CN111884036B - Semiconductor laser packaging device with multiple working wavelengths - Google Patents
Semiconductor laser packaging device with multiple working wavelengths Download PDFInfo
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- CN111884036B CN111884036B CN202010589874.0A CN202010589874A CN111884036B CN 111884036 B CN111884036 B CN 111884036B CN 202010589874 A CN202010589874 A CN 202010589874A CN 111884036 B CN111884036 B CN 111884036B
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- sliding block
- laser diode
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- limiting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
A semiconductor laser packaging device with multiple working wavelengths comprises a core column, a first pin and a second pin which are embedded in the core column, a mounting block fixedly connected to the upper surface of the core column, and a first laser diode, a second laser diode and a third laser diode which are arranged on the front side of the mounting block, wherein connecting components are sleeved outside the first pin and the second pin; a limiting groove is formed in the mounting block; a limiting component is arranged inside the limiting groove; the second sliding block moves towards the rear side, the spring can be pressed and deformed, a user slides the first sliding block, the second sliding block and the limiting block into the limiting groove respectively along the limiting groove, the second sliding block is loosened after the first sliding block, the second sliding block and the limiting block move to a proper position, and the first sliding block and the second sliding block are tightly attached to the inner wall of the limiting groove respectively under the action of the spring; the heat dissipation structure has the characteristics of rapid heat dissipation, easy disassembly and assembly and difficult looseness.
Description
Technical Field
The invention belongs to the technical field of semiconductor lasers, and particularly relates to a semiconductor laser packaging device with multiple working wavelengths.
Background
Since 1962, semiconductor lasers have been introduced and have received great attention from various countries due to their low price, simple preparation, low power consumption, easy integration and mass production, along with the rapid development of semiconductor lasers, the development of new materials and new structures, and the continuous progress of epitaxial technology, the quality of semiconductor lasers is higher and higher, the price is lower and lower, the wavelength coverage is wider and wider, now it has basically covered the whole range from far ultraviolet to far infrared, its application range is also continuously expanded, and it has gradually expanded from the initial photoelectron field to the fields of industrial production, military space, medical health and the like.
However, after the pins of the existing semiconductor laser are used for a long time, the pins are easy to loosen, and meanwhile, most of the groups of laser diodes are soldered on the mounting block through soft soldering, so that the distance between the groups of laser diodes is difficult to change, and the quick heat dissipation and the disassembly and assembly of the laser diodes are difficult to realize. Accordingly, one skilled in the art provides a semiconductor laser package structure with multiple operating wavelengths to solve the problems set forth in the background art described above.
Disclosure of Invention
The invention aims to provide a semiconductor laser packaging device with a plurality of working wavelengths, which is used for solving the problems in the background technology and has the characteristics of quick heat dissipation, easy disassembly and assembly and difficult looseness.
In order to achieve the purpose, the invention provides the following technical scheme: a semiconductor laser packaging device with multiple working wavelengths comprises a core column, a first pin and a second pin which are embedded in the core column, a mounting block fixedly connected to the upper surface of the core column, and a first laser diode, a second laser diode and a third laser diode which are arranged on the front side of the mounting block, wherein connecting components are sleeved outside the first pin and the second pin; a limiting groove is formed in the mounting block; and a limiting component is arranged in the limiting groove.
The connecting assembly comprises a second lantern ring, a connecting bracket, a first lantern ring, a supporting rod and a mounting seat; the top end of the supporting rod is integrally connected with a connecting support, and the bottom end of the supporting rod is welded with a disc-shaped mounting seat; and the two ends of the connecting bracket are respectively and fixedly connected with a second lantern ring and a first lantern ring.
The second lantern ring and the first lantern ring are fixedly sleeved on the second pin and the first pin respectively, and the second lantern ring and the first lantern ring are identical in size and material.
The limiting assembly comprises a first sliding block, a spring, a second sliding block and a limiting block, wherein one end of the spring is connected with the first sliding block, and the other end of the spring is connected with the second sliding block; the front surface of the second sliding block is connected with a limiting block; the limiting block is fixedly connected with the rear surface of the first laser diode.
The first sliding block, the second sliding block and the limiting block are respectively located inside the limiting groove, the first sliding block, the second sliding block and the limiting block are respectively in sliding connection with the limiting groove, and the first sliding block, the second sliding block (11) and the limiting block are all members made of stainless steel materials.
The first pin is connected with the third laser diode through a bonding wire, and the second pin is connected with the second laser diode through a bonding wire.
Compared with the prior art, the invention has the beneficial effects that:
1) according to the invention, the first pin and the second pin can be fastened through the connecting component, so that the first pin and the second pin are not easy to loosen in the using process, and the normal use of the first pin and the second pin is ensured;
2) the spacing assembly can be used for conveniently adjusting the spacing among the first laser diode, the second laser diode and the third laser diode by a user according to actual needs, so that the rapid heat dissipation of the first laser diode, the second laser diode and the third laser diode is facilitated, the first laser diode, the second laser diode and the third laser diode are easy to disassemble and assemble, and the variation of the spacing among the first laser diode, the second laser diode and the third laser diode can also be used for changing the diffusion degree of the laser light to meet different use needs.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic view of an installation structure of the limiting assembly of the present invention.
Fig. 3 is a schematic structural view of the connecting assembly of the present invention.
In the figure: 1. mounting blocks; 2. a first laser diode; 3. a limiting groove; 4. a stem; 5. a connecting assembly; 6. a first pin; 7. a second pin; 8. a first slider; 9. a spring; 10. a limiting component; 11. a second slider; 12. a limiting block; 13. a second collar; 14. connecting a bracket; 15. a first collar; 16. a support bar; 17. a mounting seat; 18. a second laser diode; 19. a third laser diode.
Detailed Description
The structural and operational principles of the present invention are explained in further detail below with reference to the accompanying drawings and examples.
A semiconductor laser packaging device with a plurality of working wavelengths comprises a core column 4, a first pin 6 and a second pin 7 embedded in the core column 4, an installation block 1 fixedly connected to the upper surface of the core column 4, and a first laser diode 2, a second laser diode 18 and a third laser diode 19 arranged on the front side of the installation block 1, wherein a connecting assembly 5 is sleeved outside the first pin 6 and the second pin 7; a limiting groove 3 is formed in the mounting block 1; the limiting groove 3 is internally provided with a limiting component 10.
The connecting assembly 5 comprises a second collar 13, a connecting bracket 14, a first collar 15, a supporting rod 16 and a mounting seat 17; the top end of the support rod 16 is integrally connected with a connecting bracket 14, and the bottom end of the support rod 16 is welded with a disc-shaped mounting seat 17; the two ends of the connecting bracket 14 are respectively fixedly connected with a second collar 13 and a first collar 15.
The second collar 13 and the first collar 15 are respectively and fixedly sleeved on the second pin 7 and the first pin 6, and the size and the material of the second collar 13 and the first collar 15 are the same.
The limiting assembly 10 comprises a first sliding block 8, a spring 9, a second sliding block 11 and a limiting block 12, wherein one end of the spring 9 is connected with the first sliding block 8, and the other end of the spring 9 is connected with the second sliding block 11; the front surface of the second sliding block 11 is connected with a limiting block 12; the stopper 12 is fixedly connected to the rear surface of the first laser diode 2.
The first pin 6 is connected with the third laser diode 19 through a bonding wire, and the second pin 7 is connected with the second laser diode 18 through a bonding wire.
Referring to fig. 1 to 3, in an embodiment of the present invention, a semiconductor laser package device with multiple operating wavelengths includes a core pillar 4, a first lead 6 and a second lead 7 embedded in the core pillar 4, a mounting block 1 fixed on an upper surface of the core pillar 4, and a first laser diode 2, a second laser diode 18, and a third laser diode 19 disposed on a front side of the mounting block 1, wherein a single laser diode is connected in series with a resistor to control a voltage of the single laser diode, oscillation wavelengths of the first laser diode 2, the second laser diode 18, and the third laser diode 19 are respectively 780nm band (infrared), 650nm band (red), and 450nm band (blue-violet), the first lead 6 is connected to the third laser diode 19 through a bonding wire, the second lead 7 is connected to the second laser diode 18 through a bonding wire, a connection component 5 is sleeved outside the first lead 6 and the second lead 7, coupling assembling 5 includes the second lantern ring 13, linking bridge 14, first lantern ring 15, bracing piece 16 and mount pad 17, the top an organic whole of bracing piece 16 is connected with linking bridge 14, and the bottom welding of bracing piece 16 has the mount pad 17 of disc, the both ends of linking bridge 14 rigid coupling respectively have second lantern ring 13 and first lantern ring 15, second lantern ring 13 and first lantern ring 15 are fixed the cup joint respectively on second pin 7 and first pin 6, and second lantern ring 13 and first lantern ring 15's size, the material is the same, can fasten first pin 6 and second pin 7 through coupling assembling 5, make first pin 6 and second pin 7 difficult appearance not hard up phenomenon in the use, the normal use of first pin 6 and second pin 7 has been ensured.
In fig. 1 and 2: the mounting block 1 is internally provided with a limiting groove 3, the limiting groove 3 is internally provided with a limiting component 10, the limiting component 10 comprises a first slider 8, a spring 9, a second slider 11 and a limiting block 12, one end of the spring 9 is connected with the first slider 8, the other end of the spring 9 is connected with the second slider 11, the front surface of the second slider 11 is fixedly connected with the limiting block 12, the limiting block 12 is fixedly connected with the rear surface of the first laser diode 2, the first slider 8, the second slider 11 and the limiting block 12 are respectively positioned in the limiting groove 3, the first slider 8, the second slider 11 and the limiting block 12 are respectively in sliding connection with the limiting groove 3, the first slider 8, the second slider 11 and the limiting block 12 are stainless steel members, and a user can conveniently adjust the distance among the first laser diode 2, the second laser diode 18 and the third laser diode 19 according to actual needs through the limiting component 10, on one hand, the quick heat dissipation of the first laser diode 2, the second laser diode 18 and the third laser diode 19 is facilitated, the first laser diode 2, the second laser diode 18 and the third laser diode 19 are easy to disassemble and assemble, and meanwhile, the change of the distance among the first laser diode 2, the second laser diode 18 and the third laser diode 19 can also change the diffusion degree of the laser light, so that different use requirements are met.
The working principle of the invention is as follows: the user firstly moves the second slider 11 to the rear side, at this time, the spring 9 can be pressed and deformed, then the user slides the first slider 8, the second slider 11 and the limiting block 12 into the limiting groove 3 respectively, after the user moves to a proper position, the second slider 11 is loosened, under the action of the spring 9, the first slider 8 and the second slider 11 are tightly attached to the inner wall of the limiting groove 3 respectively, at this time, the position of the first laser diode 2 is fixed, because the limiting assemblies 10 are arranged on the rear sides of the second laser diode 18 and the third laser diode 19, the user can conveniently adjust the distance among the first laser diode 2, the second laser diode 18 and the third laser diode 19 according to actual needs through the limiting assemblies 10, on one hand, the quick heat dissipation of the first laser diode 2, the second laser diode 18 and the third laser diode 19 is facilitated, simultaneously, the first laser diode 2, the second laser diode 18 and the third laser diode 19 are easily disassembled and assembled, the distance between the first laser diode 2, the second laser diode 18 and the third laser diode 19 is changed, the diffusion degree of the laser light can be changed, different use requirements are met, then a user fixedly sleeves the second sleeve ring 13 and the first sleeve ring 15 on the second pin 7 and the first pin 6 respectively, the mounting seat 17 is fixed on the core column 4 through screws, the first pin 6 and the second pin 7 can be fastened through the connecting assembly 5, the first pin 6 and the second pin 7 are not prone to loosening in the use process, and normal use of the first pin 6 and the second pin 7 is guaranteed.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention are equivalent to or changed within the technical scope of the present invention.
Claims (1)
1. A semiconductor laser packaging device with multiple working wavelengths comprises a core column (4), a first pin (6) and a second pin (7) which are embedded in the core column (4), a mounting block (1) fixedly connected to the upper surface of the core column (4), and a first laser diode (2), a second laser diode (18) and a third laser diode (19) which are arranged on the front side of the mounting block (1), and is characterized in that a connecting assembly (5) is sleeved outside the first pin (6) and the second pin (7); a limiting groove (3) is formed in the mounting block (1); a limiting component (10) is arranged in the limiting groove (3);
the connecting assembly (5) comprises a second lantern ring (13), a connecting bracket (14), a first lantern ring (15), a supporting rod (16) and a mounting seat (17); the top end of the supporting rod (16) is integrally connected with a connecting support (14), and the bottom end of the supporting rod (16) is welded with a disc-shaped mounting seat (17); a second lantern ring (13) and a first lantern ring (15) are fixedly connected to two ends of the connecting support (14) respectively;
the second lantern ring (13) and the first lantern ring (15) are fixedly sleeved on the second pin (7) and the first pin (6) respectively, and the second lantern ring (13) and the first lantern ring (15) are identical in size and material;
the limiting assembly (10) comprises a first sliding block (8), a spring (9), a second sliding block (11) and a limiting block (12), one end of the spring (9) is connected with the first sliding block (8), and the other end of the spring (9) is connected with the second sliding block (11); the front surface of the second sliding block (11) is connected with a limiting block (12); the limiting block (12) is fixedly connected with the rear surface of the first laser diode (2);
the first sliding block (8), the second sliding block (11) and the limiting block (12) are all located inside the limiting groove (3), the first sliding block (8), the second sliding block (11) and the limiting block (12) are respectively in sliding connection with the limiting groove (3), and the first sliding block (8), the second sliding block (11) and the limiting block (12) are all members made of stainless steel materials;
the first pin (6) is connected with the third laser diode (19) through a bonding wire, and the second pin (7) is connected with the second laser diode (18) through a bonding wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010589874.0A CN111884036B (en) | 2020-06-24 | 2020-06-24 | Semiconductor laser packaging device with multiple working wavelengths |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010589874.0A CN111884036B (en) | 2020-06-24 | 2020-06-24 | Semiconductor laser packaging device with multiple working wavelengths |
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| Publication Number | Publication Date |
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| CN111884036A CN111884036A (en) | 2020-11-03 |
| CN111884036B true CN111884036B (en) | 2021-12-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010589874.0A Active CN111884036B (en) | 2020-06-24 | 2020-06-24 | Semiconductor laser packaging device with multiple working wavelengths |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101924323A (en) * | 2009-06-09 | 2010-12-22 | 三菱电机株式会社 | Multi-wavelength semiconductor laser device |
| CN207615839U (en) * | 2017-12-26 | 2018-07-17 | 杭州迅盈光电科技有限公司 | A kind of four foot LED package shelf groups |
| CN208580736U (en) * | 2018-08-06 | 2019-03-05 | 深圳市华珅邦电子科技有限公司 | A kind of stability triode |
| CN210073917U (en) * | 2019-05-20 | 2020-02-14 | 深圳市晶宏欣光电有限公司 | Light-emitting diode support structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7236366B2 (en) * | 2004-07-23 | 2007-06-26 | Excel Cell Electronic Co., Ltd. | High brightness LED apparatus with an integrated heat sink |
-
2020
- 2020-06-24 CN CN202010589874.0A patent/CN111884036B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101924323A (en) * | 2009-06-09 | 2010-12-22 | 三菱电机株式会社 | Multi-wavelength semiconductor laser device |
| CN207615839U (en) * | 2017-12-26 | 2018-07-17 | 杭州迅盈光电科技有限公司 | A kind of four foot LED package shelf groups |
| CN208580736U (en) * | 2018-08-06 | 2019-03-05 | 深圳市华珅邦电子科技有限公司 | A kind of stability triode |
| CN210073917U (en) * | 2019-05-20 | 2020-02-14 | 深圳市晶宏欣光电有限公司 | Light-emitting diode support structure |
Non-Patent Citations (1)
| Title |
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| "弹簧螺母 方块螺母 不锈钢弹簧螺母";鸿洋五金;《http://www.hy-wj.com/products/qiaojiapeijian/thlm.html》;20170620;第1-2页，图1-8 * |
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| CN111884036A (en) | 2020-11-03 |
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