CN111849379A - Semi-conductive buffer adhesive tape, preparation method and application thereof, and power cable - Google Patents

Semi-conductive buffer adhesive tape, preparation method and application thereof, and power cable Download PDF

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Publication number
CN111849379A
CN111849379A CN202010685085.7A CN202010685085A CN111849379A CN 111849379 A CN111849379 A CN 111849379A CN 202010685085 A CN202010685085 A CN 202010685085A CN 111849379 A CN111849379 A CN 111849379A
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parts
semi
semiconductive
substrate layer
buffer tape
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Chinese (zh)
Inventor
杨宏艳
俞飞
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Shenyang Tianrong Cable Material Co ltd
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Shenyang Tianrong Cable Material Co ltd
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Priority to CN202010685085.7A priority Critical patent/CN111849379A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C09J123/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/21—Paper; Textile fabrics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H01B7/18—Protection against damage caused by wear, mechanical force or pressure; Sheaths; Armouring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B9/00—Power cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B9/00—Power cables
    • H01B9/02—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/04—Antistatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/26—Presence of textile or fabric
    • C09J2400/263—Presence of textile or fabric in the substrate

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Conductive Materials (AREA)

Abstract

The invention provides a semiconductive buffer adhesive tape, a preparation method, application and a power cable thereof, wherein the semiconductive buffer adhesive tape comprises the following components: the substrate layer, set up and be in the first semiconduction glue film of the relative two sides of substrate layer, and set up in at least one side of substrate layer the second semiconduction glue film on the first semiconduction glue film. The semiconductive buffer adhesive tape obtained by the invention not only has good electric field buffering and mechanical buffering functions, but also has good ageing resistance and stable electrical performance; when the adhesive tape is applied to manufacturing a power cable, the adhesive tape can be arranged between a cable shielding layer and an outer protective sleeve, the friction between hard protective sleeves is buffered, and a compact protective layer is formed by utilizing the viscoelasticity of a semi-conductive buffer adhesive tape under the high-temperature action of extrusion molding cabling.

Description

Semi-conductive buffer adhesive tape, preparation method and application thereof, and power cable
Technical Field
The invention relates to the field of power cables, in particular to a semiconductive buffer tape, a preparation method and application thereof and a power cable.
Background
When the power cable is in operation, the current of the cable core can generate a strong electric field, and if moisture permeates into the insulating layer to form water branches, the water branches can discharge at the defect position in the sheath, so that the cable is punctured. There is a need for a semiconducting material with water blocking properties that can provide semiconducting shielding to buffer electric fields; and because the cable inner sheath and the metal sheath are directly contacted, the cable inner sheath can be abraded and scratched, and a high-temperature-resistant buffer material is needed to be bound between the sheaths, so that the cable can be prevented from being directly abraded and scratched in the high-temperature extrusion molding process, and the cable has a mechanical buffer effect. In order to solve the problems, the conventional method is to adopt a semi-conductive buffer water-blocking belt to shield and buffer an electric field, and meanwhile, the semi-conductive buffer belt has good water absorption capacity and protects a cable from being affected with damp.
Disclosure of Invention
In view of the above, the present invention aims to provide a semiconductive buffer tape, a preparation method, an application and a power cable thereof, wherein the semiconductive buffer tape not only has good electric field buffering and mechanical buffering effects, but also has anti-aging and electrical performance stabilizing effects; when the adhesive tape is applied to manufacturing a power cable, the adhesive tape can be arranged between a cable shielding layer and an outer protective sleeve, the friction between hard protective sleeves is buffered, and a compact protective layer is formed by utilizing the viscoelasticity of a semi-conductive buffer adhesive tape under the high-temperature action of extrusion molding cabling.
In order to achieve the above purpose, the invention provides the following technical scheme:
a semiconductive buffer tape comprising: the device comprises a substrate layer, first semi-conductive adhesive layers arranged on two opposite surfaces of the substrate layer and second semi-conductive adhesive layers arranged on the first semi-conductive adhesive layers on at least one surface of the substrate layer;
the first semi-conductive adhesive layer comprises the following raw materials in parts by weight: 10-150 parts of water-based textile emulsion, 5-50 parts of first carbon material, 0.1-10 parts of dispersing agent, 0.1-10 parts of wetting agent and 0.1-20 parts of first auxiliary agent; the first auxiliary agent comprises at least one of carbazone, polyacrylamide, nano montmorillonite, mercapto benzothiazole sodium salt, silicon-containing emulsion and reclaimed rubber;
The second semi-conductive adhesive layer comprises the following raw materials in parts by weight: 10-100 parts of rubber, 0.1-20 parts of plasticizer, 5-45 parts of second carbon material, 0.1-20 parts of vulcanizing agent and 0.1-10 parts of second auxiliary agent; the second auxiliary agent comprises at least one of white carbon black, talcum powder, calcium carbonate, argil, diethylene glycol, benzotriazole and sodium salt thereof, and methylbenzotriazole and sodium salt thereof.
As a further improvement of the above technical solution, the material of the substrate layer is selected from one of polyester fiber cloth, polypropylene fiber cloth, nylon fiber cloth, vinylon fiber cloth, polyester cotton fiber cloth, aramid fiber cloth, and spandex fiber cloth.
As a further improvement of the above technical solution, the aqueous textile emulsion comprises at least one of pure acrylic and modified emulsion thereof, vinyl acetate acrylic and modified emulsion thereof, styrene acrylic and modified emulsion thereof, polyurethane emulsion and polyvinyl alcohol;
preferably, the first carbon material includes one of pigment carbon black, acetylene carbon black, superconducting carbon black, and carbon nanotubes;
preferably, the dispersant comprises at least one of glyceryl stearate, peregal O-15, peregal O-25, liquid paraffin, microcrystalline paraffin and polyethylene wax;
Preferably, the wetting agent comprises at least one of polyoxyethylene octylphenol ether, sodium diisooctyl sulfosuccinate, span, tween, alkyl sulfate, sulfonate, fatty acid or fatty acid ester sulfate, carboxylic acid soap, phosphate ester, polyoxyethylene fatty alcohol ether and polyoxyethylene polyoxypropylene block copolymer.
As a further improvement of the above technical solution, the rubber comprises one of butyl rubber, chlorinated butyl rubber and brominated butyl rubber;
preferably, the plasticizer includes at least one of paraffin oil, rosin, coumarone resin, phthalate ester, fatty dibasic acid ester, phosphate ester and polyester.
As a further improvement of the above technical solution, the second carbon material is at least one selected from the group consisting of wear-resistant carbon black, semi-reinforcing carbon black, thermal carbon black, and superconducting carbon black;
preferably, the vulcanizing agent includes at least one of sulfur, zinc oxide, magnesium oxide, dithiocarbamate, thiourea, and potassium peroxide.
A preparation method of a semiconductive buffer tape is provided, wherein the semiconductive buffer tape is the semiconductive buffer tape; the preparation method comprises the following steps:
arranging the first semi-conductive adhesive layers on two opposite surfaces of the substrate layer;
And arranging the second semi-conductive adhesive layer on the first semi-conductive adhesive layer on at least one surface of the substrate layer.
As a further improvement of the above technical solution, the first semi-conductive adhesive layer is disposed on the opposite sides of the substrate layer by any one of padding, dipping, coating and spraying.
As a further improvement of the above technical solution, the second semiconductive adhesive layer is disposed on the first semiconductive adhesive layer by means of rolling.
The application of the semi-conductive buffer adhesive tape in manufacturing the power cable is to arrange the semi-conductive buffer adhesive tape between a shielding layer and an outer protective sleeve.
The utility model provides a power cable, includes shielding layer, outer protective sheath and set up in the shielding layer with semi-conductive buffering sticky tape between the outer protective sheath layer, semi-conductive buffering sticky tape is foretell semi-conductive buffering sticky tape.
The invention has the beneficial effects that:
(1) according to the invention, the first semi-conductive adhesive layers are arranged on the two opposite surfaces of the substrate layer, and the second semi-conductive adhesive layer is arranged on the first semi-conductive adhesive layer on at least one surface of the substrate layer, so that the obtained semi-conductive buffer adhesive tape not only has good electric field buffering and mechanical buffering functions, but also has good ageing resistance and stable electrical performance; when the adhesive tape is applied to manufacturing a power cable, the adhesive tape can be arranged between a cable shielding layer and an outer protective sleeve, the friction between hard protective sleeves is buffered, and a compact protective layer is formed by utilizing the viscoelasticity of a semi-conductive buffer adhesive tape under the high-temperature action of extrusion molding cabling.
(2) The invention has simple production process and stable technical performance, thereby ensuring the safe operation of the cable, prolonging the service life, having wide market prospect and being suitable for large-scale production.
Drawings
To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, and it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope of the present invention.
Fig. 1 is a schematic structural view of a semiconductive buffer tape according to the present invention.
The reference numbers illustrate:
1-semiconducting buffer tape; 100-a substrate layer; 200-a first semiconductive adhesive layer; 300-second semiconductive glue layer.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention.
This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be construed as broadly as the present invention is capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In case of conflict, the present specification, including definitions, will control.
The terms as used herein:
"prepared from … …" is synonymous with "comprising". The terms "comprises," "comprising," "includes," "including," "has," "having," "contains," "containing," or any other variation thereof, as used herein, are intended to cover a non-exclusive inclusion. For example, a composition, process, method, article, or apparatus that comprises a list of elements is not necessarily limited to only those elements but may include other elements not expressly listed or inherent to such composition, process, method, article, or apparatus.
The conjunction "consisting of … …" excludes any unspecified elements, steps or components. If used in a claim, the phrase is intended to claim as closed, meaning that it does not contain materials other than those described, except for the conventional impurities associated therewith. When the phrase "consisting of … …" appears in a clause of the subject matter of the claims rather than immediately after the subject matter, it defines only the elements described in the clause; other elements are not excluded from the claims as a whole.
When an amount, concentration, or other value or parameter is expressed as a range, preferred range, or as a range of upper preferable values and lower preferable values, this is to be understood as specifically disclosing all ranges formed from any pair of any upper range limit or preferred value and any lower range limit or preferred value, regardless of whether ranges are separately disclosed. For example, when the range "1 ~ 5" is disclosed, the ranges described should be construed to include the ranges "1 ~ 4", "1 ~ 3", "1 ~ 2 and 4 ~ 5", "1 ~ 3 and 5", and the like. When a range of values is described herein, unless otherwise stated, the range is intended to include the endpoints thereof and all integers and fractions within the range.
In these examples, the parts and percentages are by mass unless otherwise indicated.
"part by mass" means a basic unit of measure indicating a mass ratio of a plurality of components, and 1 part may represent any unit mass, for example, 1g or 2.689 g. If we say that the part by mass of the component A is a part by mass and the part by mass of the component B is B part by mass, the ratio of the part by mass of the component A to the part by mass of the component B is a: b. alternatively, the mass of the A component is aK and the mass of the B component is bK (K is an arbitrary number, and represents a multiple factor). It is unmistakable that, unlike the parts by mass, the sum of the parts by mass of all the components is not limited to 100 parts.
"and/or" is used to indicate that one or both of the illustrated conditions may occur, e.g., a and/or B includes (a and B) and (a or B).
Referring to fig. 1, the present invention provides a semiconductive buffer tape 1, comprising: the adhesive comprises a substrate layer 100, a first semiconductive adhesive layer 200 arranged on two opposite surfaces of the substrate layer 100, and a second semiconductive adhesive layer 300 arranged on the first semiconductive adhesive layer 200 on at least one surface of the substrate layer 100.
Further, the material of the substrate layer 100 is selected from one of polyester fiber cloth, polypropylene fiber cloth, nylon fiber cloth, vinylon fiber cloth, polyester-cotton fiber cloth, aramid fiber cloth, and spandex fiber cloth; the water molecules can be effectively prevented from spreading on the base material, and the water tree phenomenon of the cable can be avoided.
The first semiconductive adhesive layer 200 comprises the following raw materials in parts by weight: 10-150 parts of water-based textile emulsion, 5-50 parts of first carbon material, 0.1-10 parts of dispersing agent, 0.1-10 parts of wetting agent and 0.1-20 parts of first auxiliary agent.
The first auxiliary agent comprises at least one of carbazone, polyacrylamide, nano montmorillonite, mercapto benzothiazole sodium salt, silicon-containing emulsion and reclaimed rubber.
Preferably, the aqueous textile emulsion comprises at least one of pure acrylic and modified emulsion thereof, vinyl acetate acrylic and modified emulsion thereof, styrene acrylic and modified emulsion thereof, polyurethane emulsion and polyvinyl alcohol;
Preferably, the first carbon material includes one of pigment carbon black, acetylene carbon black, superconducting carbon black, and carbon nanotubes;
preferably, the dispersant comprises at least one of glyceryl stearate, peregal O-15, peregal O-25, liquid paraffin, microcrystalline paraffin and polyethylene wax.
Preferably, the wetting agent comprises at least one of polyoxyethylene octylphenol ether, sodium diisooctyl sulfosuccinate, span, tween, alkyl sulfate, sulfonate, fatty acid or fatty acid ester sulfate, carboxylic acid soap, phosphate, polyoxyethylene fatty alcohol ether and polyoxyethylene polyoxypropylene block copolymer.
The second semiconductive adhesive layer 300 comprises the following raw materials in parts by weight: 10-100 parts of rubber, 0.1-20 parts of plasticizer, 5-45 parts of second carbon material, 0.1-20 parts of vulcanizing agent and 0.1-10 parts of second auxiliary agent.
The second auxiliary agent comprises at least one of white carbon black, talcum powder, calcium carbonate, argil, diethylene glycol, benzotriazole and sodium salt, and methylbenzotriazole and sodium salt.
Preferably, the rubber comprises one of butyl rubber, chlorinated butyl rubber and brominated butyl rubber.
Preferably, the plasticizer includes at least one of paraffin oil, rosin, coumarone resin, phthalic acid esters, fatty dibasic acid esters, phosphoric acid esters, and polyesters.
Preferably, the second carbon material is at least one selected from the group consisting of wear-resistant carbon black, semi-reinforcing carbon black, thermal black and superconducting carbon black.
Preferably, the vulcanizing agent includes at least one of sulfur, zinc oxide, magnesium oxide, dithiocarbamate, thiourea, and potassium peroxide.
The utility model provides a power cable, includes shielding layer, outer protective sheath and set up in the shielding layer with semi-conductive buffering sticky tape between the outer protective sheath layer, semi-conductive buffering sticky tape is foretell semi-conductive buffering sticky tape.
According to the invention, the first semi-conductive adhesive layers 200 are arranged on the two opposite surfaces of the substrate layer 100, and the second semi-conductive adhesive layer 300 is arranged on the first semi-conductive adhesive layer 200 on at least one surface of the substrate layer 100, so that the obtained semi-conductive buffer adhesive tape 1 not only has good electric field buffering and mechanical buffering effects, but also has good ageing resistance and stable electrical performance; when the adhesive tape is applied to manufacturing a power cable, the adhesive tape can be arranged between a cable shielding layer and an outer protective sleeve, the friction between hard protective sleeves is buffered, and a compact protective layer is formed by utilizing the viscoelasticity of a semi-conductive buffer adhesive tape under the high-temperature action of extrusion molding cabling.
The invention also provides a preparation method of the semiconductive buffer tape 1; the preparation method comprises the following steps:
Providing a substrate layer 100;
arranging the first semiconductive adhesive layer 200 on two opposite surfaces of the substrate layer 100;
the second semiconductive adhesive layer 300 is disposed on the first semiconductive adhesive layer 200 of at least one side of the substrate layer 100.
Preferably, the first semiconductive adhesive layer 200 is disposed on the opposite sides of the substrate layer 100 by any one of padding, dipping, coating, and spraying.
Preferably, the second semiconductive adhesive layer 300 is disposed on the first semiconductive adhesive layer 200 by means of calendering.
The invention has simple production process and stable technical performance, thereby ensuring the safe operation of the cable, prolonging the service life, having wide market prospect and being suitable for large-scale production.
Embodiments of the present invention will be described in detail below with reference to specific examples, but those skilled in the art will appreciate that the following examples are only illustrative of the present invention and should not be construed as limiting the scope of the present invention. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
Example 1
The semiconductive buffer tape 1 of the present embodiment includes the following preparation steps:
(1) Providing a base material layer 100 made of nylon fiber cloth;
(2) weighing 10 parts of aqueous textile emulsion, 5 parts of first carbon material, 1 part of dispersant, 1 part of wetting agent and 1 part of first auxiliary agent, and uniformly mixing and stirring to obtain first semiconductive adhesive; the water-based textile emulsion is polyurethane emulsion, the first carbon material is carbon nano tubes, and the dispersing agent is microcrystalline paraffin and polyethylene wax in a mass ratio of 1: 1, obtaining a mixture, wherein the wetting agent is diisooctyl succinate sodium sulfonate, and the first auxiliary agent is kasong, polyacrylamide and nano montmorillonite in a mass ratio of 2: 1: 2;
(3) weighing 10 parts of rubber, 1 part of plasticizer, 5 parts of second carbon material, 1 part of vulcanizing agent and 1 part of second auxiliary agent, and uniformly mixing and stirring to obtain second semi-conductive glue; wherein the rubber is butyl rubber, and the plasticizer is paraffin oil and rosin in a mass ratio of 1: 1, the carbon black is superconducting carbon black, the vulcanizing agent is sulfur, and the second auxiliary agent is talcum powder, calcium carbonate and argil according to the mass ratio of 2: 1: 1;
(4) uniformly spraying the first semi-conductive adhesive on two opposite surfaces of the substrate layer 100 in a spraying manner, and drying the two opposite surfaces of the substrate layer 200 to form first semi-conductive adhesive layers 200;
(5) The second semiconductive adhesive layer 300 is formed by rolling the second semiconductive adhesive on the first semiconductive adhesive layer 200 on the one surface of the substrate layer 100.
Example 2
The semiconductive buffer tape 1 of the present embodiment includes the following preparation steps:
(1) providing a substrate layer 100 made of aramid fiber cloth;
(2) weighing 80 parts of water-based textile emulsion, 25 parts of first carbon material, 5 parts of dispersing agent, 5 parts of wetting agent and 10 parts of first auxiliary agent, and uniformly mixing and stirring to obtain first semi-conductive adhesive; the water-based textile emulsion is polyurethane emulsion, the first carbon material is carbon nano tubes, and the dispersing agent is microcrystalline paraffin and polyethylene wax in a mass ratio of 1: 1, obtaining a mixture, wherein the wetting agent is diisooctyl succinate sodium sulfonate, and the first auxiliary agent is kasong, polyacrylamide and nano montmorillonite in a mass ratio of 2: 1: 2;
(3) weighing 50 parts of rubber, 10 parts of plasticizer, 25 parts of second carbon material, 10 parts of vulcanizing agent and 5 parts of second auxiliary agent, and uniformly mixing and stirring to obtain second semi-conductive glue; wherein the rubber is butyl rubber, and the plasticizer is paraffin oil and rosin in a mass ratio of 1: 1, the carbon black is superconducting carbon black, the vulcanizing agent is sulfur, and the second auxiliary agent is talcum powder, calcium carbonate and argil according to the mass ratio of 2: 1: 1;
(4) Uniformly spraying the first semi-conductive adhesive on two opposite surfaces of the substrate layer 100 in a spraying manner, and drying the two opposite surfaces of the substrate layer 200 to form first semi-conductive adhesive layers 200;
(5) the second semiconductive adhesive layer 300 is formed by rolling the second semiconductive adhesive on the first semiconductive adhesive layer 200 on the one surface of the substrate layer 100.
Example 3
The semiconductive buffer tape 1 of the present embodiment includes the following preparation steps:
(1) providing a substrate layer 100 made of polyester fiber cloth;
(2) weighing 150 parts of aqueous textile emulsion, 50 parts of first carbon material, 10 parts of dispersing agent, 10 parts of wetting agent and 20 parts of first auxiliary agent, and uniformly mixing and stirring to obtain first semi-conductive adhesive; the water-based textile emulsion is polyurethane emulsion, the first carbon material is carbon nano tubes, and the dispersing agent is microcrystalline paraffin and polyethylene wax in a mass ratio of 1: 1, obtaining a mixture, wherein the wetting agent is diisooctyl succinate sodium sulfonate, and the first auxiliary agent is kasong, polyacrylamide and nano montmorillonite in a mass ratio of 2: 1: 2;
(3) weighing 100 parts of rubber, 20 parts of plasticizer, 45 parts of second carbon material, 20 parts of vulcanizing agent and 10 parts of second auxiliary agent, and uniformly mixing and stirring to obtain second semi-conductive glue; wherein the rubber is butyl rubber, and the plasticizer is paraffin oil and rosin in a mass ratio of 1: 1, the carbon black is superconducting carbon black, the vulcanizing agent is sulfur, and the second auxiliary agent is talcum powder, calcium carbonate and argil according to the mass ratio of 2: 1: 1;
(4) Uniformly spraying the first semi-conductive adhesive on two opposite surfaces of the substrate layer 100 in a spraying manner, and drying the two opposite surfaces of the substrate layer 200 to form first semi-conductive adhesive layers 200;
(5) the second semiconductive adhesive layer 300 is formed by rolling the second semiconductive adhesive on the first semiconductive adhesive layer 200 on the one surface of the substrate layer 100.
Example 4
The semiconductive buffer tape 1 of the present embodiment includes the following preparation steps:
(1) providing a substrate layer 100 made of spandex fiber cloth;
(2) weighing 10 parts of aqueous textile emulsion, 40 parts of first carbon material, 8 parts of dispersant, 7 parts of wetting agent and 15 parts of first auxiliary agent, and uniformly mixing and stirring to obtain first semi-conductive adhesive; the water-based textile emulsion is polyurethane emulsion, the first carbon material is carbon nano tubes, and the dispersing agent is microcrystalline paraffin and polyethylene wax in a mass ratio of 1: 1, obtaining a mixture, wherein the wetting agent is diisooctyl succinate sodium sulfonate, and the first auxiliary agent is kasong, polyacrylamide and nano montmorillonite in a mass ratio of 2: 1: 2;
(3) weighing 80 parts of rubber, 15 parts of plasticizer, 32 parts of second carbon material, 15 parts of vulcanizing agent and 7 parts of second auxiliary agent, and uniformly mixing and stirring to obtain second semi-conductive glue; wherein the rubber is butyl rubber, and the plasticizer is paraffin oil and rosin in a mass ratio of 1: 1, the carbon black is superconducting carbon black, the vulcanizing agent is sulfur, and the second auxiliary agent is talcum powder, calcium carbonate and argil according to the mass ratio of 2: 1: 1;
(4) Uniformly spraying the first semi-conductive adhesive on two opposite surfaces of the substrate layer 100 in a spraying manner, and drying the two opposite surfaces of the substrate layer 200 to form first semi-conductive adhesive layers 200;
(5) the second semiconductive adhesive layer 300 is formed by rolling the second semiconductive adhesive on the first semiconductive adhesive layer 200 on the one surface of the substrate layer 100.
Comparative example 1
This comparative example differs from example 1 in that: the steps (3) and (5) are removed, and the obtained semiconductive buffer tape only comprises the substrate layer and the first semiconductive adhesive layers arranged on two opposite surfaces of the substrate layer, and the rest is the same as the embodiment 1.
Comparative example 2
This comparative example differs from example 1 in that: and (3) removing the step (2) and the step (4), replacing the step (5) by directly calendering the second semiconductive adhesive on one surface of the substrate layer to form a second semiconductive adhesive layer, wherein the obtained semiconductive buffer adhesive tape only comprises the substrate layer and the second semiconductive adhesive layer, and the rest is the same as the embodiment 1.
Comparative example 3
This comparative example differs from example 1 in that: the procedure of example 1 was repeated except that the first auxiliary in step (2) was replaced with water.
Comparative example 4
This comparative example differs from example 1 in that: the second auxiliary agent in the step (3) is removed, and the process is otherwise the same as that in the example 1.
The same technical effects can be achieved by replacing the aqueous textile emulsion, the first carbon material, the dispersant, the wetting agent, the first auxiliary agent, the rubber, the plasticizer, the second carbon material, the vulcanizing agent, the second auxiliary agent, and the like with the other compounds described above.
The performance indexes and the like of the examples 1 to 4 and the comparative examples 1 to 4 of the present invention were measured, and the results are shown in table 1 below.
TABLE 1
Figure BDA0002587266060000121
In conclusion, the semiconductive buffer adhesive tape prepared by the invention not only has good electric field buffering and mechanical buffering functions, but also has good ageing resistance and stable electrical performance; when the adhesive tape is applied to manufacturing a power cable, the adhesive tape can be arranged between a cable shielding layer and an outer protective sleeve, the friction between hard protective sleeves is buffered, and a compact protective layer is formed by utilizing the viscoelasticity of a semi-conductive buffer adhesive tape under the high-temperature action of extrusion molding cabling.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Furthermore, those skilled in the art will appreciate that while some embodiments herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, in the claims above, any of the claimed embodiments may be used in any combination. The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.

Claims (10)

1. A semiconductive buffer tape, comprising: the device comprises a substrate layer, first semi-conductive adhesive layers arranged on two opposite surfaces of the substrate layer and second semi-conductive adhesive layers arranged on the first semi-conductive adhesive layers on at least one side of the substrate layer;
the first semi-conductive adhesive layer comprises the following raw materials in parts by weight: 10-150 parts of water-based textile emulsion, 5-50 parts of first carbon material, 0.1-10 parts of dispersing agent, 0.1-10 parts of wetting agent and 0.1-20 parts of first auxiliary agent; the first auxiliary agent comprises at least one of carbazone, polyacrylamide, nano montmorillonite, mercapto benzothiazole sodium salt, silicon-containing emulsion and reclaimed rubber;
The second semi-conductive adhesive layer comprises the following raw materials in parts by weight: 10-100 parts of rubber, 0.1-20 parts of plasticizer, 5-45 parts of second carbon material, 0.1-20 parts of vulcanizing agent and 0.1-10 parts of second auxiliary agent; the second auxiliary agent comprises at least one of white carbon black, talcum powder, calcium carbonate, argil, diethylene glycol, benzotriazole and sodium salt thereof, and methylbenzotriazole and sodium salt thereof.
2. The semiconductive buffer tape according to claim 1, wherein the material of the substrate layer is selected from one of polyester fiber cloth, polypropylene fiber cloth, nylon fiber cloth, vinylon fiber cloth, polyester cotton fiber cloth, aramid fiber cloth and spandex fiber cloth.
3. The semiconductive buffer tape of claim 1, wherein the aqueous textile emulsion comprises at least one of pure acrylic and modified emulsions thereof, vinyl acetate acrylic and modified emulsions thereof, styrene acrylic and modified emulsions thereof, polyurethane emulsions, and polyvinyl alcohol;
preferably, the first carbon material includes one of pigment carbon black, acetylene carbon black, superconducting carbon black, and carbon nanotubes;
preferably, the dispersant comprises at least one of glyceryl stearate, peregal O-15, peregal O-25, liquid paraffin, microcrystalline paraffin and polyethylene wax;
Preferably, the wetting agent comprises at least one of polyoxyethylene octylphenol ether, sodium diisooctyl sulfosuccinate, span, tween, alkyl sulfate, sulfonate, fatty acid or fatty acid ester sulfate, carboxylic acid soap, phosphate ester, polyoxyethylene fatty alcohol ether and polyoxyethylene polyoxypropylene block copolymer.
4. The semiconductive buffer tape of claim 1, wherein the rubber comprises one of butyl rubber, chlorinated butyl rubber, and brominated butyl rubber;
preferably, the plasticizer includes at least one of paraffin oil, rosin, coumarone resin, phthalate ester, fatty dibasic acid ester, phosphate ester and polyester.
5. The semiconducting buffer tape of claim 1, where the second carbon material is selected from at least one of wear resistant carbon black, semi-reinforcing carbon black, thermal black, superconducting carbon black;
preferably, the vulcanizing agent includes at least one of sulfur, zinc oxide, magnesium oxide, dithiocarbamate, thiourea, and potassium peroxide.
6. A preparation method of a semiconductive buffer tape, which is characterized in that the semiconductive buffer tape is the semiconductive buffer tape according to any one of claims 1 to 5; the preparation method comprises the following steps:
Arranging the first semi-conductive adhesive layers on two opposite surfaces of the substrate layer;
and arranging the second semi-conductive adhesive layer on the first semi-conductive adhesive layer on at least one surface of the substrate layer.
7. The method of preparing a semiconductive buffer tape according to claim 6, wherein the first semiconductive adhesive layer is disposed on opposite sides of the substrate layer by any one of padding, dipping, coating and spraying.
8. The method of claim 6, wherein the second semiconductive adhesive layer is disposed on the first semiconductive adhesive layer by calendering.
9. Use of the semiconductive buffer tape according to any of claims 1 to 5 in the manufacture of a power cable, wherein the semiconductive buffer tape is arranged between a shield and an outer protective sheath.
10. A power cable, characterized by comprising a shielding layer, an outer protective sleeve and a semiconductive buffer tape arranged between the shielding layer and the outer protective sleeve, wherein the semiconductive buffer tape is the semiconductive buffer tape according to any one of claims 1 to 5.
CN202010685085.7A 2020-07-16 2020-07-16 Semi-conductive buffer adhesive tape, preparation method and application thereof, and power cable Pending CN111849379A (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112844338A (en) * 2020-12-31 2021-05-28 浙江工业大学 Black talc-polyvinyl formal gel composite adsorption material
CN117238564A (en) * 2023-09-19 2023-12-15 安徽省康利亚股份有限公司 Cable for railway vehicle

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CN108666014A (en) * 2018-06-20 2018-10-16 沈阳天荣电缆材料有限公司 A kind of sea water resistance semiconductive sealing binding strap and preparation method thereof
CN208298600U (en) * 2018-06-29 2018-12-28 沈阳天荣电缆材料有限公司 Cable anticorrosion semi-conductive buffer water-blocking band

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CN108666014A (en) * 2018-06-20 2018-10-16 沈阳天荣电缆材料有限公司 A kind of sea water resistance semiconductive sealing binding strap and preparation method thereof
CN208298600U (en) * 2018-06-29 2018-12-28 沈阳天荣电缆材料有限公司 Cable anticorrosion semi-conductive buffer water-blocking band

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CN112844338A (en) * 2020-12-31 2021-05-28 浙江工业大学 Black talc-polyvinyl formal gel composite adsorption material
CN117238564A (en) * 2023-09-19 2023-12-15 安徽省康利亚股份有限公司 Cable for railway vehicle
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