell and phase change particles positioned in the shell. The debonding temperature of the thermosensitive phase change protective film can be increased by selecting phase change particles of a suitable phase change temperature. The thermosensitive phase change protective film is applied to the laminated ceramic capacitor manufacturing process, plays a role in fixing the laminated ceramic capacitor substrate through higher ceramic initial viscosity, and is beneficial to the stability of the cutting manufacturing process; and the ceramic capacitor can be sensitized quickly under the condition of high temperature to generate phase change, so that the viscosity of the matrix adhesive layer is greatly reduced, the viscosity of the matrix adhesive layer is removed quickly, and the matrix adhesive layer is not remained to pollute the laminated ceramic capacitor. The thermosensitive phase change protective film can be applied to processing of laminated ceramic capacitors of a finer size, for example, 1005 size or a laminated ceramic capacitor of a size smaller than 1 mm.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. Wherein:
FIG. 1 is a schematic structural view of an embodiment of a thermosensitive phase change protective film according to the present application;
FIG. 2 is a schematic diagram of a multilayer ceramic capacitor according to an embodiment of the present application;
Fig. 3 is a schematic flow chart of an embodiment of a method for preparing a thermosensitive phase change protective film according to the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a thermosensitive phase change protective film according to the present application. The thermosensitive phase change protective film 1 provided by the present application includes: a support film layer 10 and a thermosensitive phase change layer 12 are laminated. The thermosensitive phase change layer 12 includes a matrix gel layer 122 and thermosensitive phase change capsules 120 located in the matrix gel layer 122, and the thermosensitive phase change capsules 120 include a shell 1201 and phase change particles 1202 located inside the shell 1201. In this embodiment, the support film layer 10 may be a polyester-based film. The polyester film is biaxially oriented and has an effective thickness of 4 μm to 188 μm, for example ,4μm、10μm、15μm、20μm、25μm、30μm、35μm、40μm、45μm、50μm、55μm、60μm、65μm、70μm、80μm、90μm、100μm、110μm、120μm、130μm、140μm、150μm、160μm、170μm、175μm、180μm、188μm. Preferably, the thickness of the polyester-based film is 100 μm.+ -. 3. Mu.m, for example, 97 μm, 98 μm, 99 μm, 100 μm, 101 μm, 102 μm, 103 μm, etc. In other embodiments, other film materials may be used for the support film layer 10, such as ethylene/vinyl acetate film, polyethylene based film, polystyrene film, polyvinyl chloride film, polypropylene film, polyolefin film, polyamide film, polyimide film, polyethylene terephthalate film, etc., which are not limited in this regard. Alternatively, the housing 1201 may be made of a resin material, or of course, other materials, such as plastic, polyolefin, etc., which are not limited in the present application, and may be softened or melted after being heated.
The thermosensitive phase change protective film 1 of the present application adopts the thermosensitive phase change layer 12 comprising the matrix gel layer 122 and the thermosensitive phase change capsules 120 located in the matrix gel layer 122, and the debonding temperature of the thermosensitive phase change protective film 1 can be increased by selecting the phase change particles 1202 with appropriate phase change temperature. For example, if the phase change temperature of the phase change particles 1202 exceeds 150 ℃, the debonding temperature of the thermosensitive phase change protective film 1 exceeds 150 ℃. The thermosensitive phase change protective film 1 can be sensitized rapidly under the condition of high temperature to generate phase change, so that the viscosity of the matrix adhesive layer 122 is greatly reduced, and the viscosity of the matrix adhesive layer 122 is removed.
In one embodiment, with continued reference to FIG. 1, the phase change particles 1202 may be paraffin ester particles that flow out of the housing 1201 into the substrate glue layer 122 after being melted by heat, and the paraffin ester does not have a viscosity, thereby inhibiting the viscosity of the substrate glue layer 122. In other embodiments, azide prepolymer particles may be used for the phase change particles 1202. The azide prepolymer particles as a foaming agent can be suitably processed by the coating of the above-mentioned case 1201. After the azide prepolymer particles are heated and decomposed, gases such as carbon dioxide, nitrogen and the like are released, the shell 1201 is expanded and expanded, and the compound with pores is formed by reacting with the matrix glue layer 122, so that the surface tension is reduced, and the matrix glue layer 122 is ensured not to lose viscosity in the temperature range from 25 ℃ to 150 ℃. When the processing temperature exceeds 150 ℃, the surface tension of the base glue layer 122 increases and the tackiness disappears. In other embodiments, the phase change particles 1202 may also be pressurized liquid gas particles, which are heated to generate vaporization, and after expanding the housing 1201, the gas enters the matrix glue layer 122 to expand the matrix glue layer 122, so that the viscosity of the glue is lost. In the present application, the material of the phase change particles 1202 is not limited, and the phase change temperature of the phase change particles 1202 is 100 to 190 ℃, for example, 100 ℃,110 ℃,120 ℃,130 ℃,140 ℃, 150 ℃, 160 ℃, 170 ℃, 180 ℃, 190 ℃, and the like.
Of course, in other embodiments, the phase change particles 1202 may also include a plurality of paraffin particles, azide pre-polymer particles, and pressurized liquid gas particles, which are not limited in the present application, and the thermal sensitive phase change capsule 120 may be only required to expand in volume after being heated, so as to break the housing 1201 into the matrix glue layer 122, thereby reducing the viscosity of the matrix glue layer 122.
In another embodiment, with continued reference to FIG. 1, the thermosensitive phase-change capsules 120 have a diameter of 2-35 μm, e.g., 2 μm, 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, etc.
In yet another embodiment, referring still to FIG. 1, the interior of the housing 1201 further includes thermally sensitive catalytic particles 1203 to induce a phase change reaction under suitable temperature conditions. In this embodiment, the mass ratio of the thermally-sensitive catalytic particles 1203 to the phase change particles 1202 is not more than three percent, e.g., one percent, two percent, three percent, etc. The thermosensitive catalytic particle 1203 in the above ratio range can reduce the cost in realizing the acceleration of the phase change reaction.
In yet another embodiment, with continued reference to FIG. 1, the matrix gel layer 122 is a ceramic affinity gel layer to provide a higher initial ceramic viscosity. The base glue layer 122 has affinity for ceramics, has a variable working viscosity, and the working viscosity can be adjusted according to the surface characteristics of ceramics, and the working viscosity is 50g/25 mm-500 g/25mm, such as ,50g/25mm、60g/25mm、70g/25mm、80g/25mm、90g/25mm、100g/25mm、150g/25mm、200g/25mm、250g/25mm、300g/25mm、350g/25mm、400g/25mm、450g/25mm、500g/25mm and the like.
Further, the matrix glue layer 122, i.e., the ceramic affinity glue layer in the above embodiment, includes an acrylic glue layer, wherein the thickness of the acrylic glue layer is 50 μm±3 μm, for example, 47 μm, 48 μm, 49 μm, 50 μm, 51 μm, 52 μm, 53 μm, etc. In other embodiments, other materials may be used for the matrix glue layer 122, which is not limited in the present application, and only needs to ensure that the matrix glue layer 122 is made of a ceramic affinity material.
In yet another embodiment, referring to FIG. 1, the thermosensitive phase-change layer 12 has a thickness of 25 to 100 μm, for example, 25 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, etc.; the thickness of the support film layer 10 is 38 to 175. Mu.m, for example, 38 μm, 45 μm, 55 μm, 65 μm, 75 μm, 85 μm, 95 μm, 105 μm, 115 μm, 125 μm, 135 μm, 145 μm, 155 μm, 165 μm, 175 μm, or the like.
Further, as shown in fig. 1, the thermosensitive phase change protective film 1 further includes a release film layer 14, and the release film layer 14 covers a side of the thermosensitive phase change layer 12 away from the supporting film layer 10. In this embodiment, the release film layer 14 may be a polyester film. The polyester film is biaxially oriented and has an effective thickness of 4 μm to 188 μm, for example ,4μm、10μm、15μm、20μm、25μm、30μm、35μm、40μm、45μm、50μm、55μm、60μm、65μm、70μm、80μm、90μm、100μm、110μm、120μm、130μm、140μm、150μm、160μm、170μm、175μm、180μm、188μm. Preferably, the thickness of the polyester-based film is 50 μm.+ -. 3. Mu.m, for example, 47 μm, 48 μm, 49 μm, 50 μm, 51 μm, 52 μm, 53 μm, etc. In other embodiments, other film materials may be used for the release film layer 14, such as ethylene/vinyl acetate film, polyethylene film, polystyrene film, polyvinyl chloride film, polypropylene film, polyolefin film, polyamide film, polyimide film, polyethylene terephthalate film, etc., which are not limited in the present application. In this embodiment, the thickness of the release film layer 14 is 25 to 175 μm, for example, 25 μm, 35 μm, 45 μm, 55 μm, 65 μm, 75 μm, 85 μm, 95 μm, 105 μm, 115 μm, 125 μm, 135 μm, 145 μm, 155 μm, 165 μm, 175 μm, or the like. The total thickness of the support film layer 10 and the thermosensitive phase-change layer 12 is 60 to 275 μm, for example, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 125 μm, 150 μm, 175 μm, 200 μm, 250 μm, 275 μm, etc.
Referring to fig. 2, fig. 2 is a schematic structural diagram of an embodiment of a multilayer ceramic capacitor according to the present application. The multilayer ceramic capacitor 2 includes a die 22 and a thermally sensitive phase change protective film 20 in any of the embodiments described above. The structure of the thermosensitive phase change protective film 20 can be referred to any of the above embodiments, and will not be described herein. In this embodiment, the thermosensitive phase change protective film 20 is wrapped on the die 22 to ensure the stability of the cutting process of the laminated ceramic capacitor 2.
In the multilayer ceramic capacitor 2 provided in this embodiment, the improved thermosensitive phase change protective film 20 is wrapped on the die 22, and the working viscosity is increased because the thermosensitive phase change protective film 20 is made of a ceramic affinity material. The ceramic has higher initial viscosity, plays a role in fixing the laminated ceramic capacitor substrate, and is beneficial to the stability of the processing process of the cutting process. The debonding temperature of the thermosensitive phase change protective film can be increased by selecting phase change particles with proper phase change temperature; and the quick sensitization under the high temperature condition generates phase change, so that the viscosity of the adhesive layer is greatly reduced, and the adhesive layer is quickly removed without residual adhesive. The thermosensitive phase change protective film is applied to the laminated ceramic capacitor manufacturing process, plays a role in fixing the laminated ceramic capacitor substrate through higher ceramic initial viscosity, and is beneficial to the stability of the cutting manufacturing process; and the ceramic capacitor can be sensitized quickly under the condition of high temperature to generate phase change, so that the viscosity of the matrix adhesive layer is greatly reduced, the viscosity of the matrix adhesive layer is removed quickly, and the matrix adhesive layer is not remained to pollute the laminated ceramic capacitor. The thermosensitive phase change protective film can be applied to processing of laminated ceramic capacitors of a finer size, for example, 1005 size or a laminated ceramic capacitor of a size smaller than 1 mm.
Referring to fig. 3, fig. 3 is a schematic flow chart of an embodiment of a method for preparing a thermosensitive phase change protective film according to the present application, which specifically includes:
S11: the thermosensitive phase change capsules are dispersed in a solution containing a matrix gel layer to form a first dispersion.
Specifically, in one embodiment, the mass ratio of the thermosensitive phase change capsule to the matrix gel layer is 30% -50%, for example, 30%, 35%, 40%, 45%, 50%, etc., so that the thermosensitive phase change capsule can exert the greatest effect. In addition, the solution containing the substrate glue layer also contains a solvent, and the solvent can be an ester solvent.
S12: and continuously adding a matrix glue layer to the first dispersion liquid to obtain a second dispersion liquid.
Specifically, the objective of this step S12 is to continue to dilute the thermosensitive phase change capsule, where the first dispersion and the matrix gel layer are diluted in a mass ratio of 1:10, where the concentration of the dilution is 3% -30%, for example, 3%, 5%, 10%, 15%, 20%, 25%, 30%, etc., so as to obtain the second dispersion.
S13: the second dispersion is roll coated onto the support film layer.
Specifically, in the present embodiment, the speed of roll coating is controlled to 8 to 15m/min, for example, 8m/min, 9m/min, 10m/min, 11m/min, 12m/min, 13m/min, 14m/min, 15m/min, etc.; wherein the temperature of the roll coating axis is 40 to 50 ℃, for example, 40 ℃, 41 ℃, 42 ℃, 43 ℃, 44 ℃, 45 ℃, 46 ℃, 47 ℃, 48 ℃, 49 ℃, 50 ℃, etc.
S14: and drying the solvent in the second dispersion liquid, and forming a thermosensitive phase change layer by the thermosensitive phase change capsule and the matrix adhesive layer.
Specifically, the second dispersion may be baked using an infrared light constant temperature oven. In other embodiments, other tools may be used to dry the solvent in the second dispersion, for example, a constant temperature drying oven, which is not limited in the present application, and only needs to have functions of constant temperature and drying. Wherein the baking time is 5-10 min, for example, 5min, 6min, 7min, 8min, 9min, 10min, etc. The baking temperature is controlled to be 120-150 ℃, for example, 120 ℃, 125 ℃, 130 ℃, 135 ℃, 140 ℃, 145 ℃, 150 ℃, etc.
S15: and a release film layer is arranged on one side of the thermosensitive phase change layer, which is far away from the support film layer.
In summary, unlike the prior art, the thermosensitive phase change layer in the thermosensitive phase change protective film of the present application includes a matrix gel layer and thermosensitive phase change capsules located in the matrix gel layer, and the thermosensitive phase change capsules include a shell and phase change particles located inside the shell. The debonding temperature of the thermosensitive phase change protective film can be increased by selecting phase change particles of a suitable phase change temperature. The thermosensitive phase change protective film is applied to the laminated ceramic capacitor manufacturing process, plays a role in fixing the laminated ceramic capacitor substrate through higher ceramic initial viscosity, is favorable for stabilizing the cutting manufacturing process, is rapidly sensitized to generate phase change under the condition of high temperature, and greatly reduces the adhesive layer viscosity, so that the adhesive layer viscosity is rapidly removed, the adhesive is not remained to pollute the laminated ceramic capacitor, and the thermosensitive phase change protective film can be suitable for processing laminated ceramic capacitors with more tiny sizes, for example, 1005 sizes or laminated ceramic capacitors with sizes smaller than 1 mm.
The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the application, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present application or directly or indirectly applied to other related technical fields are included in the scope of the present application.
Claims (10)
1. A thermosensitive phase change protective film, comprising:
A support film layer and a thermosensitive phase change layer which are laminated;
the thermosensitive phase change layer comprises a matrix adhesive layer and thermosensitive phase change capsules located in the matrix adhesive layer, the thermosensitive phase change capsules comprise a shell and phase change particles located in the shell, and the phase change particles are used for expanding the volume of the thermosensitive phase change capsules after being heated and destroying the shell to enter the matrix adhesive layer.
2. The thermosensitive phase change protective film according to claim 1, wherein,
The phase change particles include at least one of paraffin ester particles, azide prepolymer particles, and pressurized liquid gas particles.
3. The protective film according to claim 1 or 2, wherein,
The housing also includes thermally sensitive catalytic particles therein.
4. The protective film according to claim 1, wherein,
The diameter of the thermosensitive phase change capsule is 2-35 mu m.
5. The protective film according to claim 1, wherein,
The matrix glue layer is a ceramic affinity glue layer, and the ceramic affinity glue layer comprises an acrylic resin glue layer.
6. The protective film according to claim 1, wherein,
The thickness of the thermosensitive phase change layer is 25-100 mu m, and the thickness of the supporting film layer is 38-175 mu m.
7. The thermosensitive phase change protective film according to claim 1, further comprising:
And the release film layer covers one side of the thermosensitive phase change layer far away from the support film layer.
8. The protective film according to claim 7, wherein,
The thickness of the release film layer is 25-175 mu m; and/or the number of the groups of groups,
The total thickness of the supporting film layer and the thermosensitive phase change layer is 60-275 mu m.
9. A multilayer ceramic capacitor comprising:
A die;
The thermosensitive phase change protective film according to any one of claims 1 to 8, wherein the thermosensitive phase change protective film wraps the die.
10. A method of producing the thermosensitive phase change protective film according to any one of claims 1 to 8, comprising:
Dispersing the thermosensitive phase change capsules in a solution containing a matrix gel layer to form a first dispersion;
Continuously adding the matrix glue layer into the first dispersion liquid to obtain second dispersion liquid;
Coating the second dispersion liquid on a supporting film layer by roller;
Drying the solvent in the second dispersion liquid, wherein the thermosensitive phase change capsules and the matrix glue layer form a thermosensitive phase change layer;
and a release film layer is arranged on one side of the thermosensitive phase change layer, which is far away from the support film layer.
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