CN111818430A

CN111818430A - Loudspeaker

Info

Publication number: CN111818430A
Application number: CN202010885830.2A
Authority: CN
Inventors: 牛家鹏; 孙志军; 周冰洋
Original assignee: Goertek Inc
Current assignee: Goertek Inc
Priority date: 2020-08-28
Filing date: 2020-08-28
Publication date: 2020-10-23

Abstract

The invention discloses a loudspeaker, which comprises a shell and a vibration assembly arranged in the shell, wherein the vibration assembly comprises a voice coil, the voice coil is provided with a lead, a bonding pad is arranged on the shell, and the lead is fixed on the bonding pad and is electrically connected with an external circuit. In the invention, the buffer layer is arranged between the lead bonding pad and the shell, so that the buffer layer can buffer the vibration transmitted by the voice coil in the working process of the voice coil, and the larger stress generated at the joint of the lead and the bonding pad can be transferred, thereby inhibiting the resonance of the lead, preventing the resonance disconnection of the lead and improving the acoustic stability of the loudspeaker.

Description

Loudspeaker

Technical Field

The invention relates to the technical field of electroacoustic conversion, in particular to a loudspeaker.

Background

A speaker is an energy conversion device as an important acoustic component of a portable electronic device for performing conversion between an electrical signal and an acoustic signal. The loudspeaker usually includes vibration system and magnetic circuit, the vibration system includes vibrating diaphragm and voice coil that combine together, wherein the voice coil is the drive unit of the loudspeaker, when the alternating audio current passes the voice coil, the voice coil produces the magnetic field that changes with the audio current, this changing magnetic field and magnetic circuit of the loudspeaker produce the attraction or repulsion effect mutually, make the voice coil produce the mechanical vibration of cutting the magnetic line of force, thus drive vibrating diaphragm vibration and send out the sound. The voice coil is formed by winding a voice coil wire, and the starting end and the tail end of the voice coil wire are respectively led out to be used as voice coil lead wires and welded on the bonding pad.

Generally, the lead and the bonding pad are connected with the shell after being welded, and the bonding pad is in full-freedom-degree limited connection with the shell, so that in the working process of the voice coil, the connection part of the lead and the bonding pad can generate large stress due to the limitation of the freedom degree, and the disconnection is easily caused, so that the acoustic failure is caused.

Therefore, a technical solution capable of solving the technical problem that the lead is easily broken during the operation of the voice coil is needed to improve the reliability and the service life of the speaker, so that the speaker can adapt to the development trend of speaker products.

Disclosure of Invention

The invention mainly aims to provide a loudspeaker, and aims to solve the technical problem that a lead is easy to break in the working process of a voice coil of the loudspeaker.

In a first aspect, the present invention provides a speaker, including a housing, and a vibration assembly disposed in the housing, wherein the vibration assembly includes a voice coil, the voice coil has a lead, a bonding pad is disposed on the housing, and the lead is fixed to the bonding pad and electrically connected to an external circuit, and a buffer layer is disposed between the bonding pad and the housing; the voice coil can drive in the vibration process of the voice coil the pad vibrates, and the buffer layer provides a buffer force in the vibration process of the pad.

Preferably, the buffer layer is arranged between the bottom end or/and the side surface of the pad and the shell.

Preferably, the lead and the cable wire of the external circuit are electrically connected to the pad, and the voice coil is electrically connected to the external circuit through the pad.

Preferably, the buffer layer is silica gel or double-sided adhesive tape.

Preferably, the buffer layer is a silica gel layer, and the thickness of the silica gel layer is 0.1mm-1 mm.

Preferably, the buffer layer is a double-sided adhesive tape, and the thickness of the double-sided adhesive tape is 1mm-1.5 mm.

Preferably, the buffer layer is foam.

Preferably, the foam is adhered between the pad and the housing.

Preferably, the thickness of the foam layer is 1mm-1.5 mm.

Preferably, the speaker includes two pads, and buffer layers are respectively disposed between the two pads and the housing.

According to the loudspeaker, the buffer layer is arranged between the bonding pad and the shell, so that the bonding pad and the shell are not restricted by full freedom degree in the working process of the voice coil, and the buffer layer can buffer the vibration transmitted by the voice coil, so that larger stress generated by the lead is transferred, the resonance of the lead is inhibited, the lead is prevented from being broken, and the acoustic stability of the loudspeaker is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic perspective view of a voice coil and a housing of a speaker according to the present invention;

FIG. 2 is an enlarged schematic view of a portion of the speaker A of FIG. 1;

fig. 3 is a schematic cross-sectional view of a portion a of the speaker a shown in fig. 1.

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

The invention provides a loudspeaker, as shown in fig. 1, comprising a housing 2, wherein a vibration component is accommodated in the housing 2, and the housing 2 comprises a side wall and a bottom wall extending inwards from the side wall. It should be noted that the bottom wall of the housing 2 herein refers to only a portion extending from the side wall of the housing 2 to the inside, and in a specific implementation, the bottom wall of the housing 2 is not a structure capable of connecting two opposite side walls, and the middle portion of the bottom wall is mostly of a hollow design so as to be convenient for assembling with the magnetic circuit. The vibration assembly includes a voice coil 1, and the voice coil 1 has a lead wire 11. The lead 11 is electrically connected to the pad 3, the pad 3 is provided on the case 2, and the buffer layer 4 is provided between the pad 3 and the case 2.

As one embodiment, the pad 3 is disposed on the bottom wall, and the buffer layer 4 is disposed between the bottom end of the pad 3 and the housing 2. Alternatively, the buffer layers 4 are provided between the bottom and side surfaces of the pad 3 and the case 2. The buffer layer 4 buffers vibrations transmitted to the pad 3 during vibration of the voice coil.

In another embodiment, the bonding pad 3 is injection molded at the lower end of the sidewall, and both ends of the bonding pad are exposed out of the sidewall, and the buffer layer 4 is disposed between the bottom end of the bonding pad 3 at the inner portion of the sidewall and the bottom wall.

Further, the lead wire 11 and the cable wire of the external circuit are both soldered to the land 3, and for convenience of operation, both are soldered to the upper end surface of the land 3, and the voice coil 2 is electrically connected to the external circuit through the land 3.

Compared with the prior art in which the bonding pad 3 is directly arranged on the shell 2, the buffer layer 4 is arranged between the bonding pad 3 and the shell 2 of the loudspeaker, so that the shell 2 and the bonding pad 3 are not constrained by full freedom. Through the setting of buffer layer 4, among the messenger voice coil 2 vibration process, the vibration that voice coil 2 conducted pad 3 through lead wire 11 can be buffered by buffer layer 4 to make the great stress that lead wire 11 produced obtain shifting, avoid arousing lead wire 11 resonance to lead to the broken string, thereby improve the acoustics reliability of speaker. The buffer layer 4 is arranged between the bonding pad 3 and the shell 4, so that the vibration conducted by the lead 11 can be buffered, and the vibration amplitude of the voice coil 1 can not be limited by interference, therefore, the acoustic performance of the loudspeaker cannot be influenced by the buffer layer 4, the reliability of the loudspeaker is improved, and the service life of the loudspeaker is prolonged.

Furthermore, the material of the buffer layer 4 is soft glue, preferably silica gel, and the silica gel can directly realize the vibration force of the buffer pad 3 and the effect of the fixed pad 3. The thickness range of the silica gel layer is 0.1mm-1mm, and in the thickness range, the silica gel layer can buffer the vibration transmitted by the lead 11 and does not occupy too much space. Furthermore, the buffer layer 4 can also be made of thicker double-sided adhesive, and the thickness of the double-sided adhesive layer is 1mm-1.5mm due to the large compression allowance of the double-sided adhesive. In specific implementation, the thickness of the buffer layer is limited according to the actual space of the loudspeaker.

As another embodiment of the present invention, the cushioning layer 4 may also be made of foam. The foam is adhered between the shell and the bonding pad through glue, and preferably adhered through soft glue, so that better buffering performance is realized. The thickness of the foam layer is preferably 1mm to 1.5 mm.

As shown in fig. 1, the speaker of the present invention has two pads 3 corresponding to the wire inlet end and the wire outlet end of the lead 11, wherein a buffer layer 4 is disposed between each of the two pads 3 and the housing 2. The shape of the buffer layer 4 is set according to the shape of the pad 3, and is determined by the shape of the housing 2 and the vibration space, which are well known to those skilled in the art and will not be described herein.

The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A loudspeaker comprises a shell and a vibration assembly arranged in the shell, wherein the vibration assembly comprises a voice coil, the voice coil is provided with a lead, a bonding pad is arranged on the shell, and the lead is fixed on the bonding pad and is electrically connected with an external circuit;

the voice coil can drive in the vibration process of the voice coil the pad vibrates, and the buffer layer provides a buffer force in the vibration process of the pad.

2. A loudspeaker according to claim 1, wherein the buffer layer is provided between the bottom or/and side of the pad and the enclosure.

3. The speaker of claim 1, wherein the lead and a cable wire of the external circuit are electrically connected to the pad, and the electrical connection of the voice coil and the external circuit is achieved through the pad.

4. The loudspeaker of claim 1, wherein the buffer layer is silicone or double-sided tape.

5. The loudspeaker of claim 4, wherein the buffer layer is a silicone layer, and the thickness of the silicone layer is 0.1mm to 1 mm.

6. The loudspeaker of claim 4, wherein the buffer layer is a double-sided adhesive tape, and the thickness of the double-sided adhesive tape is 1mm to 1.5 mm.

7. The loudspeaker of claim 1, wherein the cushioning layer is foam.

8. The loudspeaker in accordance with claim 7 wherein the foam is adhered between the pad and the housing.

9. The loudspeaker in accordance with claim 8 wherein the foam layer is 1mm to 1.5mm thick.

10. The loudspeaker of claim 1, wherein the loudspeaker includes two pads, and a buffer layer is disposed between each of the two pads and the enclosure.