CN111856370A - Superconducting device test probe rod - Google Patents
Superconducting device test probe rod Download PDFInfo
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- CN111856370A CN111856370A CN202010533473.3A CN202010533473A CN111856370A CN 111856370 A CN111856370 A CN 111856370A CN 202010533473 A CN202010533473 A CN 202010533473A CN 111856370 A CN111856370 A CN 111856370A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/035—Measuring direction or magnitude of magnetic fields or magnetic flux using superconductive devices
- G01R33/0354—SQUIDS
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/30—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Containers, Films, And Cooling For Superconductive Devices (AREA)
Abstract
The application provides a superconductive device test probe rod, includes: the test rod comprises a test rod body, a heat conduction sample table and a temperature measurement and control module. The test rod body has a test end. The heat conduction sample table is fixedly connected with the testing end. The temperature measurement and control module is fixed on the heat-conducting sample table. The temperature measurement and control module is used for measuring and controlling the temperature of the heat-conducting sample stage. This application will heat conduction sample platform is fixed in the test end of test bar body, and will the temperature is observed and controled the module and is fixed in heat conduction sample platform utilizes the good heat conductivility of heat conduction sample platform makes the module is observed and controled through measuring to the temperature of heat conduction sample platform realizes the accurate accuse temperature to the superconductive device that awaits measuring, thereby has ensured the test effect of superconductive device that awaits measuring.
Description
Technical Field
The application relates to the technical field of magnetic field testing, in particular to a superconducting device testing probe rod.
Background
A sensor using a Superconducting Quantum Interference Device (SQUID) is the most sensitive magnetic sensor known at present, and a precise magnetic field measurement effect can be achieved by using the sensitivity of the Quantum Interference property of a superconductor to an external magnetic field. SQUIDs are typically built into liquid helium and operate in very low temperature environments of 4-10K.
The SQUID test rod has the function of placing the SQUID device at low temperature, realizing the precise electrical transport property measurement of the SQUID in a temperature measurement and control range of 4-10K and under the condition of applying a magnetic field in a certain range, and is used for the performance characterization of the SQUID at extremely low temperature.
When a superconducting device is tested (such as a SQUID device), the temperature greatly affects the superconducting property of the superconducting device and also directly affects the thermal noise level of the device, so the temperature of the superconducting device needs to be strictly controlled during testing. When the traditional test rod is used for testing the superconducting device, the test effect cannot be guaranteed due to uncontrollable temperature.
Disclosure of Invention
Therefore, the superconducting device testing probe rod is needed to be provided for solving the problems that the testing effect cannot be guaranteed due to uncontrollable temperature when the conventional testing rod tests the superconducting device.
A superconducting device testing probe, comprising:
the test rod body is provided with a test end;
the heat conduction sample table is fixedly connected with the test end; and
and the temperature measurement and control module is fixed on the heat-conducting sample table and used for measuring and controlling the temperature of the heat-conducting sample table.
In one embodiment, the temperature measurement and control module comprises:
The temperature sensor is fixed on the heat-conducting sample table and used for measuring the temperature of the heat-conducting sample table; and
and the heating resistor is fixed on the heat-conducting sample table, is in thermal contact with the heat-conducting sample table and is used for controlling the temperature of the heat-conducting sample table.
In one embodiment, the heat-conducting sample stage is provided with a groove, the heating resistor is fixed in the groove, and a heat-conducting material is arranged between the heating resistor and the groove.
In one embodiment, the superconducting device testing probe further includes:
and the test circuit board is detachably connected with the heat-conducting sample table and is used for fixing the superconducting device to be tested, which is electrically connected with the test circuit board, to the heat-conducting sample table.
In one embodiment, the temperature sensor and the test circuit board are respectively disposed on two sides of the heat-conducting sample stage, and a projection of the temperature sensor on the heat-conducting sample stage is located in a projection of the to-be-tested superconducting device on the heat-conducting sample stage.
In one embodiment, the test circuit board is provided with a hollow area, the hollow area is used for placing the superconducting device to be tested, and the superconducting device to be tested is in thermal contact with the heat-conducting sample stage through a copper foil.
In one embodiment, the test circuit board is provided with pins of a socket, and the pins of the socket are used for being electrically connected with the superconducting device to be tested.
In one embodiment, the superconducting device testing probe further includes:
and the magnetic field module is fixed on one side, far away from the test circuit board, of the heat-conducting sample table, and the projection of the magnetic field module on the heat-conducting sample table is located in the projection of the to-be-tested superconducting device in the heat-conducting sample table and used for applying a specific magnetic field to the to-be-tested superconducting device.
In one embodiment, the superconducting device testing probe further includes:
a magnetism shielding section of thick bamboo, with the connection can be dismantled to the test end, just heat conduction sample platform with the temperature is observed and controled the module and all is set up in a magnetism shielding section of thick bamboo.
In one embodiment, the superconducting device testing probe further includes:
and the sealing flange is sleeved on the test rod body and is hermetically connected with the test rod body.
In one embodiment, the end of the test rod body away from the test end is provided with a plurality of airtight socket interfaces.
Compared with the prior art, the superconducting device testing probe rod is characterized in that the heat-conducting sample table is fixed at the testing end of the testing rod body, and the temperature measurement and control module is fixed at the heat-conducting sample table, so that the temperature measurement and control module can realize accurate temperature control of the superconducting device to be tested through measurement and control of the temperature of the heat-conducting sample table, and the testing effect of the superconducting device to be tested is guaranteed.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is an isometric view of a superconducting device testing probe according to an embodiment of the present application;
FIG. 2 is a block diagram of a testing portion of a superconducting device testing probe according to an embodiment of the present application;
fig. 3 is a schematic diagram of a current-voltage characteristic curve of a SQUID device to be tested at different temperatures according to an embodiment of the present application;
FIG. 4 is a block diagram of a testing portion of a superconducting device testing probe according to another embodiment of the present application;
FIG. 5 is a schematic structural diagram of a superconducting device testing probe according to an embodiment of the present application;
fig. 6 is a schematic diagram of a magnetic flux-voltage characteristic curve of a SQUID device to be tested at a temperature of 4.8K under different bias currents according to an embodiment of the present application;
fig. 7 is a left side view of a superconducting device testing probe according to an embodiment of the present application.
Description of reference numerals:
10 superconductive device test probe rod
100 test rod body
101 airtight socket interface
102 socket
110 test terminal
120 adiabatic pole
200 heat conduction sample platform
210 groove
300 temperature measurement and control module
310 temperature sensor
320 heating resistor
400 test circuit board
401 superconducting device under test
410 inserting needle
500 magnetic field module
600 magnetic shielding cylinder
700 closure flange
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and those skilled in the art will be able to make similar modifications without departing from the spirit of the application and it is therefore not intended to be limited to the embodiments disclosed below.
The numbering of the components as such, e.g., "first", "second", etc., is used herein for the purpose of describing the objects only, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings). In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be considered as limiting the present application.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 and 2, an embodiment of the present application provides a superconducting device testing probe 10, including: the test rod comprises a test rod body 100, a heat conduction sample table 200 and a temperature measurement and control module 300. The test stick body 100 has a test end 110. The heat-conducting sample stage 200 is fixedly connected to the testing terminal 110. The temperature measurement and control module 300 is fixed on the heat-conducting sample stage 200. The temperature measurement and control module 300 is used for measuring and controlling the temperature of the heat-conducting sample stage 200.
It is understood that the material of the test bar body 100 is not limited as long as the shape is ensured. In one embodiment, the material of the test rod body 100 may be stainless steel. In one embodiment, the material of the test rod body 100 may be german silver. In one embodiment, the test rod body 100 is a hollow rod with low thermal conductivity, and the length of the hollow rod can be selected according to actual requirements, such as 1 meter. In one embodiment, the interior of the test bar body 100 is hollow, so that internal routing of the test bar body 100 can be realized. In one embodiment, one of the ends of the test rod body 100 is a test end 110. In use, the test end 110 is required to extend into a low temperature dewar.
In one embodiment, the material of the thermally conductive sample stage 200 may be non-magnetic red copper with good thermal conductivity. The heat-conducting sample table 200 made of red copper has good heat conductivity, and the temperature consistency of the whole sample table area is easily maintained. It can be understood that the fixed connection manner between the heat-conducting sample stage 200 and the testing end 110 of the testing rod body 100 is not limited, as long as the heat insulation and the fixed connection between the heat-conducting sample stage 200 and the testing end 110 are ensured. In one embodiment, the thermally conductive sample stage 200 and the test rod body 100 may be fixedly connected by a rivet. In one embodiment, the thermally conductive sample stage 200 and the test rod body 100 may be integrally formed.
In one embodiment, the thermally conductive sample stage 200 and the test end 110 may be connected by a material with good thermal insulation. Specifically, the heat-conducting sample stage 200 may be fixedly connected to the testing terminal 110 through organic glass. The heat-conducting sample stage 200 may also be fixedly connected to the testing end 110 through bakelite. The heat-conducting sample stage 200 is fixedly connected with the testing end 110 by a material with good heat insulation, so that the influence of external heat conducted to the heat-conducting sample stage 200 through the testing end 110 on the temperature of the sample stage can be avoided, and the testing effect is improved.
It can be understood that the specific structure of the temperature measurement and control module 300 is not limited as long as it has the function of measuring and controlling the temperature of the thermally conductive sample stage 200. In one embodiment, the temperature measurement and control module 300 may include a temperature sensor and a resistor. In one embodiment, the temperature sensor and the resistor can cooperate with an external temperature control device to realize temperature control of the thermally conductive sample stage 200. Specifically, detect through temperature sensor the current temperature of heat conduction sample platform 200 to judge current temperature through outside temperature control equipment, if the temperature is low excessively, but outside temperature control equipment accessible resistance heats, thereby the realization is right the control of heat conduction sample platform 200 temperature, and then realize accurate accuse temperature.
In one embodiment, the superconducting device test probe 10 may perform measurements on a SQUID device under test. Specifically, by matching the heat-conducting sample stage 200 with the temperature measurement and control module 300, the current-voltage characteristic curve of the SQUID device to be measured can be measured under different temperatures, as shown in fig. 3. By adopting the temperature control mode, the temperature control precision can reach +/-2 mK.
In one embodiment, the temperature measurement and control module 300 and the thermally conductive sample stage 200 can be in thermal contact, that is, the temperature measurement and control module 300 and the thermally conductive sample stage 200 have good thermal conduction, so that the temperature control effect of the temperature measurement and control module 300 can be more accurate.
In this embodiment, will heat conduction sample platform 200 is fixed in test end 110 of test bar body 100, and will temperature observes and controls module 300 and is fixed in heat conduction sample platform 200 utilizes heat conduction sample platform 200's good heat conductivility, makes temperature observes and controls module 300 is through measuring and controlling heat conduction sample platform 200's temperature, realizes the accurate accuse temperature to the superconductive device that awaits measuring, thereby has ensured the test effect of the superconductive device that awaits measuring.
Referring again to fig. 2, in an embodiment, the temperature measurement and control module 300 includes: a temperature sensor 310 and a heating resistor 320. The temperature sensor 310 is fixed to the thermally conductive sample stage 200. The temperature sensor 310 is used for measuring the temperature of the heat-conducting sample stage 200. The heating resistor 320 is fixed to the heat-conducting sample stage 200. The heating resistor 320 is in thermal contact with the thermally conductive sample stage 200. The heating resistor 320 is used for controlling the temperature of the heat-conducting sample stage 200.
It can be understood that the manner of fixing the temperature sensor 310 to the heat-conducting sample stage 200 is not limited, as long as the temperature sensor 310 and the heat-conducting sample stage 200 are fixed to each other. In one embodiment, the temperature sensor 310 may be embedded within the thermally conductive sample stage 200. In one embodiment, the temperature sensor 310 may also be fixed to the thermally conductive sample stage 200 by a snap fit. The current temperature of the thermally conductive sample stage 200 is detected in real time by the temperature sensor 310.
It can be understood that the manner of fixing the heating resistor 320 to the heat-conducting sample stage 200 is not limited, as long as the thermal contact between the heating resistor 320 and the heat-conducting sample stage 200 is ensured. In one embodiment, the heating resistor 320 may be embedded in the thermally conductive sample stage 200. In one embodiment, the heating resistor 320 may also be adhesively fixed to the thermally conductive sample stage 200. The temperature control of the heat-conducting sample stage 200 is realized through the heating resistor 320. Specifically, the heat-conducting sample stage 200 may be heated by the heating resistor 320.
In one embodiment, the thermally conductive sample stage 200 is provided with a groove 310. The heating resistor 320 is fixed in the groove 310, and a heat conducting material is arranged between the heating resistor 320 and the groove 310. In one embodiment, the groove 310 may be disposed on a side surface of the thermally conductive sample stage 200. In one embodiment, the groove 310 may be a hemispherical groove, that is, the shape of the groove 310 is matched with the shape of the heating resistor 320, so that the heating resistor 320 can be embedded in the groove 310 while being in thermal contact with the sidewall of the groove 310, thereby increasing the contact area between the heating resistor 320 and the thermally conductive sample stage 200 as much as possible. In one embodiment, the heat conductive material between the heating resistor 320 and the groove 310 may be indium foil. Specifically, indium foil may be wound around the heating resistor 320 and then embedded into the groove 310, so that thermal contact between the heating resistor 320 and the thermally conductive sample stage 200 may be improved.
In one embodiment, the superconducting device testing probe 10 further includes: the circuit board 400 is tested. The test circuit board 400 is detachably connected to the thermally conductive sample stage 200. The test circuit board 400 is used for fixing the superconducting device 401 to be tested, which is electrically connected with the test circuit board 400, to the heat-conducting sample stage 200. In one embodiment, the test Circuit Board 400 may be a PCB (Printed Circuit Board) Board.
In one embodiment, the detachable connection between the test circuit board 400 and the heat-conducting sample stage 200 is not limited, as long as the detachable connection between the test circuit board 400 and the heat-conducting sample stage 200 is ensured. In one embodiment, the test circuit board 400 may be detachably connected to the thermally conductive sample stage 200 by screws. In one embodiment, the test circuit board 400 may also be detachably connected to the thermally conductive sample stage 200 by a snap. The test circuit board 400 and the heat-conducting sample table 200 are detachably connected, so that the superconducting device 401 to be tested has the advantage of convenience in disassembly and assembly when different superconducting devices to be tested are replaced.
In one embodiment, the electrical connection between the superconducting device under test 401 and the test circuit board 400 may be achieved by ultrasonic bonding. In one embodiment, the step of fixing the superconducting device 401 to be tested, electrically connected to the test circuit board 400, to the thermally conductive sample stage 200 by the test circuit board 400 includes: the superconducting device 401 to be tested is fixed to the heat-conducting sample stage 200 through the test circuit board 400. Specifically, the superconducting device 401 to be tested may be fixed to the test circuit board 400, and then the test circuit board 400 is fixed to the thermally conductive sample stage 200.
In one embodiment, the area of the test circuit board 400 where the superconducting device under test 401 is placed may be a hollow area. The hollowed-out area is provided with a copper foil with good heat conduction. In one embodiment, the size of the hollow-out area may be a square hollow-out area of 2 × 2 cm. The process of fixing the superconducting device 401 to be tested to the test circuit board 400 is as follows: the superconducting device 401 to be tested can be adhered to the copper foil in the hollow area through low-temperature heat-conducting glue, and then the electrode of the superconducting device 401 to be tested is electrically connected with the electrode of the test circuit board 400 in an ultrasonic pressure welding mode. When the test circuit board 400 is fixed to the thermally conductive sample stage 200, the superconducting device 401 to be tested and the thermally conductive sample stage 200 are in thermal contact through a copper foil, so that good temperature consistency can be achieved between the superconducting device 401 to be tested and the thermally conductive sample stage 200.
In one embodiment, the temperature sensor 310 and the test circuit board 400 are respectively disposed on two sides of the thermally conductive sample stage 200, and a projection of the temperature sensor 310 on the thermally conductive sample stage 200 is located in a projection of the to-be-tested superconducting device 401 on the thermally conductive sample stage 200. The temperature sensor 310 and the test circuit board 400 are respectively disposed at both sides of the thermally conductive sample stage 200, which means that: the test circuit board 400 is disposed at one side of the heat-conducting sample stage 200, the temperature sensor 310 is disposed at the other side of the heat-conducting sample stage 200, and the temperature sensor 310 and the to-be-tested superconducting device 401 are symmetrically disposed with respect to the heat-conducting sample stage 200.
In one embodiment, the superconducting device under test 401 is disposed on one side of the thermally conductive sample stage 200 through the test circuit board 400. The temperature sensor 310 is disposed on a side of the heat-conducting sample stage 200 away from the test circuit board 400, and the temperature sensor 310 is as close as possible to an area of the test circuit board 400 where the to-be-tested superconducting device 401 is disposed, so as to ensure accuracy of temperature measurement. Specifically, the temperature sensor 310 may be disposed at a position corresponding to the hollowed-out area on a side of the heat-conducting sample stage 200 away from the test circuit board 400, that is, a projection of the temperature sensor 310 on the heat-conducting sample stage 200 is located in a projection of the to-be-measured superconducting device 401 on the heat-conducting sample stage 200, so that accuracy of temperature measurement may be improved.
Referring to fig. 4, in one embodiment, the test circuit board 400 is provided with pins 410 of a socket. The superconducting device to be tested 401 is electrically connected with the pins 410 of the extension socket. In one embodiment, the pins 410 of the row may be 22-pin pins. In one embodiment, a 2 × 2cm square frame hollow area is disposed on one side of the test circuit board 400, and the superconducting device to be tested 401 (e.g., SQUID device to be tested) is disposed in the square frame hollow area. And 22 electrodes of the SQUID device to be tested are arranged on 3 sides of the square frame hollow area, and the 22 electrodes are electrically connected with the contact pins 410 in a one-to-one correspondence manner in a pressure welding manner.
In one embodiment, before the superconducting device 401 to be tested is subjected to the low temperature test, the process of mounting the superconducting device 401 to be tested on the superconducting device test probe 10 is as follows: the superconducting device 401 to be tested is firstly adhered to the copper foil of the hollow area of the test circuit board 400 through heat conducting glue, then each electrode of the superconducting device 401 to be tested is electrically connected with each electrode of the contact pin 410 through an ultrasonic pressure welding mode, then the test circuit board 400 is fixed on the heat conducting sample table 200 through a screw, and finally the socket 102 (shown in figure 5) which is arranged on the test rod body 100 and matched with the contact pin 410 is connected to the contact pin 410 of the test circuit board 300.
In one embodiment, the testing rod body 100 is provided with a socket 102 matching with the contact pin 410, and the socket 102 on the testing rod body 100 is connected with an external socket through an internal wire, so as to supply power to the superconducting device testing probe 10. When a sample to be tested is replaced each time, the socket 102 only needs to be plugged and pulled out, a soldering iron is not needed for connecting wires, the assembly and disassembly are convenient, and static electricity and heat damage of devices in the wire welding process are avoided. In one embodiment, the internal traces may be wires with high thermal resistance, so as to block heat from being transmitted into the thermally conductive sample stage 200 through the wires.
In one embodiment, the thermally conductive sample stage 200 is fixedly connected to one end of the test rod body 100 through an insulating rod 120. It is understood that the material of the heat insulation rod 120 is not limited as long as it has the function of blocking heat transfer. In one embodiment, the heat insulation rod 120 may be made of organic glass. In one embodiment, the material of the heat insulation rod 120 may also be bakelite. By the heat insulation rod 120, it is avoided that external heat is transferred to the heat-conducting sample table 200 through the testing rod body 100, and the temperature of the heat-conducting sample table 200 is influenced.
In one embodiment, the superconducting device testing probe 10 further includes: a magnetic field module 500. The magnetic field module 500 is fixed on one side of the heat-conducting sample stage 200, which is far away from the test circuit board 400, and the projection of the magnetic field module 500 on the heat-conducting sample stage 200 is located in the projection of the to-be-tested superconducting device 401 on the heat-conducting sample stage 200. The magnetic field module 500 is configured to apply a specific magnetic field to the superconducting device 401 to be tested.
In one embodiment, the magnetic field module 500 may be implemented by winding a magnetic field coil of an enameled niobium superconducting wire. It can be understood that the way of fixing the magnetic field module 500 to the side of the heat-conducting sample stage 200 away from the test circuit board 400 is not limited, as long as the magnetic field module 500 and the heat-conducting sample stage 200 are fixed. In one embodiment, the magnetic field module 500 may be fixed to the thermally conductive sample stage 200 by rivets. In one embodiment, the magnetic field module 500 may also be fixed to the thermally conductive sample stage 200 by a snap. A specific magnetic field is applied to the superconducting device 401 to be measured through the magnetic field module 500, so that the electrical transport property of the superconducting device 401 to be measured under different magnetic fields can be measured.
Specifically, when the temperature of the thermally conductive sample stage 200 is controlled at 4.8K and the superconducting device 401 to be measured is a SQUID device to be measured, the magnetic flux-voltage characteristic curve of the SQUID device to be measured under different bias currents is measured as shown in fig. 6. In an embodiment, the magnetic field module 500 may be directly placed at a position corresponding to the hollowed-out area on a side of the heat-conducting sample stage 200 away from the test circuit board 400, that is, a projection of the magnetic field module 500 on the heat-conducting sample stage 200 is located in a projection of the to-be-tested superconducting device 401 on the heat-conducting sample stage 200, so that a sufficiently strong mutual inductance between the magnetic field module 500 and the to-be-tested superconducting device 401 may be ensured.
In one embodiment, the magnetic field module 500 is a magnetic field coil. The magnetic field coil is fixed on the heat-conducting sample stage 200, and the projection of the magnetic field coil on the heat-conducting sample stage 200 is located in the projection of the to-be-tested superconducting device 401 on the heat-conducting sample stage 200. In one embodiment, the magnetic field coil may be a magnetic field coil wound with an enameled niobium superconducting wire.
It should be understood that the way of fixing the magnetic field coil to the heat-conducting sample stage 200 is not limited, as long as the magnetic field coil and the heat-conducting sample stage 200 are fixed. In one embodiment, the magnetic field coil may be fixed to the thermally conductive sample stage 200 by rivets. In one embodiment, the magnetic field coil may also be fixed to the thermally conductive sample stage 200 by a snap fit. A specific magnetic field is applied to the superconducting device 401 to be measured through the magnetic field coil, so that the electrical transport property of the superconducting device 401 to be measured under different magnetic fields can be measured.
In one embodiment, the superconducting device testing probe 10 further includes: a magnetic shielding cartridge 600. Magnetic shield section of thick bamboo 600 with the connection can be dismantled to test end 110, just heat conduction sample platform 200 with module 300 is observed and controled to temperature all set up in magnetic shield section of thick bamboo 600 is interior.
It is understood that the specific material of the magnetic shielding cylinder 600 is not limited as long as it has the electromagnetic shielding function. In one embodiment, the material of the magnetic shielding can 600 may be lead. In one embodiment, the material of the magnetic shielding cylinder 600 may also be niobium. In one embodiment, the magnetic shielding cylinder 600 may be made of other superconducting materials or high-permeability materials.
It is to be understood that the way of detachably connecting the magnetic shield cartridge 600 to the testing end 110 of the testing rod body 100 is not limited as long as the detachable connection between the magnetic shield cartridge 600 and the testing end 110 is ensured. In one embodiment, the magnetic shield cartridge 600 and the test end 110 can be detachably attached by screws. In one embodiment, the magnetic shield cartridge 600 and the testing end 110 can also be removably attached by threads. Specifically, the inner wall of the magnetic shielding cylinder 600 is provided with an internal thread, and the testing end 110 is provided with an external thread matched with the internal thread; alternatively, the outer wall of the magnetic shielding cylinder 600 is provided with an external thread, and the testing end 110 is provided with an internal thread matched with the external thread. Through the cooperation between the magnetic shielding cylinder 600 and the test rod body 100, the electromagnetic shielding performance can be realized so as to shield the interference of an external magnetic field and improve the test effect.
Referring to fig. 7, in one embodiment, the end of the test rod body 100 away from the test end 110 is provided with a plurality of airtight socket interfaces 101. In one embodiment, the number of the plurality of airtight socket interfaces 101 may be 10-50. Specifically, the other end of the test rod body 100 can select the airtight socket interface 101 of 26 cores; the magnetic field module 500 is electrically connected to 2 airtight socket interfaces 101, the heating resistor 320 is electrically connected to 2 airtight socket interfaces 101, the temperature sensor 310 is electrically connected to 4 airtight socket interfaces 101, and the rest 18 airtight socket interfaces 101 are connected to the test electrode of the superconducting device 401 to be tested, so as to measure the electrical transportation property.
In one embodiment, the superconducting device testing probe 10 further includes: closing the flange 700. The sealing flange 700 is sleeved on the testing rod body 100 and is hermetically connected with the testing rod body 100. The sealing flange 700 is used for sealing and connecting the test rod body 100 with the low-temperature dewar mouth. In one embodiment, the sealing flange 700 for sealing the test rod body 100 to the cryogenic dewar needs to be a flange having sufficient airtightness to prevent leakage of liquid helium gas. Meanwhile, the flange can slide along the extension direction of the test rod body 100, so that the depth of the test rod body 100 immersed in the liquid helium dewar is adjusted to adapt to different liquid level conditions in the dewar.
To sum up, this application will heat conduction sample platform 200 the temperature observes and controls module 300 test circuit board 400 and magnetic field module 500 all set up in a magnetic shielding section of thick bamboo 600, through a magnetic shielding section of thick bamboo 600 with the electromagnetic shielding performance is realized in the cooperation of test rod body 100, will simultaneously test circuit board 400 with set up to dismantling the connection between the heat conduction sample platform 200, have easy dismounting's advantage. Simultaneously will heat conduction sample platform 200 is fixed in test end 110 of test rod body 100, and will temperature observes and controls module 300 and is fixed in heat conduction sample platform 200 utilizes the good heat conductivility of heat conduction sample platform 200 makes temperature observes and controls module 300 realizes the accurate accuse temperature to the superconductive device that awaits measuring through measuring and controlling the temperature of heat conduction sample platform 200, thereby has ensured the test effect of the superconductive device that awaits measuring.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A superconducting device test probe, comprising:
a test stick body (100) having a test end (110);
the heat-conducting sample table (200) is fixedly connected with the testing end (110); and
and the temperature measurement and control module (300) is fixed on the heat-conducting sample table (200) and is used for measuring and controlling the temperature of the heat-conducting sample table (200).
2. The superconducting device testing probe of claim 1, wherein the temperature measurement and control module (300) comprises:
a temperature sensor (310) fixed to the thermally conductive sample stage (200) for measuring the temperature of the thermally conductive sample stage (200); and
and the heating resistor (320) is fixed on the heat-conducting sample table (200), is in thermal contact with the heat-conducting sample table (200), and is used for controlling the temperature of the heat-conducting sample table (200).
3. The superconducting device testing probe of claim 2, wherein the thermally conductive sample stage (200) is provided with a recess (210), the heating resistor (320) is fixed in the recess (210), and a thermally conductive material is provided between the heating resistor (320) and the recess (210).
4. The superconducting device testing probe of claim 2 further comprising:
the test circuit board (400) is detachably connected with the heat conduction sample table (200) and is used for fixing the to-be-tested superconducting device (401) electrically connected with the test circuit board (400) to the heat conduction sample table (200).
5. The superconducting device testing probe of claim 4, wherein the temperature sensor (310) and the testing circuit board (400) are respectively disposed on two sides of the thermally conductive sample stage (200), and a projection of the temperature sensor (310) on the thermally conductive sample stage (200) is located within a projection of the superconducting device under test (401) on the thermally conductive sample stage (200).
6. The superconducting device test probe of claim 4, wherein the test circuit board (400) is provided with a hollowed-out area for placing the superconducting device under test (401), and the superconducting device under test (401) is in thermal contact with the thermally conductive sample stage (200) through a copper foil.
7. The superconducting device test probe as claimed in claim 4, wherein the test circuit board (400) is provided with pins (410) of a socket, the pins (410) of the socket being adapted to electrically connect with the superconducting device (401) to be tested.
8. The superconducting device testing probe of claim 4 further comprising:
the magnetic field module (500) is fixed on one side, far away from the test circuit board (400), of the heat conduction sample table (200), and the magnetic field module (500) is located in the projection of the heat conduction sample table (200) of the superconducting device (401) to be tested in the projection of the heat conduction sample table (200) and used for applying a specific magnetic field to the superconducting device (401) to be tested.
9. A superconducting device testing probe according to any one of claims 1-8, further comprising:
magnetic shielding section of thick bamboo (600), with test end (110) can dismantle the connection, just heat conduction sample platform (200) with temperature is observed and controled module (300) and is all set up in magnetic shielding section of thick bamboo (600).
10. A superconducting device testing probe according to any one of claims 1-8, further comprising:
and the sealing flange (700) is sleeved on the testing rod body (100) and is hermetically connected with the testing rod body (100).
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