CN111889834B - Method for manufacturing high-order mode absorber - Google Patents
Method for manufacturing high-order mode absorber Download PDFInfo
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- CN111889834B CN111889834B CN202010640143.4A CN202010640143A CN111889834B CN 111889834 B CN111889834 B CN 111889834B CN 202010640143 A CN202010640143 A CN 202010640143A CN 111889834 B CN111889834 B CN 111889834B
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- ring
- oxygen
- silicon carbide
- free copper
- copper ring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P21/00—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
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Abstract
The invention discloses a novel structure of a high-order mode absorber, which comprises silicon carbide with a barrel-shaped structure, an oxygen-free copper ring and a stainless steel ring, wherein the silicon carbide, the oxygen-free copper ring and the stainless steel ring are sequentially sleeved and assembled from inside to outside; an annular water channel for cooling is formed on the outer wall of the oxygen-free copper ring and the inner wall of the stainless steel ring together, and a welding flux groove and a positioning boss which are matched with each other are formed at the joint surfaces of the two ends of the oxygen-free copper ring and the stainless steel ring. The structure is simple, the volume is small, the manufacture is easy, the strength is high, the reliability is good, and the method is suitable for batch production. Also disclosed is a method of manufacture comprising: a. the feasibility demonstration of the thermal assembly of the oxygen-free copper ring and the silicon carbide; b. welding an oxygen-free copper ring and a stainless steel ring; c. installing an absorber; d. detecting the assembling tightness of the oxygen-free copper ring and the absorber; e. and (5) detecting the pressure of the water path. The method is simple, compact in structure, high in production success rate and short in cycle; meanwhile, chemicals and metal raw materials are less used in production and manufacturing, so that the production risk is reduced, and the environment protection is facilitated.
Description
Technical Field
The invention relates to a novel structure and a manufacturing method of a high-order mode absorber.
Background
The absorber is usually manufactured by adopting a structure of splicing and assembling a plurality of sheets, the manufacturing process is more, the structure is complex, and the absorption efficiency is low because gaps exist among the sheet silicon carbide. For absorption purposes, the structure size can only be increased to increase the silicon carbide area.
Disclosure of Invention
The invention aims to provide a novel structure of a high-order mode absorber, which has the advantages of simple structure, small volume, easy manufacture, high strength, good reliability and suitability for batch production.
The invention also aims to provide a manufacturing method of the high-order mode absorber, which has the advantages of simplicity, compact structure, high production success rate and short period; meanwhile, chemicals and metal raw materials are less used in production and manufacturing, so that the production risk is reduced, and the environment protection is facilitated.
In order to achieve the purpose, the invention provides a manufacturing method of a high-order mode absorber, which comprises a silicon carbide ring, an oxygen-free copper ring and a stainless steel ring which are of barrel-shaped structures, wherein the silicon carbide ring, the oxygen-free copper ring and the stainless steel ring are sequentially sleeved and assembled from inside to outside; an annular water channel for cooling is formed on the outer wall of the oxygen-free copper ring and the inner wall of the stainless steel ring together, and a solder groove and a positioning boss which are matched with each other are formed at the joint surfaces of the two ends of the oxygen-free copper ring and the stainless steel ring; wherein, the oxygen-free copper ring and the silicon carbide ring are fixed by thermal shrinkage, and the size of the barrel-shaped structure of the silicon carbide ring is phi 90 multiplied by phi 79.6 multiplied by 130 mm; the manufacturing method comprises the following steps:
step a, demonstrating feasibility of thermal assembly of the oxygen-free copper ring and the silicon carbide ring;
step b, welding the oxygen-free copper ring and the stainless steel ring;
c, mounting a silicon carbide ring;
d, detecting the assembling tightness of the oxygen-free copper ring and the silicon carbide ring;
and e, detecting the pressure of the water path.
Preferably, step a comprises: firstly, carrying out thermal simulation calculation aiming at a thermal assembly structure of a higher-order mode absorber; secondly, the strength of the silicon carbide ring is demonstrated; then, the feasibility of assembly was demonstrated; and finally, demonstrating the working reliability of the absorber in actual work.
Preferably, a vacuum furnace is used for brazing in the step b, the solder is DHLAgCuPd28-20, and the brazing temperature is 900 ℃.
Preferably, the step c comprises the steps of putting the oxygen-free copper ring and the stainless steel welding piece into a furnace integrally for heating, controlling the heating speed, heating to 180 ℃ within 1 hour, and then preserving heat; after the temperature is kept for 0.5h, taking the components out of the furnace, quickly putting the silicon carbide ring into the inner cavity of the oxygen-free copper ring, and then moving the silicon carbide ring into a purification room for natural cooling; and finally, checking whether the cooled absorber assembly is flush with the two end faces of the silicon carbide ring and the oxygen-free copper ring or not, and whether the end face of the silicon carbide ring is obviously protruded or recessed in the circumferential direction or not.
Preferably, the step d comprises heating the assembled assembly to 100 ℃ again after the silicon carbide ring is installed, and observing whether the silicon carbide ring and the oxygen-free copper ring have loosening and displacement phenomena; after cooling to normal temperature, injecting alcohol into the joint of the silicon carbide ring and the oxygen-free copper ring for 1min, and observing whether the alcohol seeps out from the other end.
Preferably, the step e comprises connecting a manual pressure test pump at the inlet end of the water cooling pipe of the absorber assembly, pressing the manual pressure test pump to discharge air in the water channel cavity of the absorber assembly, sealing the other end, pressurizing to 1.0MPa, and maintaining the pressure for 24h to check whether the water seepage phenomenon exists inside and outside the absorber assembly and whether the silicon carbide ring is intact or not.
According to the technical scheme, compared with other methods, the method is simple in production and manufacturing, compact in structure, high in production success rate and short in period. Moreover, chemicals and metal raw materials are less used, so that the production risk is reduced, and the environment protection is facilitated. Meanwhile, the material also combines the physical characteristics of the material, and has the advantages of ingenious design, high strength and good reliability.
Additional features and advantages of the invention will be set forth in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic diagram of the components of a higher order mode absorber of the present invention;
FIG. 2 is a schematic view of the welding of an oxygen-free copper ring to a stainless steel ring in the present invention;
FIG. 3 is a schematic structural view of an oxygen-free copper water-cooling ring according to the present invention;
FIG. 4 is a schematic view of a silicon carbide bucket structure according to the present invention.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
In the present invention, unless otherwise specified, the directional words "inside, outside" and the like included in a term merely represent the orientation of the term in a conventional use state or a colloquial meaning understood by those skilled in the art, and should not be construed as limiting the term.
Referring to fig. 1 to 4, the present invention provides a method for manufacturing a high-order mode absorber, the high-order mode absorber includes a silicon carbide ring, an oxygen-free copper ring and a stainless steel ring with a barrel-shaped structure, the silicon carbide ring, the oxygen-free copper ring and the stainless steel ring are sequentially sleeved and assembled from inside to outside; an annular water channel for cooling is formed on the outer wall of the oxygen-free copper ring and the inner wall of the stainless steel ring together, and a solder groove and a positioning boss which are matched with each other are formed at the joint surfaces of the two ends of the oxygen-free copper ring and the stainless steel ring; wherein, the oxygen-free copper ring and the silicon carbide ring are fixed by thermal shrinkage, and the size of the barrel-shaped structure of the silicon carbide ring is phi 90 multiplied by phi 79.6 multiplied by 130 mm; the manufacturing method comprises the following steps:
step a, demonstrating feasibility of thermal assembly of the oxygen-free copper ring and the silicon carbide ring;
step b, welding the oxygen-free copper ring and the stainless steel ring;
c, mounting a silicon carbide ring;
d, detecting the assembling tightness of the oxygen-free copper ring and the silicon carbide ring;
and e, detecting the pressure of the water path.
The step a comprises the following steps: firstly, carrying out thermal simulation calculation aiming at a thermal assembly structure of a higher-order mode absorber:
the size of the SiC ceramic is as follows: phi 90 x phi 79.6 x 130mm
Coefficient of expansion of SiC: 4.0x10-6/℃
The stainless steel has the following expansion coefficient: 17.0x10-6/℃(200℃)
The oxygen-free copper expansion coefficient is as follows: 17.3x10-6/℃(200℃)
The hot assembly temperature is 180 DEG C
Calculating the interference fit amount to be 0.22mm according to the conditions, and selecting phi 89.85 as the internal diameter of the oxygen-free copper ring by adopting the interference amount of 0.1-0.15mm because the SiC needs to be ensured to be tightly contacted with the outer sleeve after assembly+0.05mm。
Second, the strength of the silicon carbide ring was demonstrated:
the Vickers hardness of silicon carbide (SiC) is 22.2 +/-2.2 GPa, the pressure born by the SiC surface is 150MPa when the deformation of the inner surface of the oxygen-free copper ring is 0.22mm through computer simulation calculation, which is far less than the compressive strength of the material, and the product can be ensured not to be crushed after compression.
Then, the feasibility of the assembly was demonstrated:
according to data calculation, when the hot assembly temperature is 180 ℃, the expansion amount of the oxygen-free copper is 0.28mm, so that the fit clearance selected by us is 0.1-0.15mm, which can completely meet the requirement of hot shrinkage assembly.
Finally, the reliability of the absorber in actual operation is demonstrated, specifically:
because the main working mechanism of the high-order mode absorber is to convert microwave power into thermal power for consumption, if the working temperature of the absorber is higher than the thermal assembly temperature, the silicon carbide ring can fall off in the working process. The heat conduction of the high order mode absorber is calculated based on the above reasons, and 3KW power settlement (normal working power is 1KW) is calculated and selected, and the result is as follows:
the temperature rise gradient of the absorption cavity when subjected to 3KW of power was found to be 4.83 ℃ from the results calculated in the table above.
As can be seen from the above calculations, the theoretical calculation shows that the temperature rise of the water after the 3kW power is completely absorbed by the water is 4.76 ℃.
The welding of the oxygen-free copper ring and the stainless steel ring adopts DHLAgCuPd28-20 as welding material in order to ensure the strength, the welding temperature is about 900 ℃, and the welding process of the welding material and the two materials is mature. The expansion coefficient of stainless steel is 18.2 x10 when the reference temperature reaches 600 DEG C-6K, expansion coefficient of oxygen-free copper is 19.3X 10-6And the difference between the two is small, the stress in the welding process is small, and the deformation of the welded assembly is small.
Step c, putting the oxygen-free copper ring and the stainless steel welding piece into a furnace integrally, heating, controlling the heating speed, heating to 180 ℃ within 1 hour, and then preserving heat; after the temperature is kept for 0.5h, taking the components out of the furnace, quickly putting the silicon carbide ring into the inner cavity of the oxygen-free copper ring, and then moving the silicon carbide ring into a purification room for natural cooling; and finally, checking whether the cooled absorber assembly is flush with the two end faces of the silicon carbide ring and the oxygen-free copper ring or not, and whether the end face of the silicon carbide ring is obviously protruded or recessed in the circumferential direction or not.
The absorber assembly absorbs heat in actual work and is heated up, in order to ensure that the absorber is still firm and not loosened in the work, the step d comprises heating the assembled assembly to 100 ℃ again after the silicon carbide ring is installed, and observing whether the silicon carbide ring and the oxygen-free copper ring have loosening and displacement phenomena; after cooling to normal temperature, injecting alcohol into the joint of the silicon carbide ring and the oxygen-free copper ring for 1min, and observing whether the alcohol seeps out from the other end.
Because oxygen-free copper is thinner in the laminating department of oxygen-free copper ring and carborundum ring, and thickness is at 2mm, can warp under water-cooling water pressure's effect, also can extrude carborundum ring simultaneously, in order to ensure product safe and reliable after using, so will do the pressure test. According to computer simulation, when the absorber bears 3kW of power and the water flow rate is 0.15L/S, the cooling water pressure is 0.7Mpa/cm2, and the detection pressure is selected to be 1.0Mpa in consideration of the water pressure pulsation.
Therefore, the step e comprises the steps of connecting a manual pressure test pump at the inlet end of the water cooling pipe of the absorber assembly, pressing the manual pressure test pump to discharge air in the water channel cavity of the absorber assembly, sealing the other end, pressurizing to 1.0MPa, and maintaining the pressure for 24 hours to check whether the water seepage phenomenon exists inside and outside the absorber assembly and whether the silicon carbide ring is intact or not.
Therefore, compared with other methods, the invention has the advantages of simple production and manufacture, compact structure, high production success rate and short period. Moreover, chemicals and metal raw materials are less used, so that the production risk is reduced, and the environment protection is facilitated. Meanwhile, the material also combines the physical characteristics of the material, and has the advantages of ingenious design, high strength and good reliability.
The preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.
Claims (6)
1. The manufacturing method of the high-order mode absorber is characterized in that the high-order mode absorber comprises a silicon carbide ring, an oxygen-free copper ring and a stainless steel ring which are of barrel-shaped structures, and the silicon carbide ring, the oxygen-free copper ring and the stainless steel ring are sequentially sleeved and assembled from inside to outside; an annular water channel for cooling is formed on the outer wall of the oxygen-free copper ring and the inner wall of the stainless steel ring together, and a solder groove and a positioning boss which are matched with each other are formed at the joint surfaces of the two ends of the oxygen-free copper ring and the stainless steel ring; wherein, the oxygen-free copper ring and the silicon carbide ring are fixed by thermal shrinkage, and the size of the barrel-shaped structure of the silicon carbide ring is phi 90 multiplied by phi 79.6 multiplied by 130 mm; the manufacturing method comprises the following steps:
step a, demonstrating feasibility of thermal assembly of the oxygen-free copper ring and the silicon carbide ring;
step b, welding the oxygen-free copper ring and the stainless steel ring;
c, mounting a silicon carbide ring;
d, detecting the assembling tightness of the oxygen-free copper ring and the silicon carbide ring;
and e, detecting the pressure of the water path.
2. The method for manufacturing a higher order mode absorber according to claim 1, wherein step a comprises: firstly, carrying out thermal simulation calculation aiming at a thermal assembly structure of a higher-order mode absorber; secondly, the strength of the silicon carbide ring is demonstrated; then, the feasibility of assembly was demonstrated; and finally, demonstrating the working reliability of the absorber in actual work.
3. The method for manufacturing a high order mode absorber according to claim 1, wherein step b is performed by soldering using a vacuum furnace, the solder is DHLAgCuPd28-20, and the soldering temperature is 900 ℃.
4. The method for manufacturing a high-order mode absorber according to claim 1, wherein the step c comprises placing the oxygen-free copper ring and the stainless steel weldment integrally into a furnace for heating, controlling the heating speed, heating to 180 ℃ within 1 hour, and then preserving the heat; after the temperature is kept for 0.5h, taking the components out of the furnace, quickly putting the silicon carbide ring into the inner cavity of the oxygen-free copper ring, and then moving the silicon carbide ring into a purification room for natural cooling; and finally, checking whether the cooled absorber assembly is flush with the two end faces of the silicon carbide ring and the oxygen-free copper ring or not, and whether the end face of the silicon carbide ring is obviously protruded or recessed in the circumferential direction or not.
5. The method for manufacturing a high order mode absorber according to claim 1, wherein the step d comprises heating the assembled assembly to 100 ℃ again after the silicon carbide ring is installed, and observing whether the silicon carbide ring and the oxygen-free copper ring have loose displacement; after cooling to normal temperature, injecting alcohol into the joint of the silicon carbide ring and the oxygen-free copper ring for 1min, and observing whether the alcohol seeps out from the other end.
6. The method for manufacturing a high order mode absorber according to claim 1, wherein the step e comprises connecting a manual pressure test pump to the inlet end of the water cooling pipe of the absorber assembly, pressing the manual pressure test pump to discharge the air in the water channel cavity of the absorber assembly, sealing the other end, pressurizing to 1.0MPa, maintaining the pressure for 24h, and checking whether the water seepage phenomenon exists inside and outside the absorber assembly, and whether the silicon carbide ring is intact or not.
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4695766A (en) * | 1986-08-01 | 1987-09-22 | Raytheon Company | Traveling wave tube and its method of construction |
| CN101789534A (en) * | 2009-12-22 | 2010-07-28 | 安徽华东光电技术研究所 | High power box-shaped window |
| CN201552353U (en) * | 2009-12-04 | 2010-08-18 | 安徽华东光电技术研究所 | Soldering device of multi-wave traveling-wave tube absorber copper collar |
| CN201946560U (en) * | 2010-12-21 | 2011-08-24 | 安徽华东光电技术研究所 | Absorber structure of multi-beam traveling wave tube |
| CN202356812U (en) * | 2011-09-29 | 2012-08-01 | 安徽华东光电技术研究所 | Traveling wave tube collector welding clamp |
| CN103042285A (en) * | 2012-12-20 | 2013-04-17 | 宁波市锦泰橡塑有限公司 | Vacuum welding method of oxygen-free copper and stainless steel body |
| CN204720380U (en) * | 2015-07-09 | 2015-10-21 | 温州浙光电子有限公司 | A kind of can directly and the sealing ring of crunch seal |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE29820174U1 (en) * | 1998-11-02 | 1999-04-01 | Grigull, Dietmar, 58840 Plettenberg | Absorber pipe connection |
| JP6274541B2 (en) * | 2014-05-08 | 2018-02-07 | 国立大学法人東北大学 | Mode-locked laser, high-speed optical signal processing device, and spectrum spectroscopic measurement device |
-
2020
- 2020-07-06 CN CN202010640143.4A patent/CN111889834B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4695766A (en) * | 1986-08-01 | 1987-09-22 | Raytheon Company | Traveling wave tube and its method of construction |
| CN201552353U (en) * | 2009-12-04 | 2010-08-18 | 安徽华东光电技术研究所 | Soldering device of multi-wave traveling-wave tube absorber copper collar |
| CN101789534A (en) * | 2009-12-22 | 2010-07-28 | 安徽华东光电技术研究所 | High power box-shaped window |
| CN201946560U (en) * | 2010-12-21 | 2011-08-24 | 安徽华东光电技术研究所 | Absorber structure of multi-beam traveling wave tube |
| CN202356812U (en) * | 2011-09-29 | 2012-08-01 | 安徽华东光电技术研究所 | Traveling wave tube collector welding clamp |
| CN103042285A (en) * | 2012-12-20 | 2013-04-17 | 宁波市锦泰橡塑有限公司 | Vacuum welding method of oxygen-free copper and stainless steel body |
| CN204720380U (en) * | 2015-07-09 | 2015-10-21 | 温州浙光电子有限公司 | A kind of can directly and the sealing ring of crunch seal |
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