CN111900110A - Semiconductor chip laminated film assembly - Google Patents
Semiconductor chip laminated film assembly Download PDFInfo
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- CN111900110A CN111900110A CN202010770421.8A CN202010770421A CN111900110A CN 111900110 A CN111900110 A CN 111900110A CN 202010770421 A CN202010770421 A CN 202010770421A CN 111900110 A CN111900110 A CN 111900110A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a semiconductor chip laminated film assembly which comprises four support columns, wherein the tops of two support columns on the left side are fixedly connected with a feeding table, the tops of two support columns on the right side are fixedly connected with a transmission table, the feeding table is fixedly connected with the transmission table, and the outer wall of the rear side of the transmission table is fixedly connected with a molding press. According to the invention, the hydraulic cylinder, the stepping motor, the lead screw, the bearing, the mounting plate, the screw sleeve, the driving round rod and the driving rod are matched for use, so that the stepping motor drives the lead screw to rotate, the lead screw drives the driving round rod to move through threads, the driving round rod is driven to rotate through the driving of the hydraulic cylinder, and further, the high consistency of the whole production process is realized through the matching of the plurality of driving rods, so that the flatness and the void ratio of a wafer after core mounting are ensured, the problem of the utilization rate of production equipment caused by the identification problem of a post process is further improved, and the productivity of the whole assembly process is improved.
Description
Technical Field
The invention relates to the technical field of chip processing, in particular to a semiconductor chip laminated film component.
Background
Along with the progress of society, the intelligent degree is continuously deepened, the use of semiconductor devices is increasingly wide, the requirements on the quality reliability and the straightness of products are higher and higher, and how to improve the reliability of the semiconductor devices is always the direction of continuous research and development of each semiconductor packaging and testing industry.
When the existing semiconductor chip die-pressing processing is carried out, the tin pressing and core feeding of a product are both carried out in a distributed mode, so that the consistency of the product is poor, the flatness and the void ratio of the wafer after core feeding are low, the problem of the utilization rate of product equipment caused by the recognition problem of a post process can be reduced, and the productivity of the whole assembly process is low.
Disclosure of Invention
The invention aims to provide a semiconductor chip film pressing assembly which has the advantages of good consistency in the production process of products and high productivity of an assembly process, and solves the problems that in the existing semiconductor chip film pressing process, tin pressing and core loading of the products are both distributed, so that the consistency of the products is poor, the flatness and the void ratio are low after the core loading of a wafer are carried out by the mode, the utilization rate of product equipment caused by the identification problem of a post process is reduced, and the productivity of the whole assembly process is low.
In order to achieve the purpose, the invention provides the following technical scheme: the semiconductor chip die assembly comprises four support columns, a feeding table fixedly connected to the tops of the two support columns on the left side, a transmission table fixedly connected to the tops of the two support columns on the right side, the feeding table and the transmission table are fixedly connected, a die press is fixedly connected to the outer wall of the rear side of the transmission table, a controller is installed on the front side of the front surface of the die press, three heating mechanisms are arranged inside the transmission table, a hydraulic cylinder is fixedly connected to the left side of the inner wall of the die press, a transmission mechanism is arranged on the right side of the top of the transmission table, and a driving mechanism is arranged on the front side of the die press.
Preferably, the surface of the hydraulic cylinder is welded with a mounting piece, and the mounting piece is fixedly connected with the molding press through a bolt.
Preferably, the heating mechanism comprises a mounting groove arranged inside the transmission platform, the bottom of the inner wall of the mounting groove is fixedly connected with a heating block through a bolt, the top of the inner wall of the mounting groove is fixedly connected with a heat-conducting block, the top of the heating block is in contact with the heat-conducting block, and the bottom of the transmission platform is provided with a switch matched with the heating block.
Preferably, drive mechanism includes step motor, step motor's output shaft fixedly connected with lead screw, the right side fixedly connected with mounting panel at transmission bench top, the left side fixedly connected with bearing of mounting panel inner wall, the inner wall and the lead screw fixed connection of bearing, the surperficial threaded connection of lead screw has the silk cover.
Preferably, actuating mechanism includes the bearing frame, the quantity of bearing frame is two, and the inner wall of two bearing frames runs through and is provided with the drive round bar, the right side fixedly connected with adapter sleeve on drive round bar surface, the rear side and the silk cover fixed connection of adapter sleeve, the three actuating lever of fixed surface connection of drive round bar.
Preferably, the output end of the hydraulic cylinder is fixedly connected with the connecting sleeve.
Preferably, the surface of the stepping motor is welded with an installation sleeve, the installation sleeve is annular, and the top and the bottom of the front surface of the installation sleeve are fixedly connected with the molding press through bolts.
Preferably, the top of the transmission table is provided with a moving groove, the inner wall of the moving groove is connected with a moving block in a sliding manner, the top of the moving block is provided with a connecting hole, and the connecting hole is matched with the driving rod.
Preferably, the top of the feeding table is provided with a track.
Preferably, the controller, the hydraulic cylinder, the stepping motor and the switch are electrically connected.
Compared with the prior art, the invention has the following beneficial effects:
1. according to the invention, the hydraulic cylinder, the stepping motor, the lead screw, the bearing, the mounting plate, the screw sleeve, the driving round rod and the driving rod are matched for use, so that the stepping motor drives the lead screw to rotate, the lead screw drives the driving round rod to move through threads, the driving round rod is driven to rotate through the driving of the hydraulic cylinder, and further, the high consistency of the whole production process is realized through the matching of the plurality of driving rods, so that the flatness and the void ratio of a wafer after core mounting are ensured, the problem of the utilization rate of production equipment caused by the identification problem of a post process is further improved, and the productivity of the whole assembly process is improved.
2. The heating device comprises a heating mechanism, a heating groove, a heating block, a heat conduction block, a driving rod, a preheating mechanism, a core feeding mechanism and a core feeding mechanism, wherein the heating mechanism is arranged on the heating mechanism, and the heating mechanism is arranged on the heating mechanism.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a top view of the connecting structure of the loading platform and the transferring platform;
FIG. 3 is a circuit control block diagram of the present invention.
In the figure: 1. a support pillar; 2. a feeding table; 21. a track; 3. a transfer station; 31. a moving groove; 32. a moving block; 33. connecting holes; 4. a molding press; 5. a controller; 6. a heating mechanism; 61. mounting grooves; 62. a heating block; 63. a heat conducting block; 64. a switch; 7. a hydraulic cylinder; 8. a transmission mechanism; 81. a stepping motor; 82. a screw rod; 83. a bearing; 84. mounting a plate; 85. sleeving the silk; 9. a drive mechanism; 91. a bearing seat; 92. a driving round bar; 93. connecting sleeves; 94. a drive rod.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 3 of the drawings,
example 1:
the invention provides a technical scheme that: semiconductor chip pressure membrane module, including four support columns 1, be located two support columns 1 top fixedly connected with material loading platform 2 on the left, track 21 has been seted up at the top of material loading platform 2, be located two support columns 1's on right top fixedly connected with transmission platform 3, material loading platform 2 and transmission platform 3 fixed connection, the outer wall fixedly connected with molding press 4 of transmission platform 3 rear side, controller 5 is installed to the front side on molding press 4 positive surface, the inside of transmission platform 3 is provided with three heating mechanism 6, the left side fixedly connected with hydraulic cylinder 7 of molding press 4 inner wall, the right side at transmission platform 3 top is provided with drive mechanism 8, the front side of molding press 4 is provided with actuating mechanism 9.
In this embodiment, the surface of the hydraulic cylinder 7 is welded with a mounting member, and the mounting member is fixedly connected to the molding press 4 by a bolt.
As shown in fig. 1: in this embodiment, the heating mechanism 6 includes the mounting groove 61 that is set up inside the transmission platform 3, there is a heating block 62 through bolt fixedly connected with the bottom of the inner wall of the mounting groove 61, there is a heat conduction block 63 fixedly connected with the top of the inner wall of the mounting groove 61, the top of the heating block 62 contacts with the heat conduction block 63, the bottom of the transmission platform 3 is provided with a switch 64 that matches with the heating block 62, through the mounting groove 61, the heating block 62, the heat conduction block 63 and the driving rod 94 cooperate to form a heating region, three heating mechanisms 6 form three heating regions, the three heating regions are respectively preheating, core heating and cooling regions, through the setting of the three heating regions, the uniformity of the tin material layer is ensured, thereby greatly improving the flatness of the tin material layer.
FIG. 1 shows: in this embodiment, the transmission mechanism 8 includes a stepping motor 81, an output shaft of the stepping motor 81 is fixedly connected with a lead screw 82, a right side fixedly connected with mounting plate 84 at the top of the transmission platform 3, a left side fixedly connected with bearing 83 at the inner wall of the mounting plate 84, the inner wall of the bearing 83 is fixedly connected with the lead screw 82, a surface thread of the lead screw 82 is connected with a screw sleeve 85, a surface welding of the stepping motor 81 is provided with a mounting sleeve, the mounting sleeve is annular, the top and the bottom of the front surface of the mounting sleeve are both fixedly connected with the molding press 4 through bolts, and the controller 5, the hydraulic cylinder 7, the stepping motor 81 and the switch 64 are.
FIG. 1 shows: in this embodiment, the driving mechanism 9 includes the bearing seats 91, the number of the bearing seats 91 is two, the inner walls of the two bearing seats 91 are provided with the driving round rods 92 in a penetrating manner, the right side fixedly connected with connecting sleeve 93 on the surface of the driving round rods 92, the rear side of the connecting sleeve 93 is fixedly connected with the screw sleeve 85, the surface fixedly connected with three driving rods 94 of the driving round rods 92, and the output end of the hydraulic cylinder 7 is fixedly connected with the connecting sleeve 93.
FIG. 2 shows: in this embodiment, the top of the transmission platform 3 is provided with a moving groove 31, the inner wall of the moving groove 31 is slidably connected with a moving block 32, the top of the moving block 32 is provided with a connecting hole 33, and the connecting hole 33 is matched with the driving rod 94.
Example 2:
the invention provides a technical scheme that: a semiconductor chip die assembly comprises four supporting columns 1, wherein the tops of two supporting columns 1 on the left side are fixedly connected with a feeding table 2, feeding operation is carried out through the feeding table 2, a rail 21 is arranged on the top of the feeding table 2, in actual use, a user can place an element in the inner wall of the rail 21, the tops of two supporting columns 1 on the right side are fixedly connected with a transmission table 3, the feeding table 2 is fixedly connected with the transmission table 3, the outer wall on the rear side of the transmission table 3 is fixedly connected with a die press 4, the die press 4 is common equipment in the industry and is not described in detail, a controller 5 is installed on the front side of the front surface of the die press 4, the controller 5 is a product known in the market and is not described in detail herein, three heating mechanisms 6 are arranged inside the transmission table 3, each heating mechanism 6 comprises an installation groove 61 arranged inside the transmission table 3, and the bottom of the inner wall of the installation groove 61 is fixedly connected, the top of the inner wall of the mounting groove 61 is fixedly connected with a heat conducting block 63, the top of the heating block 62 is contacted with the heat conducting block 63, the bottom of the transmission platform 3 is provided with a switch 64 matched with the heating block 62, the controller 5, the hydraulic cylinder 7, the stepping motor 81 and the switch 64 are electrically connected, the left side of the inner wall of the molding press 4 is fixedly connected with the hydraulic cylinder 7, the surface of the hydraulic cylinder 7 is welded with a mounting piece, the mounting piece is fixedly connected with the molding press 4 through bolts, the right side of the top of the transmission platform 3 is provided with a transmission mechanism 8, the transmission mechanism 8 comprises the stepping motor 81, the output shaft of the stepping motor 81 is fixedly connected with a screw rod 82, the right side of the top of the transmission platform 3 is fixedly connected with a mounting plate 84, the left side of the inner wall of the mounting plate 84 is fixedly connected with a bearing 83, the inner, the shape of the mounting sleeve is annular, the top and the bottom of the front surface of the mounting sleeve are fixedly connected with a molding press 4 through bolts, a driving mechanism 9 is arranged on the front side of the molding press 4, the driving mechanism 9 comprises bearing seats 91, the number of the bearing seats 91 is two, the inner walls of the two bearing seats 91 are provided with driving round rods 92 in a penetrating manner, a connecting sleeve 93 is fixedly connected to the right side of the surface of the driving round rod 92, the rear side of the connecting sleeve 93 is fixedly connected with a wire sleeve 85, three driving rods 94 are fixedly connected to the surface of the driving round rod 92, the output end of a hydraulic cylinder 7 is fixedly connected with the connecting sleeve 93, a moving groove 31 is formed in the top of the transmission table 3, a moving block 32 is slidably connected to the inner wall of the moving groove 31, a connecting hole.
Example 3:
the invention provides a technical scheme that: a semiconductor chip laminated film assembly comprises four supporting columns 1, two supporting columns 1 on the left side are fixedly connected with a feeding table 2 on the top, a track 21 is formed in the top of the feeding table 2, two supporting columns 1 on the right side are fixedly connected with a transmission table 3 on the top, the feeding table 2 is fixedly connected with the transmission table 3, an outer wall of the rear side of the transmission table 3 is fixedly connected with a molding press 4, a controller 5 is installed on the front side of the front surface of the molding press 4, three heating mechanisms 6 are arranged inside the transmission table 3, each heating mechanism 6 comprises an installation groove 61 arranged inside the transmission table 3, a heating block 62 is fixedly connected to the bottom of the inner wall of the installation groove 61 through a bolt, a heat conduction block 63 is fixedly connected to the top of the inner wall of the installation groove 61, the top of the heating block 62 is in contact with the heat conduction block 63, a switch 64 matched with the, The heating block 62, the heat conduction block 63 and the driving rod 94 are matched to form a heating area, three heating mechanisms 6 form three heating areas which are respectively a preheating area, a core-feeding heating area and a cooling area, the uniformity of a tin material layer is ensured through the arrangement of the three heating areas, so that the flatness of the tin material layer is greatly improved, the controller 5, the hydraulic cylinder 7, the stepping motor 81 and the switch 64 are electrically connected, the hydraulic cylinder 7 is fixedly connected to the left side of the inner wall of the molding press 4, the surface of the hydraulic cylinder 7 is welded with a mounting part, the mounting part is fixedly connected with the molding press 4 through a bolt, the hydraulic cylinder 7 which is detachably connected can facilitate advanced and convenient maintenance of a user in a long-term use process, the transmission mechanism 8 is arranged on the right side of the top of the transmission table 3, the transmission mechanism 8 comprises the stepping motor 81, and the output shaft, the right side of the top of the transmission platform 3 is fixedly connected with a mounting plate 84, the left side of the inner wall of the mounting plate 84 is fixedly connected with a bearing 83, the inner wall of the bearing 83 is fixedly connected with a screw rod 82, the surface of the screw rod 82 is in threaded connection with a screw sleeve 85, the surface of a stepping motor 81 is welded with a mounting sleeve, the mounting sleeve is in an annular shape, the top and the bottom of the front surface of the mounting sleeve are fixedly connected with a molding press 4 through bolts, the hydraulic cylinder 7, the stepping motor 81, the screw rod 82, the bearing 83, the mounting plate 84, the screw sleeve 85, a driving round rod 92 and a driving rod 94 are matched for use, so that the stepping motor 81 drives the screw rod 82 to rotate, the screw rod 82 drives the driving round rod 92 to move through threads, the driving mechanism 9 is arranged on the front side of the molding press 4, the driving mechanism 9 comprises two bearing, the right side fixedly connected with adapter sleeve 93 on drive round bar 92 surface, the rear side and the silk braid 85 fixed connection of adapter sleeve 93, the three actuating lever 94 of fixed surface connection of drive round bar 92, hydraulic cylinder 7's output and adapter sleeve 93 fixed connection, shifting chute 31 has been seted up at the top of transmission platform 3, the inner wall sliding connection of shifting chute 31 has movable block 32, connecting hole 33 has been seted up at the top of movable block 32, connecting hole 33 and actuating lever 94 looks adaptation, drive through hydraulic cylinder 7, drive round bar 92 and rotate, further cooperation through a plurality of actuating levers 94, realize that whole product production process reaches higher uniformity, thereby roughness and the void fraction of wafer behind the last core have been guaranteed, further promotion back process is because the problem of the apparatus for producing utilization rate that the recognition problem caused, the productivity of whole assembly process has been promoted.
Example 4:
the invention provides a technical scheme that: the semiconductor chip laminated assembly comprises four supporting columns 1, wherein the tops of two supporting columns 1 positioned on the left side are fixedly connected with a feeding table 2, the top of the feeding table 2 is provided with a track 21, the tops of two supporting columns 1 positioned on the right side are fixedly connected with a transmission table 3, the feeding table 2 is fixedly connected with the transmission table 3, the outer wall of the rear side of the transmission table 3 is fixedly connected with a molding press 4, the front side of the front surface of the molding press 4 is provided with a controller 5,
in the embodiment, three heating mechanisms 6 are arranged inside the conveying table 3, each heating mechanism 6 comprises a mounting groove 61 arranged inside the conveying table 3, the bottom of the inner wall of the mounting groove 61 is fixedly connected with a heating block 62 through a bolt, the top of the inner wall of the mounting groove 61 is fixedly connected with a heat conduction block 63, the top of the heating block 62 is contacted with the heat conduction block 63, the bottom of the conveying table 3 is provided with a switch 64 matched with the heating block 62, the mounting groove 61, the heating block 62, the heat conduction block 63 and a driving rod 94 are matched to form a heating region, the three heating mechanisms 6 form three heating regions which are respectively preheating, core-feeding heating and cooling regions, wherein the preheating temperature is about 300 ℃, the core-feeding heating temperature is about 380 ℃, the cooling region is about 250 ℃, and the uniformity of a tin material layer is ensured through the arrangement of the three heating regions, thereby great improvement the planarization on tin material layer, controller 5, hydraulic cylinder 7, step motor 81 and switch 64 electric connection, the left side fixedly connected with hydraulic cylinder 7 of molding press 4 inner wall, the skin weld of hydraulic cylinder 7 has the installed part, the installed part passes through bolt and molding press 4 fixed connection, hydraulic cylinder 7 through detachable connection can the person of facilitating the use advance convenient maintenance to it in long-term use.
In this embodiment, the right side at the top of the transmission platform 3 is provided with the transmission mechanism 8, the transmission mechanism 8 includes the step motor 81, the output shaft fixedly connected with lead screw 82 of step motor 81, the right side fixedly connected with mounting panel 84 at the top of the transmission platform 3, the left side fixedly connected with bearing 83 of the inner wall of mounting panel 84, the inner wall and the lead screw 82 fixed connection of bearing 83, the surface threaded connection of lead screw 82 has the silk braid 85, the skin weld of step motor 81 has the installation cover, the shape of installation cover is the annular, the top and the bottom on the installation cover front surface all pass through bolt and die press 4 fixed connection, through hydraulic cylinder 7, step motor 81, lead screw 82, bearing 83, mounting panel 84, silk braid 85, drive round bar 92 and actuating lever 94 cooperation use, make step motor 81 drive lead screw 82 rotate, lead screw 82 drives drive round bar 92 through the screw and remove.
In this embodiment, a driving mechanism 9 is disposed on the front side of the molding press 4, the driving mechanism 9 includes two bearing seats 91, two bearing seats 91 are provided, a driving round rod 92 is disposed on the inner wall of each bearing seat 91, a connecting sleeve 93 is fixedly connected to the right side of the surface of the driving round rod 92, the rear side of the connecting sleeve 93 is fixedly connected to the screw sleeve 85, three driving rods 94 are fixedly connected to the surface of the driving round rod 92, the output end of the hydraulic cylinder 7 is fixedly connected to the connecting sleeve 93, the hydraulic cylinder 7 drives the driving round rod 92 to rotate, and further, the matching of a plurality of driving rods 94 realizes the higher consistency of the whole production process, thereby guaranteed the roughness and the voidage of wafer after the last core, further promoted the problem of back process because the production facility utilization ratio that the recognition problem caused, promoted the productivity of whole assembly process.
In this embodiment, the top of the transmission platform 3 is provided with a moving groove 31, the inner wall of the moving groove 31 is slidably connected with a moving block 32, the top of the moving block 32 is provided with a connecting hole 33, and the connecting hole 33 is matched with the driving rod 94.
In this embodiment, a user controls the switch h1 and the switch h2 respectively through the controller 5, the switch h3 controls the temperature of the three heating zones, after the feeding is completed, the controller 5 controls the operation of the stepping motor 81, and simultaneously controls the opening and closing of the hydraulic cylinder 7 to complete the operation of the matched material conveying.
The working principle is as follows: when the invention is used, a user loads materials through the track 21, then starts the stepping motor 81, drives the screw rod 82 to rotate ninety degrees clockwise and then rotate ninety degrees counterclockwise through the output shaft of the stepping motor 81 to reset, drives the screw sleeve 85 to reciprocate left and right through the arrangement of the screw threads on the surface of the screw rod 82, drives the driving rod 94 to rotate through the connecting sleeve 93, so that the driving rod 94 drives the moving block 32 to slide in the inner wall of the moving groove 31 through the connecting hole 33, starts the hydraulic cylinder 7, drives the connecting sleeve 93 to rotate forty-five degrees downwards through the output end of the hydraulic cylinder 7, then rotates forty-five degrees upwards to reset, so as to drive elements to transmit, and through the matching use of the plurality of driving rods 94, the advantages of good consistency and high productivity of assembly procedures in the production process of the semiconductor chip pressure film assembly are achieved, and through the arrangement of, preheating the component of track 21 department, when dripping the tin operation again, go up the core heating, go up the chip and go out when the piece, get into the cooling zone and carry out slow cooling, the homogeneity on the tin material layer has been guaranteed, thereby great improvement the planarization on tin material layer, current semiconductor chip moulding-die man-hour has been solved, the product presses tin, it all adopts the distribution operation to go up the core, the uniformity that leads to the product is relatively poor, this kind of mode is lower at roughness and the void ratio after the wafer goes on the core, the back process that can reduce equally causes because of the discernment problem is to product equipment utilization ratio problem, and then cause the lower problem of whole assembly process productivity.
In summary, the following steps: the semiconductor chip laminated membrane assembly is matched with a hydraulic cylinder 7, a stepping motor 81, a screw rod 82, a bearing 83, a mounting plate 84, a thread sleeve 85, a driving round rod 92 and a driving rod 94 for use, so that the stepping motor 81 drives the driving round rod 82 to rotate, the screw rod 82 drives the driving round rod 92 to move through threads, the driving round rod 92 is driven to rotate through the hydraulic cylinder 7, the whole production process of a product is further matched through the driving rods 94, high consistency of the whole production process is achieved, the flatness and the void ratio of the wafer after core loading are guaranteed, the problem of the utilization rate of production equipment caused by recognition problems in the later process is further improved, the capacity of the whole assembly process is improved, a heating region is formed by matching the mounting groove 61, the heating block 62, the heat conducting block 63 and the driving rod 94, and three heating mechanisms 6 form three heating regions, the three heating areas are respectively a preheating area, a core feeding heating area and a cooling area, and the uniformity of a tin material layer is ensured by the arrangement of the three heating areas, so that the smoothness of the tin material layer is greatly improved, the problems that the flatness and the void ratio are low after the core feeding of a wafer are carried out, the utilization rate of product equipment caused by the recognition problem of a post process is also reduced, and the capacity of the whole assembly process is low are solved.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. Semiconductor chip press mold subassembly includes four support columns (1), its characterized in that: be located left two support column (1) top fixedly connected with material loading platform (2), be located top fixedly connected with transmission platform (3) of two support column (1) on right side, material loading platform (2) and transmission platform (3) fixed connection, the outer wall fixedly connected with molding press (4) of transmission platform (3) rear side, controller (5) are installed to the front side on positive surface of molding press (4), the inside of transmission platform (3) is provided with three heating mechanism (6), left side fixedly connected with hydraulic cylinder (7) of molding press (4) inner wall, the right side at transmission platform (3) top is provided with drive mechanism (8), the front side of molding press (4) is provided with actuating mechanism (9).
2. The semiconductor chip laminated film assembly according to claim 1, wherein: the surface welding of hydraulic cylinder (7) has the installed part, and the installed part passes through bolt and molding press (4) fixed connection.
3. The semiconductor chip laminated film assembly according to claim 1, wherein: heating mechanism (6) are including offering mounting groove (61) inside transmission platform (3), bolt fixedly connected with heating piece (62) is passed through to the bottom of mounting groove (61) inner wall, top fixedly connected with heat conduction piece (63) of mounting groove (61) inner wall, the top and the contact of heat conduction piece (63) of heating piece (62), switch (64) with heating piece (62) looks adaptation are installed to the bottom of transmission platform (3).
4. The semiconductor chip laminated film assembly according to claim 1, wherein: drive mechanism (8) include step motor (81), output shaft fixedly connected with lead screw (82) of step motor (81), the right side fixedly connected with mounting panel (84) at transmission platform (3) top, the left side fixedly connected with bearing (83) of mounting panel (84) inner wall, the inner wall and lead screw (82) fixed connection of bearing (83), the surperficial threaded connection of lead screw (82) has silk braid (85).
5. The semiconductor chip laminated film assembly according to claim 1, wherein: actuating mechanism (9) are including bearing frame (91), the quantity of bearing frame (91) is two, and the inner wall of two bearing frames (91) runs through and is provided with drive round bar (92), the right side fixedly connected with adapter sleeve (93) on drive round bar (92) surface, the rear side and silk cover (85) fixed connection of adapter sleeve (93), the three actuating lever (94) of fixed surface connection of drive round bar (92).
6. The semiconductor chip laminated film assembly according to claim 5, wherein: the output end of the hydraulic cylinder (7) is fixedly connected with the connecting sleeve (93).
7. The semiconductor chip laminated film assembly according to claim 4, wherein: the surface of the stepping motor (81) is welded with an installation sleeve, the installation sleeve is annular, and the top and the bottom of the front surface of the installation sleeve are fixedly connected with the molding press (4) through bolts.
8. The semiconductor chip laminated film assembly according to claim 1, wherein: the top of the transmission table (3) is provided with a moving groove (31), the inner wall of the moving groove (31) is connected with a moving block (32) in a sliding mode, the top of the moving block (32) is provided with a connecting hole (33), and the connecting hole (33) is matched with the driving rod (94).
9. The semiconductor chip laminated film assembly according to claim 1, wherein: the top of the feeding table (2) is provided with a track (21).
10. The semiconductor chip laminated film assembly according to claim 3 or 4, wherein: the controller (5), the hydraulic cylinder (7), the stepping motor (81) and the switch (64) are electrically connected.
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| CN202010770421.8A CN111900110B (en) | 2020-08-04 | 2020-08-04 | Semiconductor chip laminated film assembly |
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| CN202010770421.8A CN111900110B (en) | 2020-08-04 | 2020-08-04 | Semiconductor chip laminated film assembly |
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| CN111900110B CN111900110B (en) | 2021-04-06 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040108582A1 (en) * | 2002-12-06 | 2004-06-10 | Samsung Electronics Co., Ltd. | In-line die attaching and curing apparatus for a multi-chip package |
| CN105304534A (en) * | 2015-11-10 | 2016-02-03 | 东莞市沃德精密机械有限公司 | Chip mounter |
| CN106735702A (en) * | 2016-12-29 | 2017-05-31 | 淄博才聚电子科技有限公司 | A kind of semiconductor devices automatic soldering device |
| CN108364892A (en) * | 2018-03-31 | 2018-08-03 | 广州明森科技股份有限公司 | A kind of burning chip equipment |
-
2020
- 2020-08-04 CN CN202010770421.8A patent/CN111900110B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040108582A1 (en) * | 2002-12-06 | 2004-06-10 | Samsung Electronics Co., Ltd. | In-line die attaching and curing apparatus for a multi-chip package |
| CN105304534A (en) * | 2015-11-10 | 2016-02-03 | 东莞市沃德精密机械有限公司 | Chip mounter |
| CN106735702A (en) * | 2016-12-29 | 2017-05-31 | 淄博才聚电子科技有限公司 | A kind of semiconductor devices automatic soldering device |
| CN108364892A (en) * | 2018-03-31 | 2018-08-03 | 广州明森科技股份有限公司 | A kind of burning chip equipment |
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| CN111900110B (en) | 2021-04-06 |
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