CN111822223B - Dielectric layer slurry coating device and manufacturing method of planar capacitor - Google Patents

Dielectric layer slurry coating device and manufacturing method of planar capacitor Download PDF

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Publication number
CN111822223B
CN111822223B CN202010485600.7A CN202010485600A CN111822223B CN 111822223 B CN111822223 B CN 111822223B CN 202010485600 A CN202010485600 A CN 202010485600A CN 111822223 B CN111822223 B CN 111822223B
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dielectric layer
layer slurry
metal foil
gravure roller
brush
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CN111822223A (en
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李峰
卢星华
陶玉红
杨柳
周智勇
李雪
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Shenzhen Fengyong Technology Co ltd
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Shenzhen Fengyong Technology Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
    • B05C1/08—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line
    • B05C1/0826—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line the work being a web or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
    • B05C1/08—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line
    • B05C1/0808—Details thereof, e.g. surface characteristics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
    • B05C1/08—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line
    • B05C1/0817—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line characterised by means for removing partially liquid or other fluent material from the roller, e.g. scrapers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0209—Multistage baking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/04—Drying; Impregnating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2504/00—Epoxy polymers

Abstract

The invention discloses a dielectric layer slurry coating device and a manufacturing method of a planar capacitor, wherein the dielectric layer slurry coating device comprises a coating groove, a gravure roller and a brush, the gravure roller partially extends into the coating groove and is immersed in the dielectric layer slurry, the gravure roller can rotate relative to the coating groove and coats the dielectric layer slurry in the coating groove on the surface of a metal film, the gravure roller comprises a starting end of a material and a tail end of the coated material, the brush is arranged at the tail end of the gravure roller, the brush is arranged at an edge contact angle of the gravure roller and the liquid level of the dielectric layer slurry, and the brush is in contact with the surface of the gravure roller and the liquid level of the dielectric layer slurry. The residual slurry blocked in the narrow slot of the gravure roller is scraped out through the brush, so that bubbles generated in the scraping and brushing process can be prevented from being brought into the dielectric layer slurry, the gravure roller can be immersed into the dielectric layer slurry by using the whole volume of the narrow slot when immersed into the dielectric layer slurry again, the amount of the dielectric layer slurry brought up by the rotation of the gravure roller is consistent in the whole coating process, and the uniform thickness consistency is realized.

Description

Dielectric layer slurry coating device and manufacturing method of planar capacitor
Technical Field
The invention relates to the technical field of capacitor processing, in particular to a dielectric layer slurry coating device and a manufacturing method of a planar capacitor.
Background
In the prior art, for the coating process of the planar capacitor, the characteristic of high thickness uniformity of a dimple quantitative coating mode can be utilized to realize the requirement of high uniformity of the coating thickness, thereby achieving high capacitance value uniformity. The existing micro-gravure quantitative coating mode uses a gravure roller, two sides of the gravure roller are installed on a bearing, a part of the gravure roller is immersed in a feeding plate, the gravure roller rotates to bring up a coating, and after the gravure roller is quantified by a flexible rigid scraper, a part of the coating liquid is taken away by a reverse moving substrate, so that the coating is coated.
However, since the paste formula of the planar capacitor belongs to a high-filler ratio type, the coating is carried by the rotation of the gravure roller, and the gravure roller can only transfer part of the coating liquid to the substrate under the normal and stable production condition, and the rest of the coating liquid is left in the narrow slot of the gravure roller and cannot be transferred after being transferred to the substrate, and can remain in the reticulate slot of the gravure roller.
Disclosure of Invention
In order to overcome the defects and shortcomings in the prior art, the invention aims to provide a dielectric layer slurry coating device and a manufacturing method of a planar capacitor, so as to solve the problem of uneven thickness of a dielectric layer in the prior art.
The purpose of the invention is realized by the following technical scheme:
the invention provides a medium layer slurry coating device which comprises a coating groove, a gravure roller and a brush, wherein the coating groove is used for containing medium layer slurry, the gravure roller partially extends into the coating groove and is soaked in the medium layer slurry, the gravure roller can rotate relative to the coating groove and coats the medium layer slurry in the coating groove onto the surface of a metal film, the gravure roller comprises a starting end for material lifting and a tail end after coating, the brush is arranged at the tail end of the gravure roller, the brush is arranged at an edge contact angle between the gravure roller and the liquid level of the medium layer slurry, and the brush is in contact with the surface of the gravure roller and the liquid level of the medium layer slurry.
Further, the dielectric layer slurry coating device further comprises a scraper, and the scraper is arranged at the starting end of the gravure roller and is in contact with the surface of the gravure roller.
Further, the hairbrush is inclined along the tangential direction of the gravure roll.
Further, the gravure roller is a rough surface, and a plurality of grooves are formed in the surface of the gravure roller.
The invention also provides a manufacturing method of the planar capacitor, which is applied to the dielectric layer slurry coating device, wherein the planar capacitor comprises a first metal foil, a second metal foil and a dielectric layer arranged between the first metal foil and the second metal foil, and the manufacturing method comprises the following steps:
manufacturing dielectric layer slurry for forming the dielectric layer;
coating the dielectric layer slurry on the surface of the first metal foil through the gravure roller, and drying the dielectric layer slurry to form the dielectric layer on the surface of the first metal foil;
and laminating the first metal foil attached with the dielectric layer and the second metal foil, wherein the surface of the first metal foil attached with the dielectric layer faces the second metal foil to obtain the planar capacitor.
Further, the solid content of the dielectric layer slurry is 50-80 wt%, and the viscosity is 150-500 cp.
Further, the dielectric layer slurry comprises at least one of epoxy resin, inorganic filler, auxiliary agent and solvent, wherein the epoxy resin is at least one of glycidyl ether type epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, alicyclic epoxy resin, epoxidized olefin compound, sugar cane polyol epoxy resin and mixed structure epoxy resin; the auxiliary agent is at least one of a curing agent, a dispersing agent, a coupling agent, a flatting agent, a defoaming agent and an accelerating agent; the inorganic filler is at least one of barium sodium titanate, barium titanate, copper calcium titanate, strontium titanate, barium strontium titanate, calcium titanate, barium calcium titanate, lead zirconate titanate, lead sodium titanate and lead titanate; the solvent comprises at least one of acetone, pentanone, alcohol and butanone.
Further, the method for manufacturing the dielectric layer slurry comprises the following steps:
adding epoxy resin into a first solvent, and stirring at the temperature of 20-40 ℃ for 15-35 min to obtain a mixed solution of the dielectric layer slurry;
stirring and dispersing inorganic filler in a second solvent to obtain a suspension of the dielectric layer slurry, and stirring and dispersing the suspension in the mixed solution;
and adding an auxiliary agent, stirring and mixing uniformly to obtain a mixture of the dielectric layer slurry, and pouring the mixture into a ball milling tank to perform ball milling for 5-15 h at the rotating speed of 100-200 rpm to obtain the dielectric layer slurry.
Further, the method for drying the dielectric layer slurry comprises the following steps:
firstly, preserving heat for 0.7-2 min at a first drying temperature; preserving the heat for 0.7-1.5 min at the second drying temperature; and finally, preserving heat at a third drying temperature for 2.5-3.6 min to obtain a medium layer in a semi-cured state or lower than the semi-cured state, wherein the first drying temperature of the medium layer is more than or equal to 35 percent of the curing temperature, and the second drying temperature is more than or equal to 60 percent of the curing temperature of the medium layer.
Further, the method for laminating the first metal foil and the second metal foil attached with the dielectric layer includes:
pressing the first metal foil attached with the dielectric layer and the second metal foil at a preset temperature and a preset pressure to obtain the planar capacitor with uniform thickness;
the preset temperature is 100-150 ℃, and the preset pressure is 3-6 kg/cm2。
The invention has the beneficial effects that: the coating device for the medium layer slurry comprises a coating tank, a gravure roller and a brush, wherein the coating tank is used for containing the medium layer slurry, the lower portion of the gravure roller extends into the coating tank and is soaked in the medium layer slurry, the gravure roller can rotate relative to the coating tank and coats the medium layer slurry in the coating tank onto the surface of the metal film, the gravure roller comprises a starting end of material lifting and a tail end of the coated metal film, the brush is arranged at the tail end of the gravure roller, the brush is arranged at the edge contact angle of the gravure roller and the liquid level of the medium layer slurry, and the brush is in contact with the surface of the gravure roller and the liquid level of the medium layer slurry. The residual slurry blocked in the narrow slot of the gravure roller is scraped out through the brush, so that bubbles generated in the scraping and brushing process can be prevented from being brought into the dielectric layer slurry, the gravure roller can be immersed into the dielectric layer slurry through the whole volume of the narrow slot when immersed into the dielectric layer slurry again, the consistent amount of the dielectric layer slurry brought up by the rotation of the gravure roller is realized in the whole coating process, and the uniform thickness is realized.
Drawings
FIG. 1 is a schematic structural view of a dielectric layer slurry coating apparatus according to the present invention;
FIG. 2 is a schematic structural diagram of a planar capacitor according to the present invention;
fig. 3 is a flow chart of a method for manufacturing a planar capacitor according to the present invention.
In the figure: the planar capacitor comprises a planar capacitor 10, a metal foil 11, a first metal foil 11a, a second metal foil 11b, a dielectric layer 12, dielectric layer slurry 121, a coating tank 20, a gravure roller 30, a hairbrush 40 and a scraper 50.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description will be given of the specific implementation, structure, features and effects of the dielectric layer slurry coating apparatus and the method for manufacturing a planar capacitor according to the present invention with reference to the accompanying drawings and preferred embodiments:
[ example one ]
As shown in fig. 1 to 2, a dielectric layer slurry coating apparatus according to a first embodiment of the present invention includes a coating tank 20, a gravure roller 30 and a brush 40, where the coating tank 20 is used to contain a dielectric layer slurry 121, the gravure roller 30 partially extends into the coating tank 20 and is immersed in the dielectric layer slurry 121, the gravure roller 30 can rotate relative to the coating tank 20 and coats the dielectric layer slurry 121 in the coating tank 20 onto the surface of the metal film 11, the gravure roller 30 includes a start end (an end that rotates out of the dielectric layer slurry 121) for material lifting and a tail end (an end that rotates into the dielectric layer slurry 121) for coating, and with reference to fig. 1 as an example, the gravure roller 30 rotates clockwise, and a left end of the gravure roller 30 is a start end and a right end is a tail end. The brush 40 is arranged at the tail end of the gravure roller 30, the brush 40 is arranged at the edge contact angle between the gravure roller 30 and the liquid level of the dielectric layer slurry 121, the brush 40 is in contact with the surface of the gravure roller 30 and the liquid level of the dielectric layer slurry 121, the brush 40 is not in suspended contact, gel particles are prevented from being generated on the upper edge of the brush 40 due to solvent volatilization in a blade coating production process, and therefore coating apparent quality is influenced, and the brush 40 is not in the dielectric layer slurry 121, and the infiltration effect of the dielectric layer slurry 121 on the gravure roller 30 is influenced. Wherein, both ends of the gravure roller 30 are installed in bearings and the motor drives the gravure roller 30 to rotate, the brush 40 is fixed differently, and the gravure roller 30 can rotate relative to the coating tank 20 and the brush 40. The thickness of the metal film 11 is 9-50 μm, and the metal film 11 is one of copper foil, nickel foil and aluminum foil.
In this embodiment, the transmission direction of the metal film 11 is opposite to the rotation direction of the gravure roller 30, the gravure roller 30 rotates clockwise, the metal film 11 is transmitted from right to left, and the right end of the metal film 11 slightly inclines downward, so that the contact force with the gravure roller 30 is increased.
Further, the medium layer slurry coating device further comprises a scraper 50, and the scraper 50 is arranged at the starting end of the gravure roll 30 and is in contact with the surface of the gravure roll 30. Doctor blade 50 is also stationary and gravure roll 30 can rotate relative to doctor blade 50.
Further, the fur brush 40 is inclined in the tangential direction of the gravure roll 30.
Further, gravure roll 30 has a rough surface, and a plurality of grooves are formed on the surface of gravure roll 30 to increase the amount of dielectric layer slurry 121 that is carried by gravure roll 30.
Further, a liquid level display and a liquid level alarm device are further arranged in the coating tank 20, the liquid level display is used for displaying the residual amount of the medium layer slurry in the coating tank 20, and when the residual amount of the medium layer slurry in the coating tank 20 reaches a preset value, the liquid level alarm device sends out an alarm prompt so as to prompt a user to add the medium layer slurry.
According to the invention, the slurry remained and blocked in the slot of the gravure roller 30 is scraped out through the brush 40, so that bubbles generated in the scraping and brushing process can be prevented from being brought into the dielectric layer slurry 121, the gravure roller 30 can be immersed into the dielectric layer slurry 121 in the whole volume of the slot when immersed into the dielectric layer slurry 121 again, and the consistency of the amount of the dielectric layer slurry 121 brought up by the rotation of the gravure roller 30 is realized in the whole coating process, thereby realizing the uniformity of the thickness.
As shown in fig. 3 and referring to fig. 1 and 2, in a first embodiment of the present invention, a method for manufacturing a planar capacitor is further provided, in which a planar capacitor 10 includes a metal foil 11 and a dielectric layer 12, the metal foil 11 includes a first metal foil 11a and a second metal foil 11b, the dielectric layer 12 is disposed between the first metal foil 11a and the second metal foil 11b, and the manufacturing method is applied to the dielectric layer slurry coating apparatus.
The compounding method comprises the following steps:
step S1: a dielectric layer paste 121 for forming the dielectric layer 12 is prepared. The dielectric layer slurry 121 comprises at least one of an inorganic filler, an auxiliary agent, an epoxy resin and a solvent, the solid content of the dielectric layer slurry 121 is 50-80 wt%, the viscosity is 150-500 cp, the flow of the dielectric layer slurry 121 on the surface of the coated foil is reduced by reducing the using amount of the solvent in the dielectric layer slurry 121, the thickness uniformity of the dielectric layer 12 in the planar capacitor 10 is improved, and the pressure resistance is further improved.
Wherein the inorganic filler is at least one of barium sodium titanate, barium titanate, copper calcium titanate, strontium titanate, barium strontium titanate, calcium titanate, barium calcium titanate, lead zirconate titanate, lead sodium titanate and lead titanate. The inorganic filler can be selected from at least one of one-dimensional filler, two-dimensional filler and particle powder filler. Preferably, one-dimensional fillers are adopted, and compared with two-dimensional fillers and/or particle powder fillers, the one-dimensional ceramic fillers can increase the effective interface area and the electric dipole moment, so that higher dielectric constant and energy storage density can be obtained under the same addition amount. For example, the one-dimensional inorganic filler may have a particle size of 50nm to 2 μm, a spherical or spheroidal shape, or the like. The mass fraction of the inorganic filler in the dielectric layer slurry 121 may be 20% to 60%.
The auxiliary agent is at least one of curing agent, dispersing agent, coupling agent, flatting agent, defoaming agent and accelerating agent. The mass fraction of the auxiliary agent can be 1-5%. Wherein, the dispersing agent can be a nonionic emulsifier, a cationic emulsifier or an anionic emulsifier. The coupling agent can be at least one selected from silane coupling agent, titanate coupling agent, aluminate coupling agent and phosphate coupling agent. The Silane coupling agent may be, for example, KH550, KH560, KH570 or KH551 available in China, or OFS-6020, OFS-6030 or OFS-6040 available from Dow Corning, or A-186Silane, A-171Silane, A-1120Silane or A-1100Silane available from Meiji Korea, or KBM303, KBM503, KBM603, KBM403, KBE1003 or KBE903 available from Japan. The titanate coupling agent may be, for example, titanate coupling agent-101, titanate coupling agent-102, titanate coupling agent-105, titanate coupling agent-130 or titanate coupling agent-133 of Qiyu chemistry, or TytanAP100 of DuPont, or R-TTS, KR-38S, KR-12, KR-9S or TTOP-38S of Kenzich, USA, or TC-70 of Houston chemical. The aluminate coupling agent can be HY-133, HY-1804, HY-1805, HY-1108, HY-999 or HY-988 of Jersey chemical engineering, Hangzhou. The phosphate coupling agent is, for example, domestic DN-27, DN-37 or DN-307. The leveling agent can be at least one of organic silicon leveling agent and fluorocarbon leveling agent. The silicone leveling agent may be, for example, WE-D9000, Europe style KLE-41, BYK-300, BYK-306, BYK-307, or BYK-310. The fluorocarbon leveling agent can be, for example, EFKA-3600 or EFKA-E3500.
The epoxy resin is at least one of glycidyl ether type epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, alicyclic epoxy resin, epoxidized olefin compound, sugar cane polyol epoxy resin and mixed structure epoxy resin. The mass fraction of the epoxy resin can be 8-25%.
The solvent is at least one of acetone, butanone, alcohol and pentanone. The mass fraction of the solvent is 20-40%.
Specifically, the dielectric layer slurry 121 is prepared by the following method: adding epoxy resin into the first solvent, and stirring (ultrasonic stirring) at the temperature of 20-40 ℃ for 15-35 min to obtain a mixed solution of the dielectric layer slurry 121; stirring (ultrasonic stirring) the inorganic filler to disperse in the second solvent to obtain a suspension of the dielectric layer slurry 121, and stirring (ultrasonic stirring) the suspension to disperse in the mixed solution; adding the auxiliary agent, stirring and mixing uniformly to obtain a mixture of the dielectric layer slurry 121, pouring the mixture into a ball milling tank, and ball milling for 5-15 hours at the rotating speed of 100-200 rpm (r/min, revolution/minute) to obtain the dielectric layer slurry 121. The mass ratio of the epoxy resin to the first solvent is 1: 3-1: 6, the mass ratio of the inorganic filler to the second solvent is 1: 2-1: 5, the first solvent and the second solvent can be the same or different, and the first solvent and the second solvent are selected from one or more of acetone, butanone, alcohol and pentanone.
Step S2: coating the dielectric layer slurry 121 on the surface of the first metal foil 11a through a gravure roll 30, and drying the dielectric layer slurry 121 to form a dielectric layer 12 on the surface of the first metal foil 11a, wherein the thickness of the dielectric layer 12 may be 1-20 μm. The dielectric layer 12 is now in a less than semi-cured state, a fully cured state, or a semi-cured state. Of course, the dielectric layer paste 121 may be simultaneously coated on the surfaces of the first metal foil 11a and the second metal foil 11 b.
Specifically, when the dielectric layer slurry 121 is coated on the surface of the first metal foil 11a, the first metal foil 11a is transported in a direction opposite to the rotation direction of the gravure roll 30. After the dielectric layer slurry 121 is coated on the surface of the first metal foil 11a, after the heat preservation is performed at the drying temperature for the preset time, the dielectric layer 12 is in a completely cured state, a semi-cured state or a state lower than the semi-cured state, and the first metal foil 11a with the dielectric layer 12 coated on the surface is obtained. The drying temperature may be 35% to 100% of the curing temperature of the dielectric layer 12, and is preferably 35% to 60% of the curing temperature so as to be in a semi-cured state or lower than the semi-cured state. The total heat preservation time (preset time) at the drying temperature can be 3-6 min. In an alternative embodiment, a low temperature drying oven may be used for the drying process. For example, the first metal foil 11a coated with the semi-cured or lower dielectric layer 12 on the surface is passed through a long low-temperature drying oven with a proper oven temperature at a constant speed (2-8 m/min, e.g., 3m/min) at a certain speed. The holding time may be considered as the time of stay in the drying oven at a specific temperature.
In other embodiments, a staged drying manner may be selected to make the dielectric layer in a semi-cured state or lower than the semi-cured state, for example, 2 to 3 stages. As an example of performing the drying treatment in three stages, after the dielectric layer slurry 121 is coated on the surface of the first metal foil 11a, the first metal foil is first insulated at the first drying temperature for a first preset time, then insulated at the second drying temperature for a second preset time, and finally insulated at the third drying temperature for a third preset time, so as to obtain a dielectric layer in a semi-cured state or lower than the semi-cured state. Wherein the curing temperature of the dielectric layer is not less than 35% of the first drying temperature, and the third drying temperature is less than the second drying temperature and not more than 60% of the curing temperature of the dielectric layer. For example, the heating degree is 0.5 to 1.5min in the dry box region at a curing temperature (first drying temperature) of 35% of the dielectric layer 12, 1.4 to 3.6min in the dry box region at a curing temperature (second drying temperature) of 60% so that the dielectric layer 12 is semi-cured or less than the semi-cured state on the first metal foil 11a, and finally 0.5 to 1.5min in the dry box region at a curing temperature (third drying temperature) of 35%. Alternatively, the stage of the third drying temperature is not performed. The dielectric layer slurry 121 for manufacturing the dielectric layer 12 adopts special composition components and special process treatment on the dielectric layer 12, so that the quantity of the dielectric layer slurry 121 brought up by the rotation of the gravure roller 30 is more consistent, and the thickness uniformity is realized. The curing temperature of the dielectric layer 12 may vary depending on the composition of the dielectric layer 12, and the curing temperature may be determined after the composition of the dielectric layer 12 is determined.
Step S3: and laminating the first metal foil 11a and the second metal foil 11b which are attached with the dielectric layer 12, wherein the surface of the first metal foil 11a which is attached with the dielectric layer 12 faces the second metal foil 11b to obtain the planar capacitor 10. The first metal foil 11a and the second metal foil 11b with the dielectric layer 12 coated on the surfaces are subjected to laminating treatment at the joint of the laminating roller and the rubber roller, so that the flat capacitor 10 without scale marks and wrinkles is obtained.
Specifically, the first metal foil 11a and the second metal foil 11b, the surfaces of which are coated with the dielectric layer 12, are combined at a certain temperature and pressure to obtain the planar capacitor 10 with uniform thickness. Wherein the pressure of the covering is 3-6 kg/cm2. The temperature of the combination can be 100-150 ℃. In an alternative embodiment, the first metal foil 11a and the second metal foil 11b, the surfaces of which are coated with the semi-cured or lower dielectric layer 12, enter the laminating unit (laminating roller and rubber roller) at the same speed, and then are subjected to laminating treatment. The structure of the laminating unit comprises an upper laminating steel roller, a rubber roller and a lower laminating steel roller. The upper bonding steel roller and the rubber roller are bonded. The lower covering steel roller is attached to the rubber roller. The first metal foil 11a coated with the dielectric layer 12 on the surface thereof is transferred by a transfer roller, and the second metal foil 11b is transferred by another transfer roller. Wherein the entering speed can be 2-8 m/min. The thickness of the obtained dielectric layer 12 can be 1-20 μm. The first metal foil 11a is selected from one of copper foil, nickel foil, and aluminum foil. The second metal foil 11b is selected from one of copper foil, nickel foil, and aluminum foil. Wherein, the thickness of the first metal foil 11a or the second metal foil 11b can be 9-50 μm. For example, the dielectric layer + the first metal foil and the second metal foil are laminated after being taken out of the oven.
Specifically, in this embodiment, the first metal foil 11a and the second metal foil 11b both use copper foils, and the first copper foil substrate (50 μm) is coated with the dielectric layer 12 with a certain thickness (20 μm). The dielectric layer 12 is coated by dielectric layer slurry 121. Specifically, vinylcyclohexene diepoxy resin (260-340 g) is added into an acetone solvent (1400-1600 g), and ultrasonic stirring is carried out for 30min at the temperature of 30 ℃ to obtain a mixed solution of dielectric layer slurry; and adding an inorganic filler barium sodium titanate (650-760 g) into the mixed solution, performing ultrasonic stirring at the temperature of 30 ℃ for 30min, and performing ball milling for 10h to obtain the dielectric layer slurry 121.
Passing the first copper foil base material coated with the dielectric layer 12 through a low-temperature drying box at a constant speed at a certain speed (5 m/min); the heating degree (drying degree) is controlled to be 0.9min in the first drying chamber and the third drying chamber at the curing temperature of 35 percent of the dielectric layer 12 (the first drying temperature and the third drying temperature are both 55 ℃), and 3min in the second drying chamber at the curing temperature of 60 percent of the dielectric layer 12 (the second drying temperature is about 94 ℃), so that the dielectric layer 12 is in a semi-cured state or a state lower than the semi-cured state on the first copper foil base material.
The first copper foil substrate coated with the semi-cured or less-than-semi-cured dielectric layer 12 passes through the laminating unit at a speed of 5m/min and is laminated with the second copper foil substrate (50 μm) to finally obtain the planar capacitor 10 with uniform thickness. The thickness of the dielectric layer in the planar capacitor 10 obtained in this example was 20 μm, and the thickness tolerance was within ± 8% (the tolerance was measured by a metallographic section method).
[ example two ]
The manufacturing method of the planar capacitor provided by the second embodiment of the present invention is substantially the same as the manufacturing method of the planar capacitor in the first embodiment (fig. 1 to fig. 3), except that in this embodiment, the dielectric layer 12 with a certain thickness (10 μm) is coated on the first copper foil substrate (35 μm). The dielectric layer 12 is obtained by coating dielectric layer slurry on a first copper foil base material and drying. Specifically, dicyclopentadiene polyol diepoxy resin (360-440 g) is added into butanone solvent (2350-2450 g), and ultrasonic stirring is carried out for 30min at the temperature of 30 ℃ to obtain a dielectric layer slurry mixed solution; and adding inorganic filler lead titanate (660-750 g) into the mixed solution, performing ultrasonic stirring at the temperature of 30 ℃ for 30min, and performing ball milling for 10h to obtain dielectric layer slurry.
Passing the first copper foil base material coated with the dielectric layer 12 through a low-temperature drying box at a constant speed at a certain speed (4 m/min); the heating degree (drying degree) is controlled to be 1min in the first drying chamber and the third drying chamber which are both at the curing temperature of 35 percent of the dielectric layer 12 (the first drying temperature and the third drying temperature are both 55 ℃), and 3min in the second drying chamber which is at the curing temperature of 60 percent of the dielectric layer 12 (the second drying temperature is about 94 ℃), so that the dielectric layer 12 is in a semi-cured state or a state lower than the semi-cured state on the first copper foil base material.
The first copper foil substrate coated with the semi-cured or less-than-semi-cured dielectric layer 12 passes through the laminating unit at a speed of 4m/min and is laminated with the second copper foil substrate (35 μm) to finally obtain the planar capacitor 10 with uniform thickness. The thickness of the dielectric layer in the planar capacitor 10 obtained in this embodiment is 10 μm, and the thickness tolerance is within ± 10% (the tolerance is measured by a metallographic section method). .
It should be understood by those skilled in the art that the rest of the structure and the operation principle of the present embodiment are the same as those of the first embodiment, and are not described herein again.
[ third example ]
The manufacturing method of the planar capacitor provided by the third embodiment of the present invention is substantially the same as the manufacturing method of the planar capacitor in the first embodiment (fig. 1 to fig. 3), except that in this embodiment, the dielectric layer 12 with a certain thickness (5 μm) is coated on the first copper foil substrate (18 μm). The dielectric layer 12 is obtained by coating dielectric layer slurry on a first copper foil base material and drying. Specifically, 1, 2-epoxycyclohexane and 4, 5-diformic acid epoxy resin (360-450 g) are added into a butanone solvent (1950-2100 g), and ultrasonic stirring is carried out for 30min at the temperature of 30 ℃ to obtain a mixed solution of the dielectric layer slurry; and adding inorganic filler barium titanate (850-960 g) into the mixed solution, performing ultrasonic stirring at the temperature of 30 ℃ for 30min, and performing ball milling for 10h to obtain the dielectric layer slurry.
Passing the first copper foil base material coated with the dielectric layer 12 through a low-temperature drying box at a constant speed at a certain speed (6 m/min); the heating degree (drying degree) is controlled to be 1min in the first drying chamber and the third drying chamber which are both at the curing temperature of 35 percent of the dielectric layer 12 (the first drying temperature and the third drying temperature are both 55 ℃), and 3min in the second drying chamber which is at the curing temperature of 60 percent of the dielectric layer 12 (the second drying temperature is about 94 ℃), so that the dielectric layer 12 is in a semi-cured state or a state lower than the semi-cured state on the first copper foil base material;
the first copper foil substrate coated with the semi-cured or less-than-semi-cured dielectric layer 12 passes through the laminating unit at a speed of 6m/min and is laminated with the second copper foil substrate (18 μm), and finally the planar capacitor 10 with uniform thickness is obtained. The thickness of the dielectric layer in the planar capacitor 10 obtained in this example was 5 μm, and the thickness tolerance was within ± 10% (the tolerance was measured by a metallographic section method). .
It should be understood by those skilled in the art that the rest of the structure and the operation principle of the present embodiment are the same as those of the first embodiment, and are not described herein again.
[ example four ]
The manufacturing method of the planar capacitor provided by the fourth embodiment of the present invention is substantially the same as the manufacturing method of the planar capacitor in the first embodiment (fig. 1 to fig. 3), except that in this embodiment, the dielectric layer 12 with a certain thickness (12 μm) is coated on the first copper foil substrate (12 μm). The dielectric layer 12 is obtained by coating dielectric layer slurry on a first copper foil base material and drying. Specifically, adding mesityl oxide epoxy resin (260-340 g) into a pentanone solvent (850-950 g), and ultrasonically stirring at 25 ℃ for 35min to obtain a mixed solution of the dielectric layer slurry; and adding inorganic filler strontium lead titanate (360-470 g) into the mixed solution, performing ultrasonic stirring at the temperature of 25 ℃ for 30min, and performing ball milling for 10h to obtain the dielectric layer slurry.
Passing the first copper foil base material coated with the dielectric layer 12 through a low-temperature drying box at a constant speed at a certain speed (8 m/min); the heating degree (drying degree) is controlled to be 3.5min in a drying chamber at the curing temperature (drying temperature is 85 ℃) of 55% of the dielectric layer 12, so that the dielectric layer 12 is in a semi-curing state.
The first copper foil substrate coated with the cured dielectric layer 12 passes through the laminating unit at a speed of 8m/min and is laminated with the second copper foil substrate (12 μm) to finally obtain the planar capacitor 10 with uniform thickness. The thickness of the dielectric layer in the planar capacitor 10 obtained in this example was 12 μm with a thickness tolerance within ± 8% (the tolerance was measured by a metallographic section method). .
It should be understood by those skilled in the art that the rest of the structure and the operation principle of the present embodiment are the same as those of the first embodiment, and are not described herein again.
In this document, the terms upper, lower, left, right, front, rear and the like are used for defining the positions of the structures in the drawings and the positions of the structures relative to each other, and are only used for the clarity and convenience of the technical solution. It is to be understood that the use of the directional terms should not be taken to limit the scope of the claims. It is also to be understood that the terms "first" and "second," etc., are used herein for descriptive purposes only and are not to be construed as limiting in number or order.
Although the present invention has been described with reference to the preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (8)

1. The manufacturing method of the planar capacitor is characterized by providing a dielectric layer slurry coating device, wherein the dielectric layer slurry coating device comprises a coating tank (20), a gravure roller (30) and a brush (40), the coating tank (20) is used for containing dielectric layer slurry (121), the gravure roller (30) partially extends into the coating tank (20) and is immersed in the dielectric layer slurry (121), the gravure roller (30) can rotate relative to the coating tank (20) and coats the dielectric layer slurry (121) in the coating tank (20) onto the surface of a metal film (11), the gravure roller (30) comprises a starting end of material and a tail end of the coated material, the brush (40) is arranged at the tail end of the gravure roller (30), and the brush (40) is arranged at an edge contact angle between the gravure roller (30) and the liquid level of the dielectric layer slurry (121), the brush (40) is in contact with the surface of the gravure roller (30) and the liquid level of the medium layer slurry (121), the brush (40) is fixed, and the gravure roller (30) rotates relative to the brush (40);
the planar capacitor (10) comprises a first metal foil (11a), a second metal foil (11b) and a dielectric layer (12) arranged between the first metal foil (11a) and the second metal foil (11b), and the manufacturing method of the planar capacitor comprises the following steps:
manufacturing dielectric layer slurry (121) for forming the dielectric layer (12);
coating the dielectric layer slurry (121) on the surface of the first metal foil (11a) through the gravure roller (30), heating and drying the dielectric layer slurry at a preset drying temperature, and keeping the temperature for a preset time, wherein the drying temperature is 35-60% of the curing temperature of the dielectric layer slurry, and the preset time is 3-6 min;
firstly, preserving heat at a first drying temperature for a first preset time; preserving the heat at a second drying temperature for a second preset time; finally, the surface of the first metal foil (11a) is subjected to heat preservation at a third drying temperature for a third preset time to form the dielectric layer (12) in a semi-cured state or lower than the semi-cured state, wherein the first drying temperature of the dielectric layer (12) is more than or equal to 35 percent of the curing temperature, and the third drying temperature is less than or equal to 60 percent of the curing temperature of the dielectric layer (12);
and laminating the first metal foil (11a) and the second metal foil (11b) which are attached with the dielectric layer (12), wherein the surface of the first metal foil (11a) which is attached with the dielectric layer (12) faces the second metal foil (11b) for lamination, and the planar capacitor (10) is obtained.
2. The method for manufacturing a planar capacitor as claimed in claim 1, wherein the dielectric layer slurry coating device further comprises a scraper (50), and the scraper (50) is disposed at the beginning of the gravure roll (30) and contacts with the surface of the gravure roll (30).
3. The method of claim 1, wherein the brush (40) is inclined in a tangential direction of the gravure roll (30).
4. The method of claim 1, wherein the gravure roll (30) has a rough surface, and the gravure roll (30) has a plurality of grooves on the surface.
5. The method for manufacturing a planar capacitor as claimed in claim 1, wherein the dielectric layer paste (121) has a solid content of 50-80 wt% and a viscosity of 150-500 cp.
6. The method for manufacturing a planar capacitor according to claim 1, wherein the dielectric layer paste (121) comprises at least one of an epoxy resin, an inorganic filler, an additive and a solvent, wherein the epoxy resin is at least one of a glycidyl ether type epoxy resin, a glycidyl ester type epoxy resin, a glycidyl amine type epoxy resin, an alicyclic epoxy resin, an epoxidized olefin compound, a sugar cane polyol epoxy resin and a mixed structure epoxy resin; the auxiliary agent is at least one of a curing agent, a dispersing agent, a coupling agent, a flatting agent, a defoaming agent and an accelerating agent; the inorganic filler is at least one of barium sodium titanate, barium titanate, copper calcium titanate, strontium titanate, barium strontium titanate, calcium titanate, barium calcium titanate, lead zirconate titanate, lead sodium titanate and lead titanate; the solvent comprises at least one of acetone, pentanone, alcohol and butanone.
7. The method for fabricating a planar capacitor as claimed in claim 6, wherein the method for fabricating the dielectric layer paste (121) comprises:
adding epoxy resin into a first solvent, and stirring at the temperature of 20-40 ℃ for 15-35 min to obtain a mixed solution of the dielectric layer slurry (121);
stirring and dispersing inorganic filler in a second solvent to obtain a suspension of the dielectric layer slurry (121), and stirring and dispersing the suspension in the mixed solution;
and adding an auxiliary agent, stirring and mixing uniformly to obtain a mixture of the dielectric layer slurry (121), and pouring the mixture into a ball milling tank to perform ball milling for 5-15 h at a rotating speed of 100-200 rpm to obtain the dielectric layer slurry (121).
8. The method of claim 1, wherein the step of laminating the first metal foil (11a) and the second metal foil (11b) with the dielectric layer (12) attached thereto comprises:
pressing the first metal foil (11a) and the second metal foil (11b) attached with the dielectric layer (12) at a preset temperature and a preset pressure to obtain the planar capacitor (10) with uniform thickness;
the preset temperature is 100-150 ℃, and the preset pressure is 3-6 kg/cm2。
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