CN111826103A - Transparent cover film and preparation method thereof, flexible circuit board and LED transparent screen - Google Patents

Transparent cover film and preparation method thereof, flexible circuit board and LED transparent screen Download PDF

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Publication number
CN111826103A
CN111826103A CN201911076665.XA CN201911076665A CN111826103A CN 111826103 A CN111826103 A CN 111826103A CN 201911076665 A CN201911076665 A CN 201911076665A CN 111826103 A CN111826103 A CN 111826103A
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film
modified coating
layer
coating
transparent
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由龙
赵伟业
张林杰
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Shenzhen Kenuoqiao Technology Co ltd
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Shenzhen Kenuoqiao Technology Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate

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  • Engineering & Computer Science (AREA)
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  • Wood Science & Technology (AREA)
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  • General Physics & Mathematics (AREA)
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Abstract

The invention belongs to the technical field of transparent flexible circuit boards, and particularly relates to a transparent cover film, a preparation method of the transparent cover film, a flexible circuit board and an LED transparent screen. The transparent covering film comprises a base material film layer, and a first modified coating and a second modified coating which are respectively arranged on two opposite surfaces of the base material film layer, wherein the first modified coating and the second modified coating are used for improving the temperature resistance of the base material film layer; the surface of the first modified coating layer, which deviates from the substrate film layer, is provided with a first release protective film, the surface of the second modified coating layer, which deviates from the substrate film layer, is provided with a second release protective film, and the second modified coating layer and the second release protective film are attached through an adhesive layer. The first modified coating and the second modified coating in the transparent covering film can improve the high-temperature resistance of the base material film layer, so that the base material is not easy to precipitate and thermally deform under a high-temperature condition, thereby avoiding fogging and improving light transmittance.

Description

Transparent cover film and preparation method thereof, flexible circuit board and LED transparent screen
Technical Field
The invention belongs to the technical field of transparent flexible circuit boards, and particularly relates to a transparent cover film, a preparation method of the transparent cover film, a flexible circuit board and an LED transparent screen.
Background
A Light Emitting Diode (LED) is a commonly used Light Emitting device, emits Light by energy released by recombination of electrons and holes, and is widely used in the field of illumination. The LED transparent screen is one of LED display screens, the luminous source is LED lamp beads, compared with the field of the traditional LED display screen, the LED transparent screen has the main characteristics of high permeability, light screen body weight, seamless splicing of the screen body, unlimited expansion of size in principle, mainly installation and attachment at the back of a glass curtain wall or the back of a glass show window, indoor installation and outdoor viewing; the LED transparent screen has a simple structure, and the light transmittance of the common visible light is more than 85%.
With the rise of the definition of 'new retail', the digital signage industry symbolizing retail is rapidly expanded in China, and the LED transparent screen plays an important role in the fields of commercial retail show windows, indoor decoration and the like, thereby having great influence on new retail. Undoubtedly, shop window display is a main mode of product display and propaganda popularization in retail shops, and at present, many shop windows are provided with LED transparent screens, and in addition, the LED transparent screens can be applied to scenes such as stage dance beauty, 4S shops, building brightening, building curtain walls and the like.
In the field of a transparent Flexible Circuit board (FPC), after a transparent Copper Clad Laminate (CCL) is etched, when tin is deposited on the surface of the CCL, the haze of a film of a covering film can be increased, so that the light transmittance is reduced, and the application of the film in the field of LED transparent screens is influenced.
Therefore, the prior art is in need of improvement.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, provides a transparent covering film, a preparation method thereof, a flexible circuit board and an LED transparent screen, and aims to solve the technical problem that the transparent covering film is easy to fog and deform at high temperature.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a transparent covering film, which is used for a transparent flexible circuit board and comprises a base material film layer, a first modified coating and a second modified coating, wherein the first modified coating and the second modified coating are respectively arranged on two opposite surfaces of the base material film layer and are used for improving the temperature resistance of the base material film layer; the surface of the first modified coating layer, which deviates from the substrate film layer, is provided with a first release protective film, the surface of the second modified coating layer, which deviates from the substrate film layer, is provided with a second release protective film, and the second modified coating layer and the second release protective film are attached through an adhesive layer.
According to the transparent cover film provided by the invention, the first modified coating and the second modified coating which are used for improving the temperature resistance of the base material film are arranged on the two opposite surfaces of the base material film, and the first modified coating and the second modified coating can improve the high-temperature resistance of the base material film, so that the base material is not easy to precipitate and deform thermally under a high-temperature condition, thereby avoiding fogging and improving light transmittance.
The invention also provides a preparation method of the transparent covering film, which comprises the following steps:
providing a substrate film layer with two opposite surfaces;
coating a modified coating on one surface of the substrate film layer, carrying out first drying treatment to obtain a first modified coating, and then attaching a first release protective film to the surface of the first modified coating, which is far away from the substrate film layer;
coating the modified coating on the other surface of the base material film layer, carrying out second drying treatment to obtain a second modified coating, then coating an adhesive on the surface of the second modified coating, which is away from the base material film layer, and carrying out third drying treatment to form an adhesive layer;
attaching a second release protective film to the surface of the adhesive layer, which is far away from the second modified coating, and then curing to obtain the transparent covering film;
wherein the first modified coating and the second modified coating are used for improving the temperature resistance of the base material film layer.
In the preparation process of the transparent covering film, the two opposite surfaces of the base material film layer are respectively coated with the modified coatings to form the first modified coating and the second modified coating, and the first modified coating and the second modified coating can improve the temperature resistance of the base material film layer, so that the base material is not easy to precipitate and deform thermally under the high-temperature condition; therefore, the transparent covering film prepared by the method can avoid fogging and improve light transmittance.
The invention also provides a flexible circuit board which is a transparent flexible circuit board and comprises a circuit substrate, wherein the surface of the circuit substrate is bonded with the transparent covering film.
The special transparent covering film is attached to the surface of the circuit substrate of the flexible circuit board, and the base material of the transparent covering film is not easy to precipitate and deform at high temperature, so that the flexible circuit board has a good light transmission effect.
The invention also provides an LED transparent screen which comprises an LED light source and the flexible circuit board.
The flexible circuit board in the LED transparent screen is the special flexible circuit board, and the base material of the transparent covering film in the flexible circuit board is not easy to precipitate and deform at high temperature, so that the LED transparent screen has a good light transmission effect.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
Fig. 1 is a schematic structural diagram of a transparent cover film according to an embodiment of the present invention;
fig. 2 is a diagram of a transparent cover film according to an embodiment of the present invention;
fig. 3 is a diagram of a transparent flexible circuit board according to an embodiment of the present invention;
1-a substrate film layer;
21-a first modified coating;
22-a second modified coating;
3-an adhesive layer;
41-a first release protective film;
42-second release protection film.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It should be noted that the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In one aspect, the embodiment of the present invention provides an exposed cover film, as shown in fig. 1, the transparent cover film includes a substrate film layer 1, and a first modified coating 21 and a second modified coating 22 respectively disposed on two opposite surfaces of the substrate film layer 1, where the first modified coating 21 and the second modified coating 22 are used to improve the temperature resistance of the substrate film layer 1; the surface of the first modified coating 21 departing from the substrate film layer 1 is provided with a first release protective film 41, the surface of the second modified coating 22 departing from the substrate film layer 1 is provided with a second release protective film 42, and the second modified coating 22 and the second release protective film 42 are attached through an adhesive layer 3. The first modified coating 21 and the second modified coating 22 can improve the high temperature resistance of the substrate film layer 1, so that the substrate is not easy to precipitate and thermally deform under a high temperature condition, thereby reducing the haze of the transparent cover film and improving the light transmittance. The first release protective film 41 and the second release protective film 41 can prevent the intermediate substrate film layer 1 and the adhesive layer 3 from being damaged or contaminated. The adhesive layer 3 can be filled for downstream lines, and plays a role in bonding and protecting.
In one embodiment, the first modified coating has a thickness of 2-50 μm. The thickness of the second modified coating is 2-50 μm. If the thicknesses of the first modified coating and the second modified coating are too thin, the effect of improving the heat resistance of the substrate film layer 1 is not good, and too thick is not good for light transmission. In one embodiment, the thickness of the first release protective film is 4-100 μm; the thickness of the second release type protective film is 4-100 mu m.
The first modified coating and the first modified coating are obtained by coating modified paint, and the modified paint comprises the following components in percentage by mass:
Figure BDA0002262687170000051
the modified coating takes an aliphatic hydrocarbon solvent and a ketone solvent as mixed solvents, and is dissolved with zirconia, photosensitive resin and pentaerythritol triacrylate, wherein the zirconia has the characteristics of high-temperature chemical stability and corrosion resistance, and the pentaerythritol triacrylate can be cured by high crosslinking and has the characteristics of high adhesive force, high hardness, wear resistance and corrosion resistance; therefore, when the modified coating is used on the surface of a transparent covering film, fogging is avoided, and the light transmittance is improved.
In the modified coating, zirconia (ZrO) is used2) The chemical property is stable, the high temperature resistance and corrosion resistance are realized, and the content range of the zirconia is 20-30%; pentaerythritol triacrylate (PETA) isThe film material with high adhesive force, high hardness, excellent wear resistance and heat resistance is formed by monomer free radical polymerization of a monomer containing a side hydroxyl group and fast curing, and the content range of the pentaerythritol triacrylate is 0.5-1%; the modified coating of the zirconia and the pentaerythritol triacrylate with the content is coated on the surface of the base material film layer of the transparent covering film, the base material film layer is modified by the zirconia and the pentaerythritol triacrylate, so that the transparent covering film is not easy to fog and thermally deform under a high-temperature condition, and the haze of the covering film cannot be increased when the modified transparent covering film is attached to an FPC (flexible printed circuit) and then subjected to tin deposition and other processing technologies, so that the light transmittance of the covering film is improved. The zirconia is preferably zirconia fiber, and the zirconia fiber as a polycrystalline refractory fiber material can be used for a long time in an ultrahigh-temperature oxidation atmosphere of more than 1500 ℃, and has the characteristics of stable high-temperature chemical property, corrosion resistance, oxidation resistance, thermal shock resistance, non-volatility, no pollution and the like. The photosensitive resin comprises polyvinyl alcohol cinnamate photosensitive resin or diazo type photosensitive resin, the photosensitive resin is a functional polymer material with photosensitive property, the photosensitive resin is coated on the surface of the transparent cover film, a photoetching process can be well carried out when the FPC is manufactured, and the content of the photosensitive resin is 9-30%. In the modified coating, the solvent is a mixed solvent of an aliphatic hydrocarbon solvent and a ketone solvent; the ketone solvent can well dissolve the resin and is matched with the aliphatic hydrocarbon solvent, so that the modified coating can reach moderate cost performance. Wherein, the content of the aliphatic hydrocarbon solvent is 10-20%; the aliphatic hydrocarbon solvent includes at least one of a saturated hydrocarbon solvent and an unsaturated hydrocarbon solvent. The saturated hydrocarbon solvent is selected from at least one of pentane, hexane, heptane and octane; the unsaturated hydrocarbon solvent is selected from at least one of an alkene solvent and an alkyne solvent, and specifically may be a linear alkene or alkyne having 5 to 15 carbon atoms. In one embodiment, the ketone solvent includes at least one of methyl-2-pentanone, 1-methoxy-2-propanone, and cyclohexanone. Specifically, the ketone solvent is composed of methyl-2-pentanone, 1-methoxy-2-propanone and cyclohexanone, and the mass ratio of the methyl-2-pentanone (3-methyl-2-pentanone or 4-methyl-2-pentanone), the 1-methoxy-2-propanone and the cyclohexanone is (1-2)10-20% of aliphatic hydrocarbon solvent, 10-20% of methyl-2-pentanone, 10-20% of 1-methoxy-2-acetone and 10-20% of cyclohexanone (1-2); the mixed solvent within the proportion range can well dissolve the zirconium oxide, the photosensitive resin and the pentaerythritol triacrylate, has the best dispersion effect, and enables the modified coating to be better coated.
The preparation of the modified coating comprises the following steps: weighing raw materials of the components according to the components and the content of the modified coating; and mixing the zirconium oxide, the photosensitive resin, the pentaerythritol triacrylate, the aliphatic hydrocarbon solvent and the ketone solvent, and then filtering to obtain the modified coating. Further, the mixing treatment conditions comprise dispersion for 1-3h under the condition of the rotation speed of 800-; the temperature of the mixing treatment is 25-30 ℃. Specifically, a high-speed dispersion machine is used for dispersion, and a constant-temperature water tank is added to keep the temperature at 25-30 ℃ in order to avoid overhigh temperature in the dispersion process. And finally, after uniform dispersion, filtering by using a 5-10 micron filter screen to form the modified coating with more uniform dispersion. The prepared modified coating can be coated on the line after standing for 2 hours.
The modified coating is coated on the surface of a substrate film layer and then dried to volatilize the solvent so as to obtain the first modified coating and the second modified coating, wherein the modified coating comprises the following components in a mass ratio of 20-30: 9-30: 0.5-1 of zirconium oxide: photosensitive resin: pentaerythritol triacrylate.
In one embodiment, the substrate film layer has a thickness of 5 to 150 μm. The substrate film layer is a transparent film, and includes any one of pet (polyethylene terephthalate) film, pa (polyamide) film, PEEK (Poly-ether-ketone) film, pps (polyphenylene sulfide) film, EPFE (Ethylene-tetra-fluoro-Ethylene) film, ptfe (polytetrafluoroethylene) film, pen (polyethylene naphthalate) film, pei (polyetherimide) film, pfa (perfluoroalkylkoxy) copolymer film of perfluoropropylperfluorovinylether and polytetrafluoroethylene, and cpi polymer film.
In one embodiment, the substrate film layer is a PET film, which generally can resist 120 ℃, and when the PET film is cured at a high temperature of 160 ℃ (for example, 160 ℃ for 1 hour), the PET film is easily fogged and thermally deformed, so that the haze of the transparent cover film is increased, and the first modified coating and the second modified coating on the surface of the PET film can make the PET film not easily separated out and fogged under the condition of more than 160 ℃ (for example, 160-.
In one embodiment, the adhesive layer is a transparent adhesive layer.
On the other hand, the embodiment of the invention also provides a preparation method of the transparent covering film, which comprises the following steps:
s01: providing a substrate film layer with two opposite surfaces;
s02: coating a modified coating on one surface of the substrate film layer, carrying out first drying treatment to obtain a first modified coating, and then attaching a first release protective film to the surface of the first modified coating, which is far away from the substrate film layer;
s03: coating the modified coating on the other surface of the base material film layer, carrying out second drying treatment to obtain a second modified coating, then coating an adhesive on the surface of the second modified coating, which is away from the base material film layer, and carrying out third drying treatment to form an adhesive layer;
s04: attaching a second release protective film to the surface of the adhesive layer, which is far away from the second modified coating, and then curing to obtain the transparent covering film;
wherein the first modified coating and the second modified coating are used for improving the temperature resistance of the base material film layer.
In the preparation process of the transparent cover film provided by the embodiment of the invention, the two opposite surfaces of the base material film layer are respectively coated with the modified coatings to form the first modified coating and the second modified coating, and the first modified coating and the second modified coating can improve the temperature resistance of the base material film layer, so that the base material is not easy to precipitate and deform thermally under a high-temperature condition; therefore, the transparent covering film prepared by the method can reduce the haze and improve the light transmittance.
Specifically, the modified coating formula comprises: 20-30% of zirconium oxide; 9-30% of photosensitive resin; 0.5 to 1 percent of pentaerythritol triacrylate; 10-20% of aliphatic hydrocarbon solvent; 30-60% of ketone solvent.
The first drying treatment and the second drying treatment can remove the solvent in the modified coating, preferably, the first drying treatment temperature is 60-120 ℃, specifically, the first drying treatment temperature can be 60-80 ℃ -120 ℃ -120 ℃ -120 ℃ -60 ℃ in sequence, and the second drying treatment temperature is 60-120 ℃, specifically, the second drying treatment temperature can be 60-80 ℃ -120 ℃ -120 ℃ -60 ℃ in sequence. Under the temperature condition, the aliphatic hydrocarbon solvent and the ketone solvent can be well volatilized, so that the coated coating becomes a first modified coating and a second modified coating respectively after being formed into a film. The third drying treatment aims at removing the solvent in the adhesive, the temperature of the third drying treatment is 60-120 ℃, and the temperature of the drying tunnel is specifically set as follows: 60-80-120-60 ℃; the air frequency of the air inlet and the air outlet is set as follows: air inlet: 25-20-20-20-20-25(HZ), air exhaust: 40 (HZ). Under the conditions, the solvent in the adhesive can be well removed to form the adhesive layer.
The adhesive is a transparent adhesive, and the formula of the transparent adhesive can be the following components in percentage by mass: 30% of rubber, 45% of bisphenol resin, 1% of ion scavenger, 2% of antioxidant, 2% of accelerator and the balance of solvent 20%. The rubber can increase the binding force and toughness, the bisphenol resin has good softness and tensile action, the accelerator promotes the reaction to be thorough, the ion scavenger eliminates the residual metal ions, and the antioxidant prevents oxidation in use. The adhesive layer formed by the transparent adhesive is not easy to yellow, and has the advantages of ultraviolet resistance, difficult glare and the like.
Specifically, the configuration of the transparent adhesive comprises the following steps:
preparing a semi-finished product 1 (rubber): based on 1kg
The rubber adding proportion is as follows: 10% -30% (usually, 1072cgj/1072cgx, etc.)
Diluent (i.e., solvent) addition ratio: 70-90% (MEK/mcs, etc.)
Preparing a semi-finished product 2 (ion scavenger): based on 1kg
Adding the semi-finished product 1 in the proportion: 10 to 20 percent
The addition ratio of the ion scavenger: 40-60% (IXE-100, etc.)
The addition ratio of the diluent is as follows: 20-50% (MEK/mcs, etc.)
Preparing a semi-finished product 3 (antioxidant): based on 1kg
The addition ratio of the antioxidant is as follows: 20 to 40 percent of
The addition ratio of the diluent is as follows: 60-80% (MEK/mcs, etc.)
Preparing a semi-finished product 4 (an accelerant): based on 1kg
The addition ratio of the accelerator is as follows: 20 to 30 percent
The addition ratio of the diluent is as follows: 70 to 80 percent
Preparing a semi-finished product 5 (bisphenol resin): based on 1kg
The resin addition proportion is as follows: 40-60% (E-12(604/E-20 (601))
The addition ratio of the diluent is as follows: 40-60% (toluene, etc.)
Mixing the finished product glue: the proportion of the powder is set based on 1kg
38-60% of semi-finished product 1 (rubber), 38-60% of semi-finished product 5 (bisphenol resin), 0.5-1% of semi-finished product 2 (ion scavenger), 0.5-1% of semi-finished product 3 (antioxidant) and 4% of semi-finished product (accelerator).
After all semi-finished products are mixed, a high-speed dispersion machine is used for dispersing for 3-5h at the rotating speed of 800-. And filtering by using a 5-10 micron filter screen after the dispersion is finished to obtain the finished product glue. After the adhesive layer is obtained, attaching a second release protective film to the surface of the adhesive layer, which is far away from the second modified coating, and finally curing to form a product; wherein the curing treatment may be a low temperature curing (e.g., about 0-5 ℃).
In one embodiment, the transparent cover film obtained by the preparation method is shown in fig. 2, and as can be seen from the figure, the opposite landscape can be clearly seen through the transparent cover film, which indicates that the transparent cover film has good light transmittance.
The embodiment of the invention also provides a flexible circuit board which is a transparent flexible circuit board and comprises a circuit substrate, wherein the surface of the circuit substrate is bonded with the transparent cover film. Specifically, the release protective film may be removed, and the base film layer may be adhered to the surface of the circuit board by an adhesive layer. The base material of the transparent covering film is not easy to precipitate and thermally deform at high temperature, so that the flexible circuit board has a good light-transmitting effect. In one embodiment, the flexible circuit board is shown in fig. 3, and as can be seen from the figure, the substrate of the transparent flexible circuit board is clearly visible, which shows that the flexible circuit board has good light transmittance.
The embodiment of the invention also provides an LED transparent screen which comprises an LED light source and the flexible circuit board. The flexible circuit board in the LED transparent screen is the flexible circuit board, and the base material of the transparent covering film is not easy to precipitate and deform at high temperature, so that the LED transparent screen has a good light transmission effect.
In the embodiment of the invention, the temperature is from normal temperature to 25-30 ℃.
The invention is described in further detail with reference to a part of the test results, which are described in detail below with reference to specific examples.
Example 1
The utility model provides a transparent cover film, includes that the second that from the bottom up set gradually leaves type protection film, adhesive layer, second modified coating, PET substrate rete, first modified coating and first from type protection film.
Wherein, the first modified coating and the second modified coating are obtained by coating, drying and desolventizing a modified coating, and the modified coating comprises: 25% of zirconium oxide; 15% of photosensitive resin; 1% of pentaerythritol triacrylate; heptane 20%, methyl-2-pentanone 10%, 1-methoxy-2-propanone 14% and cyclohexanone 15%.
Example 2
The utility model provides a transparent cover film, includes that the second that from the bottom up set gradually leaves type protection film, adhesive layer, second modified coating, PET substrate rete, first modified coating and first from type protection film.
Wherein, the first modified coating and the second modified coating are obtained by coating, drying and desolventizing a modified coating, and the modified coating comprises: 25% of zirconium oxide; 25% of photosensitive resin; 1% of pentaerythritol triacrylate; 10% of heptane, 15% of methyl-2-pentanone, 14% of 1-methoxy-2-acetone and 10% of cyclohexanone.
Example 3
The utility model provides a flexible circuit board, flexible circuit board is transparent flexible circuit board, and its circuit substrate surface laminating has the transparent cover film of embodiment 1 (tears first from type protection film and second from type protection film, through the adhesive layer adhesion on circuit substrate surface).
Example 4
The utility model provides a flexible circuit board, flexible circuit board is transparent flexible circuit board, and its circuit substrate surface laminating has embodiment 2's transparent cover film (tears first from type protection film and second from type protection film, through the adhesive layer adhesion on circuit substrate surface).
Performance testing
(1) The transparent cover films of examples 1 and 2 were tested for performance and the results are shown in table 1:
TABLE 1
Figure BDA0002262687170000111
Figure BDA0002262687170000121
(2) The transparent flexible circuit boards of examples 3 and 4 were subjected to performance tests, and the results are shown in table 2.
TABLE 2
Figure BDA0002262687170000122
(3) The flexible circuit boards of example 3 and example 4 were subjected to an appearance test:
wherein, the point defect standard and the detection result (including crystal point, bubble point, white spot, bright point, impurity point, etc.) are shown in table 3; the surface scratch standards and test results are shown in table 4; the results of the reliability tests are shown in table 5.
TABLE 3
Figure BDA0002262687170000131
TABLE 4
Figure BDA0002262687170000132
TABLE 5
Figure BDA0002262687170000133
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims (10)

1. A transparent cover film for a transparent flexible circuit board is characterized by comprising a base material film layer, a first modified coating and a second modified coating, wherein the first modified coating and the second modified coating are respectively arranged on two opposite surfaces of the base material film layer and are used for improving the temperature resistance of the base material film layer; the surface of the first modified coating layer, which deviates from the substrate film layer, is provided with a first release protective film, the surface of the second modified coating layer, which deviates from the substrate film layer, is provided with a second release protective film, and the second modified coating layer and the second release protective film are attached through an adhesive layer.
2. The transparent cover film of claim 1, wherein the first modification coating has a thickness of 2 to 50 μ ι η; and/or the thickness of the second modified coating is 2-50 μm.
3. The transparent cover film of claim 1, wherein the thickness of the first release protective film is 4-100 μ ι η; and/or the thickness of the second release type protective film is 4-100 mu m.
4. The transparent cover film of claim 1, wherein the substrate film layer has a thickness of 5 to 150 μm.
5. The transparent cover film of any one of claims 1-4, wherein the substrate film layer comprises any one of a PET film, a PA film, a PEEK film, a PPS film, an EPFE film, a PTFE film, a PEN film, a PEI film, a PFA film, and a CPI film.
6. The transparent cover film of any one of claims 1-4, wherein the first modified coating layer and the second modified coating layer are obtained by coating modified paint on two opposite surfaces of a substrate film layer of the transparent cover film; the modified coating comprises the following components in percentage by mass based on the total mass of the modified coating as 100 percent:
Figure FDA0002262687160000011
7. the preparation method of the transparent covering film is characterized by comprising the following steps:
providing a substrate film layer with two opposite surfaces;
coating a modified coating on one surface of the substrate film layer, carrying out first drying treatment to obtain a first modified coating, and then attaching a first release protective film to the surface of the first modified coating, which is far away from the substrate film layer;
coating the modified coating on the other surface of the base material film layer, carrying out second drying treatment to obtain a second modified coating, then coating an adhesive on the surface of the second modified coating, which is away from the base material film layer, and carrying out third drying treatment to form an adhesive layer;
attaching a second release protective film to the surface of the adhesive layer, which is far away from the second modified coating, and then curing to obtain the transparent covering film;
wherein the first modified coating and the second modified coating are used for improving the temperature resistance of the base material film layer.
8. The preparation method of claim 7, wherein the modified coating comprises the following components in percentage by mass based on 100% of the total mass of the modified coating:
Figure FDA0002262687160000021
9. a flexible circuit board which is a transparent flexible circuit board and comprises a circuit substrate, wherein the transparent cover film of any one of claims 1 to 6 is attached to the surface of the circuit substrate.
10. An LED transparent screen comprising an LED light source and a flexible circuit board, wherein the flexible circuit board is the flexible circuit board of claim 9.
CN201911076665.XA 2019-11-06 2019-11-06 Transparent cover film and preparation method thereof, flexible circuit board and LED transparent screen Pending CN111826103A (en)

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WO2024041015A1 (en) * 2022-08-26 2024-02-29 广西量子通达科技有限公司 Interactive decorative panel, preparation method therefor and use thereof

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WO2024041015A1 (en) * 2022-08-26 2024-02-29 广西量子通达科技有限公司 Interactive decorative panel, preparation method therefor and use thereof
CN115851166A (en) * 2022-11-22 2023-03-28 深圳深汕特别合作区科诺桥新材料有限公司 OLED support film preparation process
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CN115975538A (en) * 2023-01-05 2023-04-18 深圳深汕特别合作区科诺桥新材料有限公司 Ultrathin high-transmittance OLED (organic light emitting diode) support film with high safety performance and preparation method thereof
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