CN111901961B - Intelligent circuit board capable of working in water and manufacturing method thereof - Google Patents
Intelligent circuit board capable of working in water and manufacturing method thereof Download PDFInfo
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- CN111901961B CN111901961B CN202010790010.5A CN202010790010A CN111901961B CN 111901961 B CN111901961 B CN 111901961B CN 202010790010 A CN202010790010 A CN 202010790010A CN 111901961 B CN111901961 B CN 111901961B
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- module
- power management
- chip
- copper sheet
- metal shielding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0275—Security details, e.g. tampering prevention or detection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0227—Split or nearly split shielding or ground planes
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Computer Security & Cryptography (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses an intelligent circuit board capable of working in water, which comprises a metal shielding cover, a copper sheet, a control chip, a power management chip, a connecting wire and a module function chip, wherein the metal shielding cover is grounded, the copper sheet is arranged on the inner side of the metal shielding cover and is electrically connected with the control chip. When an accident happens to cause the structure of a certain module of the circuit board to be damaged, the circuit board can automatically power off to protect the module from further damage, and data is backed up under possible conditions.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to an intelligent circuit board capable of working in water and a manufacturing method thereof.
Background
Data is very important for everyone, the existing data regular backup and protection technology can regularly backup the data, and control special data (including privacy and confidentiality) cannot be leaked out, but for abnormal conditions in sudden, especially personal computer or smart phone products, under the unexpected conditions such as falling or water entering, the data which is not stored in external storage (still in a volatile memory RAM) is often lost.
At present, on cell-phone and thing networking equipment, almost all have waterproof design, and these equipment adopt the design of waterproof glue of installation in shell connection position more, but this kind of design has two kinds of defects:
firstly, the disassembly and maintenance are inconvenient;
secondly, once the waterproof glue is damaged or the shell is deformed and damaged, the internal circuit board can enter water when the water is soaked again, and then the circuit board can not work normally or even be damaged permanently, and data loss can be caused.
Some companies adopt a method for smearing waterproof glue on a circuit board, so that waterproof protection on most parts on the circuit board can be realized, but the defects that electrochemical corrosion of electrodes can be caused when water enters the interface, the interface is easy to damage, parts connected with the interface can be burnt out due to short circuit under severe conditions, after the circuit board is smeared with the waterproof glue, a glue removing process is added for circuit board maintenance, the difficulty is increased, and if the interface is also smeared with the waterproof glue, the maintenance difficulty is increased.
Disclosure of Invention
The invention aims to solve the problems that data is easy to lose when accidents happen, the waterproof performance of a circuit board is poor, the circuit board manufactured by the existing scheme is difficult to maintain after being manufactured into a product and the like in the prior art, and provides an intelligent circuit board capable of working in water and a manufacturing method thereof.
In order to achieve the purpose, the invention provides the following technical scheme: a manufacturing method of an intelligent circuit board capable of working in water comprises a metal shielding cover, a copper sheet, a control chip, a power management chip, a connecting wire and a module function chip, wherein the metal shielding cover is grounded, the copper sheet is arranged on the inner side of the metal shielding cover and is electrically connected with the control chip, the copper sheet is electrically connected with the power management chip, the power management chip is electrically connected with the control chip, the power management chip is electrically connected with the module function chip, and the connecting wire is arranged on one side of the upper end of the module function chip;
the manufacturing method comprises the following steps:
firstly, performing modular design and wiring according to the functions of each part, wherein a circuit board is provided with two modules, a metal shielding cover is arranged at the edge of a module area, the metal shielding cover is grounded, a copper sheet for detecting liquid is arranged on the inner side of the metal shielding cover, the copper sheet is connected with a power management chip and is powered by the power management chip, the copper sheet is also connected with a control chip, the power management chip is connected with the control chip, the power management chip is connected with a module function chip, and the distance between the metal shielding cover and the copper sheet, the resistance value between the copper sheet and the power management chip and the detection voltage output by the power management chip can be adjusted;
step two, when water enters the copper sheet after the metal shielding cover is damaged or the metal shielding cover deforms and contacts the copper sheet, the ground potential of the copper sheet is reduced to cause interruption of the control chip, and then the control chip controls the power management chip to be powered off to prevent further damage;
and step three, if the module with the damaged metal shielding cover structure is not the central processing module, the control chip in the module can also report the abnormal information to the central processing module, the central processing module can immediately perform data backup, generate an internal memory dump and store the internal memory dump in an external memory, and try to cooperate with the communication module so as to upload local data to a cloud end for backup.
And step four, the power management chip in the module also has an output current sensing function, when the current exceeds a preset threshold value, the power management chip can be subjected to power-off protection and is reported to the control chip, if the module with the current exceeding the preset threshold value is detected not to be the central processing module, the control chip in the module can also report abnormal information to the central processing module, the central processing module can immediately perform data backup, an internal memory dump is generated and stored in an external memory, the control chip and the communication module are tried to cooperate so as to upload local data to a cloud end for backup, and the connection line between the modules can be subjected to traditional circuit board paint spraying insulation protection.
Preferably, when the circuit board interface needs to use a metal interface connection structure, a smooth area is reserved around the female interface, a sealed sucker is installed around the male interface, when interface materials are manufactured, an external connection electrode is processed by a method of copper oxidation, silver plating, titanium plating or gold plating, after the interface is welded on the circuit board, a welding pin is coated with waterproof glue, and under the other conditions, a pluggable optical communication interface with rubber friction is adopted.
Preferably, the metal shielding case comprises a completely closed structure of the bottom welding spot.
Compared with the prior art, the invention provides an intelligent circuit board supporting underwater work and a manufacturing method thereof, and the intelligent circuit board has the following beneficial effects:
1. the invention can automatically backup data to protect data when internal abnormality is detected, and can normally run without damage when soaked in water. When an accident causes the structure of a certain module of the circuit board to be damaged, the module can be automatically powered off to protect the module from further damage, and data is backed up under possible conditions, so that the waterproof circuit board and the product manufactured by using the waterproof circuit board are easy to maintain, and are particularly suitable for the fields of mobile phone waterproofing, Internet of things equipment waterproofing, robot waterproofing and the like;
2. the circuit board design scheme provided by the invention can work normally in water, can immediately transfer the data dump in the memory to the external memory when the internal abnormality is detected, and upload the local data to the cloud server for backup under possible conditions, and can automatically backup the data after the abnormality is detected, including backup at local and cloud;
the device has the advantages that the structure is scientific and reasonable, the use is safe and convenient, and great help is provided for people.
Drawings
FIG. 1 is a circuit diagram of a module according to the present invention;
fig. 2 is a schematic circuit diagram of a module two according to the present invention.
Description of the reference numerals
1. A metal shield case; 2. a copper sheet; 3. a control chip; 4. a power management chip; 5. connecting wires; 6. and (5) a module functional chip.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-2, the present invention provides a technical solution: a method for manufacturing an intelligent circuit board capable of working in water comprises a metal shielding cover 1, a copper sheet 2, a control chip 3, a power management chip 4, a connecting wire 5 and a module function chip 6, and is characterized in that: the metal shielding case 1 is grounded, a copper sheet 2 is arranged on the inner side of the metal shielding case 1, the copper sheet 2 is electrically connected with the control chip 3, the copper sheet 2 is electrically connected with the power management chip 4, the power management chip 4 is electrically connected with the control chip 3, the power management chip 4 is electrically connected with the module function chip 6, and a connecting wire 5 is arranged on one side of the upper end of the module function chip 6;
the manufacturing method comprises the following steps:
firstly, performing modular design and wiring according to the functions of each part, wherein a circuit board is provided with two modules, a metal shielding cover 1 is arranged at the edge of a module area, the metal shielding cover 1 is grounded, a copper sheet 2 for detecting liquid is arranged on the inner side of the metal shielding cover 1, the copper sheet 2 is connected with a power management chip 4 and is powered by the power management chip 4, the copper sheet 2 is also connected with a control chip 3, the power management chip 4 is connected with the control chip 3, the power management chip 4 is connected with a module function chip 6, the distance between the metal shielding cover 1 and the copper sheet 2, the resistance value between the copper sheet 2 and the power management chip 4 and the detection voltage output by the power management chip 4 can be adjusted;
step two, when water enters the copper sheet 2 after the metal shielding case 1 is damaged or the metal shielding case 1 deforms and contacts the copper sheet 2, the ground potential of the copper sheet 2 is reduced to cause the interruption of the control chip 3, and then the control chip 3 controls the power management chip 4 to be powered off to prevent further damage;
and step three, if the damaged module of the metal shielding cover 1 is not the central processing module, the control chip 3 in the module can also report the abnormal information to the central processing module, the central processing module can immediately perform data backup, generate an internal memory dump and store the internal memory dump in an external memory, and try to cooperate with the communication module so as to upload local data to a cloud for backup.
And step four, the power management chip 4 in the module also has an output current sensing function, when the current exceeds a preset threshold value, the power management chip 4 can be subjected to power-off protection and is reported to the control chip 3, if the module with the current exceeding the preset threshold value is detected not to be a central processing module, the control chip 3 in the module can also report abnormal information to the central processing module, the central processing module can immediately perform data backup, generate a memory dump and store the memory dump in an external memory, and try to cooperate with the communication module so as to upload local data to a cloud end for backup, and a connecting line 5 between the modules can be subjected to traditional circuit board paint spraying insulation protection.
When a metal interface connection structure is required to be used for a circuit board interface, a smooth area is reserved around a female interface, a sealed sucker is installed around a male interface, when interface materials are manufactured, an external connection electrode is processed by adopting a copper oxidation, silver plating, titanium plating or gold plating method, after the interface is welded on the circuit board, a welding pin is coated with waterproof glue, and a pluggable optical communication interface with rubber friction is adopted under the other conditions.
The metal shielding case 1 adopts a completely closed structure including a bottom welding spot.
The working principle and the using process of the invention are as follows: when the device is used, modular design and wiring are firstly carried out according to the functions of each part, a circuit board in the following figure is provided with two modules, a metal shielding cover 1 is arranged at the edge of a module area, the metal shielding cover 1 is grounded, a copper sheet 2 for detecting liquid is arranged on the inner side of the metal shielding cover 1, the copper sheet 2 is connected with a power management chip 4 and is powered by the power management chip 4, the copper sheet 2 is also connected with a control chip 3, the power management chip 4 is connected with the control chip 3, the power management chip 4 is connected with a module function chip 6, the distance between the metal shielding cover 1 and the copper sheet 2, the resistance value between the copper sheet 2 and the power management chip 4 and the detection voltage output by the power management chip 4 can be adjusted, when the metal shielding cover 1 is damaged and water enters the copper sheet 2 or the metal shielding cover 1 is deformed and contacts the copper sheet 2, the ground potential of the copper sheet 2 can be reduced, the control chip 3 is interrupted, then the control chip 3 controls the power management chip 4 to be powered off to prevent further damage, if the damaged module of the metal shielding case 1 is not the central processing module, the control chip 3 in the module can also report abnormal information to the central processing module, the central processing module can immediately perform data backup, generate a memory dump and store the memory dump in an external memory, and try to cooperate with a communication module to upload local data to a cloud for backup, the power management chip 4 in the module is also provided with an output current sensing function, when the current exceeds a preset threshold value, the power management chip 4 can be powered off for protection and report the local data to the control chip 3, if the module with the current exceeding the preset threshold value is detected not the central processing module, the control chip 3 in the module can also report the abnormal information to the central processing module, and the central processing module can immediately perform data backup, and generating a memory dump and storing the memory dump in an external memory, and trying to cooperate with a communication module so as to upload local data to a cloud end for backup, wherein the connecting line 5 between the modules is protected by adopting traditional circuit board paint spraying insulation.
The invention can automatically backup data to protect the data when internal abnormality is detected, and can normally run and not be damaged when being soaked in water; when an accident happens to cause the structure of a certain module of the circuit board to be damaged, the circuit board can automatically power off to protect the module from further damage, and data is backed up if possible; the waterproof circuit board and the product manufactured by using the waterproof circuit board are easy to maintain, and are particularly suitable for the fields of mobile phone waterproofing, Internet of things equipment waterproofing, robot waterproofing and the like;
the circuit board design scheme provided by the invention can work normally in water, and can immediately transfer the data dump in the memory to the external memory when the internal abnormality is detected, and upload the local data to the cloud server for backup under possible conditions; the data can be automatically backed up after the abnormality is detected, including local backup and cloud backup;
the device has the advantages that the structure is scientific and reasonable, the use is safe and convenient, and great help is provided for people.
The preferred embodiments of the present invention have been described above in detail, but the present invention is not limited thereto. Within the scope of the technical idea of the invention, many simple modifications can be made to the technical solution of the invention, including combinations of various technical features in any other suitable way, and these simple modifications and combinations should also be regarded as the disclosure of the invention, and all fall within the scope of the invention.
Claims (3)
1. The manufacturing method of the intelligent circuit board capable of working in water comprises a metal shielding cover (1), a copper sheet (2), a control chip (3), a power management chip (4), a connecting wire (5) and a module function chip (6), and is characterized in that: the metal shielding cover (1) is grounded, a copper sheet (2) is arranged on the inner side of the metal shielding cover (1), the copper sheet (2) is electrically connected with the control chip (3), the copper sheet (2) is electrically connected with the power management chip (4), the power management chip (4) is electrically connected with the control chip (3), the power management chip (4) is electrically connected with the module function chip (6), and a connecting wire (5) is arranged on one side of the upper end of the module function chip (6);
the manufacturing method comprises the following steps:
firstly, performing modular design and wiring according to the functions of each part, wherein a circuit board is provided with two modules, a metal shielding cover (1) is arranged at the edge of a module area, the metal shielding cover (1) is grounded, a copper sheet (2) for detecting liquid is arranged on the inner side of the metal shielding cover (1), the copper sheet (2) is connected with a power management chip (4) and is powered by the power management chip (4), the copper sheet (2) is also connected with a control chip (3), the power management chip (4) is connected with the control chip (3), the power management chip (4) is connected with a module function chip (6), the distance between the metal shielding cover (1) and the copper sheet (2), the resistance value between the copper sheet (2) and the power management chip (4), and the detection voltage output by the power management chip (4) can be adjusted;
step two, when water enters the copper sheet (2) after the metal shielding cover (1) is damaged or the metal shielding cover (1) deforms and contacts the copper sheet (2), the ground potential of the copper sheet (2) is reduced to cause interruption of the control chip (3), and then the control chip (3) controls the power management chip (4) to be powered off to prevent further damage;
step three, if the damaged module of the metal shielding cover (1) is not the central processing module, the control chip (3) in the module can also report abnormal information to the central processing module, the central processing module can immediately perform data backup, generate an internal memory dump and store the internal memory dump in an external memory, and try to cooperate with the communication module so as to upload local data to a cloud end for backup;
and step four, the power management chip (4) in the module also has an output current sensing function, when the current exceeds a preset threshold value, the power management chip (4) can be subjected to power-off protection and is reported to the control chip (3), if the module with the current exceeding the preset threshold value is detected not to be a central processing module, the control chip (3) in the module can also report abnormal information to the central processing module, the central processing module can immediately perform data backup, a memory dump is generated and stored in an external memory, the memory dump and the communication module are tried to cooperate so as to upload local data to a cloud end for backup, and the connecting line (5) between the modules can be subjected to traditional circuit board paint spraying insulation protection.
2. The manufacturing method of claim 1, wherein when the circuit board interface has to use a metal interface connection structure, a smooth area is left around the female interface, a sealed sucker is installed around the male interface, when the interface material is manufactured, the external connection electrode is processed by copper oxidation, silver plating, titanium plating or gold plating, after the interface is welded on the circuit board, the welding pin is coated with waterproof glue, otherwise, a pluggable optical communication interface with rubber friction is used.
3. Method of manufacturing according to claim 1, characterized in that the metallic shielding can (1) comprises a completely closed structure with a bottom weld.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010790010.5A CN111901961B (en) | 2020-08-07 | 2020-08-07 | Intelligent circuit board capable of working in water and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010790010.5A CN111901961B (en) | 2020-08-07 | 2020-08-07 | Intelligent circuit board capable of working in water and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN111901961A CN111901961A (en) | 2020-11-06 |
| CN111901961B true CN111901961B (en) | 2021-09-28 |
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| CN202010790010.5A Active CN111901961B (en) | 2020-08-07 | 2020-08-07 | Intelligent circuit board capable of working in water and manufacturing method thereof |
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| CN101969486A (en) * | 2010-10-13 | 2011-02-09 | 华为终端有限公司 | Method and circuit for preventing mobile terminal from waterlogged damage and mobile terminal |
| WO2011016159A1 (en) * | 2009-08-06 | 2011-02-10 | パナソニック株式会社 | Portable wireless device |
| CN102724335A (en) * | 2012-04-16 | 2012-10-10 | 中兴通讯股份有限公司 | Waterproofing device |
| CN202551167U (en) * | 2012-03-21 | 2012-11-21 | 青岛百灵信息科技有限公司 | Automatic power off device of wet cell phone |
| CN106603760A (en) * | 2016-12-06 | 2017-04-26 | 上海斐讯数据通信技术有限公司 | Water-in automatic protection circuit and method for achieving same |
| CN210327664U (en) * | 2019-10-29 | 2020-04-14 | 盘新建 | Waterproof structure and mobile phone or searchlight thereof |
-
2020
- 2020-08-07 CN CN202010790010.5A patent/CN111901961B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1889050A (en) * | 2006-07-26 | 2007-01-03 | 华为技术有限公司 | System and method for raising single-board exception handling ability |
| WO2011016159A1 (en) * | 2009-08-06 | 2011-02-10 | パナソニック株式会社 | Portable wireless device |
| CN101969486A (en) * | 2010-10-13 | 2011-02-09 | 华为终端有限公司 | Method and circuit for preventing mobile terminal from waterlogged damage and mobile terminal |
| CN202551167U (en) * | 2012-03-21 | 2012-11-21 | 青岛百灵信息科技有限公司 | Automatic power off device of wet cell phone |
| CN102724335A (en) * | 2012-04-16 | 2012-10-10 | 中兴通讯股份有限公司 | Waterproofing device |
| CN106603760A (en) * | 2016-12-06 | 2017-04-26 | 上海斐讯数据通信技术有限公司 | Water-in automatic protection circuit and method for achieving same |
| CN210327664U (en) * | 2019-10-29 | 2020-04-14 | 盘新建 | Waterproof structure and mobile phone or searchlight thereof |
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| CN111901961A (en) | 2020-11-06 |
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