CN1118930C

CN1118930C - Quartz oscillation chip holder and making method thereof

Info

Publication number: CN1118930C
Application number: CN99108583A
Authority: CN
Inventors: J·皮根多尔菲; R·陶森德特菲尔; D·黑梅尔
Original assignee: Schott Glaswerke AG
Current assignee: Schott AG
Priority date: 1998-06-23
Filing date: 1999-06-23
Publication date: 2003-08-20
Anticipated expiration: 2019-06-23
Also published as: KR100341687B1; TW448615B; CN1240313A; JP2000031775A; KR20000006332A

Abstract

Quartz resonators have a quartz disc resonator which is accommodated in a holder situated on a base plate. There are holders which are welded onto the current lead-through pins, and the so-called integrated holder on the holder. However, the known integrated receptacles are not sufficiently mechanically flexible for the quartz resonator to be used at high frequencies above 14 MHz. According to the invention, the integrated quartz-resonator holder is designed in such a way that the tabs (8a, b) have a cutout (12a, b) which runs from the bent-off area up to the receiving seat (9a, b) so as to form two webs (10a, b), and the webs additionally have a notch (11a, b) in the bent-over edge.

Description

The support of quartz oscillation chip and manufacture method thereof

Technical field

The present invention relates to a kind of support of the quartz oscillation chip with a base plate and the manufacture method of this support.

Background technology

Quartz (controlled) oscillator has a wide range of applications in the information transmission technology and the field of computer technology in the communication technology.These quartz (controlled) oscillators come excited oscillation by voltage, and their natural mode shape is looked specification requirement and fixed on several KHz extremely greater than between the 100MHz.

Because crystal oscillator is responsive especially device, it not only must encapsulate hermetically but also should use and is rich in flexible support and fixes.Can is normally realized by so-called full glass shell or metal-back.Support receives two flexible spring, and the latter is welded in and passes base plate and wear on the pin with the water conservancy diversion of glass and its insulation.

For about wide frequency range of 0.8 to 20MHz, the thickness d of quartz wafer is suitable for following approximate formula: 1600/f (MHz)=d (μ m) as the function of frequency f.

Can obtain by this formula, along with the thickness of the increase quartz wafer of frequency then reduces.Here it is causes, and the amount of deflection that increases the quartz wafer support along with operating frequency must increase, and makes thus by mechanical load (as making the quartz wafer fracture) in the process medium frequency skew of contact resistance weldering sealing and the shock test dipstick metering to keep very little.Therefore when frequency＞14MHz, only can use the quartz wafer support of welding now.Though the quartz wafer support of welding shows enough amounts of deflection, (the spring distance of lengthening and the little cross section that is welded to connect) makes them have bigger transition contact resistance value because its characteristic.

Also known a kind of whole receiver, be the quartz wafer support, it and water conservancy diversion are worn pin and are constituted wholely, and wear the pin upper end at water conservancy diversion and are stamped into given shape to receive and secure (placement) quartz wafer.But it can not be used under the situation of frequency＞14MHz usually because it can not provide enough flexible, and when it according to crooked secondary described in DE 4216035 C1 and form when dwindling the bracket component of coupling part, can not be used.

The shortcoming of this known integral support is that it must have big mechanical strength during fabrication, because it is by prebuckling ground melt-forming and in order to prevent that the bending in the follow-up processing (electroplate, pack) from damaging and must be done hardly relatively.Under impact or vibrational loading, can cause local stress concentration and mechanical failure thus.

On the other hand, whole quartz wafer receiver has its advantage, promptly it and water conservancy diversion wear the tie point of pin be determine and can make with very little tolerance, and can realize little structure height.

Summary of the invention

Task of the present invention is, design a kind of described quartz oscillation chip support of part that begins with whole quartz wafer receiver, it also can use at high frequency (under＞14MHz) the situation, and also can avoid the damage of quartz oscillation chip when additional mechanical is loaded.

According to the present invention, this task is from beginning part described support, and realizes by a recess is set at least one bending area in tongue piece.

By measure according to the present invention, can advantageously reach the high mechanical bending deflection of quartz crystal receiver.

According to a further configuration of the present invention, this tongue piece has an aperture and constitutes two bridge limits.

Because the aperture in the tongue piece reduces the quality of quartz wafer receiver, has improved its vibration and impact characteristics thus.When according to another configuration, this aperture extends to the received block place always on whole tongue piece length, and this advantage will be more outstanding.

Therefore, can under high frequency, the application as low resistance also reach best electrical quantity simultaneously according to stent configuration of the present invention.

And propose, reach best amount of deflection in order to make the quartz crystal receiver, its tongue piece thickness will be done as far as possible for a short time.Therefore by water conservancy diversion wear the relative water conservancy diversion of low profile that pin goes out to the special punching out of tongue piece wear the diameter of pin should be very little.

According to a further configuration, tongue piece thickness is preferably 0.1mm to 0.12mm in 0.08 to 0.18mm scope.

According to another configuration of the present invention, the aperture in the tongue piece is formed by punching press, and this can make receiver moulding simply.

For the method for making this quartz oscillation chip, the solution of its task realizes by following steps:

-two water conservancy diversion are worn the pin sealing by fusing in the respective aperture of a base plate, they have been squeezed into earlier a flat tongue piece in the bracket side in sealing by fusing zone,

-make the outwardly-bent and moulding of tongue piece, form a elastic support in conjunction with the recess that is located at least in tongue piece one bending area with quartz oscillation chip received block.

The moulding of tongue piece or received block means that as last manufacturing step the intensity to tongue piece need not to consider follow-up manufacturing step.Therefore just can realize receiving the excellent resilient properties of tongue piece, to satisfy the high-quality requirement that the quartz wafer support is proposed.

Other configuration characteristic of the present invention and advantage can draw from the description to embodiment shown in the accompanying drawing,

Description of drawings

Fig. 1: according to the front view of quartz oscillation chip support of the present invention, wherein the part represents that with the cross section it is the so-called low profile structure with quartz (controlled) oscillator of horizontal supporting;

Fig. 2: the cross-sectional view of wearing quartz oscillation chip support shown in Fig. 1 of pin by a water conservancy diversion;

Fig. 3: the top view of quartz oscillation chip shown in Fig. 1;

The zoomed-in view of Fig. 4: Fig. 1 is used for representing in detail of two support tongue pieces;

Fig. 5: the perspective view of fragment shown in Figure 4, but wherein do not have the quartz oscillation chip that supports;

Fig. 6: the perspective view of similar Fig. 5, but have the tongue piece that is used for according to the vertical longitudinal extension of the quartz (controlled) oscillator vertical support frame of first embodiment;

Fig. 7: a perspective view of corresponding figures 6, but have the tongue piece of the vertical support frame that is used for second embodiment;

A perspective view of Fig. 8 corresponding figures 6, but have the tongue piece of the vertical support frame that is used for the 3rd embodiment.

Embodiment

Accompanying drawing is represented the holder part 1 of the quartz (controlled) oscillator of formation according to the present invention.Support 1 has a base plate 2, wherein is provided with two holes, and each is inserted with two water conservancy diversion by a sealing by fusing material 4 and wears

6a and 6b in this two hole.These water conservancy diversion are worn pin and are had round

section

7a and 7b, and they will extend into (Fig. 4) in the sealing by fusing material always, and change to flat,

bandy tongue piece

8a and 8b by extruding then.Water conservancy diversion is worn pin and is constituted

tongue piece

8a, 8b, promptly water conservancy diversion wear pin be squeezed in sealing by fusing the time just begin, especially as shown in Figure 4.

In all embodiment,

tongue piece

8a, 8b have recess 11a, a 11b at least, and it is flexible that they form tongue piece, so that it also can be used at the beginning part described high frequency (＞14MHz) quartz (controlled) oscillator under the situation.It is about 50% that recess reduces tongue piece thickness, can reach the obvious improvement of its amount of deflection thus.

In Fig. 1 to 5, express an embodiment of the horizontal stand of quartz oscillation chip 3.

Bandy tongue piece

8a, 8b have flat received

block

9a and 9b in its end.On these received blocks by silver conducting resinl 5 quartz oscillation chip 3 of bonding rectangle (strip quartz crystal) conductively mechanically and simultaneously.

Between the outlet of received

block

9a and 9b and

tongue piece

8a, 8b,, impact part and reach the sealing by fusing material always owing to go out

part

12a and 12b reduces the width of crimping section and the cross section of tongue thus.

Form bridge limit

10a and 10b by the impact portion branch, in addition, the inboard of first sweep is provided with

recess

11a and 11b above the sealing by fusing place.By not only in

bridge limit

10a and 10b zone the minimizing of material but also the recess 11a in first bending area and 11b amount of deflection will be improved significantly.

An embodiment of Fig. 6 to 8 expression quartz oscillation chip vertical support frame.

Bandy tongue piece

8a, 8b carry out the transition to a longitudinal extension part 8c, have a pod 9b in this longitudinal extension part, and it is as the receiving unit of quartz oscillation chip, as what seen from Fig. 1 of cited paper DE 4,216 035 C1.

Be provided with two

recess

11b and 11c in the embodiment shown in fig. 6, respectively be located at place to the vertical section transition.

In the embodiment shown in fig. 7, on perpendicular segment 8c, be additionally provided with an aperture 12b, formed flexible bridge limit 10b by it.

In the embodiment shown in fig. 8, be provided with aperture 12b equally, it is similar to horizontal stand shown in Figure 5, and this aperture extends to sealing by fusing always and constitutes Chang Qiao limit 10b from received block 9b.

In the case, recess 11b and 11c reach assisting of the 12b that blurts out the flexible of necessity are provided down.

Blurt out (groove) be very favorable especially for horizontal embodiment (Fig. 1-5) because this system uses the short lever arm of

tongue piece

8a, 8b to seem firmer.Under the situation of vertical embodiment (Fig. 6-8), groove 12 does not play this effect, because utilize this system of big lever arm of vertical longitudinal extension tongue piece just to provide big flexible naturally.Bracket table 1. quartz oscillation chip support 2. base plates 3. quartz oscillation chips 4. sealing by fusing materials 5. silver conducting resinl 6. water conservancy diversion are worn pin 7. and are worn 11. recesses, 12. apertures, pin section 8. tongue piece 9. received blocks, 10. bridge limits

Claims

1. the support that has the quartz oscillation chip (3) of a base plate (2), fix two water conservancy diversion therein and wearing pin (6a, b), they are configured flat tongue piece (8a, b) bandy, that be provided with the received block (9a, b) that receives quartz oscillation chip (3) usefulness at its free end in bracket side and it is characterized in that: tongue piece (8a, b) at least one bending area, be provided with a recess (11a, b)

2. according to the support of claim 1, it is characterized in that: these tongue pieces (8a, b) have an aperture (12a, b) and constitute two bridge limits (10a, b).

3. according to the support of claim 2, it is characterized in that: aperture (12a, b) extends to received block (9a, b) always and locates on whole tongue piece length.

4. according to the support of claim 2 or 3, it is characterized in that: aperture (12a, b) constitutes by punching out.

5. according to one support in the claim 1 to 4, it has by water conservancy diversion wears the tongue piece that the crimp of pin plane forms, and it is characterized in that: tongue piece thickness is preferably 0.1mm to 0.12mm in 0.08 to 0.18mm scope.

6. make according to one the method for support of quartz oscillation chip in the claim 1 to 5, have following steps:

-make the outwardly-bent and moulding of tongue piece, and form a elastic support with quartz oscillation chip received block in conjunction with the recess that is located at least in tongue piece-bending area.

7. according to the method for claim 6, it is characterized in that: at least one curved section, carry out the punching out in aperture.