CN111864371A - Bluetooth antenna device with three-dimensional structure and Bluetooth equipment - Google Patents

Bluetooth antenna device with three-dimensional structure and Bluetooth equipment Download PDF

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Publication number
CN111864371A
CN111864371A CN202010812074.0A CN202010812074A CN111864371A CN 111864371 A CN111864371 A CN 111864371A CN 202010812074 A CN202010812074 A CN 202010812074A CN 111864371 A CN111864371 A CN 111864371A
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CN
China
Prior art keywords
antenna
pcb
layer
bluetooth
pcb substrate
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CN202010812074.0A
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Chinese (zh)
Inventor
唐顺祥
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Shenzhen Lingruite Technology Co ltd
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Shenzhen Lingruite Technology Co ltd
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Priority to CN202010812074.0A priority Critical patent/CN111864371A/en
Publication of CN111864371A publication Critical patent/CN111864371A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/526—Electromagnetic shields

Abstract

The invention is suitable for the technical field of Bluetooth antennas, and provides a Bluetooth antenna device with a three-dimensional structure and Bluetooth equipment, wherein the Bluetooth antenna device comprises: the PCB substrate of the multilayer structure is provided with a first antenna reference ground and a second antenna reference ground; a first metal edge covering structure; the first antenna reference ground and the second antenna reference ground are connected through a first metal edge-covered structure; a second metal edge covering structure; a third metal edge covering structure; the first antenna structure comprises at least two antenna line segments etched on the PCB substrate; in the first antenna structure, two adjacent antenna line segments are connected through a second metal edge covering structure and a third metal edge covering structure; a second antenna structure including antenna wire segments etched in the PCB substrate; and a via having a conductor feature; the first antenna structure is connected with the second antenna structure through the via hole. The Bluetooth antenna device has the advantages of small structure volume, low cost, good parameter consistency, strong anti-electromagnetic interference capability and the like.

Description

Bluetooth antenna device with three-dimensional structure and Bluetooth equipment
Technical Field
The invention belongs to the technical field of Bluetooth antennas, and particularly relates to a Bluetooth antenna device with a three-dimensional structure and Bluetooth equipment.
Background
The Bluetooth antenna technology is a wireless communication technology which is widely applied and works in a 2.4GHz frequency band with low cost and low power consumption.
The Bluetooth headset is a consumer audio product which wirelessly transmits voice, music and related data to related intelligent equipment by using a Bluetooth antenna technology; the antenna is an important component for transmitting and receiving electromagnetic waves in the Bluetooth headset; generalizing from the type of construction and the materials of application, the following types of antennas are commonly used: an LDS (laser) antenna, an FPC (flexible printed circuit) antenna, a ceramic antenna and a PCB (printed circuit board) onboard antenna; the LDS antenna, the FPC antenna, and the ceramic antenna require different factories to perform cooperative processing and production due to the factors of structure and material, and the cooperation between different manufacturers inevitably causes uncertainty of quality and delivery date, and also causes an increase in cost.
Today, bluetooth headsets are explosively increasing in sales due to portability, aesthetics, and flexibility of use. Similarly, in order to meet the market consumption requirements, the appearance design of the Bluetooth headset is more and more attractive, the smaller and more ingenious, and the functions are more and more diversified; the miniaturization of the earphone shape reduces the area of the PCB, reduces the area of the PCB and diversifies functions, which can cause the increase of power consumption, music playing and noise during communication of related circuits due to electromagnetic interference; similarly, the electromagnetic interference can also change the radio frequency parameters of the bluetooth antenna, which affects the reduction of the communication connection distance between the bluetooth headset and the related intelligent device and the reduction of the communication connection quality, thereby affecting the stability and reliability of the product.
In addition, the bluetooth headset is constructed by different devices, and according to the scene requirements of the bluetooth headset, the bluetooth antenna needs to meet the omni-directionality or multi-directionality of the antenna during design; therefore, the placement of devices with conductor characteristics is forbidden in a short range near the Bluetooth antenna and the RF signal loop, so that the effective transmission/reception of Bluetooth radio frequency signals can be ensured; this is the radio frequency "headroom" referred to by some communication terminals, communication devices; in the application of a common Bluetooth product, based on the performance and parameter requirements of a Bluetooth antenna, devices with conductor characteristics cannot be placed in a minimum clearance area of 5mm around the Bluetooth antenna; the battery, the loudspeaker, the key, the microphone and the welding wire of the battery in the components of the Bluetooth headset, and the copper foil on the PCB are all devices with conductor characteristics; these devices are placed in a limited structural space, which poses a severe challenge to the design and development of bluetooth antennas, and this is also a technical difficulty to be solved by many bluetooth headset manufacturers.
Therefore, a design manner of an antenna structure different from the related circuit of the existing bluetooth headset is required to reduce the electromagnetic interference of the related circuit and simultaneously improve the consistency of the radiation power, the radiation efficiency, the radiation directivity and the related radio frequency parameters of the antenna, so as to realize the reliability and the stability of the bluetooth headset.
Disclosure of Invention
An embodiment of the present invention provides a bluetooth antenna apparatus with a three-dimensional structure, which is intended to solve the problems in the background art.
The embodiment of the invention is realized in such a way that the Bluetooth antenna device with the three-dimensional structure comprises a PCB (printed Circuit Board) substrate with at least two layers of structures, wherein the top layer and the bottom layer of the PCB substrate are both provided with a first antenna reference ground and a second antenna reference ground; the bluetooth antenna apparatus further includes:
the first metal edge covering structure is arranged on one side of the PCB substrate; the first antenna reference ground and the second antenna reference ground are connected through the first metal edge-covered structure;
the second metal edge covering structure is arranged on the other side of the PCB substrate;
the third metal edge covering structure is arranged on the same side of the PCB substrate as the second metal edge covering structure;
the first antenna structure is arranged between the first antenna reference ground and the second antenna reference ground and comprises at least two antenna line sections which are provided with conductor characteristics and etched on the top layer or the bottom layer of the PCB substrate; the adjacent two sections of antenna line segments etched on the top layer or the bottom layer of the PCB substrate are connected through the second metal edge covering structure and the third metal edge covering structure;
a second antenna structure disposed between the first antenna reference ground and the second antenna reference ground, including an antenna line segment having a conductor feature and etched in a bottom layer or a top layer of the PCB substrate; and a via having a conductor feature disposed on the PCB substrate; the first antenna structure is connected with the second antenna structure through the through hole.
As a preferable aspect of the embodiment of the present invention, the first antenna structure includes:
a first antenna line segment having a conductor feature etched in a top or bottom layer of the PCB substrate and parallel to the first antenna reference ground;
the second antenna line segment is provided with a conductor characteristic, is etched on the top layer or the bottom layer of the PCB substrate and is of an n-type structure; one end of the second antenna line segment is connected with the first antenna line segment through the second metal edge covering structure; the third antenna line segment is etched on the top layer or the bottom layer of the PCB substrate and is parallel to the second antenna reference ground; and the third antenna line segment is connected with the other end of the second antenna line segment through the third metal edge covering structure.
As another preferable aspect of the embodiment of the present invention, the first antenna structure further includes:
the short circuit line segment with the conductor characteristics is etched on the top layer or the bottom layer of the PCB substrate and is connected with the first antenna line segment; and the antenna feed end is arranged on the top layer or the bottom layer of the PCB substrate and is connected with the first antenna line segment.
As another preferable aspect of the embodiment of the present invention, the second antenna structure includes:
and the fourth antenna line segment with the conductor characteristic is etched at the bottom layer or the top layer of the PCB substrate and has an S-shaped structure.
As another preferable aspect of the embodiment of the present invention, the PCB substrate includes:
the PCB comprises a first PCB layer, a fourth PCB layer, a first PCB inner layer and a second PCB inner layer, wherein the first PCB inner layer and the second PCB inner layer are arranged between the first PCB layer and the fourth PCB layer; the PCB comprises a PCB first layer, a PCB inner layer and a PCB second layer, wherein a power supply positive line segment with conductor characteristics is etched on the PCB first layer, a signal line positive electrode with conductor characteristics is etched on the PCB inner layer first layer, and a signal line negative electrode with conductor characteristics is etched on the PCB inner layer second layer.
As another preferable solution of the embodiment of the present invention, the second antenna reference ground is provided with a power supply negative electrode pad, a power supply positive electrode pad, a signal line positive electrode pad, and a signal line negative electrode pad.
As another preferable scheme of the embodiment of the invention, the thickness of the PCB substrate is 0.6-1 mm.
As another preferable aspect of the embodiment of the present invention, the bluetooth antenna apparatus further includes:
a passive element having inductive or capacitive characteristics is placed between the first antenna reference ground and the first antenna structure.
As another preferable aspect of the embodiment of the present invention, the passive element includes:
a passive component first pin having inductive or capacitive characteristics, placed on said first antenna reference ground;
and a second pin of the passive element with inductance or capacitance characteristics is placed on the first antenna structure.
Another objective of the present invention is to provide a bluetooth device, which includes a micro control unit, a power supply device and the bluetooth antenna device.
In the invention, the three-dimension in the Bluetooth antenna device with the three-dimensional structure refers to the direction of all relevant antenna line segments arranged on a PCB substrate in the overall structure of the antenna by using X, Y and Z coordinate axes, wherein the X axis refers to the length of the antenna in the antenna structure illustrated between a first antenna reference ground and a second antenna reference ground; the Y axis refers to the width of an antenna in the antenna structure shown between two sides of the PCB; the Z axis refers to the thickness of the PCB substrate and also refers to the width of a related antenna line segment in a complete antenna structure constructed on one side of the PCB substrate by using a metal edge covering process.
The Bluetooth antenna device with the three-dimensional structure provided by the embodiment of the invention has the advantages of small structure volume, low cost, good parameter consistency, strong anti-electromagnetic interference capability and the like. Specifically, the first metal wrapping structure is arranged on one side of the PCB substrate, and the first antenna reference ground and the second antenna reference ground can be connected, so that the whole antenna reference ground area of the Bluetooth antenna device can be increased, and the whole antenna reference ground area can be used as a power supply cathode and an electromagnetic shielding ground wire at the same time, so that the electromagnetic interference resistance of a circuit in the Bluetooth antenna device is enhanced. In addition, the second metal edge covering structure and the third metal edge covering structure are arranged on the other side of the PCB substrate, so that multiple sections of antenna line sections in the first antenna structure can be connected, the resonance length of the antenna can be increased in a limited structural space, and the overall size of the Bluetooth antenna device can be further reduced.
Drawings
Fig. 1 is a schematic overall structure diagram of a bluetooth antenna apparatus with a three-dimensional structure according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a first layer of a PCB of a bluetooth antenna apparatus having a three-dimensional structure according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a fourth layer of a PCB of a bluetooth antenna apparatus having a three-dimensional structure according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of one side surface of a three-dimensional bluetooth antenna apparatus according to an embodiment of the present invention.
Fig. 5 is a schematic structural diagram of another side surface of a bluetooth antenna apparatus with a three-dimensional structure according to an embodiment of the present invention.
Fig. 6 is a schematic structural dimension diagram of a first layer of a PCB of a bluetooth antenna apparatus having a three-dimensional structure according to an embodiment of the present invention.
Fig. 7 is a schematic structural dimension diagram of a fourth layer of a PCB of a bluetooth antenna apparatus having a three-dimensional structure according to an embodiment of the present invention.
Fig. 8 is a schematic diagram illustrating a four-layer PCB structure of a bluetooth antenna apparatus having a three-dimensional structure according to an embodiment of the present invention;
in the figure: 1-a first antenna reference ground, 2-a passive element, 3-an antenna feed terminal, 4-a via, 5-a first metal-wrapped-around line segment, 6-a second metal-wrapped-around line segment, 7-a third metal-wrapped-around line segment, 8-a power supply positive line segment, 11-a first layer of a PCB, 12-a first inner layer of a PCB, 13-a second inner layer of a PCB, 14-a fourth layer of a PCB, 20-a passive element first pin, 21-a passive element second pin, 101-a second antenna reference ground, 102-a power supply negative pad, 103-a power supply positive pad, 104-a signal line positive pad, 105-a signal line negative pad, 201-a short-circuit segment, 202-a first antenna segment, 203-a second antenna segment, 204-a third antenna segment, 205-a fourth antenna segment, 801-signal line positive pole line segment, 802-signal line negative pole line segment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In addition, in the description of the present application, terms used should be construed broadly, and specific meanings of the terms may be understood by those skilled in the art according to actual situations. For example, the terms "disposed" and "disposed," as used in this application, may be defined as either a contact or a non-contact arrangement, etc.; the terms "connected" and "coupled," as used herein, may be defined as mechanically coupled or electrically coupled; all the terms of orientation used are used with reference to the drawings or are based on the direction defined by the actual situation and the common general knowledge.
As shown in fig. 1, an embodiment of the present invention provides a bluetooth antenna device with a three-dimensional structure, which includes a PCB substrate with at least two layers, where the top layer and the bottom layer of the PCB substrate are both provided with a first antenna reference ground 1 and a second antenna reference ground 101; the bluetooth antenna apparatus further includes:
the first metal edge covering structure is arranged on one side of the PCB substrate; the first antenna reference ground 1 and the second antenna reference ground 101 are connected through the first metal edge-covered structure;
the second metal edge covering structure is arranged on the other side of the PCB substrate;
the third metal edge covering structure is arranged on the same side of the PCB substrate as the second metal edge covering structure;
the first antenna structure is arranged between the first antenna reference ground 1 and the second antenna reference ground 101 and comprises at least two antenna line sections which have conductor characteristics and are etched on the top layer or the bottom layer of the PCB substrate; the adjacent two sections of antenna line segments etched on the top layer or the bottom layer of the PCB substrate are connected through the second metal edge covering structure and the third metal edge covering structure;
a second antenna structure disposed between the first antenna reference ground 1 and the second antenna reference ground 101, including an antenna line segment having a conductor feature and etched in a bottom layer or a top layer of the PCB substrate; and
a via 4 having a conductor feature disposed on the PCB substrate; the first antenna structure is connected with the second antenna structure through the via hole 4.
In practical application, the PCB substrate may be formed by stacking a plurality of dielectric materials, and after the plurality of dielectric materials are stacked, both sides of the PCB substrate may be encapsulated by a metal taping process to form a first metal taping structure and a second metal taping structure, and specifically, the PCB substrate may use FR4 as a material. In addition, in the present invention, all types of line segments (including the embodiments described below) refer to copper foils etched on a PCB substrate having conductive features and having different lengths and widths. The top layer and the bottom layer of the PCB substrate are both provided with a first antenna reference ground 1 and a second antenna reference ground 101 which have the same structure, the first antenna reference ground 1 and the second antenna reference ground 101 are respectively arranged at two ends of the top layer or the bottom layer of the PCB substrate, and the middle part of the top layer or the bottom layer of the PCB substrate is used for arranging a first antenna structure or a second antenna structure. The via hole 4 penetrates through the PCB substrate, and the hole wall of the via hole is metallized so as to connect the first antenna structure and the second antenna structure of the upper layer and the lower layer, and the via hole can be processed by a copper deposition electroplating process in the prior art.
Specifically, as shown in fig. 5, the first metal edge covering structure includes a first metal edge covering line segment 5, and the first metal edge covering line segment 5 is disposed on one side surface of the PCB substrate; the first antenna reference ground 1 and the second antenna reference ground 101 at the two ends of the top layer and the bottom layer of the PCB substrate are connected through the first metal wrapping line segment 5, so that the integral antenna reference ground area of the Bluetooth antenna device is increased, and the electromagnetic interference resistance of a circuit of the Bluetooth antenna device is enhanced.
According to the embodiment of the invention, the first metal wrapping structure is arranged on one side of the PCB substrate, and the first antenna reference ground 1 and the second antenna reference ground 101 can be connected, so that the integral antenna reference ground area of the Bluetooth antenna device can be increased, and the integral antenna reference ground area can be used as a power supply cathode and an electromagnetic shielding ground wire at the same time, so that the electromagnetic anti-interference capability of a circuit in the Bluetooth antenna device is enhanced. In addition, the second metal wrapping structure is arranged on the other side of the PCB substrate, so that multiple sections of antenna line sections in the first antenna structure can be connected, the resonance length of the antenna can be increased in a limited structural space, and the overall size of the Bluetooth antenna device can be reduced.
Referring to fig. 1, 2 and 4, in a preferred embodiment of the present invention, the second metal edge covering structure includes a second metal edge covering line segment 6 disposed on one side of the PCB substrate, the third metal edge covering structure includes a third metal edge covering line segment 7 disposed on one side of the PCB substrate, and the second metal edge covering line segment 6 and the third metal edge covering line segment 7 are located on the same side; the first antenna structure includes:
a first antenna line segment 202 having a conductor feature, etched in the top or bottom layer of the PCB substrate, and parallel to the first antenna ground reference 1;
a second antenna line segment 203 with a conductor feature, which is etched on the top layer or the bottom layer of the PCB substrate and has an "n" type structure; one end of the second antenna line segment 203 is connected to the first antenna line segment 202 through the second metal wrapping line segment 6; a third antenna line segment 204 with a conductor feature, which is etched on the top layer or the bottom layer of the PCB substrate and is parallel to the second antenna reference ground 101; the third antenna line segment 204 is connected to the other end of the second antenna line segment 203 through the third metal edge-covered line segment 7.
Specifically, the first antenna segment 202, the second antenna segment 203 and the third antenna segment 204 can be etched on the top layer of the PCB substrate and are all located between the first antenna reference ground 1 and the second antenna reference ground 101 on the top layer of the PCB substrate; through setting up first antenna segment 202, second antenna segment 203 and third antenna segment 204 to utilize the second metal that sets up in PCB base plate side to bordure line segment 6 and third metal bordure line segment 7 and couple together these antenna segments, can realize increasing the resonant length of antenna to a great extent in limited structural space, thereby can guarantee under the condition of antenna resonant length enough length (can guarantee requirements such as the radio frequency parameter of antenna promptly), design bluetooth antenna device's overall structure size littleer, in order to reduce the occupation space of bluetooth antenna device in bluetooth equipment.
In another preferred embodiment of the present invention, as shown in fig. 1, fig. 2 and fig. 4 of the accompanying drawings, the first antenna structure further includes:
a short circuit line segment 201 with a conductor feature, which is etched on the top layer or the bottom layer of the PCB substrate and connected to the first antenna line segment 202; and an antenna feed terminal 3 disposed on the top layer or the bottom layer of the PCB substrate and connected to the first antenna line segment 202.
Specifically, the short circuit line segment 201 may be etched on the top layer of the PCB substrate, which is perpendicular to the first antenna line segment 202; the antenna feed terminal 3 may also be etched in the top layer of the PCB substrate, which is also perpendicular to the first antenna segment 202 and is located in the same PCB layer as the short circuit segment 201 and the first antenna segment 202. The antenna feed end 3, the short circuit line segment 201, the first antenna line segment 202, the second metal edge-covered line segment 6, the second antenna line segment 203, the third metal edge-covered line segment 7 and the third antenna line segment 204 form a complete first antenna structure. In addition, the characteristic impedance of the antenna feeding terminal 3 may be designed to be 50 ohms.
In another preferred embodiment of the present invention, as shown in fig. 3, the second antenna structure comprises:
a fourth antenna wire segment 205 with conductive features is etched in the bottom or top layer of the PCB substrate and is in an "S" configuration.
Specifically, the fourth antenna line segment 205 may be etched on the bottom layer of the PCB substrate, and is located between the first antenna reference ground 1 and the second antenna reference ground 101 on the bottom layer of the PCB substrate, and one end of the fourth antenna line segment 205 is connected to one end of the third antenna line segment 204 on the top layer of the PCB substrate through the via hole 04, so as to connect the first antenna structure and the second antenna structure together, thereby forming a complete antenna resonant length.
In another preferred embodiment of the present invention, as shown in fig. 3, the PCB substrate includes:
the PCB comprises a first PCB layer 11, a fourth PCB layer 14, a first PCB inner layer 12 and a second PCB inner layer 13, wherein the first PCB inner layer 12 and the second PCB inner layer 13 are arranged between the first PCB layer 11 and the fourth PCB layer 14; the PCB comprises a PCB first layer 11, a PCB inner layer 12, a PCB second layer 13 and a power supply positive line segment 8, a signal line positive electrode 801 and a signal line negative electrode 802, wherein the power supply positive line segment 8 is etched on the PCB first layer, the signal line positive electrode 801 is etched on the PCB inner layer 12, and the signal line negative electrode 802 is etched on the PCB inner layer second layer.
Specifically, the first layer 11 of the PCB is the top layer of the PCB substrate in the above embodiments; the first PCB inner layer 12 and the second PCB inner layer 13 are inner layers of the PCB substrate in the above embodiments; the fourth layer 14 of the PCB is the bottom layer of the PCB substrate in the above embodiments; in this embodiment, a first PCB inner layer 12 and a second PCB inner layer 13 are respectively disposed between the first PCB layer 11 and the fourth PCB layer 14; in addition, the power supply positive line segment 8 may be etched on the first layer 11 of the PCB and located at one side of the first antenna structure; the signal line positive electrode line segment 801 and the signal line negative electrode line segment 802 are respectively etched on the first inner layer 12 (second layer) and the second inner layer 13 (third layer) 13 of the PCB, which can be used as connection line segments of signal lines such as a microphone, so as to increase the functions of the circuit of the bluetooth antenna device. In addition, a power supply negative electrode pad 102, a power supply positive electrode pad 102, a signal line positive electrode pad 104 and a signal line negative electrode pad 105 are sequentially disposed on the second antenna reference ground 101 on the first PCB layer 11 (top layer).
Referring to fig. 4, 5 and 8, in another preferred embodiment of the present invention, the total thickness of the PCB substrate (i.e. PCB _ H in fig. 4, 5 and 8) is 0.6 to 1mm, preferably 0.8mm, but not limited thereto.
In addition, in fig. 6 and 7, ANT _ L refers to a length of a space occupied by the first antenna structure and the second antenna structure, and may be designed to be 5mm, but is not limited thereto; ANT _ W refers to a width of a space occupied by the first antenna structure and the second antenna structure, which may be designed to be 4.9mm, but is not limited thereto; ANT _ FB is the length of the antenna feed end 3, which can be designed to be 1.2-1.3 mm, but is not limited thereto; ANT _ S is the distance between the antenna feed end 3 and the second pin 21, and can be designed to be 1.7-1.9 mm, but is not limited thereto; ANT _ L0 refers to the length of the third antenna segment 204, which can be designed to be 3.0-3.5 mm, but is not limited thereto; ANT _ LS0 is the length of the second metal edge-covered wire segment 6, which can be designed to be 1.5-1.7 mm, but is not limited thereto; ANT _ LS1 is the length of the third metal edge-covered wire segment 7, which can be designed to be 1.5-1.7 mm, but is not limited thereto.
In fig. 7, ANT _ BL refers to the length of the fourth antenna segment 205, which can be designed to be 3.0-3.1 mm, but is not limited thereto; ANT _ BH refers to the width of the fourth antenna segment 205, which can be designed to be 2.9-3.0 mm, but is not limited thereto; ANT _ VIA refers to the diameter of the VIA 4, which can be designed to be 0.2-0.35 mm, but is not limited thereto.
As can be seen from the dimensional designs of fig. 4, 6 and 7, the total size of the first antenna structure and the second antenna structure of the bluetooth antenna device provided by the embodiment of the present invention can be designed to be 5mm × 4.9mm × 0.8mm, but is not limited thereto;
the structure size of the bluetooth PCB antenna with the three-dimensional structure is only one fourth of the space occupied by the PCB on-board antenna in the prior art (for example, the invention patent about the bluetooth headset antenna disclosed in CN 201610540958).
As shown in fig. 1 and 4, in another preferred embodiment of the present invention, the bluetooth antenna apparatus further includes:
a passive element 2 with inductive or capacitive characteristics is arranged between the first antenna reference ground 1 and the first antenna structure.
Specifically, the passive element 2 includes:
a passive component first pin 20 with inductive or capacitive characteristics, arranged on the first antenna reference ground 1;
a passive component second pin 21 with inductive or capacitive characteristics is arranged on the first antenna structure.
Specifically, the passive component first pins 20 and the passive component second pins 21 can be disposed on the top layer of the PCB substrate. By arranging the passive element 2 with the first pin 20 and the second pin 21 between the first antenna reference ground 1 and the first antenna structure, the antenna characteristic parameter change caused by the board material and the process difference of the PCB can be adjusted by the L/C (inductance/capacitance) parameter adjustment so as to meet the radiation efficiency of the antenna and the directivity of the antenna, and meanwhile, the passive element 2 can be used for parameter optimization so as to further reduce the occupied area of the antenna structure.
In another embodiment of the present invention, there is also provided a bluetooth device, which includes a micro control unit, a power supply device and the bluetooth antenna device.
Specifically, the bluetooth device may be a bluetooth headset, a bluetooth sound box, or the like, and may further include a circuit structure such as an antenna impedance matching circuit, an RF signal circuit, an audio circuit, and the like, and a speaker, a key, a microphone, and the like, but is not limited thereto.
In summary, the bluetooth antenna device provided by the embodiment of the present invention can be applied to a bluetooth headset, and has an ultra-small-sized PCB onboard monopole bluetooth antenna with a three-dimensional structural feature, and compared with a PCB onboard antenna with the same structural feature in the existing market, the bluetooth antenna device has the advantages of small structural volume, low cost, good parameter consistency, strong anti-electromagnetic interference capability, and the like.
According to the electromagnetic field theory and practical application experience, in the Bluetooth device, only when the length of the antenna is equal to 1/4 wavelengths, the radiation intensity and the radiation efficiency of the antenna are in the optimal state, and the reliability, the stability and the consistency of the Bluetooth headset product can be effectively realized. In the actual production of bluetooth headset, discovery in the assembling process, near the effectual forbidden area of PCB antenna on-board antenna, the part that possesses the characteristic of conductor wantonly appears, will seriously influence the characteristic impedance of antenna to the radiation directivity that will influence the antenna and the radiation efficiency of antenna, consequently can lead to bluetooth headset's production yield, influence bluetooth headset's reliability, stability.
For the technical problem, the invention creatively carries out metallization edge covering process treatment on the line segments with different lengths and different widths at the relevant positions at the two sides of the PCB substrate to form the antenna line segment with conductor characteristics at one part of the whole antenna length; simultaneously, according to the design rule of the antenna framework, the antenna conductor is respectively etched on the copper foils on the top layer and the bottom layer of the PCB substrate; after the production and processing of the two steps are completed, the antenna conductors of the top layer and the bottom layer and related conductors of the edge covering metallization process on the two sides of the PCB substrate are completely connected through the metallized through holes, and a Bluetooth PCB on-board antenna completely conforming to the design parameters of the antenna is constructed; meanwhile, under the condition that relevant parameters of the Bluetooth antenna are not influenced, four line segments with the same width and different lengths can be placed on each layer of the multilayer PCB substrate to serve as power lines, microphones and other signal lines of the circuit, so that the functionality of the circuit can be increased.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A Bluetooth antenna device with a three-dimensional structure comprises a PCB substrate with at least two layers of structures, and is characterized in that a first antenna reference ground and a second antenna reference ground are arranged on the top layer and the bottom layer of the PCB substrate; the bluetooth antenna apparatus further includes:
the first metal edge covering structure is arranged on one side of the PCB substrate; the first antenna reference ground and the second antenna reference ground are connected through the first metal edge-covered structure;
the second metal edge covering structure is arranged on the other side of the PCB substrate;
the third metal edge covering structure is arranged on the same side of the PCB substrate as the second metal edge covering structure;
the first antenna structure is arranged between the first antenna reference ground and the second antenna reference ground and comprises at least two antenna line sections which are provided with conductor characteristics and etched on the top layer or the bottom layer of the PCB substrate; the adjacent two sections of antenna line segments etched on the top layer or the bottom layer of the PCB substrate are connected through the second metal edge covering structure and the third metal edge covering structure;
a second antenna structure disposed between the first antenna reference ground and the second antenna reference ground, including an antenna line segment having a conductor feature and etched in a bottom layer or a top layer of the PCB substrate; and
a via having a conductor feature disposed on the PCB substrate; the first antenna structure is connected with the second antenna structure through the through hole.
2. The three-dimensional structure bluetooth antenna device according to claim 1, wherein the first antenna structure comprises:
a first antenna line segment having a conductor feature etched in a top or bottom layer of the PCB substrate and parallel to the first antenna reference ground;
the second antenna line segment is provided with a conductor characteristic, is etched on the top layer or the bottom layer of the PCB substrate and is of an n-type structure; one end of the second antenna line segment is connected with the first antenna line segment through a second metal edge covering structure; the third antenna line segment is etched on the top layer or the bottom layer of the PCB substrate and is parallel to the second antenna reference ground; and the third antenna line segment is connected with the other end of the second antenna line segment through the third metal edge covering structure.
3. The three-dimensional structure bluetooth antenna device according to claim 2, wherein the first antenna structure further comprises:
the short circuit line segment with the conductor characteristics is etched on the top layer or the bottom layer of the PCB substrate and is connected with the first antenna line segment; and the antenna feed end is arranged on the top layer or the bottom layer of the PCB substrate and is connected with the first antenna line segment.
4. The three-dimensional structure bluetooth antenna device according to claim 1, wherein the second antenna structure comprises:
and the fourth antenna line segment with the conductor characteristic is etched at the bottom layer or the top layer of the PCB substrate and has an S-shaped structure.
5. The three-dimensional structure bluetooth antenna device according to claim 1, wherein the PCB substrate comprises:
the PCB comprises a first PCB layer, a fourth PCB layer, a first PCB inner layer and a second PCB inner layer, wherein the first PCB inner layer and the second PCB inner layer are arranged between the first PCB layer and the fourth PCB layer; the PCB comprises a PCB first layer, a PCB inner layer and a PCB second layer, wherein a power supply positive line segment with conductor characteristics is etched on the PCB first layer, a signal line positive electrode with conductor characteristics is etched on the PCB inner layer first layer, and a signal line negative electrode with conductor characteristics is etched on the PCB inner layer second layer.
6. The bluetooth antenna device having a three-dimensional structure according to claim 1, wherein the second antenna reference ground is provided with a power supply negative pad, a power supply positive pad, a signal line positive pad and a signal line negative pad.
7. The bluetooth antenna device having a three-dimensional structure according to claim 1, wherein the thickness of the PCB substrate is 0.6-1 mm.
8. The Bluetooth antenna device with a three-dimensional structure according to any one of claims 1 to 7, further comprising:
a passive element having inductive or capacitive characteristics is placed between the first antenna reference ground and the first antenna structure.
9. The three-dimensional structure bluetooth antenna device according to claim 8, wherein the passive element comprises:
a passive component first pin having inductive or capacitive characteristics, placed on said first antenna reference ground;
and a second pin of the passive element with inductance or capacitance characteristics is placed on the first antenna structure.
10. A bluetooth device comprising a micro control unit and a power supply means, characterized in that it further comprises a bluetooth antenna arrangement as claimed in any one of claims 1 to 9.
CN202010812074.0A 2020-08-13 2020-08-13 Bluetooth antenna device with three-dimensional structure and Bluetooth equipment Pending CN111864371A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010812074.0A CN111864371A (en) 2020-08-13 2020-08-13 Bluetooth antenna device with three-dimensional structure and Bluetooth equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010812074.0A CN111864371A (en) 2020-08-13 2020-08-13 Bluetooth antenna device with three-dimensional structure and Bluetooth equipment

Publications (1)

Publication Number Publication Date
CN111864371A true CN111864371A (en) 2020-10-30

Family

ID=72968784

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010812074.0A Pending CN111864371A (en) 2020-08-13 2020-08-13 Bluetooth antenna device with three-dimensional structure and Bluetooth equipment

Country Status (1)

Country Link
CN (1) CN111864371A (en)

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