CN111830134A - Ultrasonic nondestructive testing system - Google Patents
Ultrasonic nondestructive testing system Download PDFInfo
- Publication number
- CN111830134A CN111830134A CN202010679543.6A CN202010679543A CN111830134A CN 111830134 A CN111830134 A CN 111830134A CN 202010679543 A CN202010679543 A CN 202010679543A CN 111830134 A CN111830134 A CN 111830134A
- Authority
- CN
- China
- Prior art keywords
- ultrasonic
- scanning
- workpiece
- laser
- acquisition card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
- G01N29/0654—Imaging
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2418—Probes using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2437—Piezoelectric probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
- G01N29/4454—Signal recognition, e.g. specific values or portions, signal events, signatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
- G01N29/449—Statistical methods not provided for in G01N29/4409, e.g. averaging, smoothing and interpolation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/023—Solids
- G01N2291/0234—Metals, e.g. steel
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
- G01N2291/0289—Internal structure, e.g. defects, grain size, texture
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/10—Number of transducers
- G01N2291/105—Number of transducers two or more emitters, two or more receivers
Abstract
The invention discloses an ultrasonic nondestructive testing system, which comprises: the system comprises a laser ultrasonic transmitting system, an ultrasonic receiving system, a control and analysis imaging system and a three-axis platform system; the laser ultrasonic transmitting system comprises: the device comprises a high-frequency fiber laser, a facula shaping device, a scanning galvanometer and a focusing mirror; the ultrasonic receiving system includes: the system comprises a multi-array element piezoelectric sensor, a charge amplifier and a multi-channel high-speed data acquisition card; the control and analysis imaging system: the computer, the waveform processor, the imaging display and controller; the three-axis platform system includes: the invention can realize the omnibearing 360-degree detection of surface and internal defects, has higher working efficiency, higher sensitivity of received signals, low price and higher precision of extracted signal envelope, and is more suitable for industrial use.
Description
Technical Field
The invention relates to the field of nondestructive testing, in particular to a laser ultrasonic high-sensitivity detection system and method based on a phased array technology.
Background
With the continuous development of modern industry, nondestructive testing is an indispensable means in the industrial development process, and reflects the modern industrial level of a country to a certain extent. The effective nondestructive testing evaluation can improve the product quality and guarantee the high-efficiency safe production, and bring better economic benefit for enterprises. The traditional ultrasonic detection technology is developed for years, and the technology is mature. There are some disadvantages, however: the comprehensive quality requirement of the practitioner is high, and the state of the measured object needs to be judged through experience; the requirement on a measured object is high, and workpieces with complex geometric shapes are generally difficult to detect; with the development of material technology, the traditional ultrasonic detection is in bottleneck for the application of novel materials such as composite materials and the like; nondestructive testing in severe environments such as high temperature and high pressure in the industrial field also provides a new subject for conventional ultrasonic testing; the conventional ultrasonic detection needs different ultrasonic probes if sound waves of different modes are excited. Therefore, how to overcome the current difficulties encountered by the traditional ultrasonic detection technology, reduce the requirements on the surface of the object to be detected and improve the detection precision and the anti-interference capability becomes the problem to be solved at present.
Disclosure of Invention
The invention aims to solve the technical problem of overcoming the difficulties of the traditional ultrasonic detection technology at present, reducing the requirements on the surface of a detected object and improving the detection precision and the anti-interference capability, and provides an ultrasonic nondestructive detection system and a method.
The invention solves the technical problems through the following technical scheme:
an ultrasonic non-destructive inspection system, comprising: the system comprises a laser ultrasonic transmitting system, an ultrasonic receiving system, a control and analysis imaging system and a three-axis platform system; the laser ultrasonic transmitting system comprises: the device comprises a high-frequency fiber laser, a facula shaping device, a scanning galvanometer and a focusing mirror; the ultrasonic receiving system includes: the system comprises a multi-array element piezoelectric sensor, a charge amplifier and a multi-channel high-speed data acquisition card; the control and analysis imaging system: the computer, the waveform processor, the imaging display and controller; the three-axis platform system includes: three-dimensional moving platform, workpiece to be measured and ultrasonic probe.
Furthermore, the controller is respectively connected to the high-frequency fiber laser, the multi-channel high-speed data acquisition card, the computer, the scanning galvanometer and the focusing mirror; forming a point light source array scanning path on the surface of the workpiece to be detected, enabling the point light source array to act with the workpiece to be detected to emit ultrasonic waves, and transmitting the ultrasonic waves into the multi-array element piezoelectric sensor after being received by the ultrasonic probe; the high-frequency fiber laser, the light spot shaping device, the scanning galvanometer and the focusing mirror are electrically connected in sequence; the multi-array element piezoelectric sensor, the charge amplifier and the multi-channel high-speed data acquisition card are electrically connected in sequence; the computer, the waveform processor and the image display are electrically connected in sequence.
Further, forming a point light source array scanning path on the surface of the workpiece to be measured includes:
under the action of a phased array, the high-frequency fiber laser delays the same time to excite the excitation pulse for multiple times;
the excitation pulse excited for multiple times forms the point light source array through the light spot shaping device, the scanning galvanometer and the focusing mirror so as to form the scanning path.
Further, the controller controls the power percentage of the high-frequency fiber laser so that the point light source array is lower than an ablation threshold value when acting with the workpiece to be detected and the thermal-elastic mechanism emits the ultrasonic waves.
Furthermore, the controller realizes the control of the scanning galvanometer and the focusing mirror through galvanometer scanning control, and the two-dimensional path scanning is completed.
Furthermore, the multi-array element piezoelectric sensor is connected with the workpiece to be detected, and is selectively distributed and arranged at different positions according to the detection range and surface detection or internal detection.
Preferably, the multi-array element piezoelectric sensor adopts specification parameters with different center frequencies to be electrically connected with the charge amplifier, the charge amplifier is electrically connected with the multi-channel high-speed acquisition card, and the multi-channel high-speed acquisition card is electrically connected with the computer to realize the real-time acquisition of the ultrasonic signals.
Furthermore, the computer is provided with a software analysis module which can acquire, analyze and detect the output signals of the multi-channel high-speed acquisition card in real time.
Furthermore, the waveform processor filters and transforms the ultrasonic waves, extracts signal envelopes and takes absolute values, and the imaging display realizes amplitude imaging of the ultrasonic echo and quantitative analysis of defects.
On the basis of the common knowledge in the field, the above preferred conditions can be combined randomly to obtain the preferred embodiments of the invention.
The positive progress effects of the invention are as follows: the all-round 360 degrees detection that can realize surface and internal defect, work efficiency is higher, and received signal sensitivity is higher, and the low price, and it is higher to extract signal envelope precision, more is fit for the industry and uses.
Drawings
FIG. 1 is a schematic diagram of a system configuration in an embodiment of an ultrasonic non-destructive inspection system according to the present invention;
FIG. 2 is a schematic diagram of the distribution of ultrasonic probes in an embodiment of an ultrasonic nondestructive testing system of the invention;
FIG. 3 is a schematic diagram of a phased array controlled acoustic beam concept in an embodiment of an ultrasonic nondestructive testing system of the present invention;
FIG. 4 is a diagram illustrating a signal after processing by a digital filter in an embodiment of an ultrasonic nondestructive testing system according to the invention;
FIG. 5 is a schematic diagram of a transformed signal envelope in an embodiment of an ultrasonic non-destructive inspection system according to the invention;
FIG. 6 is a schematic diagram of two-dimensional imaging of a defect in an embodiment of a nondestructive ultrasonic inspection system of the invention.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are shown in the drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element and be integral therewith, or intervening elements may also be present. The terms "mounted," "one end," "the other end," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1, which is a schematic structural diagram of an ultrasonic nondestructive testing system of the present invention, the nondestructive testing system includes a laser ultrasonic transmitting system 100, an ultrasonic receiving system 200, a control and analysis imaging system 300 and a three-axis platform system 400, the laser ultrasonic transmitting system 100 includes a high-frequency fiber laser 101, a spot shaping device 102 and a scanning galvanometer and focusing mirror 103, the ultrasonic receiving system 200 includes a multi-element piezoelectric sensor 201, a charge amplifier 202 and a multi-channel high-speed data acquisition card 203, the control and analysis imaging system 300 includes a computer 301, a waveform processor 302 imaging display 303 and a controller 304, and the three-axis platform system 400 includes a three-dimensional moving platform 401, a workpiece to be tested 402 and an ultrasonic probe 403.
In one example, the controller 304 is connected to the multi-channel high-speed data acquisition card 203 to realize real-time control of the multi-channel high-speed data acquisition card 203, the controller 304 is further connected to the high-frequency fiber laser 101 and the scanning galvanometer and focusing mirror 103 respectively through laser control and galvanometer scanning control to realize real-time control of the high-frequency fiber laser 101 and the scanning galvanometer and focusing mirror 103, the controller 304 is further connected to a computer, the high-frequency fiber laser 101, the spot shaping device 102 and the scanning galvanometer and focusing mirror 103 are electrically connected in sequence, the excitation pulse is delayed by the same time of the high-frequency fiber laser 101 by phased array action, the excitation pulse forms the spot light source array through the spot shaping device 102 and the scanning galvanometer and focusing mirror 103 to form the scanning path as shown in fig. 3, the controller 304 controls the power of the high-frequency laser 101 to realize that the action of the point light source array and the workpiece 402 to be measured is lower than an ablation threshold and realize that a thermal ejection mechanism emits ultrasonic waves, the ultrasonic waves are transmitted to the multi-array element piezoelectric sensor 201, one end of the multi-array element piezoelectric sensor 201 is in contact with the workpiece 402 to be measured through lubricating grease, the other end of the multi-array element piezoelectric sensor 201 is electrically connected with the charge amplifier 202 through a BNC (basic network card) port, the charge amplifier 202 is electrically connected with the multi-channel high-speed data acquisition card 203 through a BNC (basic network card), the multi-channel high-speed data acquisition card 203 is electrically connected with the computer 301 to realize the real-time transmission of ultrasonic signals, and the computer 301 is electrically connected with the waveform processor 302 and the.
In an alternative example, the workpiece 402 to be detected is an aluminum block with a size of a4 paper and a thickness of 2cm, and defect detection of surface cracks and internal bubbles is performed respectively, 8 ultrasonic probes are distributed on the surface of the aluminum block, as shown in fig. 2, and respectively 403a, 403b, 403c, 403d, 403e, 403f, 403g and 403h are selected as surface wave probes if the aluminum block is subjected to surface defect detection, and as shown in fig. 2, a longitudinal wave probe is selected if the aluminum block is subjected to internal defect detection, as shown in fig. 2, the 8 ultrasonic probes are 5mm away from the boundary of the laser scanning area 500, each column (row) of the 8 ultrasonic probes is 2cm away, and the area of 3 × 3cm at the center of the surface of the aluminum block is the laser scanning area 500.
In an alternative example, Δ t is shown in FIG. 31，Δt2，Δt3，Δt4，Δt5In order to delay the scanning path of the light spot formed by the excitation pulse emitted by the high-frequency fiber laser 101 shown in fig. 1 for multiple times at the same time under the action of the phased array, the phased array controls the sound beam to realize scanning or focusing in different ranges, such as the path of performing sound beam deflection scanning and sound beam focusing scanning or only scanning a series of point light sources when global scanning is needed, the repetition frequency of the high-frequency fiber pulse laser 101 is 30KHz, compared with the repetition frequency of the traditional laser ultrasonic YAG pulse laser of 10-20Hz, the ultrasonic signal with a certain signal-to-noise ratio is ensured, more efficient detection can be completed, and the high-frequency fiber pulse laser 101 is more suitable for industrial use, the excitation pulse emitted by the high-frequency fiber pulse laser 101 passes through the light spot shaping device 102, the scanning galvanometer and the focusing mirror 103, wherein the scanning galvanometer is two pieces, and the pulse point light source with the excitation energy of 1 millijoule is excited on the aluminum block, the distance between the ultrasonic probe 403 and the aluminum block is 4cm (ensuring focusing), the spot radius of the excitation pulse is 0.5mm, the laser power percentage can be controlled by the controller 304, and the signal-to-noise ratio of the ultrasonic signal is improved on the premise of the occurrence of the thermo-elastic effect.
In an alternative example, as shown in fig. 1, a workpiece 402 to be tested is placed on a three-dimensional moving platform 401, calibration and calibration work is performed according to precise scales on the three-dimensional moving platform 401 before an experiment is started, and a pen can be used to scribe a line on the workpiece 402 to be tested to determine a scanning area, so as to ensure the accuracy of the experiment.
In an alternative example, in order to implement synchronous triggering and acquisition, the high-frequency fiber pulse laser 101 shown in fig. 1 uses a dedicated triggering channel, the output charge of the charge amplifier 202 matches the input charge of the multi-channel high-speed data acquisition card 203 to complete real-time transmission of signals, according to shannon's sampling theorem, the general sampling frequency is set to be 5-10 times of the maximum frequency of the signals, where the acquisition frequency of the multi-channel high-speed data acquisition card 203 is 30MHz, the sampling length is set to be 1Ksa, the triggering signal is provided by the controller 304, the multi-array piezoelectric sensor 201 uses the center frequencies of 2.5MHz, 3MHz and 4MHz, which are consistent with the upper limit and lower limit cutoff frequency ranges of the FIR digital filter in the waveform processor 302, 8 sets of data are acquired in each experiment, the computer 301 displays that a defect signal is received, and uses MATLAB software to perform analysis, as shown in fig. 4 and 5, the laser-excited and received signals include multiple modes that cannot be imaged, and noise signals caused by the surrounding environment also affect the imaging precision, and the signals are respectively subjected to signal filtering processing and hilbert transform by an FIR digital filter in the waveform processor 302 to perform envelope extraction, where the FIR digital filter adopts a window function method, the type of the window function is selected to be a kesselt window, the order of the filter is 33 orders, the upper limit cutoff frequency of the band-pass filter is 4.1MHz, and the lower limit cutoff frequency is 2.3 MHz; the hilbert transform includes: for any continuous detected defect echo signal x (t) as a real signal, the hilbert transform is defined as:
can obtain the analytic signal of real signal x (t)
Thus, the
The amplitude A (t) of (A) is the envelope of the real signal x (t), i.e.
As can be seen from the definition of the transformation, the time domain signal is substantially converted into a time domain analytic signal, the real part is itself, the imaginary part is a complex signal of hilbert transformation, the amplitude of the complex signal is an envelope of the real signal, the transformation is not limited by fourier analysis, the complex signal has good local adaptability, and an absolute value is taken and then imaged according to the amplitude, as shown in fig. 6, the two-dimensional imaging graph of the internal defect of the aluminum block is obtained after filtering and hilbert transformation are performed according to the ultrasonic echo signal and the absolute value is taken.
While specific embodiments of the invention have been described above, it will be appreciated by those skilled in the art that this is by way of example only, and that the scope of the invention is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the spirit and scope of the invention, and these changes and modifications are within the scope of the invention.
Claims (9)
1. An ultrasonic non-destructive inspection system, comprising: the system comprises a laser ultrasonic transmitting system, an ultrasonic receiving system, a control and analysis imaging system and a three-axis platform system; the laser ultrasonic transmitting system comprises: the device comprises a high-frequency fiber laser, a facula shaping device, a scanning galvanometer and a focusing mirror; the ultrasonic receiving system includes: the system comprises a multi-array element piezoelectric sensor, a charge amplifier and a multi-channel high-speed data acquisition card; the control and analysis imaging system: the computer, the waveform processor, the imaging display and controller; the three-axis platform system includes: three-dimensional moving platform, workpiece to be measured and ultrasonic probe.
2. The ultrasonic nondestructive inspection system of claim 1 wherein said controller is connected to said high frequency fiber laser, said multi-channel high speed data acquisition card, said computer and said scanning galvanometer and focusing mirror, respectively; forming a point light source array scanning path on the surface of the workpiece to be detected, enabling the point light source array to act with the workpiece to be detected to emit ultrasonic waves, and transmitting the ultrasonic waves into the multi-array element piezoelectric sensor after being received by the ultrasonic probe; the high-frequency fiber laser, the light spot shaping device, the scanning galvanometer and the focusing mirror are electrically connected in sequence; the multi-array element piezoelectric sensor, the charge amplifier and the multi-channel high-speed data acquisition card are electrically connected in sequence; the computer, the waveform processor and the image display are electrically connected in sequence.
3. The system of claim 2, wherein forming a scanning path of the array of point sources on the surface of the workpiece comprises:
under the action of a phased array, the high-frequency fiber laser delays the same time to excite the excitation pulse for multiple times;
the excitation pulse excited for multiple times forms the point light source array through the light spot shaping device, the scanning galvanometer and the focusing mirror so as to form the scanning path.
4. The system of claim 2, wherein the controller controls the power percentage of the high frequency fiber laser such that the array of point sources interacts with the workpiece below an ablation threshold and effects a thermoelastic mechanism to emit the ultrasonic waves.
5. The system of claim 2, wherein the controller controls the scanning galvanometer and the focusing mirror through galvanometer scanning control to complete two-dimensional path scanning.
6. The ultrasonic nondestructive inspection system of claim 2 wherein the plurality of piezoelectric transducers are coupled to the workpiece and are selectively distributed at different locations according to the inspection area and the surface inspection or the internal inspection.
7. The ultrasonic nondestructive testing system of claim 6, wherein the multi-element piezoelectric sensor is electrically connected to the charge amplifier by using specification parameters with different center frequencies, the charge amplifier is electrically connected to the multi-channel high-speed acquisition card, and the multi-channel high-speed acquisition card is electrically connected to the computer to realize real-time acquisition of the ultrasonic signals.
8. The ultrasonic nondestructive inspection system of claim 2 wherein said computer is provided with a software analysis module for acquiring and analyzing in real time the output signal of said multi-channel high speed acquisition card.
9. The ultrasonic non-destructive inspection system of any one of claims 1 through 8, wherein said waveform processor filters and transforms said ultrasonic waves to extract signal envelopes and take absolute values, and said imaging display enables amplitude imaging of said ultrasonic echoes and enables quantitative analysis of defects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010679543.6A CN111830134A (en) | 2020-07-15 | 2020-07-15 | Ultrasonic nondestructive testing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010679543.6A CN111830134A (en) | 2020-07-15 | 2020-07-15 | Ultrasonic nondestructive testing system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111830134A true CN111830134A (en) | 2020-10-27 |
Family
ID=72924146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010679543.6A Pending CN111830134A (en) | 2020-07-15 | 2020-07-15 | Ultrasonic nondestructive testing system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111830134A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112945863A (en) * | 2021-02-02 | 2021-06-11 | 上海工程技术大学 | Mechanical property nondestructive testing system and method for additive manufacturing alloy material |
| CN112986152A (en) * | 2021-02-07 | 2021-06-18 | 上海工程技术大学 | Laser ultrasonic real-time detection system and method |
| CN113155967A (en) * | 2021-04-22 | 2021-07-23 | 上海工程技术大学 | Phased array nonlinear laser ultrasonic detection system |
| CN113567561A (en) * | 2021-07-20 | 2021-10-29 | 宝宇(武汉)激光技术有限公司 | Metal nondestructive test equipment |
| CN113870152A (en) * | 2021-09-03 | 2021-12-31 | 宝宇(武汉)激光技术有限公司 | Laser ultrasonic visualization method |
| CN114460012A (en) * | 2022-01-21 | 2022-05-10 | 山东大学 | Ultrasonic intensity enhancing method suitable for underwater environment laser ultrasonic material detection and application |
| CN115166050A (en) * | 2022-09-07 | 2022-10-11 | 广东工业大学 | Handheld laser ultrasonic detection system and method |
| CN115184463A (en) * | 2022-09-07 | 2022-10-14 | 广东工业大学 | Laser ultrasonic detection device |
| CN116148356A (en) * | 2023-04-20 | 2023-05-23 | 之江实验室 | Ultrasonic microscope system and imaging method based on ultrasonic microscope |
Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005037223A (en) * | 2003-07-14 | 2005-02-10 | Jfe Steel Kk | Ultrasonic flaw detector, ultrasonic flaw detection program and ultrasonic flaw detection method |
| CN2927051Y (en) * | 2006-02-07 | 2007-07-25 | 哈尔滨工业大学 | Ultrasonic phase-controlled array inspection imager for marine platform structure |
| US20090048789A1 (en) * | 2007-04-13 | 2009-02-19 | University Of South Carolina | Optimized Embedded Ultrasonics Structural Radar System With Piezoelectric Wafer Active Sensor Phased Arrays For In-Situ Wide-Area Damage Detection |
| CN101460094A (en) * | 2006-05-04 | 2009-06-17 | 卡迪纳尔健康202公司 | Multiple frequency Doppler ultrasound probe |
| CN203203927U (en) * | 2013-04-16 | 2013-09-18 | 南京诺威尔光电系统有限公司 | Laser scanning heat wave tomographic imaging device |
| CN103822877A (en) * | 2014-02-27 | 2014-05-28 | 同济大学 | Portable nonlinear photoacoustic imaging system and photoacoustic imaging method |
| CN104706323A (en) * | 2015-03-18 | 2015-06-17 | 福建工程学院 | High-speed large-view-field multi-spectral photoacoustic imaging method and device |
| CN204971220U (en) * | 2015-08-31 | 2016-01-20 | 睿芯生命科技（深圳）有限公司 | Micro - imaging system of reflective optoacoustic |
| CN107677572A (en) * | 2017-08-22 | 2018-02-09 | 南京新瓦特智控科技有限公司 | The ultrasonic grain diameter measurement system and method for online multiple spot detection primary mixture |
| CN107782787A (en) * | 2017-10-20 | 2018-03-09 | 杭州电子科技大学 | A kind of ultrasonic defect detection method |
| US20190006157A1 (en) * | 2014-07-31 | 2019-01-03 | iSenseCloud, Inc. | Test Wafer With Optical Fiber With Bragg Grating Sensors |
| CN109212037A (en) * | 2018-10-09 | 2019-01-15 | 南昌航空大学 | A kind of Air Coupling ultrasonic phase array detection device |
| CN109269986A (en) * | 2018-09-28 | 2019-01-25 | 东南大学 | Phased-array laser ultrasonic testing system |
| CN109612940A (en) * | 2018-12-05 | 2019-04-12 | 东南大学 | A kind of nondestructive detection system and lossless detection method that laser array quickly controls generation ultrasound |
| CN110108652A (en) * | 2019-04-01 | 2019-08-09 | 同济大学 | Specific region border detection localization method and system for complex component sample |
| CN110426373A (en) * | 2019-07-16 | 2019-11-08 | 南昌航空大学 | A kind of method of Brillouin scattering and optical coherence elastogram in situ detection |
| CN110859633A (en) * | 2019-11-21 | 2020-03-06 | 电子科技大学 | Dynamic photoacoustic characteristic spectrum nondestructive blood glucose meter based on nano marker and preparation method of nano marker |
-
2020
- 2020-07-15 CN CN202010679543.6A patent/CN111830134A/en active Pending
Patent Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005037223A (en) * | 2003-07-14 | 2005-02-10 | Jfe Steel Kk | Ultrasonic flaw detector, ultrasonic flaw detection program and ultrasonic flaw detection method |
| CN2927051Y (en) * | 2006-02-07 | 2007-07-25 | 哈尔滨工业大学 | Ultrasonic phase-controlled array inspection imager for marine platform structure |
| CN101460094A (en) * | 2006-05-04 | 2009-06-17 | 卡迪纳尔健康202公司 | Multiple frequency Doppler ultrasound probe |
| US20090048789A1 (en) * | 2007-04-13 | 2009-02-19 | University Of South Carolina | Optimized Embedded Ultrasonics Structural Radar System With Piezoelectric Wafer Active Sensor Phased Arrays For In-Situ Wide-Area Damage Detection |
| CN203203927U (en) * | 2013-04-16 | 2013-09-18 | 南京诺威尔光电系统有限公司 | Laser scanning heat wave tomographic imaging device |
| CN103822877A (en) * | 2014-02-27 | 2014-05-28 | 同济大学 | Portable nonlinear photoacoustic imaging system and photoacoustic imaging method |
| US20190006157A1 (en) * | 2014-07-31 | 2019-01-03 | iSenseCloud, Inc. | Test Wafer With Optical Fiber With Bragg Grating Sensors |
| CN104706323A (en) * | 2015-03-18 | 2015-06-17 | 福建工程学院 | High-speed large-view-field multi-spectral photoacoustic imaging method and device |
| CN204971220U (en) * | 2015-08-31 | 2016-01-20 | 睿芯生命科技（深圳）有限公司 | Micro - imaging system of reflective optoacoustic |
| CN107677572A (en) * | 2017-08-22 | 2018-02-09 | 南京新瓦特智控科技有限公司 | The ultrasonic grain diameter measurement system and method for online multiple spot detection primary mixture |
| CN107782787A (en) * | 2017-10-20 | 2018-03-09 | 杭州电子科技大学 | A kind of ultrasonic defect detection method |
| CN109269986A (en) * | 2018-09-28 | 2019-01-25 | 东南大学 | Phased-array laser ultrasonic testing system |
| CN109212037A (en) * | 2018-10-09 | 2019-01-15 | 南昌航空大学 | A kind of Air Coupling ultrasonic phase array detection device |
| CN109612940A (en) * | 2018-12-05 | 2019-04-12 | 东南大学 | A kind of nondestructive detection system and lossless detection method that laser array quickly controls generation ultrasound |
| CN110108652A (en) * | 2019-04-01 | 2019-08-09 | 同济大学 | Specific region border detection localization method and system for complex component sample |
| CN110426373A (en) * | 2019-07-16 | 2019-11-08 | 南昌航空大学 | A kind of method of Brillouin scattering and optical coherence elastogram in situ detection |
| CN110859633A (en) * | 2019-11-21 | 2020-03-06 | 电子科技大学 | Dynamic photoacoustic characteristic spectrum nondestructive blood glucose meter based on nano marker and preparation method of nano marker |
Non-Patent Citations (2)
| Title |
|---|
| 万明习: "《生物医学超声实验》", 31 March 2010 * |
| 刘学坤: "《基于激光热弹效应的机械零件表面缺陷检测方法研究》", 《中国博士学位论文全文数据库基础科学辑》 * |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112945863A (en) * | 2021-02-02 | 2021-06-11 | 上海工程技术大学 | Mechanical property nondestructive testing system and method for additive manufacturing alloy material |
| CN112986152A (en) * | 2021-02-07 | 2021-06-18 | 上海工程技术大学 | Laser ultrasonic real-time detection system and method |
| CN113155967A (en) * | 2021-04-22 | 2021-07-23 | 上海工程技术大学 | Phased array nonlinear laser ultrasonic detection system |
| CN113567561A (en) * | 2021-07-20 | 2021-10-29 | 宝宇(武汉)激光技术有限公司 | Metal nondestructive test equipment |
| CN113870152A (en) * | 2021-09-03 | 2021-12-31 | 宝宇(武汉)激光技术有限公司 | Laser ultrasonic visualization method |
| CN114460012A (en) * | 2022-01-21 | 2022-05-10 | 山东大学 | Ultrasonic intensity enhancing method suitable for underwater environment laser ultrasonic material detection and application |
| CN114460012B (en) * | 2022-01-21 | 2023-11-14 | 山东大学 | Ultrasonic wave intensity enhancement method suitable for underwater environment laser ultrasonic material detection and application |
| CN115166050A (en) * | 2022-09-07 | 2022-10-11 | 广东工业大学 | Handheld laser ultrasonic detection system and method |
| CN115184463A (en) * | 2022-09-07 | 2022-10-14 | 广东工业大学 | Laser ultrasonic detection device |
| CN115166050B (en) * | 2022-09-07 | 2022-12-02 | 广东工业大学 | Handheld laser ultrasonic detection system and method |
| CN116148356A (en) * | 2023-04-20 | 2023-05-23 | 之江实验室 | Ultrasonic microscope system and imaging method based on ultrasonic microscope |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111830134A (en) | Ultrasonic nondestructive testing system | |
| CN104865317B (en) | A kind of transmission-type Air Coupling ultrasonic scanning image method | |
| Blomme et al. | Air-coupled ultrasonic NDE: experiments in the frequency range 750 kHz–2 MHz | |
| CN104345092A (en) | Scanning type laser ultrasonic detection method and system | |
| CN106802323A (en) | A kind of ultrasonic total focus imaging system based on complete matrix data | |
| CN105353043A (en) | Sheet metal micro-crack time reversal positioning method based on abaqus | |
| CN104698089A (en) | Ultrasonic relative time propagation technology suitable for inclined crack quantifying and imaging | |
| CN110261473A (en) | Ultrasonic phase array testing methods for tiny crack based on finite element model | |
| CN113777166A (en) | High-resolution defect nondestructive testing method based on combination of ultrasonic plane wave imaging and time reversal operator | |
| CN113533504A (en) | Sub-surface crack quantitative measurement method based on laser ultrasonic surface wave frequency domain parameters | |
| CN111380955A (en) | Method for detecting defects of additive manufacturing part based on ultrasonic phased array | |
| CN103424475B (en) | Based on the tested surface contour extraction method of phased array ultrasonic detection | |
| Kang et al. | Measurement of shallow defects using noncontact broadband leaky Lamb wave produced by pulsed laser with ultrasound microphone | |
| Antonio Jr et al. | Ultrasonic imaging of concrete by synthetic aperture focusing technique based on hilbert-huang transform of time domain data | |
| Han et al. | Application of ultrasonic phased array total focusing method in weld inspection using an inclined wedge | |
| Hillger et al. | Practical applications of air-coupled ultrasonic technique | |
| Her et al. | 3D surface profile construction and flaw detection in a composite structure | |
| Hillger et al. | Industrial applications of air-coupled ultrasonic technique | |
| Holmes et al. | Post-processing of ultrasonic phased array data for optimal performance | |
| JPH07248317A (en) | Ultrasonic flaw detecting method | |
| RU2769080C1 (en) | Method for ultrasonic control of materials and products | |
| Sui et al. | Numerical simulation of internal defect imaging with the longitudinal wave generated by laser induced ultrasonic array | |
| Tseng et al. | A study of total focusing method for ultrasonic nondestructive testing | |
| Patankar et al. | Design and development of instrumentation for air-coupled ultrasonics | |
| Takatsubo et al. | Generation laser scanning method for visualizing ultrasonic waves propagating on 3-D objects |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |