CN1118738C

CN1118738C - Heat radiator and its manufacture

Info

Publication number: CN1118738C
Application number: CN 99117249
Authority: CN
Inventors: 刘恒智; 林保龙
Original assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 1999-11-24
Filing date: 1999-11-24
Publication date: 2003-08-20
Anticipated expiration: 2019-11-24
Also published as: CN1298135A

Abstract

The present invention relates to a heat radiating device and a manufacturing method thereof. The heat radiating device comprises a heat conducting tube and a heat radiator, wherein the heat conducting tube has a first end and a second end, the first end is connected to a wafer in a heat conducting mode, and the outer surface of the second end is surrounded by one heat radiator which is formed by oppositely combining two heat radiating bodies. Each heat radiating body has a base, a groove is correspondingly formed in one surface of each base relative to the shape of the heat conducting tube, and the outer surface of the second end of the heat conducting tube can be attached to the inner wall of each groove in a heat conducting mode. When the grooves the two heat radiating bodies are buckled, the second end of the heat conducting tube is completely attached and contained between the two grooves, the base of each heat radiating body is oppositely arranged on the other surface of the groove, and a plurality of heat radiating fins are arranged in an embedding and forming mode, and are used for radiate the heat quantity on the bases.

Description

Heat abstractor and manufacture method thereof

The invention relates to a kind of heat abstractor and manufacture method thereof, be meant especially and a kind ofly conduct heat and heat radiation, and can reduce production costs, improve the heat radiation and the heat abstractor of enhancing productivity by heat pipe and heating radiator.

Along with developing rapidly of IT industry, the arithmetic speed of the inner set wafer of computer (quickening wafer as central processing unit and figure) is more and more faster, and the ability of its deal with data is also more and more stronger.Yet along with speeding of wafer arithmetic speed, the heat of supervening also increases considerably.For these heats can promptly be discharged, wafer can be worked under normal working temperature, to protect exact figures, be equiped with a cooling system in computer inside usually according to the quality of handling, storing and transmit.General cooling system is installing one heating radiator and a fan on wafer surface, and the heat that wafer produces is strengthened cross-ventilation by the fan that is installed on the heating radiator again, thereby heat is discharged after being the heating radiator that passes to earlier with its applying.But, because speeding of arithmetic speed, the heat that wafer produces also increases considerably, in order in time heat to be discharged, so need be with the also corresponding increase of heating radiator, but so can cause the heat abstractor overall weight to increase, this not only is not inconsistent the compact trend of computer industry, and with regard to dependence tests such as vibration, impact, the doubt on the fiduciary level is arranged also.In addition, one surface of such heating radiator normally is formed into the structure kenel of some column radiators, improve radiating effect to increase cooling surface area, that is by aluminium extruded, cut, behind a series of job sequence such as profile groove, flash removal, sand milling, polishing and anodizing, can obtain final structure.Simultaneously, because such processing procedure is quite complicated, and the waste material that is produced in the profile groove process can account for quite great proportion on the integral material, so with regard to production efficiency and cost are considered, itself and imperfect design.

In addition, because the restriction on mould strength and the correlation technique level, general heating radiator the width of groove between the height of radiating fin and radiating fin than on, can't obtain gratifying ratio, therefore also have radiating fin separated with base and make, forming heating radiator at the base fluting so that fin is inserted again (can be with reference to United States Patent (USP) the 5th, 308, No. 858), but such heating radiator is directly to be plugged in the base slot with radiating fin, and is obviously not enough on integrally-built stability, and between the slot of fin and base, very easily produce the space, whole heat transfer and radiating effect are had a greatly reduced quality.

Purpose of the present invention is to provide a kind of and conducts heat and heat radiation by heat pipe and heating radiator, and can improve the heat abstractor of radiating efficiency.

Another object of the present invention is to provide a kind of heat abstractor, comprises that a heat pipe and embeds the heating radiator that takes shape on the base by radiating fin, and can reduce production costs, improve heat radiation and production efficiency.

A further object of the present invention, be to provide a kind of manufacture method of heat abstractor, wherein this heat abstractor is provided with radiator and heat pipe, and is by embedding the integrative-structure that forming method obtains, can improving heat radiation and production efficiency between the base of this radiator and the some radiating fins.

Technical characterictic of the present invention is: this heat abstractor comprises a heat pipe and a heating radiator, this heat pipe is provided with first, second end, wherein first end is to be connected with heat conduction on the wafer, and second end is to be surrounded with a heating radiator at its outside surface, this heating radiator is to be combined relatively by two radiators, its each radiator has a base, the one side of this base is the corresponding groove that is provided with of profile of this heat pipe relatively, the part outside surface of this heat pipe second end gets final product the inwall that heat conduction is fitted in this groove, after the groove phase time with two radiators fastens, second end of this heat pipe will be fitted fully and will be placed between two grooves, this radiator base is provided with the another side of groove relatively, be provided with some radiating fins by embedding forming method on it, in order to heat on the base is distributed.

The present invention compared with the prior art, its advantage is: the radiating fin of this heat abstractor is formed on the base by embedding molding mode, it can adjust the ratio of the width of groove between the height of radiating fin and radiating fin as required arbitrarily, and do not need to cut, a series of job sequence such as profile groove, flash removal, sand milling, polishing and anodizing, so this heat abstractor can overcome disappearance of the prior art fully, reach and improve heat radiation and production efficiency, and fall the low purpose of cost.

With reference to the accompanying drawings, the present invention is further illustrated in conjunction with the embodiments.

Fig. 1 is the three-dimensional combination figure of heat abstractor of the present invention.

Fig. 2 is heat abstractor of the present invention and three-dimensional exploded view.

Fig. 3 is the radiator base of heat abstractor of the present invention and the forming method synoptic diagram between some radiating fins.

See also Fig. 1 and Fig. 2.Heat abstractor of the present invention comprises a heat pipe 10 and a heating radiator 20.Wherein heat pipe 10 is provided with first,

second end

12,14, this first end 12 is to be connected (figure does not show) on the wafer with heat conduction, to draw the heat that wafer was produced, this second end 14 then is can be arranged on heat conduction in the heating radiator 20, distributes (seeing aftermentioned for details) in order to the heat that heat pipe 10 is drawn from wafer.

This heating radiator 20 is that the radiator 21 by two symmetries is combined into relatively, this radiator 21 has a base 22, and the profile of relative heat pipe 10 is at the corresponding groove 224 that is provided with of one side of base 22, the part outside surface of these heat pipe 10 second ends 14 is the inwalls that can be fitted in this groove 224 with heat conduction, after the groove 224 with two radiators 21 fastened relatively, second end 14 of this heat pipe 10 can be fitted fully and is placed between two grooves 224.In addition, one is extended with flange 220 respectively at the two ends of base 22, this flange 220 also is provided with screw 222, after these heat pipe 10 second ends 14 are placed between 21 liang of grooves 224 of radiator, pass the screw 222 of two radiators 21 by screw 30 (perhaps similar stationary installation such as bolt), and fixing through nut 32, heat pipe 10 second ends 14 can be fixed between the groove 224 of these two radiators 21 with heat conduction.In the gap of 224 of heat pipe 10 second ends 14 and grooves, usually be filled with heat-conducting cream (figure does not show), improve the heat-transfer effect of heat pipe 10

second ends

14 and 22 of radiator 21 bases in order to deaeration, thereby make the base 22 of radiator 21 can the more effective heat that transmits from heat pipe 10 second ends 14 absorption heat pipes 10 first ends 12.These radiator 21 bases 22 are provided with on the another side of groove 224 relatively, be provided with some round convex shape plates 26, be provided with some radiating fins 24 26 of these some round convex shape plates by embedding molding mode,, further improve whole radiating efficiency in order to heat on the base 22 is distributed.

Seeing also Fig. 3, is the embedding forming method synoptic diagram of 24 of radiator 21 bases 22 and some radiating fins.It includes upper module 40, lower module 42 and internal mold 44, wherein upper module 40 is provided with a raised line, in order to form the groove 224 on radiator 21 bases 22, this internal mold 44 tools one circular arc inner chamber wherein, and be provided with some elongated slots 46 in the central, some radiating fins 24 can closely be planted therebetween, and the base 22 of this radiator 21 is promptly formed by the die cavity 47 that upper module 40 and internal mold 44 are formed.At first some radiating fins 24 closely are plugged in the some elongated slots 46 in the internal mold 44, and the some that makes these some radiating fins 24 extends in the die cavity, carry out matched moulds again, from casting gate 48 cast aluminum water (figure does not show) in die cavity, die sinking after cooling, replace internal mold 44 by knock pin 49, one and radiator 21 that have some radiating fins 24 can be replaced depanning.

Claims

1. heat abstractor, comprise: a heat pipe and a heating radiator, this heat pipe is provided with first, second end, this heating radiator is made up of two radiators, it is characterized in that: this each radiator has a base, and the corresponding heat pipe second end profile is provided with the groove in order to ccontaining this heat pipe second end on the one side of this base, wherein this first end is to be connected on the chip with heat conduction, and second end is by fixing can with heat conduction and being fixed in the groove of these two radiator bases between these two radiator bases.

2. heat abstractor as claimed in claim 1 is characterized in that: this base is extended with flange respectively at its two ends.

3. heat abstractor as claimed in claim 2 is characterized in that: also be provided with on this flange for stationary installation by and heat pipe second end is retained on screw between these two radiator grooves.

4. heat abstractor as claimed in claim 3 is characterized in that: this radiator is filled with heat-conducting cream in the gap between heat pipe and deep-slotted chip breaker.

5. heat abstractor as claimed in claim 1 is characterized in that: the another side of this radiator base opposed slot is the round convex shape face.

6. heat abstractor as claimed in claim 5 is characterized in that: this round convex shape face is provided with some radiating fins that one embeds moulding.

7. the manufacture method of a heat abstractor comprises:

Be provided with a raised line in upper module;

In internal mold, establish an inner chamber;

At least form a cavity with ccontaining internal mold in lower module, by the formed die cavity of upper module, lower module and internal mold, and the base of formation radiator;

In interior mold cavity, be provided with some elongated slots, can closely plant therebetween for some radiating fins;

In the corresponding respectively some elongated slots that closely are inserted in this internal mold of some radiating fins, and make it partly extend in the die cavity;

Matched moulds and from casting port position cast aluminum water in die cavity;

After cooling, die sinking is also replaced internal mold by knock pin, and the radiator of one has been replaced depanning;

One heat pipe is placed between the groove of two relative two radiators, heat pipe heat conduction can be fixed in the groove of this two radiator by fastener.

8. as the manufacture method of heat abstractor as described in the claim 7, it is characterized in that: the raised line of this upper module is in order to form the groove on the radiator base, with ccontaining part heat pipe.

9. as the manufacture method of heat abstractor as described in the claim 8, it is characterized in that: the inner chamber of this internal mold is to be circular arc.