CN111885832B - Neutralizing and reducing solution for PCB (printed circuit board) glue removal post-treatment as well as preparation method and application thereof - Google Patents
Neutralizing and reducing solution for PCB (printed circuit board) glue removal post-treatment as well as preparation method and application thereof Download PDFInfo
- Publication number
- CN111885832B CN111885832B CN202010713257.7A CN202010713257A CN111885832B CN 111885832 B CN111885832 B CN 111885832B CN 202010713257 A CN202010713257 A CN 202010713257A CN 111885832 B CN111885832 B CN 111885832B
- Authority
- CN
- China
- Prior art keywords
- neutralizing
- pcb
- treatment
- reducing
- post
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
Abstract
The invention discloses a neutralizing and reducing solution for PCB (printed circuit board) glue removal post-treatment, and a preparation method and application thereof. The neutralizing and reducing liquid for PCB degumming post-treatment of the invention takes water as a solvent and comprises the following components by mass concentration: 1-200 g/L of reducing agent, 10-600 g/L of inorganic acid, 0.001-10 g/L of surfactant and 0.001-10 g/L of chelating agent, wherein the inorganic acid is hydrochloric acid and/or nitric acid. When the neutralizing and reducing solution for PCB degumming post-treatment is used for POFV plates, particularly POFV plates prepared by the copper deposition technology of ionic palladium activation, the probability of hole cover plating leakage is remarkably reduced.
Description
Technical Field
The invention belongs to the field of printed circuit boards, particularly relates to a neutralizing and reducing liquid, and a preparation method and application thereof, and particularly relates to a neutralizing and reducing liquid for PCB glue removal post-treatment, and a preparation method and application thereof.
Background
With the continuous update of electronic product technology, the structure and mounting manner of electronic chips are also continuously improved and changed. The development has essentially gone from components with interposer pins to highly dense integrated circuit modules that employ ball-type matrix solder joints. To adapt to this change, the resin plug hole process, i.e. pofv (plastic Over filed via) process, is more and more widely applied in the Printed Circuit Board (PCB) industry, and is especially favored for some products with high layer number and larger board thickness. After the POFV plate is plugged, a hole cover needs to be plated, and the plating process usually adopts a chemical copper deposition technology, also called an electroless copper plating technology.
One of the most critical processes in the manufacture of printed wiring boards is the hole metallization process. Electroless copper deposition is the most common technique for hole metallization, and an important part of the electroless copper deposition is the activation process. At present, the main activation technologies for PCB electroless copper plating include an ionic palladium activation technology and a colloidal palladium activation technology. Generally, both a pre-leaching solution and an activating solution of a colloidal palladium activating technology contain hydrochloric acid with higher concentration, and the hydrochloric acid plays a role in stabilizing the colloidal palladium; the activating solution of the ionic palladium activating technology does not usually contain a large amount of hydrochloric acid; compared with a colloid palladium activation technology, the ion palladium activation technology has better effect of processing the blind hole plate, is more environment-friendly and is the first choice of various large PCB manufacturers. However, after the resin hole-plugging hole cover is treated by the chemical copper deposition process activated by ionic palladium, the copper layer on the hole cover with a higher ratio is not completely covered, the hole-plugging resin leaks on the outer layer, and most of the hole-plugging resin has the defect of spot plating leakage, so that the product yield and the production efficiency are seriously influenced. Through the understanding of the upstream process of the hole plugging PCB, the hole plugging resin contains a large amount of calcium oxide fillers, and after glue removal, the proportion of calcium oxide on a hole cover is higher, so that the subsequent palladium activation and chemical copper plating are not facilitated.
CN110856348A discloses a neutralizing and reducing agent for PCB glue removing post-treatment, which belongs to the field of printed circuit boards and is used in the glue removing process of the printed circuit boards. In the PCB degumming post-treatment neutralization reducing agent, 20-100g/L of sulfuric acid, 5-30g/L of hydrogen peroxide, 0.1-1g/L of hydrogen peroxide stabilizer, 0.01-0.1g/L of corrosion inhibitor and 0.1-2g/L of surfactant are included; the invention has the advantages that the neutralizer has strong neutralizing and reducing capability, can effectively remove residues such as permanganate, manganate, manganese dioxide and the like in blind holes and through holes, has a pre-adjusting effect on hole wall charges, can be used for horizontal and vertical degumming lines, has extremely low copper corrosion rate, low ammonia nitrogen content in wastewater and is easy to treat sewage.
Practical application finds that the problem of hole cover plating leakage still exists when the POFV plate is treated by the neutralizing and reducing agent and then is subjected to chemical copper deposition treatment by the ionic palladium activation technology.
Disclosure of Invention
The neutralizing and reducing solution for PCB degumming post-treatment provided by the invention is used for treating POFV plates, and particularly, the neutralizing and reducing solution for PCB degumming post-treatment provided by the invention has the advantage that the plating leakage probability of a hole cover is remarkably reduced when the POFV plates are made by a copper deposition technology of ionic palladium activation.
One of the purposes of the invention is to provide a neutralizing and reducing solution for PCB glue removal post-treatment, and in order to achieve the purpose, the invention adopts the following technical scheme:
a neutralizing and reducing liquid for PCB glue removal post-treatment takes water as a solvent and comprises the following components in mass concentration:
wherein the inorganic acid is hydrochloric acid and/or nitric acid.
The mass concentration of the inorganic acid is 10-600 g/L, which means that the mass of the inorganic acid solution in 1L of the neutralization and reduction solution is 10-600 g based on the mass of the solution, for example, when the inorganic acid is hydrochloric acid, the mass of the hydrochloric acid solution in 1L of the neutralization and reduction solution is 10-600 g, and the mass fraction of the hydrochloric acid in the hydrochloric acid solution can be 37%.
According to the invention, inorganic acid is used in cooperation with a reducing agent, a surface reducing agent and a chelating agent after the PCB is subjected to degumming, and calcium oxide on the hole cover is effectively dissolved when the POFV plate is used for treating the POFV plate, particularly when the POFV plate is manufactured by a copper deposition technology aiming at ionic palladium activation, so that the plating leakage probability of the hole cover is remarkably reduced.
Specifically, the neutralizing and reducing solution for PCB degumming post-treatment takes water as a solvent, and comprises the following components in mass concentration:
1-200 g/L of reducing agent, for example, the mass concentration of the reducing agent is 1g/L, 10g/L, 20g/L, 30g/L, 40g/L, 50g/L, 60g/L, 70g/L, 80g/L, 90g/L, 100g/L, 110g/L, 120g/L, 130g/L, 140g/L, 150g/L, 160g/L, 170g/L, 180g/L, 190g/L or 200g/L, etc.
10-600 g/L of inorganic acid, for example, the mass concentration of the inorganic acid is 10g/L, 20g/L, 30g/L, 40g/L, 50g/L, 60g/L, 70g/L, 80g/L, 90g/L, 100g/L, 200g/L, 300g/L, 400g/L, 500g/L or 600g/L, etc.
0.001-10 g/L of a surfactant, for example, the surfactant has a mass concentration of 0.001g/L, 0.002g/L, 0.003g/L, 0.004g/L, 0.005g/L, 0.006g/L, 0.007g/L, 0.008g/L, 0.009g/L, 0.01g/L, 0.05g/L, 0.1g/L, 0.2g/L, 0.3g/L, 0.4g/L, 0.5g/L, 0.6g/L, 0.7g/L, 0.8g/L, 0.9g/L, 1g/L, 2g/L, 3g/L, 4g/L, 5g/L, 6g/L, 7g/L, 8g/L, 9g/L, or 10g/L, etc.
0.001 to 10g/L of a chelating agent, for example, the chelating agent has a mass concentration of 0.001g/L, 0.002g/L, 0.003g/L, 0.004g/L, 0.005g/L, 0.006g/L, 0.007g/L, 0.008g/L, 0.009g/L, 0.01g/L, 0.05g/L, 0.1g/L, 0.2g/L, 0.3g/L, 0.4g/L, 0.5g/L, 0.6g/L, 0.7g/L, 0.8g/L, 0.9g/L, 1g/L, 2g/L, 3g/L, 4g/L, 5g/L, 6g/L, 7g/L, 8g/L, 9g/L or 10 g/L.
Wherein the reducing agent is any one or a mixture of at least two of hydroxylamine, inorganic hydroxylamine salt or organic hydroxylamine salt.
Preferably, the reducing agent is hydroxylamine sulfate.
Wherein, the reducing agent can also be any one or a mixture of at least two of dimethylamine borane (DMAB), diethylamine borane, morpholine borane, borohydride, phosphate, sulfite, bisulfite, thiosulfate, hydrazine, aldehyde, glyoxylic acid or reducing sugar.
The inorganic acid is hydrochloric acid and/or nitric acid, preferably hydrochloric acid, more preferably, the mass fraction of the hydrochloric acid is 37%, and specifically, the mass of the hydrochloric acid in 100g of the hydrochloric acid solution is 37 g.
Wherein the surfactant is polyethylene glycol and/or polyether.
The chelating agent is any one or a mixture of at least two of Ethylene Diamine Tetraacetic Acid (EDTA) and sodium salt or potassium salt thereof, hydroxyethyl ethylene diamine triacetic acid and sodium salt or potassium salt thereof, tartaric acid and sodium salt or potassium salt thereof, gluconic acid and sodium salt or potassium salt thereof, citric acid and sodium salt or potassium salt thereof, diethylenetriamine pentaacetic acid and sodium salt or potassium salt thereof, cyclohexanediamine tetraacetic acid and sodium salt or potassium salt thereof, or tetrahydroxypropylethylenediamine, and is preferably gluconic acid and sodium salt or potassium salt thereof.
As a preferable scheme of the invention, the neutralizing and reducing solution for PCB degumming post-treatment takes water as a solvent and comprises the following components in mass concentration:
as another preferred embodiment of the invention, the neutralization and reduction solution for the treatment after the glue removal of the PCB takes water as a solvent and comprises the following components in mass concentration:
the second purpose of the invention is to provide a preparation method of neutralizing and reducing liquid after the glue removal of the PCB, which comprises the following steps:
1) preparing a neutralization reduction liquid cylinder opening agent: dissolving a reducing agent, a surfactant and a chelating agent by using water as a solvent;
2) preparing a neutralization reducing solution: adding a part of the required water quantity into a reaction container, adding the required neutralizing and reducing liquid cylinder opening agent according to the proportion, and uniformly mixing; then adding inorganic acid and mixing uniformly; and finally, supplementing the balance of water, and uniformly mixing to obtain the neutralizing and reducing solution for PCB glue removal post-treatment.
The invention also aims to provide the application of the neutralizing and reducing solution for PCB glue removal post-treatment, which is used for horizontal copper deposition technology or vertical copper deposition technology.
Compared with the prior art, the invention has the beneficial effects that:
according to the PCB degumming post-treatment neutralization and reduction solution, the inorganic acid is matched with the reducing agent, the surfactant and the chelating agent for use, and by adjusting the mass concentration of each component, when POFV plates are treated, particularly when the POFV plates are manufactured by a copper deposition technology aiming at ionic palladium activation, calcium oxide on the hole covers is effectively dissolved, the probability of plating leakage of the hole covers is remarkably reduced, and the probability of plating leakage defects of the hole covers with the plating leakage points of 10-20 mu m is less than 0.58 per thousand.
Drawings
FIG. 1 is an enlarged view of the copper plating condition of a POFV board after the glue removal treatment and the treatment of a neutralizing and reducing solution and the copper deposition of a PCB prepared in example 1 of the present invention;
FIG. 2 is an enlarged view of the copper plating of a POFV board after the treatment of the PCB after degumming and the treatment of the neutralizing and reducing solution and the copper deposition according to the invention and prepared in comparative example 1.
Detailed Description
The technical scheme of the invention is further explained by combining the attached drawings of fig. 1 and fig. 2 through a specific implementation mode.
Unless otherwise specified, various starting materials of the present invention are commercially available or prepared according to conventional methods in the art.
Example 1
The neutralizing and reducing solution for the PCB degumming post-treatment in the embodiment takes water as a solvent, and comprises the following components in mass concentration:
the preparation method of the neutralizing and reducing solution for PCB glue removal post-treatment comprises the following steps:
1) preparing a neutralization reduction liquid cylinder opening agent: dissolving a reducing agent, a surfactant and a chelating agent by using water as a solvent;
2) preparing a neutralization reducing solution: adding a part of the required water quantity into a reaction container, adding the required neutralizing and reducing liquid cylinder opening agent according to the proportion, and uniformly mixing; then adding inorganic acid and mixing uniformly; and finally, supplementing the balance of water, and uniformly mixing to obtain the neutralizing and reducing solution for PCB glue removal post-treatment.
Example 2
The neutralizing and reducing solution for the PCB degumming post-treatment in the embodiment takes water as a solvent, and comprises the following components in mass concentration:
example 3
The neutralizing and reducing solution for the PCB degumming post-treatment in the embodiment takes water as a solvent, and comprises the following components in mass concentration:
example 4
This example is different from example 1 in that the reducing agent is hydroxylamine sulfate, and the rest is the same as example 1.
Example 5
This example is different from example 1 in that the inorganic acid is nitric acid with a mass fraction of 68%, and the rest is the same as example 1.
Example 6
The difference between this example and example 1 is that the chelating agent is sodium gluconate, which is otherwise the same as example 1.
Example 7
This example differs from example 1 in that the chelating agent is cysteamine, an organometallic chelating agent, and is otherwise the same as example 1.
Example 8
This example differs from example 1 in that the reducing agent was sodium hydroxylamine phosphate, which was otherwise the same as example 1.
Comparative example 1
This comparative example differs from example 1 in that the mineral acid was replaced with sulfuric acid, and the rest was the same as example 1.
Comparative example 2
This comparative example is different from example 1 in that the concentration of hydrochloric acid was 1g/L, and the others were the same as those of example 1.
Comparative example 3
This comparative example is different from example 1 in that the hydrochloric acid concentration was 800g/L, and the others were the same as example 1.
Comparative example 4
This comparative example is example one in CN 101896039B:
the neutralization reducing solution prepared in the examples 1 to 8 and the comparative examples 1 to 4 is used for the horizontal copper deposition process for activating the ionic palladium, and the specific flow is as follows:
fluffy (expansion liquid SkySecure 302, 80 ℃, 2min) → DI water washing (normal temperature, 1min) → biting (pitting liquid SkySecure 305, 85 ℃, 4min) → DI water washing (normal temperature, 1min) → neutralization reduction → DI water washing (normal temperature, 1min) → degreasing adjustment (adjustment liquid SkyClean 321, 50 ℃, 1min) → DI water washing (normal temperature, 1min) → micro-etching (sodium persulfate/sulfuric acid solution, normal temperature, 1.5min) → DI water washing (normal temperature, 1min) → (activation pre-immersion liquid SkyCat 330, normal temperature, 25s) → activation (activation liquid SkyCat 335, 50 ℃, 65s) → DI water washing (normal temperature, 1min) → activation reduction (activation reduction liquid SkyCat R, 35 ℃, 35s) → DI water washing (normal temperature, 1min) → chemical copper plating solution) → hot air drying (hot air, 32 ℃). Among them, the swelling liquid SkySecure 302, the cavitating liquid SkySecure 305, the conditioning liquid SkyClean 321, the activation pre-dip SkyCat 330, the activation liquid SkyCat 335, the activation reducing liquid SkyCat 336R, and the electroless copper plating liquid SkyCopp 365 are products produced by kuntongtian scientific and technical limited and commercially available.
Wherein, the treatment conditions of the neutralization reduction are as follows: the temperature was 40 ℃ for 60 s.
Comparative example 5
The comparative application example is a vertical copper deposition process for activating colloid palladium by using the neutralizing and reducing solution after the glue removal of the PCB prepared in the example 1, and the specific parameters are as follows:
fluffy (expansion liquid SkySecure 302, 80 ℃, 2min) → DI water washing (normal temperature, 1min) → biting (undercut liquid SkySecure 305, 85 ℃, 4min) → DI water washing (normal temperature, 1min) → neutralization reduction → DI water washing (normal temperature, 1min) → degreasing adjustment (conditioning liquid SkyClean 326, 50 ℃, 5min) → DI water washing (normal temperature, 1min) → microetching (sodium persulfate/sulfuric acid solution, normal temperature, 1.5min) → DI water washing (normal temperature, 1min) → (activating pre-immersion liquid SkyCat 3391, normal temperature, 2min) → activation (activating liquid SkyCat 3396, 38 ℃, 7min) → DI water washing (normal temperature, 1min) → acceleration (accelerating liquid SkyCat 3398, 48 ℃, 2min) → DI water washing (normal temperature, 1min) → chemical copper plating) (hot air drying) (30 ℃, 360 ℃).
Wherein, the treatment conditions of the neutralization reduction are as follows: the temperature is 50 ℃ and the time is 60 s.
Comparative example 6
The comparative example is a vertical copper deposition process for activating colloid palladium by using the neutralizing and reducing solution after the degumming of the PCB prepared in the comparative example 1, and specific parameters refer to the comparative example 5.
And (3) carrying out hole cover plating leakage defect testing on the POFV plate treated by the copper deposition process, wherein the testing method comprises the steps of observing about 10000 holes by using a microscope under the condition of 200 times of magnification, and recording the number of the defective holes.
The probability of the plating leakage defect of the hole cover with the diameter of the plating leakage point of 10-20 mu m after copper deposition is shown in Table 1.
Wherein, metallographic microscopic images (magnified 200 times) of copper plating conditions after the treatment of degumming and copper precipitation of the reducing solution of the PCBs prepared in the example 1 and the comparative example 1 are shown in FIGS. 1 and 2. As can be seen from FIG. 1, the hole cover has no plating leakage after the neutralization and reduction solution treatment copper deposition after the glue removal of the PCB of the invention is adopted, and the hole cover has the plating leakage after the neutralization and reduction solution treatment copper deposition of the comparative example 1 is adopted.
TABLE 1
As can be seen from Table 1, the method can effectively improve the problem of plating leakage of the POFV plate hole cover in the copper deposition technology of ionic palladium activation. The content of hydrochloric acid/nitric acid is controlled within a certain range, and if the concentration is too low, the improvement on the plating leakage of the POFV plate hole cover is not obvious; if the content is too high, the environmental pollution is serious, the requirement on equipment materials is too high, and the practical application value is not high.
The comparative examples 1 and 4 adopt sulfuric acid, and the probability of plating leakage defects of the hole cover is higher.
Comparative example 3 if the hydrochloric acid concentration is too high, although the probability of the plating leakage defect of the hole cover is low, the environmental pollution is serious and the requirement on equipment is high.
It can be seen from example 1 and comparative example 2 that, if the hydrochloric acid concentration is too low, the improvement of the plating leakage of the POFV plate holes and covers is not obvious.
Compared with the neutralization and reduction solution for PCB degumming post-treatment which adopts sulfuric acid as the raw material, the neutralization and reduction solution for PCB degumming post-treatment which adopts hydrochloric acid as the raw material has the advantages that when the neutralization and reduction solution is used for POFV plate treatment, the plating leakage defect probability of the hole cover is equivalent regardless of ionic palladium activation or colloid palladium activation; as can be seen from the examples 1, the comparative examples 1 and 6, the neutralizing and reducing solution for the PCB after-degumming treatment using sulfuric acid as the raw material has a much higher probability of the plating leakage defect of the hole cover than the colloidal palladium activated hole cover, so that the neutralizing and reducing solution for the PCB after-degumming treatment prepared using hydrochloric acid of the present invention as the raw material significantly reduces the plating leakage probability of the hole cover when used for the POFV plate treatment, particularly when used for the POFV plate by the copper deposition technique for the ionic palladium activation.
The present invention is illustrated by the above-mentioned examples, but the present invention is not limited to the above-mentioned detailed process equipment and process flow, i.e. it is not meant to imply that the present invention must rely on the above-mentioned detailed process equipment and process flow to be practiced. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
The preferred embodiments of the present invention have been described in detail, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.
Claims (4)
1. The PCB degumming post-treatment neutralizing and reducing solution for preparing the POFV plate by the ionic palladium activation copper precipitation method is characterized by taking water as a solvent and comprising the following components in mass concentration:
wherein the inorganic acid is hydrochloric acid;
the mass fraction of the hydrochloric acid is 37 percent;
the reducing agent is dimethylamine borane;
the chelating agent is ethylenediamine tetraacetic acid and sodium salt or potassium salt thereof.
2. The PCB degumming post-treatment neutralizing and reducing solution according to claim 1, wherein the surfactant is polyethylene glycol and/or polyether.
3. The preparation method of the neutralizing and reducing solution for the PCB after glue removal treatment according to claim 1 or 2, characterized by comprising the following steps:
1) preparing a neutralization reduction liquid cylinder opening agent: dissolving a reducing agent, a surfactant and a chelating agent by using water as a solvent;
2) preparing a neutralization reducing solution: adding a part of the required water quantity into a reaction container, adding the required neutralizing and reducing liquid cylinder opening agent according to the proportion, and uniformly mixing; then adding inorganic acid and mixing uniformly; and finally, supplementing the balance of water, and uniformly mixing to obtain the neutralizing and reducing solution for PCB glue removal post-treatment.
4. The use of the neutralizing and reducing solution for PCB degumming post-treatment according to claim 1 or 2, characterized in that the neutralizing and reducing solution for PCB degumming post-treatment is used in horizontal copper deposition technology or vertical copper deposition technology.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010713257.7A CN111885832B (en) | 2020-07-22 | 2020-07-22 | Neutralizing and reducing solution for PCB (printed circuit board) glue removal post-treatment as well as preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010713257.7A CN111885832B (en) | 2020-07-22 | 2020-07-22 | Neutralizing and reducing solution for PCB (printed circuit board) glue removal post-treatment as well as preparation method and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111885832A CN111885832A (en) | 2020-11-03 |
| CN111885832B true CN111885832B (en) | 2021-12-21 |
Family
ID=73155965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010713257.7A Active CN111885832B (en) | 2020-07-22 | 2020-07-22 | Neutralizing and reducing solution for PCB (printed circuit board) glue removal post-treatment as well as preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111885832B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115216117B (en) * | 2022-09-21 | 2022-12-16 | 深圳市板明科技股份有限公司 | Modified hole plugging resin for circuit board and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61279195A (en) * | 1985-06-05 | 1986-12-09 | 古河電気工業株式会社 | Manufacture of circuit board |
| CN101896039A (en) * | 2010-07-28 | 2010-11-24 | 广东东硕科技有限公司 | Post treatment neutralizer for removing smears from alkaline permanganate in printed circuit board manufacture |
| CN104519664A (en) * | 2013-09-27 | 2015-04-15 | 北大方正集团有限公司 | Printed circuit board cleaning method and printed circuit board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102428185B1 (en) * | 2016-05-04 | 2022-08-01 | 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 | Method of electrodeposition thereof comprising activation of a metal or metal alloy onto the surface of a substrate |
| US10590541B2 (en) * | 2018-06-15 | 2020-03-17 | Rohm And Haas Electronic Materials Llc | Electroless copper plating compositions and methods for electroless plating copper on substrates |
-
2020
- 2020-07-22 CN CN202010713257.7A patent/CN111885832B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61279195A (en) * | 1985-06-05 | 1986-12-09 | 古河電気工業株式会社 | Manufacture of circuit board |
| CN101896039A (en) * | 2010-07-28 | 2010-11-24 | 广东东硕科技有限公司 | Post treatment neutralizer for removing smears from alkaline permanganate in printed circuit board manufacture |
| CN104519664A (en) * | 2013-09-27 | 2015-04-15 | 北大方正集团有限公司 | Printed circuit board cleaning method and printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111885832A (en) | 2020-11-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109652804B (en) | PCB copper-reduction etching solution and manufacturing process | |
| US8192636B2 (en) | Composition and method for improved adhesion of polymeric materials to copper alloy surfaces | |
| CN109628913A (en) | A kind of new chemical nickel gold production technology and chemical nickel-plating liquid | |
| CN109862710B (en) | Copper deposition process and device for PCB with uniform thickness | |
| CN111885832B (en) | Neutralizing and reducing solution for PCB (printed circuit board) glue removal post-treatment as well as preparation method and application thereof | |
| CN108823554B (en) | Chemical palladium plating solution, preparation method, use method and application thereof | |
| TW201212755A (en) | Method and agent for surface processing of printed circuit board substrate | |
| TWI732045B (en) | Manufacturing method of printed wiring board | |
| CN107473447A (en) | A kind of method of calcium method recycling treatment acidic high-strength ammonium sulfate waste water | |
| CN109679775B (en) | Acidic pore-finishing agent for circuit board hole metallization process and preparation method of circuit board | |
| CA2168013C (en) | Alkaline ammoniacal cupric chloride etching bath containing a copper (i) stabilizer | |
| TW201008882A (en) | Waste micro etchant treatment | |
| CN112111740A (en) | Removing liquid for nickel-phosphorus coating, preparation method and removing method for nickel-phosphorus coating | |
| WO1999031293A1 (en) | Pretreating fluid and method of pretreatment for electroless nickel plating | |
| CN114318436A (en) | Preparation method of high-purity copper sulfate for wafer copper interconnection and copper electroplating process thereof | |
| EP0173003A2 (en) | Method for plating from an electroless plating bath | |
| CN115369390B (en) | Activation process of electroless copper plating and application thereof | |
| CN115216771A (en) | Printed circuit board copper surface roughening liquid and application thereof | |
| CN112850778A (en) | Preparation method of basic copper chloride | |
| CN111041487A (en) | Environment-friendly PCB electroplating rack copper stripping liquid and copper stripping method using same | |
| JP2944518B2 (en) | Copper and copper alloy surface treatment agent | |
| CN108754498A (en) | A kind of method that cryochemistry nickel groove body deposited nickel layer takes off except solution and take off nickel layer | |
| JPH0293079A (en) | Surface treatment of copper and copper alloy | |
| JP2793515B2 (en) | Copper and copper alloy surface treatment agent | |
| CN115125593A (en) | Application of chelating agent in PCB preparation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 510990, No. 8 Taiyuan Road (factory building), Conghua Economic Development Zone, Guangzhou, Guangdong. Applicant after: Guangdong Tiancheng Technology Co.,Ltd. Address before: 510990, No. 8 Taiyuan Road (factory building), Conghua Economic Development Zone, Guangzhou, Guangdong. Applicant before: GUANGZHOU SKYCHEM TECHNOLOGIES Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |