CN111835196A

CN111835196A - Impedance-matched power supply device

Info

Publication number: CN111835196A
Application number: CN202010763876.7A
Authority: CN
Inventors: 吴晓宁; 陆小珊
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-08-01
Filing date: 2020-08-01
Publication date: 2020-10-27

Abstract

The present invention relates to an impedance-matched power supply device. The power supply device includes: the impedance matching circuit comprises a power supply module and at least one impedance matching circuit, wherein the power supply module is configured to supply power to external equipment; the impedance matching circuit is disposed before or after the power supply module and includes a plurality of impedance elements, at least one input terminal, and at least one output terminal. Wherein the plurality of impedance elements form a mesh structure comprising at least one mesh having edges and vertices. Each of the inputs is connected to a vertex in the at least one mesh. Each of the outputs is connected to another vertex in the at least one mesh. The power supply device can perform impedance matching on the power supply module and the external equipment through the internal impedance matching circuit, thereby realizing power supply to the external equipment and ensuring that signals generated by the external equipment are transmitted without distortion.

Description

Impedance-matched power supply device

Technical Field

The present invention relates generally to the field of power supply technology. More particularly, the present invention relates to an impedance-matched power supply apparatus.

Background

Generally, the signals transmitted in the power supply equipment and the external equipment are complex intermodulation signals synthesized by energy, which may include fundamental wave signals and harmonic signals of a plurality of frequency components, and the amplitudes of the fundamental wave signals and the harmonic signals of each frequency component may be different, and the "intermodulation" refers to the mutual influence and mutual modulation between the above-mentioned signals with different frequencies and/or different amplitude values. However, various components in the existing circuit have respective frequency and amplitude characteristics, the response and index of various components are different for signals with different frequencies and amplitudes, and the impedance characteristic of a single component changes along with the change of the frequency and the amplitude of the signal.

In the process of transmitting signals, the existing power supply equipment and external equipment generally only process the signals as signals with a single frequency. However, since the signals in the power supply device and the external device are mixed by intermodulation signals of different frequencies and amplitudes, the impedance values exhibited in the power supply device and the external device are different with respect to the signal of each frequency component thereof. This causes the impedance value of the power supply device to be mismatched with the impedance value of the external device, and thus a local standing wave may be generated between the power supply device and the external device. The standing wave is superposed with the signals of the frequency and amplitude components, and finally the signals of the frequency and amplitude components in the signals, especially the signals of the harmonic components, are filtered, weakened or strengthened at a certain moment, so that the original signals generate intermodulation distortion in the transmission process. In summary, when the conventional power supply device supplies power to the external device, due to the diversity of the signal frequencies and amplitudes in the power supply device and the external device, it is not possible to simultaneously perform impedance matching on multiple signals of different external devices, thereby causing intermodulation distortion in signal transmission in the external device.

Disclosure of Invention

To solve one or more of the problems of the background art, the present invention provides an impedance-matched power supply apparatus. The power supply device comprises a power supply module and an impedance matching circuit. Aiming at different external equipment, the number and the impedance value of impedance elements of each part and each layer in the impedance matching circuit are set, so that when a direct-current voltage intermodulation signal or a signal of the external equipment flows through the impedance matching circuit, the signals with different frequencies and/or amplitudes automatically select respective optimal paths to be transmitted, and the signal intermodulation matching is realized. Furthermore, the purpose of balanced transmission is achieved through intermodulation with a direct-current power supply signal, so that impedance matching is carried out on the power supply device and the external equipment, and finally distortion-free transmission of the signal is achieved.

Specifically, the invention discloses an impedance matching power supply device. The power supply apparatus includes a power supply module configured to output a direct current voltage to an external device so as to supply power thereto; and at least one impedance matching circuit, wherein each of the impedance matching circuits comprises: a plurality of impedance elements forming a mesh structure including at least one mesh having edges and vertices and wherein at least one edge is formed by at least one impedance element; at least one input, wherein each input is connected to a vertex in the at least one mesh; and at least one output, wherein each output is connected to another vertex in the at least one mesh. The impedance matching circuit is connected to the power supply module so that the power supply module and the external device are impedance-matched when the power supply apparatus is connected to the external device.

In one embodiment, at least two of the plurality of impedance elements have different impedance values such that signals from the external device and signals of different frequencies and/or amplitudes in the dc voltage intermodulation pass through different paths in the mesh structure.

In another embodiment, the impedance element is at least one of: a capacitor; an inductance; a capacitor and an inductor; a resistor and a capacitor; a resistance and an inductance; as well as resistors, capacitors and inductors.

In another embodiment, the input and output terminals of the impedance elements are connected to vertices at opposite corners of the impedance matching circuit, respectively, such that the impedance elements between the input and output terminals form the most combinations.

In yet another embodiment, the power module includes a transformer and a rectifying circuit, or includes a battery pack.

In another embodiment, the impedance matching circuit is disposed behind the power supply module, an input terminal of the impedance matching circuit is connected to the rectifying circuit or the battery pack, and an output terminal of the impedance matching circuit is connected to the external device.

In another embodiment, the power module is a single-channel power module, at least one input terminal of the impedance matching circuit is connected to the rectifying circuit or the battery pack, and at least one output terminal of the impedance matching circuit is connected to the external device.

In another embodiment, when the power module includes a transformer and a rectifying circuit, the power module is a dual-path power module, one input end of the impedance matching circuit is connected to the rectifying circuit, the other input end of the impedance matching circuit is connected to the transformer, one output end of the impedance matching circuit is connected to the external device, and the other output end of the impedance matching circuit is grounded.

In another embodiment, when the power supply module includes a transformer and a rectifying circuit, the impedance matching circuit is disposed in front of the power supply module, an input terminal of the impedance matching circuit is connected to a three-phase alternating current, and an output terminal of the impedance matching circuit is connected to the power supply module.

In yet another embodiment, the impedance matching circuit is at least one, and the power supply module outputs multiple direct current voltages to supply power to multiple external devices.

The impedance matching power supply device not only can supply power to external equipment, but also can realize impedance matching between the power supply device and the external equipment. In addition, the power supply device of the invention has flexible configuration, can conveniently select the impedance element and other corresponding connecting devices according to different external equipment needing power supply, and can arrange the impedance matching circuit at different positions of the power supply module, thereby achieving the purposes of impedance matching and time sequence adjustment of signals at different positions.

Drawings

The above and other objects, features and advantages of exemplary embodiments of the present invention will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. Several embodiments of the present invention are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which like reference numerals refer to similar or corresponding parts and in which:

fig. 1 is a schematic configuration diagram showing an impedance-matched power supply apparatus according to an embodiment of the present invention;

fig. 2 is a two-dimensional structural diagram showing an impedance matching circuit according to an embodiment of the present invention;

fig. 3 is a three-dimensional structural view showing an impedance matching circuit according to an embodiment of the present invention;

FIG. 4 is an exemplary signal flow diagram illustrating an impedance matching circuit according to an embodiment of the present invention;

FIG. 5 is another exemplary signal flow diagram illustrating an impedance matching circuit according to an embodiment of the present invention;

fig. 6 is a schematic diagram showing a configuration of a power supply device in which an impedance matching circuit according to an embodiment of the present invention is located behind a power supply module;

fig. 7 is a schematic diagram showing a configuration of a power supply apparatus including a one-way power supply module according to an embodiment of the present invention;

fig. 8 is a schematic view showing another structure of a power supply apparatus including a one-way power supply module according to an embodiment of the present invention;

fig. 9 is a schematic structural view showing a power supply apparatus including a two-way power supply module according to an embodiment of the present invention;

fig. 10 is a schematic diagram showing a configuration of a power supply device in which an impedance matching circuit according to an embodiment of the present invention is located before a power supply module; and

fig. 11 is a schematic diagram showing a configuration of a power supply apparatus including a plurality of impedance matching circuits according to an embodiment of the present invention.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Fig. 1 is a schematic diagram showing a configuration of an impedance-matched power supply apparatus 100 according to an embodiment of the present invention. It is to be understood that although a limited number of impedance elements and meshes are depicted in fig. 1, the number of impedance elements and meshes may be more or less depending on the external device to which the power supply apparatus of the present invention is connected. Meanwhile, in order to better understand the structure and function of the present invention, an external device for receiving the dc voltage output from the power supply apparatus of the present invention is also depicted in fig. 1. And the internal signal of the external equipment can be subjected to impedance matching and time sequence adjustment through the power supply device, so that the signal can be subjected to distortion-free transmission.

As shown in fig. 1, the power supply apparatus of the present invention may include a power supply module 110 and an impedance matching circuit 120. Wherein the power supply module is configured to output a direct current voltage to the external device to supply power thereto. The impedance matching circuit is connected with the power supply module and configured to perform impedance matching on the power supply module and the external device when the power supply apparatus is connected with the external device.

Further, each of the impedance matching circuits may include a plurality of impedance elements 121 forming a mesh structure 123 including a mesh 122 having edges 124 and vertices 125 and wherein at least one edge is formed by at least one impedance element. The impedance matching circuit further comprises at least one input terminal 126, wherein each input terminal is connected to one vertex of the plurality of meshes and is configured to receive the dc voltage output by the power supply module and/or is configured to receive a signal from the external device. The impedance matching circuit further comprises at least one output terminal 127, wherein each output terminal is connected to another vertex in the plurality of meshes and is used for outputting the plurality of signals processed by the impedance matching circuit.

In one embodiment, the mesh may be one or more of a trilateral, quadrilateral, pentagonal, hexagonal, or other shape. As shown in fig. 1, for example, the mesh may be a quadrilateral mesh including 4 sides, and the number of the meshes may be 9, which are connected to each other through a common side to form a mesh structure. The vertex of one corner of the mesh structure may serve as an input terminal of the impedance matching circuit, and the vertex of the other corner of the mesh structure may serve as an output terminal of the impedance matching circuit.

In one embodiment, an impedance element may be connected by a wire on each side of each of the meshes. The impedance elements may be arranged in a matrix form, for example, a 4 x 4 matrix, each row of the matrix comprising 3 impedance elements and each column comprising 4 impedance elements. The impedance values of at least two of the impedance elements are different, and the impedance elements may be at least one of: a capacitor; an inductance; a capacitor and an inductor; a resistor and a capacitor; a resistance and an inductance; resistance, capacitance and inductance. The input, output, conductive lines and impedance elements may form multiple paths for signals flowing through the impedance matching circuit.

Further, by configuring the number and the impedance values of the impedance elements, at least two paths of the plurality of signal paths of the impedance matching circuit have different impedance values, and the number and the impedance values of the capacitor, the inductor and the resistor may also be configured differently according to different specific application circuits, so that each path of the plurality of signal paths has a different impedance value. Therefore, when signals with different frequencies and/or amplitudes flow through the impedance matching circuit, the signals can reach the output end from the input end along different paths with different impedance values, and impedance matching between the signals with different frequencies and/or amplitudes and the application circuit is further realized, so that the signals are transmitted without distortion.

In one embodiment, some of the impedance elements of the plurality of impedance elements may be connected as a filter circuit to filter noise from signals of different frequencies and/or amplitudes flowing therethrough. The filter circuit may include, for example, a low-pass filter circuit composed of a resistor and a capacitor, which is configured to filter out high-frequency noise; or may further include a band pass filter circuit comprising an inductor and a capacitor configured to filter out-of-band noise of the band pass filter circuit.

Fig. 2 is a two-dimensional block diagram illustrating an impedance matching circuit 200 according to an embodiment of the present invention. The impedance matching circuit 200 of fig. 2 may be understood as an exemplary implementation of the impedance matching circuit 120 of fig. 1. Therefore, the details of the impedance matching circuit 120 described in connection with fig. 1 are also applicable to the description of the impedance matching circuit 200 in fig. 2.

As shown in fig. 2, the impedance matching circuit may include a two-dimensional planar mesh structure composed of m rows and n columns, and the impedance elements in the mesh structure may be arranged in a matrix form, for example, an m × n matrix shown in fig. 2, where m and n are positive integers greater than or equal to 2. Specifically, row 1 of the m rows may include sequentially arranged impedance elements ZX11, ZX12 … ZX1(n-1), and ZX1n, row 2 may include sequentially arranged impedance elements ZX21, ZX22 … ZX2(n-1), and ZX2n, and so on, and row m may include sequentially arranged impedance elements ZXm1, ZXm2 … ZXm (n-1), and ZXmn. Column 1 of the n columns may include impedance elements ZY11, ZY21 … ZY (m-1)1 and ZYm1 arranged in series, column 2 may include impedance elements ZY12, ZY22 … ZY (m-1)2 and ZYm2 arranged in series, and so on, and column n may include impedance elements ZY1n, ZY2n … ZY (m-1) n and ZYmn arranged in series.

In one embodiment, 4 of the impedance elements may be connected by wires to form a quadrilateral mesh comprising edges and vertices. Further, the two-dimensional planar mesh structure may be formed by connecting the quadrilateral meshes with each other, wherein adjacent meshes have a common edge. Specifically, the impedance elements ZX11, ZX21, ZY11 and ZY12 as in fig. 2 are connected in sequence by wires into a quadrilateral mesh; similarly, the impedance elements ZX12, ZX22, ZY12 and ZY13 are also connected in sequence by wires into a quadrilateral grid. The two meshes have a common edge including the impedance element ZY12, and are connected to a mesh structure by this common edge.

In one embodiment, each of the meshes has four vertices. The input of the impedance matching circuit may be led out from any one of the vertices of the grid and is configured to receive a signal input to the impedance matching circuit, which may be, for example, a dc voltage intermodulation signal output by the power supply apparatus of the present invention, or another signal output by an external device. The output of the impedance matching circuit may be taken from another vertex of the mesh and configured to output the signal after processing by the impedance matching circuit. Further, the number of the input ends can be multiple, and the number of the output ends can be one or more, so that multiple paths of signals can be received and output. Specifically, for example, the input end may be a plurality of A, B, C, D, E, F, G and H in fig. 2, the output end may be one or more of a to H, and the input end and the output end are different.

In one embodiment, the input and output of the impedance matching circuit may be connected to different vertices of the mesh, respectively. In particular, the vertices may be located at opposite corners of the mesh structure so that the impedance elements between the input and output terminals form the most combinations for the purpose of more accurate impedance matching. For example, the input end is connected with the end A, and the output end is connected with the end F; or the input end is connected with the end B, and the output end is connected with the end E. By such an arrangement, a longer path for the signal to flow in the mesh structure or more impedance elements can be provided, so that a more precise impedance matching of the signal can be achieved.

In one embodiment, the input, output, conductive line and plurality of impedance elements may form a plurality of paths for signals flowing through the impedance matching circuit. Each of the plurality of impedance elements may include: at least one type of impedance element of capacitance and inductance, and at least one of the at least one type of impedance element may include one or more impedance elements of the type; or each of the plurality of impedance elements may further include at least two types of impedance elements of a capacitance, an inductance, and a resistance, and each of the at least two types of impedance elements includes at least one or more of the types of impedance elements.

Further, by configuring the number of the impedance elements and the impedance values, at least two paths of the signals of the impedance matching circuit have different impedance values, and the number and the impedance values of the capacitors, the inductors and the resistors can be configured differently according to different specific application circuits, so that each path of the signals has a different impedance value. In one embodiment, the signal may comprise a composite signal composed of a plurality of harmonic signals of different frequencies and/or amplitudes, wherein each of the harmonic signals flows through one of the plurality of paths via the input terminal to the output terminal, so as to perform impedance matching on each of the harmonic signals, thereby ensuring that the signal is transmitted without distortion.

Fig. 3 is a three-dimensional structural view showing an impedance matching circuit 300 according to an embodiment of the present invention. The circuit 300 of fig. 3 may be understood as an exemplary implementation of the impedance matching circuit 120 of fig. 1, and may also be understood as an extended implementation of the impedance matching circuit 200 of fig. 2. Therefore, the details of the impedance matching circuits 120 and 200 described in connection with fig. 1 and 2 are also applicable to the description of the impedance matching circuit 300 in fig. 3.

As an expanded implementation manner of the impedance matching circuit 200 in fig. 2, the impedance matching circuit 300 may have a three-dimensional mesh structure formed by sequentially connecting multiple layers of the mesh structures shown in fig. 2. And the two adjacent layers of the mesh structures are connected through a plurality of impedance elements. In one embodiment, each layer of the mesh structure may be disposed on a board, such that a plurality of the boards are connected to form the three-dimensional mesh structure.

As shown in fig. 3, the structure of the impedance matching circuit 300 may be a three-dimensional structure consisting of three dimensions X, Y and Z, wherein m rows are included in the X dimension, n columns are included in the Y dimension, and t columns are included in the Z dimension. Each row in the X dimension is defined by an impedance element ZX_mntEach column in the Y dimension being made up of an impedance element ZY_mntEach of the Z dimensions consisting of an impedance element ZZ_mntA composition wherein m, n and t are each a positive integer of 1 or more, particularly, when m ═ n ═ t, the steric structure is a cube.

Specifically, in the X dimension, row 1, column 1 may include impedance elements ZX111, ZX121 … ZX1(n-1)1, and ZX1n1 arranged in sequence, row 2, column 1 may include impedance elements ZX211, ZX221 … ZX2(n-1)1, and ZX2n1 arranged in sequence, and so on, row 1, column 1 may include impedance elements ZXm11, ZXm21 … ZXm (n-1)1, and ZXmn1 arranged in sequence. It is understood that although the columns of row 1, row 2, row 3 … t, row 2, row 3 … t and row 3, row 4 … m, row 2, row 3 … t are not drawn in the figure, the numbering and layout structure of these impedance elements can be derived according to the above arrangement rules.

In the Y dimension, column 1, may include impedance elements ZY111, ZY211 … ZY (m-1)11, and ZYm11 in series, column 2, column 1, may include impedance elements ZY121, ZY221 … ZY (n-1)21, and ZYn21 in series, and so on, column n, column 1, may include impedance elements ZY1n1, ZY2n1 … ZY (m-1) n1, and ZYmn1 in series. It is understood that although the 1 st column, 2 nd and 3 … t columns, the 2 nd column, 2 nd and 3 … t columns, and the 3 rd and 4 … m column, 2 nd and 3 … t columns are not drawn in the figure, the numbers and the layout structures of the impedance elements not drawn can be obtained according to the above arrangement rules.

In the Z dimension, the 1 st vertical mth row may include impedance elements ZZm11, ZZm21 … ZZm (n-1)1 and ZZmn1 arranged in that order, the 2 nd vertical mth row may include impedance elements ZZm12, ZZm22 … ZZ m (n-1)2 and ZZmn2 arranged in that order, and so on, and the t vertical mth row may include impedance elements ZZm1t, ZZm2t … ZZm (n-1) t and ZZmnt arranged in that order. It is understood that although the 1 st column, 1 st and 2 … (m-1) th lines, 2 nd column, 1 st and 2 … (m-1) th lines, and 3 rd and 4 … t column, 1 st and 2 … (m-1) th lines are not depicted in the figure, the numbering and layout structure of these impedance elements, which are not depicted, can be derived according to the above-mentioned arrangement rules.

In one embodiment, the input terminal and the output terminal of the impedance matching circuit may be connected to different vertices of the three-dimensional structure, respectively. Wherein any two of the different vertices may be distant from each other. In particular, the input end and the output end may be respectively connected with the vertexes of the opposite angles of the three-dimensional structure, for example, the input end is connected with vertex a, and the output end is connected with vertex F; or the input end is connected with the vertex C, and the output end is connected with the vertex G. By means of the arrangement, the impedance elements between the input end and the output end form the most combinations, and further, the path through which the signal flows in the three-dimensional structure is longer or more impedance elements are flowed, so that the signal can be subjected to more accurate impedance matching.

In one embodiment, the input, output, conductive lines and plurality of impedance elements may form a plurality of stereoscopic paths for signals flowing through the impedance matching circuit. Each of the plurality of impedance elements may include: at least one type of reactance element of capacitance and inductance, and at least one or more reactance elements of the type are included in the at least one type of impedance element; or each of the plurality of impedance elements may further include at least two types of impedance elements of a capacitance, an inductance, and a resistance, and each of the at least two types of impedance elements includes at least one or more of the types of impedance elements.

Further, by configuring the number and the impedance values of the impedance elements, at least two paths of the multiple three-dimensional paths of the signals of the impedance matching circuit have different impedance values, and the number and the impedance values of the capacitors, the inductors and the resistors can be configured differently according to different specific application circuits, so that each path of the multiple signal paths has a different impedance value. In one embodiment, the signal may comprise a composite signal composed of a plurality of harmonic signals of different frequencies and/or amplitudes, wherein each of the harmonic signals flows through one of the plurality of paths via the input terminal to the output terminal, so as to perform impedance matching on each of the harmonic signals, thereby ensuring that the signal is transmitted without distortion.

Fig. 4 is an exemplary signal flow diagram illustrating an impedance matching circuit according to an embodiment of the present invention. It is to be understood that the signal flow diagram shown in fig. 4 is drawn on the basis of the impedance matching circuit shown in fig. 2, and therefore, the circuit configuration in the signal flow diagram of fig. 4 is partially the same as that in fig. 2. For the description of the impedance matching circuit in fig. 4, reference is made to the description in fig. 2, and details are not repeated here.

As shown in fig. 4, signals of three different frequencies enter the impedance matching circuit of the mesh structure from the input terminal D, then flow through different signal paths constituted by impedance elements, and finally are output from the output terminal H. In order to distinguish between signals of different frequencies, the signals of three different frequencies transmitted in the mesh structure are represented by a thick solid line, a thin solid line and a dotted line, respectively. As can be seen from fig. 4, the signals of three different frequencies represented by the thick solid line, the thin solid line and the dashed line, although all being input from the input terminal and all being output from the output terminal, flow through different signal paths in the mesh structure. Because the number of the impedance elements and the impedance value on each signal path with different frequencies can be different, the total impedance value of each signal path is different, thereby realizing impedance matching of the signals with three different frequencies respectively and ensuring distortion-free transmission of the signals.

In one embodiment, the signal input to the input may be, for example, one or more composite signals that may be composed of a fundamental signal at a certain frequency and a plurality of harmonic signals at different frequencies. After the synthesized signal is input into the impedance matching circuit, the fundamental wave and the harmonic signal with different frequencies can automatically select a path for transmission according to different impedance values of the impedance element, so that the purpose of respectively performing impedance matching on the fundamental wave and the harmonic signal with different frequencies is realized. In addition, the fundamental and harmonic signals of different frequencies may be generated at different timings when they flow through different kinds and numbers of impedance elements. By arranging a reasonable number and types of impedance elements, the time sequence of fundamental wave and harmonic wave signals with different frequencies at the output end is consistent with the time sequence of the fundamental wave and harmonic wave signals at the input end, so that the composite signal is completely restored at the output end.

In another embodiment, the signal input to the input terminal may also be, for example, a plurality of harmonic signals of different frequencies, wherein the plurality of harmonic signals of different frequencies are respectively derived from different synthesized signals; or the signal input to the input may also be a combination of one or more synthetic signals and a plurality of harmonic signals of different frequencies, wherein the harmonic signals are derived from one or more further synthetic signals, respectively. The working principle is the same as that of the case where the signal input to the input terminal is one or more synthesized signals, and will not be described herein again.

As a specific implementation, the following explains the principle of the impedance matching circuit for impedance matching of signals, taking the signal flow direction of one local circuit in fig. 4 as an example. As shown in fig. 4, the thick solid line path composed of ZX11, ZX21, ZX31, ZX32, ZY11, ZY12, ZY21 and ZY22 is taken as an example. Further, for convenience of description, neglecting the influence of this path on the signal timing, ZX11, ZX21, ZX31, and ZX32 may be set as resistors having a resistance of 0. Further, ZY11, ZY12 and ZY21 were provided as a capacitive element C, and ZY22 was provided as a resistive element R. Suppose that ZY11 takes the value 470uF, ZY12 takes the value 10uF, ZY21 takes the value 220uF, and ZY22 takes the value 1k Ω. Then the signal flows from input a to the junction of ZX32 and ZY23, and the impedance of this path is 470uF in parallel with 10uF, and then the combined impedance after series with the impedance of 220u in parallel with 1 k.

Obviously, on the one hand, by setting different capacitance values and resistance values, the paths of signals with different frequencies can be changed, and then the signals with different frequencies are subjected to impedance matching. On the other hand, the time sequence change of the signals with different frequencies can be adjusted by setting capacitance values with different sizes and utilizing the time sequence response difference of the capacitance to the signals with different frequencies, so that the signals with different frequencies can keep the consistency of the time sequence. Finally, the signal can be transmitted without distortion after flowing through the path.

Fig. 5 is another exemplary signal flow diagram illustrating an impedance matching circuit according to an embodiment of the present invention. It should be noted that the signal flow diagram of fig. 5 is an exemplary implementation based on the signal flow diagram of fig. 4, where the frequencies of the three different signals in fig. 5 are the same as the frequencies of the three different signals in fig. 4, and there is a one-to-one correspondence. Unlike the signal flow diagram of fig. 4, the signals of different frequencies shown in fig. 5 differ in amplitude from the corresponding frequency signals in fig. 4. Therefore, even if signals of the same frequency flow through the same impedance matching circuit, the paths through which they flow are different.

In one embodiment, as shown in fig. 5, three signals of different frequencies enter the mesh structure from the input terminal D, then flow through different signal paths formed by impedance elements, and finally are output from the output terminal H. In order to distinguish between signals of different frequencies, the signals of three different frequencies transmitted in the mesh structure are represented by a thick solid line, a thin solid line and a dotted line, respectively. As can be seen by comparison with fig. 4, the paths of the three different frequency signals in fig. 5 are not exactly the same as those in fig. 4, since the three different frequency signals in fig. 5 differ in amplitude from the corresponding three different frequency signals in fig. 4, respectively. Because the number and the impedance value of the impedance elements on each signal path can be different, the total impedance value of each signal path is different, thereby realizing impedance matching of signals with the same frequency but different amplitudes and ensuring distortion-free transmission of the signals.

Fig. 6 is a schematic diagram illustrating a structure of a power supply apparatus 600 in which an impedance matching circuit according to an embodiment of the present invention is located behind a power supply module. For a better understanding of the structure and function of the present invention, an external device for receiving the dc voltage output from the power supply apparatus 600 of the present invention for operation is also depicted in fig. 6. And the internal signal of the external equipment can be subjected to impedance matching and time sequence adjustment through the power supply device, so that the signal can be subjected to distortion-free transmission.

As shown in fig. 6, the impedance matching circuit in the power supply apparatus 600 of the present invention may be disposed after the power supply module 610. Specifically, the impedance matching circuit may include two, which are an impedance matching circuit 620 and an impedance matching circuit 621, respectively. The input terminals a and B of the impedance matching circuit 620 are respectively connected to the power supply module so as to receive the dc voltage output by the power supply module. The output terminals E and F of the impedance matching circuit 620 are respectively connected to an external device to supply power to the external device. The input end E and the output end F of the impedance matching circuit 621 are respectively connected to the external device, so as to perform impedance matching and timing adjustment on the signal output by the external device.

Alternatively, the input and output terminals of the impedance matching circuits 620 and 621 may be connected to the vertices D and H or any other vertices according to the structure of the impedance matching circuits 620 and 621. In particular, according to different requirements of the external circuit, the input terminal of the impedance matching circuit may be used as the output terminal, and the output terminal may be used as the input terminal, on the premise that different vertices are connected between the input terminal and the output terminal.

As a specific embodiment, the power supply apparatus of the present invention may have two standard interfaces, one of which is connected to the impedance matching circuit 620 and the other of which is connected to the impedance matching circuit 621. When the power supply device is in operation, on the one hand, one of the interfaces is connected to a power supply terminal of the external device in order to supply power thereto. On the other hand, the other interface is connected with the signal end of the external equipment so as to carry out impedance matching and timing adjustment on the signal output by the external equipment. The operation principle of the power supply apparatus 600 of the present invention is briefly described below.

In one aspect, the power module outputs a dc voltage to the external device through the impedance matching circuit 620 to supply power thereto. When the direct-current voltage passes through the impedance matching circuit, the direct-current voltage is firstly filtered, stabilized or limited by the impedance matching circuit, so that stable working voltage or current is provided for the external equipment. In addition, the dc voltage is processed by an impedance matching circuit 620, so that a loop with impedance matching for signals with different frequencies and/or amplitudes is formed between the impedance matching circuit 620 and the power module, and further, the power module and the external device are impedance matched.

On the other hand, an intermodulation signal including fundamental waves and harmonic signals of a plurality of frequency and/or amplitude components generated by an external device flows into the impedance matching circuit 621 through the input terminal E of the impedance matching circuit 621. In the impedance matching circuit 621, fundamental wave and harmonic signals of different frequencies and/or amplitude components are transmitted according to different automatic selection paths of impedance values, and are output from the F terminal, and finally flow to an external device for further processing. Then, the intermodulation signal of the external device is processed by the impedance matching circuit 621, so that a loop with impedance matching for intermodulation signals with different frequencies and/or amplitudes is formed between the impedance matching circuit and the external device, and further, the impedance matching and the timing adjustment are performed on the intermodulation signal. Finally, the intermodulation signal of the external equipment is transmitted without distortion.

Fig. 7 is a schematic diagram illustrating a structure of a power supply apparatus 700 including a one-way power supply module according to an embodiment of the present invention. It is to be understood that the power supply apparatus 700 shown in fig. 7 is an embodiment in which an impedance matching circuit is disposed behind a power supply module. And the single-circuit power module of fig. 7 can also be applied to fig. 6, and can replace the corresponding power module of fig. 6.

As shown in fig. 7, in one embodiment, the power module may be a single-channel power module, which may provide one channel of power to an external device. Specifically, the power supply module 710 may include a transformer 711 and a rectifying circuit 712. Wherein the transformer may include a primary coil, a secondary coil, and a core, which are configured to convert a three-phase alternating-current high voltage power input to the power supply device into a low-voltage alternating current power. The rectifying circuit is configured to convert the low-voltage alternating current output by the transformer into direct current. The input terminals a and B of the impedance matching circuit 720 are respectively connected to the positive and negative output terminals of the rectifying circuit so as to receive the direct current output by the rectifying circuit. Output terminals E and F of the impedance matching circuit are respectively connected to the external device so as to output the dc signal processed by the external device to the external device. The operation principle of the power supply device 700 of the present invention is briefly described below.

First, an external power grid inputs three-phase high-voltage alternating current to a transformer in the power supply apparatus, the three-phase high-voltage alternating current flows through a primary coil of the transformer and induces a corresponding magnetic flux in an iron core, and then the magnetic flux is induced into low-voltage alternating current again by a secondary coil wound around the iron core. The ratio of the input voltage and the output voltage of the transformer can be adjusted by adjusting the winding proportion of the primary coil and the secondary coil. Then, the low-voltage alternating current output from the secondary coil of the transformer is converted into direct current after being converted by a rectifier bridge inside a rectifier circuit, and is output to input terminals a and B of the impedance matching circuit.

Then, on the one hand, the impedance matching circuit filters, stabilizes or limits the direct current, thereby outputting a stabilized voltage or current to an external device. On the other hand, a loop which can match the impedance of the direct current electric signals with different frequencies and/or amplitudes is formed between the impedance matching circuit and the external circuit and between the impedance matching circuit and the power supply module, and therefore the impedance matching is carried out on the power supply module and the external equipment. Meanwhile, various intermodulation signals generated by external equipment can be input into the impedance matching circuit through the E end or the F end, and after impedance matching and time sequence adjustment are carried out on the intermodulation signals through the impedance matching circuit, the various intermodulation signals are transmitted without distortion.

Fig. 8 is a schematic diagram illustrating another structure of a power supply apparatus 800 including a one-way power supply module according to an embodiment of the present invention. It is to be understood that the power supply apparatus 800 shown in fig. 8 is another embodiment in which an impedance matching circuit is disposed behind a power supply module. And the single-channel power module of fig. 8 can be applied to fig. 6 and can replace the corresponding power module of fig. 6.

As shown in fig. 8, in one embodiment, the power module may be a single-channel power module, which may provide one channel of power to an external device. Specifically, the power module 810 may include a battery pack and is used to provide a one-way power to the external device. Input terminals a and B of the impedance matching circuit 820 are respectively connected to the positive and negative poles of the battery pack so as to receive the dc power output by the battery pack. Output terminals E and F of the impedance matching circuit are connected to the external device, respectively, so as to output the direct current processed by the external device to the external device. The operation of the power supply apparatus 800 of the present invention will be briefly described.

First, the battery pack outputs a direct current to an impedance matching circuit through input terminals a and B of the impedance matching circuit. Then, on the one hand, the impedance matching circuit filters, stabilizes or limits the direct current in order to output a stable voltage or current to an external device. On the other hand, a loop which can match the impedance of the direct current electric signals with different frequencies and/or amplitudes is formed between the impedance matching circuit and the external circuit and between the impedance matching circuit and the power supply module, and therefore the impedance matching is carried out on the battery pack and the external equipment. Meanwhile, when the power supply device is connected with external equipment, various intermodulation signals generated by the external equipment can be input into the impedance matching circuit through the E end or the F end, and after impedance matching and time sequence adjustment are carried out on the intermodulation signals through the impedance matching circuit, the various intermodulation signals are transmitted without distortion.

Fig. 9 is a schematic structural diagram illustrating a power supply apparatus 900 including a two-way power supply module according to an embodiment of the present invention. It is to be understood that the power supply apparatus 900 shown in fig. 9 is an embodiment in which an impedance matching circuit is disposed behind a power supply module, and is an expanded form of the power supply apparatus 700 shown in fig. 7. The two-way power module shown in fig. 9 can also be applied to fig. 6 and 7, and can replace the corresponding power module.

As shown in fig. 9, in one embodiment, the power module may be a two-way power module that may provide two-way power to an external device to power it. Specifically, the power module 910 may include a transformer 911 and a rectifying circuit 912. Wherein the transformer may include a primary coil, a secondary coil, and a core, which are configured to convert a three-phase alternating-current high voltage power input to the power supply device into a low-voltage alternating current power. The rectifying circuit is configured to convert the low-voltage alternating current output by the transformer into a direct current electrical signal.

Further, the input end D of the impedance matching circuit 920 is connected to the positive output end of the rectifying circuit and the external device, respectively. The other input terminal C of the impedance matching circuit is connected to the center tap of the secondary winding of the transformer, and the input terminal C is connected to the output terminal G and is grounded. And the other output end H of the impedance matching circuit is connected with the negative output end of the rectifying circuit and the external equipment. So that a loop with impedance matching for signals with different frequencies and/or amplitudes is formed between the impedance matching circuit and the power supply module, so as to provide two paths of voltages + VCC and-VCC for the external equipment. Meanwhile, when the power supply device is connected with an external device, a loop which can match the impedance of signals of the external device with different frequencies and/or amplitudes is formed between the impedance matching circuit and the external device. The operation of the power supply apparatus 900 of the present invention will be briefly described.

First, an external power grid inputs three-phase high-voltage alternating current to a transformer in the power supply apparatus, the three-phase high-voltage alternating current flows through a primary coil of the transformer and induces a corresponding magnetic flux in an iron core, and then the magnetic flux is induced into low-voltage alternating current again by a secondary coil wound around the iron core. The ratio of the input voltage and the output voltage of the transformer can be adjusted by adjusting the winding proportion of the primary coil and the secondary coil. Then, the low-voltage AC output from the secondary coil of the transformer is converted into dc by a rectifier bridge inside the rectifier circuit, and is output to the input terminal D of the impedance matching circuit.

Then, on the one hand, the impedance matching circuit filters, stabilizes or limits the dc current, thereby outputting two stable voltages + VCC and-VCC to an external device. On the other hand, when the power supply device is connected with an external device, a loop which can match the impedance of direct current signals with different frequencies and/or amplitudes is formed between the impedance matching circuit and the external circuit and between the impedance matching circuit and the power supply module, and therefore the impedance matching is carried out on the power supply module and the external device. Meanwhile, various intermodulation signals generated by external equipment can also be input into the impedance matching circuit through the D end, and after impedance matching and time sequence adjustment are carried out on the intermodulation signals through the impedance matching circuit, distortion-free transmission of the intermodulation signals is realized.

Fig. 10 is a schematic diagram illustrating a structure of a power supply apparatus 1000 in which an impedance matching circuit according to an embodiment of the present invention is located in front of a power supply module. For a better understanding of the structure and function of the present invention, an externally inputted three-phase ac high voltage line and external devices are also depicted in fig. 10. Wherein the three-phase ac high voltage line outputs a three-phase ac high voltage to the power supply apparatus 1000. The external device is configured to receive the dc power output by the power supply apparatus 1000 of the present invention. When the power supply device is connected with external equipment, the power supply device can also perform impedance matching and time sequence adjustment on signals inside the external equipment, so that distortion-free transmission of the signals is realized.

As shown in fig. 10, in one embodiment, the power module 1010 in the power supply apparatus 1000 of the present invention may include a transformer 1011 and a rectifying and filtering circuit 1012. Wherein the transformer may include a primary coil, a secondary coil, and a core, which are configured to convert a three-phase alternating-current high voltage power input to the power supply device into a low-voltage alternating current power by electromagnetic induction. The rectification filter circuit is configured to convert the low-voltage alternating current output by the transformer into direct current suitable for the operation of the external device.

In one embodiment, the impedance matching circuit 1020 in the power supply apparatus of the present invention may be disposed before the power supply module. Specifically, input ends a and B of the impedance matching circuit are respectively connected with an L end and an N end of a three-phase alternating-current high-voltage wire so as to receive three-phase alternating-current high-voltage electricity output by the three-phase alternating-current high-voltage wire. And output ends E and F of the impedance matching circuit are respectively connected with a primary coil of the transformer so as to output the three-phase alternating current high-voltage electricity processed by the impedance matching circuit to the transformer. The input end of the rectifying and filtering circuit is connected with the secondary coil of the transformer so as to convert the low-voltage alternating current AC output by the transformer into direct current. The output end of the rectification filter circuit is connected with the external equipment so as to provide direct current required by the operation of the external equipment for the external equipment. The operation principle of the power supply apparatus 1000 of the present invention is briefly described below.

Firstly, the external power grid outputs three-phase high-voltage alternating current to the input ends a and B of the impedance matching circuit, and when the three-phase high-voltage alternating current passes through the impedance matching circuit, the three-phase high-voltage alternating current is firstly filtered, stabilized or limited by the impedance matching circuit, so that stable voltage or current is output to the transformer. In addition. The three-phase high-voltage alternating current is processed by an impedance matching circuit, so that a loop with impedance capable of being matched with signals with different frequencies and/or amplitudes is formed between the impedance matching circuit and the transformer and between the impedance matching circuit and the three-phase alternating current high-voltage line, and impedance matching is further performed on a power grid end where the power module and the three-phase alternating current high-voltage line are located.

Fig. 11 is a schematic diagram illustrating a structure of a power supply apparatus 1100 including a plurality of impedance matching circuits according to an embodiment of the present invention. It is understood that the power supply apparatus 1100 shown in fig. 11 may include a plurality of the power supply apparatuses 700 shown in fig. 7, or may further include a plurality of the power supply apparatuses 800 shown in fig. 8.

Further, the power supply module in the power supply apparatus may provide multiple dc voltages and supply power to a plurality of external devices through one or more impedance matching circuits 1120. The power supply module may include a transformer 1111 composed of one primary coil and a plurality of secondary coils, and a plurality of rectification circuits 1112. And outputs a plurality of low-voltage alternating currents AC through the plurality of secondary coils. The multi-path low-voltage alternating current AC is converted into multi-path direct current voltage through the plurality of rectifying circuits and then is output to the plurality of impedance matching circuits. The plurality of impedance matching circuits perform impedance matching and timing adjustment on the plurality of DC voltage intermodulation signals to power the plurality of external devices. Optionally, the power supply module may further include a voltage conversion module, where the voltage conversion module is configured to perform voltage conversion on the dc voltage output by the rectification circuit, so as to output multiple paths of dc voltages with different voltage values to the multiple external devices.

It should be understood that the terms "first", "second", "third" and "fourth", etc. in the claims, the description and the drawings of the present invention are used for distinguishing different objects and are not used for describing a particular order. The terms "comprises" and "comprising," when used in the specification and claims of this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification and claims of this application, the singular form of "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should be further understood that the term "and/or" as used in the specification and claims of this specification refers to any and all possible combinations of one or more of the associated listed items and includes such combinations.

As used in this specification and claims, the term "if" may be interpreted contextually as "when", "upon" or "in response to a determination" or "in response to a detection". Similarly, the phrase "if it is determined" or "if a [ described condition or event ] is detected" may be interpreted contextually to mean "upon determining" or "in response to determining" or "upon detecting [ described condition or event ]" or "in response to detecting [ described condition or event ]".

Although the embodiments of the present invention are described above, the descriptions are only examples for facilitating understanding of the present invention, and are not intended to limit the scope and application scenarios of the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. An impedance-matched power supply apparatus comprising:

a power supply module configured to output a direct current voltage to an external device so as to supply power thereto; and

at least one impedance matching circuit, wherein each of the impedance matching circuits comprises:

a plurality of impedance elements forming a mesh structure including at least one mesh having edges and vertices and wherein at least one edge is formed by at least one impedance element;

at least one input, wherein each input is connected to a vertex in the at least one mesh; and

at least one output, wherein each output is connected to another vertex in the at least one mesh,

the impedance matching circuit is connected to the power supply module so that the power supply module and the external device are impedance-matched when the power supply apparatus is connected to the external device.

2. The power supply apparatus according to claim 1, wherein at least two of the plurality of impedance elements have different impedance values so that a signal from the external device and a signal of different frequency and/or amplitude in the direct-current voltage intermodulation pass through different paths in the mesh structure.

3. The power supply device according to claim 1, wherein the impedance element is at least one of: a capacitor; an inductance; a capacitor and an inductor; a resistor and a capacitor; a resistance and an inductance; as well as resistors, capacitors and inductors.

4. The power supply device according to claim 1, wherein the input and output terminals of the impedance element are connected with the vertices at the diagonal corners of the impedance matching circuit so that the impedance elements between the input and output terminals form the most combinations.

5. The power supply device according to claim 1, wherein the power supply module includes a transformer and a rectifying circuit, or includes a battery pack.

6. The power supply device according to claim 5, wherein the impedance matching circuit is arranged behind the power supply module, an input terminal of the impedance matching circuit is connected to the rectifying circuit or the battery pack, and an output terminal of the impedance matching circuit is connected to the external apparatus.

7. The power supply device according to claim 6, wherein the power supply module is a one-way power supply module, at least one input terminal of the impedance matching circuit is connected to the rectifying circuit or the battery pack, and at least one output terminal of the impedance matching circuit is connected to the external apparatus.

8. The power supply device according to claim 6, wherein when the power supply module includes a transformer and a rectifier circuit, the power supply module is a two-way power supply module, one input terminal of the impedance matching circuit is connected to the rectifier circuit, the other input terminal is connected to the transformer, one output terminal of the impedance matching circuit is connected to the external apparatus, and the other output terminal is grounded.

9. The power supply device according to claim 5, wherein when the power supply module includes a transformer and a rectifier circuit, the impedance matching circuit is arranged in front of the power supply module, an input terminal of the impedance matching circuit is connected to a three-phase alternating current, and an output terminal of the impedance matching circuit is connected to the power supply module.

10. The power supply device according to any one of claims 1 to 9, wherein the number of the impedance matching circuits is at least one, and the power supply module outputs a plurality of dc voltages to supply power to a plurality of external devices.