CN111816640A - BGA electromagnetic shielding packaging structure and manufacturing method thereof - Google Patents
BGA electromagnetic shielding packaging structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN111816640A CN111816640A CN202010487677.8A CN202010487677A CN111816640A CN 111816640 A CN111816640 A CN 111816640A CN 202010487677 A CN202010487677 A CN 202010487677A CN 111816640 A CN111816640 A CN 111816640A
- Authority
- CN
- China
- Prior art keywords
- copper
- substrate
- copper columns
- columns
- bga
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Abstract
The invention relates to a BGA electromagnetic shielding packaging structure and a manufacturing method thereof, wherein the packaging structure comprises a substrate (1), an element (2) is attached to the surface of the substrate (1), two rows of copper columns (3) which are arranged in a staggered mode are arranged on the periphery of the element (2), a plastic packaging material (4) is encapsulated in the peripheral area of the element (2) and the copper columns (3), the top of each copper column (3) is exposed out of the upper surface of the plastic packaging material (4), sputtering layers (5) are arranged on the upper surfaces of the plastic packaging material (4) and the copper columns (3), and metal balls (6) are arranged on the back surface of the substrate (1). The invention relates to a BGA electromagnetic shielding packaging structure and a manufacturing method thereof, which can solve the problems that the side sputtering quality of the existing product is poor and the shielding requirement is difficult to meet.
Description
Technical Field
The invention relates to a BGA electromagnetic shielding packaging structure and a manufacturing method thereof, belonging to the technical field of semiconductor packaging.
Background
During the sputtering process of the BGA product, the bottom solder balls need to be protected to prevent the metal layer sputtered during the sputtering process from being conducted with the bottom solder balls to cause short circuit. The prior art solves the problem by the scheme that:
step 1: pressing the packaged whole product on a first protective film, wherein the first protective film can protect the bottom pins or the solder balls so as to prevent the bottom pins or the solder balls from being plated during sputtering;
step 2: cutting the whole product into single products;
and step 3: transferring the single product to a PI film, and arranging the single product on the PI film in an array at a certain interval;
and 4, step 4: sputtering metal layers on the top surface and the peripheral side surfaces of the single product finished in the step 3;
and 5: stripping the PI film on the sputtered single product;
step 6: and sticking a second protective film with higher viscosity on the first protective film so as to separate the first protective film from the sputtered single product through the second protective film.
The process of the prior art is complex, each step is not enough, time and labor are wasted, the cost is increased, and in addition, the sputtering quality of the side face of the product obtained by the scheme is poor, so that the shielding requirement is difficult to meet.
Disclosure of Invention
The invention aims to solve the technical problem of providing a BGA electromagnetic shielding packaging structure and a manufacturing method thereof aiming at the prior art, and the BGA electromagnetic shielding packaging structure can solve the problems that the side sputtering quality of the existing product is poor and the shielding requirement is difficult to meet.
The technical scheme adopted by the invention for solving the problems is as follows:
a BGA electromagnetic shielding packaging structure comprises a substrate, wherein elements are mounted on the surface of the substrate in an attached mode, two rows of copper columns which are arranged in a staggered mode are arranged on the periphery of the elements, a plastic packaging material is packaged in the peripheral area of the elements and the copper columns, the tops of the copper columns are exposed out of the upper surface of the plastic packaging material, sputtering layers are arranged on the upper surfaces of the plastic packaging material and the copper columns, and metal balls are arranged on the back of the substrate.
The utility model provides a BGA electromagnetic shield packaging structure, it includes the base plate, the component is equipped with in the base plate surface subsides, the component periphery is provided with two rows of staggered arrangement's inside and outside copper post, the component has encapsulated plastic-sealed material with the peripheral region of copper post, the plastic-sealed material upper surface is provided with the trompil in the copper post corresponds the position, the trompil makes copper post top expose, be provided with in plastic-sealed material upper surface and the trompil and spatter the cladding material, spatter the cladding material and be connected with copper post top, the base plate back is provided with the metal ball.
A method of manufacturing a BGA electromagnetically shielded package structure, the method comprising the steps of:
firstly, laying a dry film on the surface of a substrate;
step two, removing a dry film of a subsequent copper column area needing electroplating by exposure and development;
electroplating copper columns, namely electroplating two rows of copper columns which are staggered with each other inside and outside on the edge of each unit product;
step four, removing the residual dry film;
fifthly, mounting elements in the inner area of the copper column on the surface of the substrate;
step six, encapsulating the surface of the substrate, and encapsulating the mounted element and the copper column by using a plastic encapsulating material;
step seven, thinning the upper surface of the plastic packaging material or exposing the top of the copper column in a drilling mode;
step eight, sputtering the upper surface of the whole packaged product, wherein the sputtering layer covers the upper surfaces of the exposed copper columns and the plastic package material;
planting balls at the bottom of the whole packaged product;
step ten, cutting the whole packaged product into single products.
Preferably, the two rows of copper columns in the third step comprise an inner row of copper columns and an outer row of copper columns, and each copper column consists of a plurality of copper columns.
Preferably, the height of the copper column in the third step is less than 100 um.
Preferably, gaps are reserved among the copper columns in the third step, the gaps of the inner row of copper columns and the gaps of the outer row of copper columns are staggered, and the gap distance is smaller than 100 um.
Compared with the prior art, the invention has the advantages that:
1. according to the invention, the electromagnetic shielding around the product is realized by plating the inner row and the outer row of staggered copper columns on the substrate, and then the sputtering is carried out on the upper surface of the whole packaged product, so that the copper columns around and the sputtering metal layer on the upper surface can meet the integral electromagnetic shielding requirement;
2. the whole packaged product is operated when the metal layer is sputtered, single operation is not needed, and the sputtering process does not need a bottom film to protect the solder balls before the solder balls are prepared, so that the production cost is saved, the process flow is reduced, and the production efficiency is improved;
3. the invention does not have the defects of the prior BGA sputtering product, such as the problems of adhesive residue, excessive plating, burrs and the like, and improves the product quality.
Drawings
Fig. 1 is a schematic view of an embodiment 1 of a BGA electromagnetic shielding package structure of the present invention.
Fig. 2 to 11 are schematic process flow diagrams of a method for manufacturing a BGA electromagnetic shielding package structure according to embodiment 1 of the present invention, wherein fig. 5 is a top view of fig. 4.
Fig. 12 is a schematic view of an embodiment 2 of a BGA electromagnetic shielding package structure of the present invention.
Fig. 13 to 22 are schematic process flow diagrams of a method for manufacturing a BGA electromagnetic shielding package structure according to embodiment 1 of the present invention, wherein fig. 16 is a top view of fig. 15.
Wherein:
substrate 1
Component 2
And (7) opening a hole.
Detailed Description
The invention is described in further detail below with reference to the accompanying examples.
Example 1:
as shown in fig. 1, the BGA electromagnetic shielding package structure of the present invention includes a substrate 1, a component 2 is mounted on a surface of the substrate 1, two rows of inner and outer copper pillars 3 are disposed on a periphery of the component 2, the component 2 and a peripheral region of the copper pillars 3 are encapsulated with a molding compound 4, a top of the copper pillar 3 is exposed out of an upper surface of the molding compound 4, sputtering layers 5 are disposed on upper surfaces of the molding compound 4 and the copper pillars 3, and a metal ball 6 is disposed on a back surface of the substrate 1;
the manufacturing method comprises the following steps:
step one, referring to fig. 2, laying a dry film on the surface of a substrate;
step two, referring to fig. 3, exposing and developing the dry film, removing part of the dry film, and exposing the subsequent copper pillar area needing electroplating;
step three, referring to fig. 4 and 5, electroplating copper columns in the exposed areas of the dry films, and electroplating two rows of copper columns which are staggered with each other inside and outside the edges of each unit product;
the height of the copper columns is less than 100um, the inner row of copper columns and the outer row of copper columns are both composed of a plurality of copper columns, gaps are reserved among the copper columns, the gap distance is less than 100um, and the gaps of the inner row of copper columns and the outer row of copper columns are staggered;
step four, referring to fig. 6, removing the remaining dry film;
step five, referring to fig. 7, mounting elements in the inner area of the inner row of copper columns on the surface of the substrate;
step six, referring to fig. 8, encapsulating the surface of the substrate, and encapsulating the copper cylinder and the mounted element by using a plastic package material;
seventhly, referring to fig. 9, thinning the plastic packaging material on the upper surface until the copper column is exposed;
step eight, referring to fig. 10, sputtering the upper surface of the whole packaging product, wherein the sputtering layer covers the upper surfaces of the exposed copper column and the plastic packaging material;
step nine, referring to fig. 11, ball planting is performed on the bottom of the whole packaged product;
step ten, cutting the whole packaged product into single products.
Example 2:
as shown in fig. 12, the BGA electromagnetic shielding package structure according to the present invention includes a substrate 1, a component 2 is attached to a surface of the substrate 1, two rows of inner and outer copper pillars 3 are disposed on a periphery of the component 2, a plastic package material 4 is encapsulated in a peripheral area of the component 2 and the copper pillars 3, an opening 7 is disposed on an upper surface of the plastic package material 4 at a position corresponding to the copper pillars 3, the opening 7 exposes a top of the copper pillars 3, sputtering layers 5 are disposed on the upper surface of the plastic package material 4 and the opening 7, the sputtering layers 5 are connected to tops of the copper pillars 3, and a metal ball 6 is disposed on a back surface of the substrate 1;
the manufacturing method comprises the following steps:
step one, referring to fig. 13, laying a dry film on the surface of a substrate;
step two, referring to fig. 14, exposing and developing the dry film, removing part of the dry film, and exposing the subsequent copper pillar area needing electroplating;
step three, referring to fig. 15 and 16, electroplating copper columns in the exposed areas of the dry films, and electroplating two rows of copper columns staggered with each other inside and outside the edges of each unit product;
step four, referring to fig. 17, removing the remaining dry film;
step five, referring to fig. 18, mounting elements in the inner area of the inner row of copper columns on the surface of the substrate;
step six, referring to fig. 19, encapsulating the surface of the substrate, and encapsulating the copper cylinder and the mounted element by using a plastic package material;
seventhly, referring to fig. 20, exposing the upper surface of the copper pillar in a mechanical drilling mode, a chemical etching mode or a laser drilling mode;
step eight, referring to fig. 21, sputtering the upper surface of the whole packaging product, wherein the sputtering layer covers the upper surfaces of the exposed copper column and the plastic packaging material;
step nine, referring to fig. 22, ball planting is performed on the bottom of the whole packaged product;
step ten, cutting the whole packaged product into single products.
In addition, the present invention also includes other embodiments, and any technical solutions formed by equivalent transformation or equivalent replacement should fall within the protection scope of the claims of the present invention.
Claims (6)
1. A BGA electromagnetic shielding packaging structure is characterized in that: the packaging structure comprises a substrate (1), wherein an element (2) is attached to the surface of the substrate (1), two rows of copper columns (3) which are arranged in a staggered mode are arranged on the periphery of the element (2), a plastic package material (4) is packaged in the peripheral area of the element (2) and the copper columns (3), the top of each copper column (3) is exposed out of the upper surface of the plastic package material (4), sputtering layers (5) are arranged on the upper surfaces of the plastic package material (4) and the copper columns (3), and metal balls (6) are arranged on the back surface of the substrate (1).
2. A BGA electromagnetic shielding packaging structure is characterized in that: the novel copper column packaging structure comprises a substrate (1), wherein an element (2) is attached to the surface of the substrate (1), two rows of inner and outer copper columns (3) which are arranged in a staggered mode are arranged on the periphery of the element (2), a plastic package material (4) is encapsulated in the peripheral area of the element (2) and the copper columns (3), open holes (7) are formed in the corresponding positions of the copper columns (3) on the upper surface of the plastic package material (4), the tops of the copper columns (3) are exposed through the open holes (7), sputtering layers (5) are arranged in the upper surface of the plastic package material (4) and the open holes (7), the sputtering layers (5) are connected with the tops of the copper columns (3), and metal balls (6) are arranged on the back surface of the substrate.
3. A method for manufacturing a BGA electromagnetic shielding packaging structure is characterized by comprising the following steps:
firstly, laying a dry film on the surface of a substrate;
step two, removing a dry film of a subsequent copper column area needing electroplating by exposure and development;
electroplating copper columns, namely electroplating two rows of copper columns which are staggered with each other inside and outside on the edge of each unit product;
step four, removing the residual dry film;
fifthly, mounting elements in the inner area of the copper column on the surface of the substrate;
step six, encapsulating the surface of the substrate, and encapsulating the mounted element and the copper column by using a plastic package material;
step seven, thinning the upper surface of the plastic packaging material or exposing the top of the copper column in a drilling mode;
step eight, sputtering the upper surface of the whole packaging product, wherein the sputtering layer covers the surfaces of the exposed copper column and the plastic packaging material;
planting balls at the bottom of the whole packaged product;
step ten, cutting the whole packaged product into single products.
4. The method of claim 3, wherein the step of manufacturing the BGA electromagnetic shielding package comprises: and the two rows of copper columns in the third step comprise an inner row of copper columns and an outer row of copper columns, and each copper column consists of a plurality of copper columns.
5. The method of claim 3, wherein the step of manufacturing the BGA electromagnetic shielding package comprises: and in the third step, the height of the copper column is less than 100 um.
6. The method of claim 4, wherein the step of manufacturing the BGA electromagnetic shielding package comprises: gaps are reserved among the copper columns in the third step, the gaps of the inner row of copper columns and the gaps of the outer row of copper columns are staggered, and the gap distance is smaller than 100 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010487677.8A CN111816640A (en) | 2020-06-02 | 2020-06-02 | BGA electromagnetic shielding packaging structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010487677.8A CN111816640A (en) | 2020-06-02 | 2020-06-02 | BGA electromagnetic shielding packaging structure and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111816640A true CN111816640A (en) | 2020-10-23 |
Family
ID=72848718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010487677.8A Pending CN111816640A (en) | 2020-06-02 | 2020-06-02 | BGA electromagnetic shielding packaging structure and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111816640A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180374798A1 (en) * | 2017-06-24 | 2018-12-27 | Amkor Technology, Inc. | Semiconductor device having emi shielding structure and related methods |
| CN109727928A (en) * | 2017-10-30 | 2019-05-07 | 长鑫存储技术有限公司 | Semiconductor package and manufacturing method with electromagnetic interference shield |
| US20200013721A1 (en) * | 2018-07-09 | 2020-01-09 | Powertech Technology Inc. | Semiconductor package and manufacturing method thereof |
| US20200051882A1 (en) * | 2017-07-28 | 2020-02-13 | Micron Technology, Inc. | Shielded fan-out packaged semiconductor device and method of manufacturing |
-
2020
- 2020-06-02 CN CN202010487677.8A patent/CN111816640A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180374798A1 (en) * | 2017-06-24 | 2018-12-27 | Amkor Technology, Inc. | Semiconductor device having emi shielding structure and related methods |
| US20200051882A1 (en) * | 2017-07-28 | 2020-02-13 | Micron Technology, Inc. | Shielded fan-out packaged semiconductor device and method of manufacturing |
| CN109727928A (en) * | 2017-10-30 | 2019-05-07 | 长鑫存储技术有限公司 | Semiconductor package and manufacturing method with electromagnetic interference shield |
| US20200013721A1 (en) * | 2018-07-09 | 2020-01-09 | Powertech Technology Inc. | Semiconductor package and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101971326B (en) | Electromagnetic shield formation for integrated circuit die package | |
| EP2537182B1 (en) | Microelectronic package with terminals on dielectric mass | |
| KR100829278B1 (en) | Semiconductor Device and Manufacture Method of That | |
| US7141868B2 (en) | Flash preventing substrate and method for fabricating the same | |
| US7825499B2 (en) | Semiconductor package and trenched semiconductor power device using the same | |
| US10049950B2 (en) | Multi-layer substrate for semiconductor packaging | |
| US20090236739A1 (en) | Semiconductor package having substrate id code and its fabricating method | |
| WO2006074543A1 (en) | Thin array plastic package without die attach pad and process for fabricating the same | |
| US10825782B2 (en) | Semiconductor packages and associated methods with solder mask opening(s) for in-package ground and conformal coating contact | |
| CN108231743A (en) | Wafer scale metallic shield encapsulating structure and its manufacturing method | |
| CN105336629B (en) | The manufacturing method and Electronic Packaging module of Electronic Packaging module | |
| CN101388374A (en) | Chip package substrate and projection welding plate construction | |
| US8400774B2 (en) | Packaging techniques and configurations | |
| US11387190B2 (en) | Shielded electronic modules and methods of forming the same utilizing plating and double-cut singulation | |
| CN111816640A (en) | BGA electromagnetic shielding packaging structure and manufacturing method thereof | |
| US7511366B2 (en) | Multi-row substrate strip and method for manufacturing the same | |
| CN115000050B (en) | Electromagnetic shielding packaging structure and manufacturing method | |
| CN201247771Y (en) | Chip package substrate and projection welding plate construction | |
| CN112397400B (en) | Semiconductor packaging method | |
| US6875637B2 (en) | Semiconductor package insulation film and manufacturing method thereof | |
| CN111834330A (en) | Novel semiconductor packaging structure and manufacturing process thereof | |
| US6894374B2 (en) | Semiconductor package insulation film and manufacturing method thereof | |
| CN111834329B (en) | Semiconductor packaging structure and manufacturing method thereof | |
| CN111180403B (en) | Packaging structure with graphene layer for heat dissipation and manufacturing method thereof | |
| KR101678969B1 (en) | Microelectronic package with terminals on dielectric mass |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201023 |
|
| RJ01 | Rejection of invention patent application after publication |