CN111881710A

CN111881710A - Electronic device

Info

Publication number: CN111881710A
Application number: CN202010151871.9A
Authority: CN
Inventors: 刘敏钻; 李冠锋
Original assignee: Innolux Corp
Current assignee: Innolux Corp
Priority date: 2019-05-03
Filing date: 2020-03-06
Publication date: 2020-11-03
Also published as: PH12020050334A1

Abstract

The invention provides an electronic device, which comprises a display panel, a fingerprint sensing unit and an integrated circuit, wherein the integrated circuit is used for driving the display panel and the fingerprint sensing unit.

Description

Electronic device

Technical Field

The present invention relates to an electronic device, and more particularly, to an electronic device having a display function and a biometric feature (e.g., fingerprint, palm print) recognition function.

Background

In general, identification of biometric features (e.g., fingerprints, palmprints) can be applied to identification. Today, the industry is working to integrate well biometric sensors into electronic devices to optimize the yield and/or performance of the electronic devices.

Disclosure of Invention

In one embodiment, an electronic device includes a display panel, a fingerprint sensing unit, and an integrated circuit, wherein the integrated circuit is used to drive the display panel and the fingerprint sensing unit.

Drawings

Fig. 1 is a schematic cross-sectional view of an electronic device according to a first embodiment of the invention.

Fig. 2 is a schematic cross-sectional view of an electronic device according to a second embodiment of the invention.

Fig. 3 is a schematic cross-sectional view of an electronic device according to a third embodiment of the invention.

Fig. 4 is a schematic cross-sectional view of an electronic device according to a fourth embodiment of the invention.

Fig. 5 is a schematic cross-sectional view of an electronic device according to a fifth embodiment of the invention.

Fig. 6 is a schematic top view of a portion of the area shown in fig. 5.

Fig. 7 is a schematic cross-sectional view of an electronic device according to a sixth embodiment of the invention.

Fig. 8 is a schematic side view of an electronic device according to a sixth embodiment of the invention.

Fig. 9 is a schematic cross-sectional view of an electronic device according to a seventh embodiment of the invention.

Fig. 10 is a schematic cross-sectional view of an electronic device according to an eighth embodiment of the invention.

Fig. 11 is a schematic top view of an electronic device according to an eighth embodiment of the invention before being bent.

Fig. 12 is a schematic cross-sectional view of an electronic device according to a ninth embodiment of the invention.

Fig. 13 is a schematic top view of an electronic device according to a ninth embodiment of the invention.

Fig. 14 is a schematic top view of an electronic device according to a tenth embodiment of the invention.

Description of reference numerals: 100. 200, 300, 400, 500, 600, 700, 800, 900, 1000-electronic device; 110-a first substrate; 110a, 140 a-an inner surface; 110b, 140 b-an outer surface; 110c, 140 c-side surfaces; 110F-front panel portion; 110K-back plate portion; 120-display element layer; 122-a display element; 124-display switching elements; 130-a fingerprint sensing element layer; 132-a fingerprint sensing unit; 134-a sensing switching element; 136-a protective layer; 140-a second substrate; 150-an integrated circuit; 160-a first connection line; 410-an interconnect; 660-a second connection line; 910-touch sensing element layer; 912-a touch sensing unit; an AL-adhesion structure; an AR-active region; a DR-display area; dt-normal direction; FSR-fingerprint sensing region; an IL-insulating layer; IPL-insulating protective layer; an LS-light blocking layer; LT1, LT2, LT 3-light converting layer; an ML-media layer; OP-opening; PR-peripheral zone; SPX1, SPX2, SPX 3-subpixels; t1 — first conductor; t3-third conductor; t5-fifth conductor; t6-sixth conductor; t7-seventh conductor; TR-touch area.

Detailed Description

The present invention may be understood by reference to the following detailed description taken in conjunction with the accompanying drawings, in which it is noted that, for the sake of clarity, the various drawings depict only some of the electronic devices and that certain elements of the drawings are not necessarily drawn to scale. In addition, the number and size of the elements in the drawings are merely illustrative and are not intended to limit the scope of the present invention.

Certain terms are used throughout the description and following claims to refer to particular elements. Those skilled in the art will appreciate that electronic device manufacturers may refer to the same components by different names. This document does not intend to distinguish between components that differ in function but not name. In the following description and claims, the terms "comprising," including, "" having, "and the like are open-ended terms and thus should be interpreted to mean" including, but not limited to …. Thus, when the terms "comprises," "comprising," and/or "having" are used in the description of the present invention, they specify the presence of stated features, regions, steps, operations, and/or components, but do not preclude the presence or addition of one or more other features, regions, steps, operations, and/or components.

Directional phrases used herein include, for example: "upper", "lower", "front", "rear", "left", "right", etc., refer only to the orientation of the figures. Accordingly, the directional terminology is used for purposes of illustration and is in no way limiting. In the drawings, various figures depict typical features of methods, structures, and/or materials used in particular embodiments. These drawings, however, should not be construed as defining or limiting the scope or nature encompassed by these embodiments. For example, the relative dimensions, thicknesses, and locations of various layers, regions, and/or structures may be reduced or exaggerated for clarity.

When a respective member (e.g., a film or region) is referred to as being "on" another member, it can be directly on the other member or there can be other members between the two. On the other hand, when a member is referred to as being "directly on" another member, there is no member between the two. In addition, when a member is referred to as being "on" another member, the two members may be located above or below the other member in a top-down relationship depending on the orientation of the device.

It will be understood that when an element or layer is referred to as being "connected to" another element or layer, it can be directly connected to the other element or layer or intervening elements or layers may be present. When a component is referred to as being "directly connected to" another component or layer, there are no intervening components or layers present between the two. In addition, when an element is referred to as being "coupled" to another element (or a variant thereof), it can be directly connected to the other element or be indirectly connected (e.g., electrically connected) to the other element through one or more elements.

The terms "about," "equal to," or "the same," "substantially," or "approximately" are generally construed as being within 20% of a given value or range, or as being within 10%, 5%, 3%, 2%, 1%, or 0.5% of a given value or range.

The use of ordinal numbers such as "first," "second," etc., in the specification and claims to modify an element, is not itself intended to imply any previous order to the element(s), nor is the order in which an element may be sequenced or methods of manufacture to distinguish it from another element having a similar designation. The claims may not use the same words in the specification, and accordingly, a first element in a specification may be a second element in a claim.

It is to be understood that the following illustrative embodiments may be implemented by replacing, recombining, and mixing features of several different embodiments without departing from the spirit of the present invention. Features of the various embodiments may be combined and matched as desired, without departing from the spirit or ambit of the invention.

In the present invention, the electronic device may optionally include, but is not limited to, display, sensing, touch, antenna, lighting, other suitable functions, or a combination thereof. In some embodiments, the electronic device may include a tiled device, but is not so limited. The electronic device may include liquid crystal molecules (LC molecules), organic light-emitting diodes (OLEDs), inorganic light-emitting diodes (LEDs), such as micro-LEDs (micro-LEDs, mini-LEDs), Quantum Dot (QDs) materials, quantum dot light-emitting diodes (QLEDs, QDLEDs), fluorescent (fluorescent) materials, phosphorescent (phosphor) materials, other suitable materials, or combinations thereof, but is not limited thereto. Furthermore, the electronic device (e.g., display device) may include a color display panel or a monochrome display panel, and the shape of the electronic device may be rectangular, circular, polygonal, a shape with curved edges, or other suitable shapes, but is not limited thereto. Hereinafter, the electronic device includes a color liquid crystal display panel for exemplary illustration, but the electronic device is not limited thereto. In some embodiments, the electronic device may also include an organic light emitting diode display panel, an inorganic light emitting diode display panel, a quantum dot display panel, or other suitable display panel.

Referring to fig. 1, fig. 1 is a schematic cross-sectional view of an electronic device according to a first embodiment of the invention. As shown in fig. 1, the electronic device 100 may include an active area AR, wherein the active area AR may selectively include a display area, a fingerprint sensing area, a light emitting area, a touch area, and a working area according to an application of the electronic device 100, but is not limited thereto. For example, the electronic device 100 shown in fig. 1 includes a liquid crystal display panel, and the active region AR may include a display region DR and a fingerprint sensing region FSR of the liquid crystal display panel, but is not limited thereto. In addition, in fig. 1, the electronic device 100 may further include a peripheral region PR of the liquid crystal display panel, for example, the peripheral region PR is disposed adjacent to or around the active region AR.

The display area DR of the electronic device 100 may include a plurality of pixels (pixels), and the pixels may include at least one Sub-Pixel (Sub-Pixel). That is, the display region DR is, for example, a region including light emitting regions of all pixels. In some embodiments, a pixel may include three sub-pixels, such as a green sub-pixel, a red sub-pixel, and a blue sub-pixel, but not limited thereto, and the number and color of the sub-pixels included in the pixel may vary according to the requirement. The number and arrangement of the pixels and the sub-pixels can be adjusted according to the requirement, for example, the sub-pixels can be arranged in an array (matrix), a stripe (stripe), a staggered (staggered) or other suitable arrangements. In addition, the top view shape of the light emitting portion of the sub-pixel may be a rectangle, a parallelogram, a chevron (chevron), a shape having curved edges, or any other suitable shape, and the top view shape of the light emitting portion of the sub-pixel may be defined, for example, by an opening of the light blocking layer, which will be described later.

As shown in fig. 1, the electronic device 100 may include a first substrate 110 and a second substrate 140, wherein the first substrate 110 and the second substrate 140 are disposed opposite to each other and overlapped in a normal direction Dt of the first substrate 110, and are connected by an adhesive structure AL to form an accommodating space between the first substrate 110 and the second substrate 140. The first substrate 110 and the second substrate 140 may include a rigid substrate or a flexible substrate, for example. The rigid substrate may include, but is not limited to, glass (glass), quartz (quartz), ceramic (ceramic), sapphire (sapphire), or other suitable materials or combinations thereof. The flexible substrate may include Polyimide (PI), polyethylene terephthalate (PET), other suitable materials, or a combination thereof, for example, but not limited to. In some embodiments, the materials of the first substrate 110 and the second substrate 140 may be the same as or different from each other. In some embodiments, the first substrate 110 and the second substrate 140 may be a rigid substrate, a flexible substrate, or a flexible substrate. In some embodiments, the first substrate 110 and the second substrate 140 are fixed to each other by an adhesive structure AL, which may include, but is not limited to, a sealant (sealant) and/or any other suitable adhesive material.

It should be noted that, in some embodiments (as shown in fig. 1), the display panel in the electronic device 100 may include a first substrate 110, a second substrate 140, a component or structure disposed on the first substrate 110, and a component or structure disposed on the second substrate 140, but is not limited thereto. In some embodiments, the display panel in the electronic device 100 may include a first substrate 110 and elements or structures disposed on the first substrate 110. Some of the elements and structures will be described in detail below, so that the electronic device 100 may include some or all of these elements and structures as desired.

As shown in fig. 1, the display element layer 120 is disposed on the inner surface 110a of the first substrate 110 adjacent to the second substrate 140, and thus the display element layer 120 is located between the first substrate 110 and the second substrate 140. The display element layer 120 may include at least one conductive layer, at least one insulating layer, at least one semiconductor layer, any other layer, or a combination thereof to form a multi-layer structure, and one or more layers of the multi-layer structure may form the display element 122 included in the sub-pixel, such as a light emitting device (e.g., a light emitting diode), a pixel electrode, a common electrode, or other suitable devices. The material of the conductive layer may include metal, transparent conductive material (e.g., Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), etc.), other suitable conductive material, or a combination thereof, the material of the insulating layer may include silicon oxide (SiOx), silicon nitride (SiNy), silicon oxynitride (SiOxNy), polymethyl methacrylate (PMMA), other suitable insulating material, or a combination thereof, and the material of the semiconductor layer may include poly-silicon (poly-silicon), amorphous silicon (amorphous silicon), metal-oxide semiconductor (IGZO), other suitable semiconductor material, or a combination thereof, but is not limited thereto.

One or more of the display element layers 120 may also form a plurality of display switching elements electrically connected to the display elements 122 within the subpixels. The display switch element may be a Thin Film Transistor (TFT) or other suitable switch, wherein the type of TFT may be, for example, a top gate type (top gate) TFT, a bottom gate type (bottom gate) TFT, a dual gate (dual gate) TFT or other suitable type of TFT. One or more of the display device layers 120 may further optionally form other electronic devices, such as capacitors, and the connection manner of the display device 122, the display switch device and the other electronic devices may be adjusted according to design requirements. For example, a sub-pixel of the liquid crystal display panel may have a pixel electrode and a display switch element, and a capacitor may be selectively disposed in the sub-pixel, but not limited thereto. For another example, in some embodiments (e.g., the electronic device 100 includes other types of display panels), the circuit design in the sub-pixel may include a circuit architecture of two transistors and one capacitor, or other suitable architectures.

The electronic device 100 may include a plurality of conductive lines, wherein each conductive line may include one or more conductive layers. In fig. 1, the plurality of conductive lines may include a plurality of first conductive lines T1 disposed on the inner surface 110a of the first substrate 110, and each of the first conductive lines T1 may electrically connect elements, such as the display element 122, the display switching element, and the capacitor, disposed in the display element layer 120. In some embodiments, the plurality of conductive lines may further include a plurality of second conductive lines (not shown) disposed on the inner surface 110a of the first substrate 110, and each of the second conductive lines may be electrically connected to devices in the display device layer 120, such as the display device 122, the display switch device, and the capacitor. In some embodiments, the first conductive line T1 may be electrically connected to one end of the display switch element, such as a source (i.e., the first conductive line T1 may be used as a display data line), and the second conductive line may be electrically connected to the other end of the display switch element, such as a gate (i.e., the second conductive line may be used as a display scan line), but not limited thereto. In some embodiments, the first conductive lines T1 may be substantially parallel to each other, the second conductive lines may be substantially parallel to each other, and the first conductive lines T1 and the second conductive lines may be non-parallel to each other, for example, the first conductive lines T1 and the second conductive lines may be substantially perpendicular to each other, but not limited thereto.

In some embodiments, the first conductive line T1 and/or the second conductive line may be formed simultaneously with at least a portion of one of the elements in the display element layer 120, respectively. In some embodiments, the first conductive line T1 and one end (e.g., source) of the display switch device can be formed simultaneously by the same process, and the second conductive line and the other end (e.g., gate) of the display switch device can be formed simultaneously by the same process, but not limited thereto. In some embodiments, the first conductive line T1 may be connected to one end (e.g., source) of the display switch device through a connection structure, and/or the second conductive line may be connected to the other end (e.g., gate) of the display switch device through another connection structure, but not limited thereto.

In addition, in some embodiments, the first conductive line T1 may be electrically connected to the gate of the display switch device to serve as a display scan line, and the second conductive line may be electrically connected to the source of the display switch device to serve as a display data line. That is, the two ends of the display switch element electrically connected to the first conductive line T1 and the second conductive line may be interchanged with each other, but not limited thereto.

The electronic device 100 may include a fingerprint sensing element layer 130 for sensing a biometric characteristic (e.g., a fingerprint), wherein the fingerprint sensing element layer 130 may be adjusted to a desired position. In some embodiments (e.g., fig. 1), the fingerprint sensing device layer 130 may be disposed on the second substrate 140, but not limited thereto. In some embodiments (as shown in fig. 1), the fingerprint sensing device layer 130 may be disposed on a surface of the second substrate 140 opposite to the first substrate 110 (or referred to as an outer surface 140b of the second substrate 140), that is, the second substrate 140 is located between the fingerprint sensing device layer 130 and the first substrate 110, but not limited thereto. The fingerprint sensing device layer 130 may define the size of the fingerprint sensing region FSR in the active region AR, wherein the fingerprint sensing region FSR may overlap or not overlap with the display region DR, and the size of the fingerprint sensing region FSR may be larger than, smaller than or equal to the size of the display region DR. For example, in some embodiments (as shown in fig. 1), the fingerprint sensing region FSR may overlap the display region DR, and the size of the fingerprint sensing region FSR is the same as that of the display region DR, but not limited thereto. In addition, the fingerprint sensing device layer 130 may include at least one conductive layer, at least one insulating layer, at least one semiconductor layer, any other film layer or a combination thereof to form an electronic device in the fingerprint sensing device layer 130, wherein the conductive layer, the insulating layer and the semiconductor layer in the fingerprint sensing device layer 130 are made of materials similar to the display device layer 120, which is not repeated herein.

The fingerprint sensing element layer 130 may comprise at least one fingerprint sensing unit 132 as a fingerprint sensor for sensing a biometric feature (e.g. a fingerprint) to obtain a profile of the biometric feature (e.g. ridges, valleys and/or feature points of the fingerprint). In the present invention, the type of the fingerprint sensor is not particularly limited, and may be, for example, a capacitive fingerprint sensor, an optical fingerprint sensor, an ultrasonic fingerprint sensor, or other suitable fingerprint sensors. In some embodiments using the capacitive fingerprint sensor, the fingerprint sensing unit 132 may include, for example, an electrode, a capacitor, or other suitable capacitive sensing units, so as to obtain a capacitance value of a corresponding area of a biological representation (e.g., a fingerprint) during sensing, and perform identification of the biological representation according to a difference between the capacitance values of the areas (i.e., the capacitance value of the area corresponding to the ridge is different from that of the area corresponding to the valley), but not limited thereto. In some embodiments using the optical fingerprint sensor, the fingerprint sensing unit 132 may include, for example, a PIN diode (having a P-type semiconductor layer, an intrinsic layer, and an N-type semiconductor layer) or other suitable photoelectric conversion unit to identify the biometric feature according to the received light intensity reflected from the biometric feature (e.g., the light intensity reflected by the ridge and the valley is different) during sensing, but not limited thereto. In some embodiments of the ultrasonic fingerprint sensor, the fingerprint sensing unit 132 may include an ultrasonic receiving and generating unit having two electrodes and a piezoelectric layer sandwiched between the two electrodes, so that when sensing, a proper voltage difference is provided to the two electrodes of the ultrasonic receiving and generating unit to deform (e.g. rapidly vibrate) the piezoelectric layer to generate ultrasonic waves, the generated ultrasonic waves reflect reflected ultrasonic waves with different intensities according to different profiles of the biological representation (e.g. ridges and valleys of a fingerprint), then the piezoelectric layer of the ultrasonic receiving and generating unit deforms (e.g. rapidly vibrates) after receiving the reflected ultrasonic waves to generate a voltage difference between the two electrodes, and finally the biological representation is identified according to the difference of the voltage difference (e.g. the voltage difference between the areas corresponding to the ridges and corresponding valleys), but not limited thereto.

The fingerprint sensing device layer 130 may further optionally include at least one sensing switch device (not shown) electrically connected to the fingerprint sensing unit 132, and the connection manner of the sensing switch device and the fingerprint sensing unit 132 may be determined according to the sensing method or other requirements. In some embodiments, the sensing switch element may be a thin film transistor or other suitable switch. In addition, the fingerprint sensing element layer 130 may optionally include other desired electronic elements.

In fig. 1, the plurality of conductive lines may include a plurality of third conductive lines T3 disposed on the second substrate 140, and each of the third conductive lines T3 is electrically connected to the fingerprint sensing unit 132, the sensing switch element, and other elements disposed in the fingerprint sensing element layer 130. In some embodiments, the plurality of conductive lines may further include a plurality of fourth conductive lines (not shown) disposed on the second substrate 140, and each of the fourth conductive lines is electrically connected to the fingerprint sensing unit 132, the sensing switch element, and other elements disposed in the fingerprint sensing element layer 130. In some embodiments, the third conductive line T3 may be electrically connected to one end of the sensing switch element, such as a source (i.e., the third conductive line T3 may be used as a sensing signal line), and the fourth conductive line may be electrically connected to the other end of the sensing switch element, such as a gate (i.e., the fourth conductive line may be used as a sensing scan line), but not limited thereto. In some embodiments, the third conductive lines T3 may be substantially parallel to each other, the fourth conductive lines may be substantially parallel to each other, and the third conductive lines T3 and the fourth conductive lines may be non-parallel to each other, for example, the third conductive lines T3 and the fourth conductive lines may be substantially perpendicular to each other, but not limited thereto.

In some embodiments, the third conductive line T3 and/or the fourth conductive line may be formed simultaneously with at least a portion of one of the elements in the fingerprint sensing element layer 130, respectively. In some embodiments, the third conductive line T3 and one end (e.g., source) of the sensing switch device can be formed simultaneously by the same process, and the fourth conductive line and the other end (e.g., gate) of the sensing switch device can be formed simultaneously by the same process, but not limited thereto. In some embodiments, the third conductive line T3 may be connected to one end (e.g., source) of the sensing switch element through a connection structure, and/or the fourth conductive line may be connected to the other end (e.g., gate) of the sensing switch element through another connection structure, but not limited thereto.

In addition, in some embodiments, the third conductive line T3 may be electrically connected to the gate of the sensing switch device to serve as a sensing scan line, and the fourth conductive line may be electrically connected to the source of the sensing switch device to serve as a sensing data line. That is, the two ends of the sensing switch element electrically connected to the third conductive line T3 and the fourth conductive line may be interchanged with each other, but not limited thereto.

The electronic device 100 may include desired circuits disposed on the first substrate 110 and/or the second substrate 140. In some embodiments, as shown in fig. 1, the electronic device 100 may include at least one Integrated Circuit (IC) 150 disposed on the peripheral region PR of the first substrate 110 and electrically connected to the conductive wires to couple to other electronic elements. In some embodiments, one integrated circuit 150 may package together electronic components providing different functions to form a single chip, for example, but not limited to, the electronic components driving the display element 122 and the electronic components driving the fingerprint sensing unit 132. In some embodiments, one integrated circuit 150 may electrically connect the display device 122 and the fingerprint sensing unit 132 to drive the display device 122 and the fingerprint sensing unit 132 in the display panel, so as to control the image display and the fingerprint identification of the electronic device 100 (i.e., the integrated circuit 150 may have both the image display control function and the fingerprint identification control function), in which case, since the number of the integrated circuits 150 may be reduced, the thickness of the electronic device 100 may be reduced and/or the size of the peripheral region PR of the electronic device 100 may be reduced, but not limited thereto.

The first conductive trace T1 can be electrically connected between the integrated circuit 150 and the display switch device, such that the integrated circuit 150 can be electrically connected to the display device 122 through the first conductive trace T1 and the display switch device in sequence, but not limited thereto. In addition, in order to electrically connect the integrated circuit 150 of the first substrate 110 to the fingerprint sensing unit 132 on the second substrate 140, the electronic device 100 may further include a first connection line 160, wherein the first connection line 160 extends from the inner surface 110a of the first substrate 110 to the outer surface 140b of the second substrate 140 through the side surface 140c of the second substrate 140 to serve as an electrical connection path between the electronic components on the first substrate 110 and the electronic components on the second substrate 140 (i.e., the first connection line 160 serves as a connection line between the electronic components on the two substrates). In some embodiments, the first connecting line 160 is located outside the adhesion structure AL. In addition, the electronic device 100 may further include a fifth conductive line (not shown in fig. 1) disposed on the inner surface 110a of the first substrate 110. In some embodiments, at least a portion of the fifth conductive line and at least a portion of the first conductive line T1 may be formed simultaneously by the same process, but not limited thereto. In some embodiments, the first conductive line T1 and the fifth conductive line may belong to different conductive layers respectively. Regarding the electrical connection between the integrated circuit 150 and the fingerprint sensing unit 132, in fig. 1, the first connection line 160 is connected between the fifth conducting line and the third conducting line T3, and the fifth conducting line is connected between the integrated circuit 150 and the first connection line 160, so that the integrated circuit 150 can be electrically connected to the fingerprint sensing unit 132 through the fifth conducting line, the first connection line 160, the third conducting line T3 and the sensing switch element in sequence, but not limited thereto. As shown in fig. 1, the fingerprint sensing unit 132 may be electrically connected to the integrated circuit 150 on the first substrate 110 through first connection lines 160 as connection lines on the side surface 140c of the second substrate 140. In some embodiments, the fifth conductive wires and the first connecting wires 160 are connected to each other one-to-one, but not limited thereto. It should be noted that, a connection pad (pad) may be selectively disposed at one end of the third conductive line T3 to increase the area of the first connection line 160 connected to the third conductive line T3, and connection pads may be selectively disposed at two ends of the fifth conductive line to increase the area of the integrated circuit 150 connected to the fifth conductive line and the area of the first connection line 160 connected to the fifth conductive line, so as to improve the reliability of the electrical connection, but not limited thereto. In addition, it should be noted that the first connection line 160 is not in direct contact with the first conductive line T1.

In addition, the first connecting line 160 may be any suitable conductive material, such as a transparent conductive material (e.g., indium tin oxide, indium zinc oxide), a metal, a conductive adhesive (e.g., silver adhesive), or other suitable materials or combinations thereof, but is not limited thereto. In some embodiments, the patterned first connection line 160 may be formed by printing, coating, or pasting, but not limited thereto. In addition, since the first connection lines 160 may be formed by printing, coating or pasting, the resolution (e.g., line width) of the first connection lines 160 may be limited (e.g., the resolution is low and/or the line width is large). Accordingly, in some embodiments, the electronic device 100 may optionally include a Demultiplexer (DEMUX) disposed on the second substrate 140 and electrically connected between the third conductive line T3 and the first connection line 160. Since the demultiplexer may enable one first connection line 160 to provide signals to different third conductive lines T3 at different times or enable different third conductive lines T3 to provide signals to the same first connection line 160 at different times, the number of first connection lines 160 may be less than the number of third conductive lines T3. In some embodiments, the electronic device 100 may not have a multi-task demodulator, and the number of the first connection lines 160 may be equal to the number of the third conductive lines T3, but is not limited thereto.

In addition, the electronic device 100 may further optionally include other circuits disposed on the second substrate 140. For example, the electronic device 100 may further optionally include a signal amplifying circuit electrically connected to the third wire T3 for amplifying the sensing signal of the fingerprint sensing unit 132, but not limited thereto. In some embodiments, these other circuits may also be integrated into the integrated circuit 150 with fingerprint recognition control.

In addition, the circuit in the electronic device 100 may further include a first gate driving circuit (gate driving circuit) disposed on the first substrate 110 and electrically connected to the gate of the display switching element in the display element layer 120 through a second conductive line to drive the display switching element, but not limited thereto. In some embodiments, the first gate driving circuit may be electrically connected to the gates of the display switch devices in the display device layer 120 through the first conductive line T1. The circuit in the electronic device 100 may further optionally include a second gate driving circuit disposed on the second substrate 140 and electrically connected to the gate of the sensing switch element in the fingerprint sensing element layer 130 through a fourth conductive line to drive the sensing switch element, but not limited thereto. In some embodiments, the second gate driving circuit may also be electrically connected to the gate of the sensing switch device in the fingerprint sensing device layer 130 through the third conductive line T3.

In some embodiments, when the first substrate 110 is a flexible substrate, a portion of the first substrate 110 may be bent to bend at least a portion of the peripheral region PR to the back of the active region AR or another portion of the peripheral region PR (i.e., downward in fig. 1), so as to form a front plate portion and a back plate portion. For example, in some embodiments (not shown), the integrated circuit 150 disposed in the peripheral region PR may be bent downward (i.e., the integrated circuit 150 is located on the back plate portion), but not limited thereto. In this case, the size of the bezel (border) of the electronic device 100 may be reduced. In addition, in some embodiments, other components in the electronic device 100, such as a battery, may be disposed between the front plate portion and the rear plate portion of the first substrate 110 after being bent, but not limited thereto.

The electronic device 100 may also include any desired layers and/or structures. In some embodiments, the electronic device 100 includes a liquid crystal display panel and a backlight module disposed on a side of the first substrate 110 opposite to the second substrate 140 (i.e., the first substrate 110 is located between the backlight module and the second substrate 140). It should be noted that, when the first substrate 110 is bent, it can be selectively bent to the lower side of the backlight module, but not limited thereto. In some embodiments, the electronic device 100 may include a dielectric layer ML, such as a liquid crystal layer containing liquid crystal molecules. The medium layer ML is disposed between the first substrate 110 and the second substrate 140, wherein the display elements 122, such as the pixel electrodes and the common electrode, can adjust the rotation of the liquid crystal molecules in the liquid crystal layer according to the display signal, so as to control the transmittance of the backlight.

In some embodiments, the electronic device 100 may include a display panel, and the electronic device 100 may further include a light conversion layer (shown in subsequent figures), a light blocking layer (shown in subsequent figures), an optical film, other suitable films, or a combination thereof. The light blocking layer may have a light shielding property and be disposed on the first substrate 110 or the second substrate 140 as required. The light blocking layer may include, for example, a black photoresist, a black ink, a black resin (resin), a colorant (dye), other suitable materials, or a combination thereof, and may have a single-layer structure or a multi-layer structure. The light blocking layer is used, for example, to shield an underlying element (e.g., a switch element or a wire) or to reduce the probability of external light being reflected by an element (e.g., a switch element or a wire) in the electronic device 100, but is not limited thereto. In some embodiments, the light blocking layer has a plurality of openings to define the top-down shape of the sub-pixels, and thus, the light blocking layer may be used to separate the sub-pixels. In some embodiments, a light blocking layer may be used to reduce interference between light rays in different sub-pixels.

The light conversion layer is disposed in the opening of the light blocking layer such that the light conversion layer may correspond to one sub-pixel in the normal direction Dt. In some embodiments, the light conversion layer is closer to the light emitting surface of the electronic device 100 than to the light emitting device (e.g., light emitting device, backlight module) to convert the color of the received light. In some embodiments, the light conversion layer may include a color filter (color filter), a Quantum Dot (QD) material, a fluorescent (fluorescent) material, a phosphorescent (phosphorescent) material, other suitable materials, or any combination thereof. In addition, the light conversion layers corresponding to different types of sub-pixels may perform different light conversions. For example, the light conversion layer corresponding to the green sub-pixel can be used to convert incident light into green light, the light conversion layer corresponding to the red sub-pixel can be used to convert incident light into red light, and the light conversion layer corresponding to the blue sub-pixel can be used to convert incident light into blue light, but not limited thereto. In some embodiments, the light conversion layer can have the property of scattering light, e.g., the light conversion layer can include light scattering particles.

Examples of the optical film layer may include an anti-reflection film, a polarizer (polarizer), other suitable film layers, or any combination thereof, and the optical film layer may be disposed at any suitable position. In some embodiments, the anti-reflection film may be disposed on the second substrate 140, but is not limited thereto. In some embodiments, the polarizer may be one or more, and may be disposed on the first substrate 110 or the second substrate 140, respectively.

The electronic device 100 may further include a circuit board (not shown) for receiving external signals or transmitting signals in the electronic device 100 to the outside. In some embodiments, the circuit board may be bonded to the first substrate 110 or the second substrate 140 by, for example, soldering, so as to be electrically connected to the electronic components (e.g., the integrated circuit 150) on the first substrate 110 and/or the second substrate 140. In some embodiments, the external connection structure may be electrically connected to the components on the circuit board by, for example, being disposed on the circuit board by soldering or other suitable means, so that the electronic device 100 and the outside may be electrically connected through the circuit board and the external connection structure on the circuit board. In addition, the circuit board can be a hard circuit board or a flexible circuit board. In some embodiments, if the circuit board is a flexible circuit board, the circuit board may be bent to reduce the size of the electronic device 100.

The electronic device of the present invention is not limited to the above-mentioned embodiments, and other embodiments will be further disclosed, however, in order to simplify the description and to make the differences between the above-mentioned embodiments more obvious, the same reference numerals are used to designate the same elements in the following description, and repeated descriptions are omitted.

Referring to fig. 2, fig. 2 is a schematic cross-sectional view of an electronic device according to a second embodiment of the invention. As shown in fig. 2, the difference between the present embodiment and the first embodiment is that the fingerprint sensing device layer 130, the third conductive line T3 and the fourth conductive line of the electronic device 200 of the present embodiment are disposed on the inner surface 140a of the second substrate 140 close to the first substrate 110, that is, the fingerprint sensing device layer 130, the third conductive line T3 and the fourth conductive line are disposed between the second substrate 140 and the first substrate 110. In addition, according to the design of the present embodiment, the first connection line 160 may not need to extend to the outer surface 140b of the second substrate 140, but is not limited thereto. In fig. 2, the third conductive line T3 is electrically connected to the first connection line 160 at a side surface 140c close to the second substrate 140, but not limited thereto.

Referring to fig. 3, fig. 3 is a schematic cross-sectional view of an electronic device according to a third embodiment of the invention. As shown in fig. 3, the difference between the present embodiment and the second embodiment is that the first connecting line 160 of the electronic device 300 of the present embodiment may extend inward onto the inner surface 140a of the second substrate 140, so as to increase the contact area between the first connecting line 160 and the third conductive line T3. In fig. 3, the adhesive structure AL does not overlap the side surface 140c of the second substrate 140 in the normal direction Dt, so that a portion of the third wire T3 is exposed outside the adhesive structure AL, thereby increasing the contact area between the first connecting wire 160 and the third wire T3.

Referring to fig. 4, fig. 4 is a schematic cross-sectional view of an electronic device according to a fourth embodiment of the invention. As shown in fig. 4, the difference between the present embodiment and the second embodiment is that the electronic device 400 of the present embodiment further includes an interconnecting portion 410 disposed on the side surface 140c of the second substrate 140 and electrically connected between the first connecting line 160 and the third conducting wire T3. For example, the interconnection portion 410 and the first connection line 160 are connected to each other one-to-one, but not limited thereto. In fig. 4, the first connection line 160 covers the interconnection 410 by way of example, but not by way of limitation. The interconnect 410 may be any suitable conductive material, such as a transparent conductive material (e.g., indium tin oxide, indium zinc oxide), a metal (e.g., aluminum, gold, silver), a conductive paste (e.g., silver paste), or other suitable materials or combinations of the foregoing, but is not limited thereto. In some embodiments, the materials of the interconnection 410 and the first connection line 160 may be the same or different. In some embodiments, the material used for the interconnection 410 may have a lower resistance than the material of the first connection line 160. In addition, in some embodiments, the interconnection 410 may be formed by printing, coating or pasting, but not limited thereto. In some embodiments, the interconnect 410 may be formed by a semiconductor process, but is not limited thereto. Since the interconnection 410 is interposed between the first connection line 160 and the third conductive line T3, the electrical connection effect between the first connection line 160 and the third conductive line T3 can be improved, such as improving the reliability of the electrical connection or reducing the resistance.

Referring to fig. 5 and 6, fig. 5 is a cross-sectional schematic view of an electronic device according to a fifth embodiment of the invention, fig. 6 is a schematic top view of a portion of the area shown in fig. 5, in which fig. 5 illustrates the sub-pixels SPX1 to SPX3, the display switch element 124, the sensing switch element 134, the fingerprint sensing unit 132, the light blocking layer LS, and the light conversion layers LT1 to LT3, fig. 6 illustrates the sub-pixels SPX1 and the sub-pixels SPX2 in fig. 5, and correspondingly illustrates the fingerprint sensing unit 132, the sensing switch element 134, and the light blocking layer LS in fig. 5. As shown in fig. 5 and 6, compared to the second embodiment shown in fig. 2, fig. 5 and 6 illustrate more components and structures in the electronic device 500. In fig. 5, the light blocking layer LS and the light conversion layers LT1 to LT3 are disposed on the inner surface 140a of the second substrate 140, and the fingerprint sensing element layer 130 is disposed on the light blocking layer LS and the light conversion layers LT1 to LT3 (i.e., the fingerprint sensing element layer 130 is located between the light blocking layer LS and the first substrate 110), but not limited thereto, the arrangement of the film layers may be adjusted according to actual requirements. In some embodiments, the fingerprint sensing element layer 130 may be disposed on the inner surface 140a of the second substrate 140, and the light blocking layer LS and the light conversion layers LT1 to LT3 are disposed on the fingerprint sensing element layer 130 (i.e., the light blocking layer LS and the light conversion layers LT1 to LT3 are disposed between the fingerprint sensing element layer 130 and the first substrate 110), but not limited thereto. In some embodiments, the light blocking layer LS and the light conversion layers LT1 to LT3 may be disposed on the first substrate 110, but not limited thereto. In addition, the electronic device 500 may further optionally include an insulating protection layer IPL to protect the covered elements or structures, wherein the insulating protection layer IPL may cover the light blocking layer LS and the light conversion layers LT1 to LT 3. In addition, the fingerprint sensing device layer 130 may further include a protection layer 136 covering the sensing switch device 134, the fingerprint sensing unit 132 and/or the conductive lines (e.g., the third conductive line T3, the fourth conductive line), but not limited thereto. In some embodiments, the light blocking layer LS, the light conversion layers LT1 to LT3, the insulating protection layer IPL, and the fingerprint sensing element layer 130 are sequentially formed on the inner surface 140a of the second substrate 140, but not limited thereto, the forming order may be adjusted according to the stack design of the film layers. In addition, since the sub-pixels SPX1 to SPX3 in fig. 5 emit different colors, the light conversion layers LT1 to LT3 can emit light of different colors.

In fig. 5, the light blocking layer LS may overlap and shield the display switching elements 124, the sensing switching elements 134, the conductive lines, and/or at least a portion of the fingerprint sensing unit 132 in the normal direction Dt, and the light conversion layers LT1 to LT3 are disposed through the opening OP. In the top view of fig. 6, the fingerprint sensing unit 132 and the sensing switch element 134 are disposed around the light conversion layers LT1 to LT3, and the sensing switch element 134 and at least a part of the fingerprint sensing unit 132 overlap the light blocking layer LS in the normal direction Dt. In addition, in some embodiments, the light blocking layer LS may optionally have a sensing opening (not shown) to expose a portion of the fingerprint sensing unit 132, such that the fingerprint sensing unit 132 can receive light, electromagnetic waves or acoustic waves through the sensing opening, but not limited thereto. In addition, the correspondence between the fingerprint sensing units 132 and the sub-pixels, the density of the fingerprint sensing units 132, and the number of the fingerprint sensing units 132 may be adjusted according to actual sensing requirements. For example, one fingerprint sensing unit 132 may correspond to one sub-pixel, a plurality of sub-pixels, one pixel or a plurality of pixels, but not limited thereto. In fig. 6, one fingerprint sensing unit 132 corresponds to two sub-pixels (e.g., the sub-pixel SPX1 and the sub-pixel SPX2), but not limited thereto.

Referring to fig. 7 and 8, fig. 7 is a cross-sectional view of an electronic device according to a sixth embodiment of the invention, and fig. 8 is a side view of the electronic device according to the sixth embodiment of the invention. As shown in fig. 7 and 8, the difference between the present embodiment and the second embodiment is that the integrated circuit 150 and the fifth conductive line T5 of the electronic device 600 of the present embodiment can be disposed on the surface of the first substrate 110 opposite to the second substrate 140 (or referred to as the outer surface 110b of the first substrate 110), so that the size of the electronic device 600 can be reduced. In order to connect the integrated circuit 150 to the electronic components of the second substrate 140 (e.g., the fingerprint sensing unit 132 and the sensing switch element in the fingerprint sensing device layer 130), the first connection line 160 extends from the side surface 140c of the second substrate 140 to the outer surface 110b of the first substrate 110 through the side surface 110c of the first substrate 110 to connect the fifth conductive line T5 on the outer surface 110b of the first substrate 110, so that the electronic components of the second substrate 140 can be electrically connected to the integrated circuit 150 through the first connection line 160 and the fifth conductive line T5.

In addition, in order to enable the integrated circuit 150 to be connected to electronic components located on different surfaces of the first substrate 110 (for example, the display component 122 and the display switch component located in the display component layer 120 on the inner surface 110a of the first substrate 110), the electronic device 600 may further include a second connection line 660, the second connection line 660 extending from the side surface 110c of the first substrate 110 to the outer surface 110b of the first substrate 110 to electrically connect the electronic components located on the inner surface 110a and the outer surface 110b of the first substrate 110, and thus, the second connection line 660 may serve as a connection line between the electronic components on two opposite surfaces of the first substrate 110. In some embodiments, the second connection lines 660 are located outside the adhesion structure AL. In addition, referring to fig. 7 and 8, the electronic device 600 may further include a sixth conductive trace T6 disposed on the outer surface 110b of the first substrate 110. In some embodiments, the fifth conductive line T5 and the sixth conductive line T6 may be formed simultaneously by the same process, but not limited thereto. In some embodiments, the fifth conductive line T5 and the sixth conductive line T6 may belong to different conductive layers. Regarding the electrical connection between the integrated circuit 150 and the devices in the display device layer 120, in fig. 7 and 8, the second connection line 660 is connected between the sixth conductive line T6 and the first conductive line T1, and the sixth conductive line T6 is connected between the integrated circuit 150 and the second connection line 660, so that the integrated circuit 150 can be electrically connected to the display device 122 through the sixth conductive line T6, the second connection line 660, the first conductive line T1 and the display switch device in sequence, but not limited thereto. In some embodiments, the sixth conductive line T6 and the second connection line 660 may be connected to each other in a one-to-one manner, but not limited thereto. Similarly, the connection pads may be selectively disposed at two ends of the sixth conductive line T6 to increase the area of the integrated circuit 150 connected to the sixth conductive line T6 and the area of the second connection line 660 connected to the sixth conductive line T6, so as to improve the connection reliability, but not limited thereto.

In addition, in fig. 7, the first connection line 160 may extend inward to the inner surface 140a of the second substrate 140 to increase a connection area between the first connection line 160 and the third conductive line T3, and the second connection line 660 may extend inward to the inner surface 110a of the first substrate 110 to increase a connection area between the second connection line 660 and the first conductive line T1, but not limited thereto. In some embodiments, the third conductive line T3 may be electrically connected to the first connection line 160 at the side surface 140c of the second substrate 140, and the first conductive line T1 may be electrically connected to the second connection line 660 at the side surface 110c of the first substrate 110, but not limited thereto.

In fig. 8, the first connection lines 160 and the second connection lines 660 may be alternately disposed with each other, but not limited thereto, and the arrangement of the first connection lines 160 and the second connection lines 660 on the side surfaces may be designed according to the requirement. In addition, the electronic device 600 may further optionally include an interconnection (e.g., the interconnection 410 shown in fig. 4) disposed between the first connection line 160 and the third conductive line T3 and/or disposed between the first connection line 160 and the fifth conductive line T5 and/or disposed between the second connection line 660 and the first conductive line T1 and/or disposed between the second connection line 660 and the sixth conductive line T6.

In addition, in some embodiments, the circuit board may be bonded to the inner surface 110a or the outer surface 110b of the first substrate 110, but not limited thereto. In addition, in some embodiments, if the electronic device 600 has a backlight module, the integrated circuit 150, the fifth conductive line T5 and the sixth conductive line T6 may be disposed on a surface of the backlight module away from the first substrate 110, the first connection line 160 may extend from the side surface 140c of the second substrate 140 to the surface of the backlight module away from the first substrate 110 through the side surface 110c of the first substrate 110 and the side surface of the backlight module, and the second connection line 660 may extend from the side surface 110c of the first substrate 110 to the surface of the backlight module away from the first substrate 110 through the side surface of the backlight module. Therefore, the integrated circuit 150 can be connected to other electronic devices through the conductive wires (the fifth conductive wire T5, the sixth conductive wire T6, the first conductive wire T1 and/or the third conductive wire T3) and the connecting wires (the first connecting wire 160 and/or the second connecting wire 660). In this case, the circuit board may be selectively bonded to a surface of the backlight module away from the first substrate 110, but not limited thereto.

Referring to fig. 9, fig. 9 is a schematic cross-sectional view of an electronic device according to a seventh embodiment of the invention. As shown in fig. 9, the difference between the present embodiment and the first embodiment is that the fingerprint sensing device layer 130 of the electronic device 700 of the present embodiment is disposed on the first substrate 110. In fig. 9, the fingerprint sensing element layer 130 is disposed on the display element layer 120 and separated from each other by an insulating layer IL, so that the integrated circuit 150 is electrically connected to the elements in the fingerprint sensing element layer 130 through the third conductive line T3, but not limited thereto. In some embodiments, the first conductive line T1 and the third conductive line T3 may be made of the same material or different materials. In some embodiments, the display element layer 120 may also be disposed on the fingerprint sensing element layer 130 and separated from each other by the insulating layer IL, but not limited thereto.

In addition, in some embodiments, the second substrate 140, the adhesion structure AL, and the medium layer ML in fig. 9 may be removed, so that the electronic device 700 may be a single-substrate structure. In this case, the electronic device 700 may include an organic light emitting diode display panel, an inorganic light emitting diode display panel, a quantum dot display panel, or other suitable display panel.

Referring to fig. 10 and 11, fig. 10 is a cross-sectional view of an electronic device according to an eighth embodiment of the invention, and fig. 11 is a top view of the electronic device according to the eighth embodiment of the invention before being bent, wherein fig. 11 only shows a portion of the sub-pixels SPX 1-SPX 3 and a portion of the fingerprint sensing unit 132, so as to make the drawings clear. As shown in fig. 10, the difference between the present embodiment and the seventh embodiment is that the first substrate 110 of the electronic device 800 of the present embodiment is a flexible substrate, wherein the bent first substrate 110 can be divided into a front plate portion 110F and a rear plate portion 110K, and the display element layer 120 and the fingerprint sensing element layer 130 can be respectively disposed on different portions of the first substrate 110. For example, in fig. 10, the display element layer 120 may be disposed on the front plate portion 110F of the first substrate 110, and the fingerprint sensing element layer 130 may be disposed on the rear plate portion 110K of the first substrate 110, wherein the display element layer 120 may display a picture upwards (i.e., towards the second substrate 140 in fig. 10), and the fingerprint sensing element layer 130 may sense upwards (i.e., towards the second substrate 140 in fig. 10) or downwards (i.e., towards the direction away from the second substrate 140 in fig. 10), but not limited thereto. In addition, in fig. 10, the integrated circuit 150 may be disposed on the back plate portion 110K of the first substrate 110, but not limited thereto. In fig. 10 and 11, the sizes of the display region DR and the fingerprint sensing region FSR may be the same or different from each other. In addition, the correspondence between the fingerprint sensing units 132 and the sub-pixels SPX 1-SPX 3, the density of the fingerprint sensing units 132, and the number of the fingerprint sensing units 132 can be designed according to actual requirements.

Referring to fig. 12 and 13, fig. 12 is a cross-sectional view of an electronic device according to a ninth embodiment of the invention, and fig. 13 is a top view of the electronic device according to the ninth embodiment of the invention, wherein fig. 13 only shows some components in the active region AR, so that the drawings are clear. As shown in fig. 12 and fig. 13, the difference between the present embodiment and the seventh embodiment is that the electronic device 900 of the present embodiment further includes a touch sensing device layer 910 for generating a touch signal to know the position or the motion of a touch device (e.g., a stylus, a finger, etc.). In some embodiments, the touch sensing device layer 910 may be disposed on the outer surface 140b or the inner surface 140a of the second substrate 140 (the touch sensing device layer 910 is disposed on the inner surface 140a of the second substrate 140 in fig. 12), and the fingerprint sensing device layer 130 and the display device layer 120 may be disposed on the first substrate 110, but not limited thereto. The touch sensing device layer 910 may define a size of a touch region TR in the active region AR, wherein the fingerprint sensing region FSR, the display region DR and the touch region TR may or may not overlap each other, and the size of the touch region TR may be larger than, smaller than or equal to the size of the display region DR. For example, in some embodiments (as shown in fig. 12 and 13), the fingerprint sensing region FSR, the display region DR and the touch region TR may overlap with each other, and the sizes of the fingerprint sensing region FSR, the display region DR and the touch region TR are the same, but not limited thereto. In addition, the touch sensing device layer 910 may include at least one conductive layer, any other film layer, or a combination thereof to form, for example, the touch sensing unit 912. For example, the touch sensing unit 912 can be a transparent conductive electrode, but not limited thereto. In some embodiments, the touch sensing unit 912 can perform sensing in a capacitive manner, such as self-capacitance (self-capacitance) or mutual-capacitance (mutual-capacitance), but not limited thereto. In some embodiments, the touch sensing unit 912 can sense using any other suitable manner. In addition, in some embodiments, the electronic device 900 may include an in-cell (in-cell) touch display panel, that is, the touch sensing unit 912 may serve as, for example, a common electrode in the display timing and may perform touch sensing in the touch sensing timing.

The conductive traces of the electronic device 900 may further include seventh conductive traces T7 disposed on the second substrate 140, and each of the seventh conductive traces T7 is electrically connected between the touch sensing unit 912 and the integrated circuit 150 disposed on the first substrate 110. It should be noted that the number of the integrated circuits 150 and the functions thereof can be designed according to the requirement. In some embodiments, the electronic device 900 may include an integrated circuit 150 having a display control function, a fingerprint identification control function and a touch sensing function, so that the integrated circuit 150 may electrically connect and drive the display device 122, the fingerprint sensing unit 132 and the touch sensing unit 912, but not limited thereto.

In fig. 12, in order to electrically connect the touch sensing unit 912 on the second substrate 140 to the integrated circuit 150 of the first substrate 110, the first connection line 160 is electrically connected between the touch sensing unit 912 and the integrated circuit 150. In addition, in fig. 12, the wires of the electronic device 900 may further include an eighth wire (not shown) disposed on the inner surface 110a of the first substrate 110, wherein the first connecting wire 160 is connected between the seventh wire T7 and the eighth wire, and the eighth wire is connected between the first connecting wire 160 and the integrated circuit 150, so that the integrated circuit 150 can be electrically connected to the touch sensing unit 912 through the eighth wire, the first connecting wire 160 and the seventh wire T7 in sequence, that is, the touch sensing unit 912 is electrically connected to the integrated circuit 150 through the first connecting wire 160 on the side surface 140c of the second substrate 140. In some embodiments (e.g., fig. 12), the eighth conductive line may be formed simultaneously with at least a portion of the first conductive line T1 or the eighth conductive line may be formed simultaneously with at least a portion of the third conductive line T3 by the same process, but not limited thereto. In some embodiments, the first conductive line T1, the third conductive line T3 and the eighth conductive line may belong to different conductive layers, respectively. In some embodiments, the eighth conductive wire and the first connection wire 160 are connected to each other one-to-one, but not limited thereto. It should be noted that a connection pad may be selectively disposed at one end of the seventh conductive line T7 to increase the area of the first connection line 160 connected to the seventh conductive line T7. In an embodiment, the connection pads may be selectively disposed at two ends of the eighth conductive line to increase the area of the integrated circuit 150 connected to the eighth conductive line and the area of the first connection line 160 connected to the eighth conductive line, so as to improve the reliability of the electrical connection, but not limited thereto. In addition, a desired circuit, such as a signal amplifying circuit and/or a multiplexer, may be selectively disposed between the first connecting line 160 and the seventh conducting line T7, but not limited thereto. It should be noted that, for clarity of the drawings, fig. 12 omits an insulating layer between the first connection line 160 and the third conductive line T3, that is, the first connection line 160 and the third conductive line T3 in fig. 12 are not in direct contact with each other, and the first connection line 160 is not in direct contact with the first conductive line T1.

The film configurations of the display device layer 120, the fingerprint sensing device layer 130 and the touch sensing device layer 910 can be adjusted according to design requirements, and are not limited to the above. In some embodiments (not shown), the display element layer 120 may be disposed on the fingerprint sensing element layer 130 and separated from each other by an insulating layer IL on the first substrate 110, but not limited thereto. In some embodiments (not shown), the position of the touch sensing device layer 910 can be exchanged with the position of the fingerprint sensing device layer 130 (i.e. the fingerprint sensing device layer 130 is located on the second substrate 140, and the touch sensing device layer 910 and the display device layer 120 are both located on the first substrate 110), but not limited thereto. In some embodiments (not shown), the display device layer 120, the fingerprint sensing device layer 130, and the touch sensing device layer 910 may also be disposed on the first substrate 110, and the display device layer 120, the fingerprint sensing device layer 130, and the touch sensing device layer 910 may or may not overlap with each other, and the stacking order of the display device layer 120, the fingerprint sensing device layer 130, and the touch sensing device layer 910 may be changed according to design requirements. For example, in some embodiments, the display element layer 120, the fingerprint sensing element layer 130, and the touch sensing element layer 910 may be sequentially stacked on one another; in some embodiments, the fingerprint sensing device layer 130 and the touch sensing device layer 910 may be disposed on the display device layer 120, but the fingerprint sensing device layer 130 is disposed on one side of the touch sensing device layer 910 and does not overlap with each other, but is not limited thereto.

In addition, in fig. 13, one touch sensing unit 912 may correspond to a plurality of sub-pixels SPX 1-SPX 3 (display element 122) and a plurality of fingerprint sensing units 132 in the normal direction Dt, and the fingerprint sensing unit 132 may not overlap with the sub-pixels SPX 1-SPX 3 (display element 122) in the normal direction Dt, and one fingerprint sensing unit 132 in fig. 13 may correspond to one sub-pixel, but is not limited thereto. In addition, as shown in fig. 13, the first conductive line T1, the third conductive line T3 and the seventh conductive line T7 may be substantially parallel to each other, but not limited thereto, the arrangement direction of the conductive lines may vary according to design requirements, for example, the conductive lines may overlap and/or be non-parallel in the normal direction Dt.

Referring to fig. 14, fig. 14 is a schematic top view of an electronic device according to a tenth embodiment of the invention, wherein fig. 14 only shows some elements in the active region AR, so that the drawings are clear. As shown in fig. 14, the difference between the present embodiment and the ninth embodiment lies in the configuration of each area in the active area AR of the electronic device 1000 of the present embodiment. The display area DR overlaps the touch area TR in the normal direction Dt, and the fingerprint sensing area FSR does not overlap the touch area TR and the display area DR in the normal direction Dt, that is, the fingerprint sensing unit 132 does not overlap the touch sensing unit 912 and the sub-pixels SPX1 through SPX3 (the display element 122) in the normal direction Dt, but not limited thereto. In fig. 14, the fingerprint sensing unit 132 is disposed at one side of the touch sensing unit 912 and the sub-pixels SPX 1-SPX 3 (the display element 122), but not limited thereto.

In summary, the present invention discloses a plurality of embodiments of an electronic device, which has a display function and a biometric characterization (e.g. fingerprint, palm print) identification function, and optionally has a touch sensing function. In some embodiments, the integrated circuit can have multiple functions to drive the display panel and the fingerprint sensing unit, thereby reducing the number of integrated circuits. In some embodiments, the electronic device may have connecting lines on the side surfaces of the substrates, so that electronic components on different substrates may be electrically connected to each other.

Although embodiments of the present invention and their advantages have been disclosed above, it should be understood that various changes, substitutions and alterations can be made herein by those skilled in the art without departing from the spirit and scope of the invention. Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification, but it is to be understood that any process, machine, manufacture, composition of matter, means, method and steps, presently existing or later to be developed, that will be obvious to one skilled in the art from this disclosure may be utilized according to the present application as many equivalents of the presently available embodiments of the present application are possible and equivalents may be developed in that way. Accordingly, the scope of the present application includes the processes, machines, manufacture, compositions of matter, means, methods, and steps described above. In addition, each claim scope constitutes individual embodiments, and the scope of protection of the present invention also includes combinations of the respective claim scopes and embodiments. The protection scope of the present invention should be determined by the appended claims.

Claims

1. An electronic device, comprising:

a display panel;

a fingerprint sensing unit; and

an integrated circuit for driving the display panel and the fingerprint sensing unit.

2. The electronic device of claim 1, further comprising a touch sensing unit, wherein the integrated circuit is further configured to drive the touch sensing unit.

3. The electronic device of claim 2, wherein the display panel comprises a first substrate, and the fingerprint sensing unit, the touch sensing unit and the integrated circuit are disposed on the first substrate.

4. The electronic device of claim 2, wherein the display panel comprises:

the fingerprint sensing unit and the integrated circuit are arranged on the first substrate; and

the second substrate is overlapped with the first substrate, and the touch sensing unit is arranged on the second substrate.

5. The electronic device of claim 4, wherein the touch sensing unit is electrically connected to the integrated circuit through a connection line on a side surface of the second substrate.