CN111813187B - Heat dissipation device and server - Google Patents
Heat dissipation device and server Download PDFInfo
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- CN111813187B CN111813187B CN202010597722.5A CN202010597722A CN111813187B CN 111813187 B CN111813187 B CN 111813187B CN 202010597722 A CN202010597722 A CN 202010597722A CN 111813187 B CN111813187 B CN 111813187B
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- heat dissipation
- wind shield
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
The invention belongs to the technical field of heat dissipation equipment, and particularly relates to a heat dissipation device and a server. The heat dissipating double-fuselage includes: the heat dissipation structure comprises a fixed frame with a mounting cavity and a heat dissipation fan which is positioned in the mounting cavity and used for driving air to flow, wherein the fixed frame is provided with a heat dissipation hole communicated with the mounting cavity and a vent hole for allowing external air to flow into the mounting cavity, and the heat dissipation fan is provided with an air inlet; the anti-backflow structure comprises a wind shield and a sensing piece, wherein the wind shield is arranged opposite to the air inlet and positioned in the mounting cavity, the wind shield is connected with the fixing frame in a sliding mode, and the sensing piece is positioned between the wind shield and the heat dissipation fan and used for sensing the flow direction of gas; the driving structure is used for driving the wind shield to slide; the response piece will trigger the drive structure when sensing gas by air intake flow direction deep bead to make drive structure drive deep bead slide towards the heat dissipation fan and sealed the air intake. The invention can prevent the gas from generating backflow at the radiating fan.
Description
Technical Field
The invention belongs to the technical field of heat dissipation equipment, and particularly relates to a heat dissipation device and a server.
Background
At present, a server is generally provided with four heat dissipation fans to convey airflow to a mainboard of the server together in a normal state, and the airflow flows to the mainboard from the four heat dissipation fans. When the four heat dissipation fans work normally, the phenomenon of airflow backflow does not exist.
However, when some of the heat dissipation fans fail, for example, one heat dissipation fan fails, some of the airflow blown by the other three heat dissipation fans may flow back from the failed heat dissipation fan, thereby causing the heat dissipation efficiency of the server motherboard to be lost and reduced, or performing useless heat dissipation, thereby causing the components on the motherboard to fail due to an excessive temperature.
Disclosure of Invention
An object of the embodiment of the present application is to provide a heat dissipation apparatus, which aims to solve the problem of how to avoid the backflow of gas at a heat dissipation fan after the heat dissipation fan fails.
In order to achieve the purpose, the technical scheme adopted by the application is as follows: provided is a heat dissipating device, including:
the heat dissipation structure comprises a fixed frame with a mounting cavity and a heat dissipation fan which is positioned in the mounting cavity and used for driving air to flow, wherein the fixed frame is provided with heat dissipation holes communicated with the mounting cavity and vent holes for allowing external air to flow into the mounting cavity;
the anti-backflow structure comprises a wind shield and a sensing piece, wherein the wind shield is arranged opposite to the air inlet and is positioned in the placement cavity, the wind shield is connected with the fixing frame in a sliding mode, and the sensing piece is positioned between the wind shield and the heat dissipation fan and is used for sensing the flow direction of the gas; and
the driving structure is used for driving the wind deflector to slide;
when the induction piece induces that the air flows to the wind shield from the air inlet, the driving structure is triggered, so that the driving structure drives the wind shield to slide towards the heat dissipation fan and seal the air inlet.
In one embodiment, the driving structure comprises an elastic piece with elastic restoring force and a locking mechanism, wherein the locking mechanism has a locking state and an unlocking state; when the locking mechanism is in the locking state, the wind shield is limited to slide; when the locking mechanism is in the unlocking state, the sliding limitation on the wind shield is removed; the one end of elastic component is fixed to be set up, the other end butt of elastic component and orientation the heat dissipation fan bulldozes the deep bead, the response piece is sensing gaseous by the air intake flow direction during the deep bead, triggers latched device is in the unblock state.
In one embodiment, the response piece includes wind direction tablet and rotates and connects the lever arm of fixed frame, the one end of lever arm is connected the wind direction tablet, the other end of lever arm is connected latched device, gaseous follow the air intake flow direction deep bead promotes wind direction tablet, the wind direction tablet drives the lever arm rotates, so that the lever arm triggers latched device switches to the unblock state.
In one embodiment, the length from the transition point of the lever arm and the fixed frame to the wind direction sensing plate is greater than the length from the transition point to the locking mechanism.
In one embodiment, the locking mechanism includes a female buckle disposed on the wind deflector and a male buckle engaged with the female buckle, and the male buckle is connected to the lever arm.
In one embodiment, a fastening groove is formed in one end of the female buckle, which is matched with the male buckle, and one end of the male buckle is clamped into the fastening groove.
In one embodiment, the resilient member is a tube spring.
In one embodiment, the heat dissipation device further comprises a guide structure, the guide structure comprises a guide rail arranged in the placement cavity and a sliding block connected with the wind shield and matched with the guide rail, and the length direction of the guide rail is the same as the flowing direction of the gas.
In one embodiment, the heat dissipation holes are provided in plural, one heat dissipation fan is correspondingly provided at each heat dissipation hole, and the anti-backflow structure and the driving structure are correspondingly provided for each heat dissipation fan.
Another objective of the present application is to provide a server, which includes the heat dissipation device as described above, the server further includes a chassis and a motherboard disposed in the chassis, and the heat dissipation device is connected to the chassis and configured to dissipate heat from the motherboard.
The beneficial effect of this application lies in: after the heat dissipation fan became invalid, the gaseous of backward flow got into from the louvre and settled the chamber and flowed to the deep bead from the air intake, and the response piece was after sensing gaseous flow this moment, triggered drive structure work, made drive structure drive deep bead slide towards the air intake to sealed air intake after sliding to target in place, thereby make and carry out radiating gaseous unable follow air intake to pass through to the mainboard, and then prevent radiating gaseous and produce the backward flow in heat dissipation fan department.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a heat dissipation fan of a heat dissipation device according to an embodiment of the present disclosure during normal operation;
fig. 2 is a schematic structural diagram of a heat dissipating device according to an embodiment of the present disclosure when a heat dissipating fan fails.
Wherein, in the figures, the respective reference numerals:
100. a heat sink; 10. a heat dissipation structure; 11. a fixing frame; 12. a heat dissipation fan; 111. a placement cavity; 112. heat dissipation holes; 113. a vent hole; 121. an air inlet; 122. an air outlet; 40. a guide structure; 41. a guide rail; 20. a backflow prevention structure; 21. a wind deflector; 22. a sensing member; 221. a wind direction sensing plate; 222. a lever arm; 30. a drive wool structure; 31. a latch mechanism; 32. an elastic member; 33. a fixing member; 311. a female buckle; 312. a male buckle;
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1 and fig. 2, a heat dissipation device 100 for dissipating heat from a motherboard is provided in an embodiment of the present application. It includes a heat dissipation structure 10, a backflow prevention structure 20, and a driving structure. The heat dissipation structure 10 includes a fixing frame 11 having a mounting cavity 111 and a heat dissipation fan 12 located in the mounting cavity 111 and used for driving air to flow, the fixing frame 11 is provided with a heat dissipation hole 112 communicating with the mounting cavity 111 and a vent hole 113 for allowing external air to flow into the mounting cavity 111, the heat dissipation fan 12 has an air inlet 121, air enters the mounting cavity 111 through the vent hole 113, flows into the heat dissipation fan 12 through the air inlet 121, and then flows out of the mounting cavity 111 through the heat dissipation hole 112. It can be understood that the heat dissipation fan 12 also has an air outlet 122, the air outlet 122 is used for conveying air to the heat dissipation hole 112, the air flows in the direction shown in fig. 1, and the air coming out from the heat dissipation hole 112 can dissipate heat of the motherboard. The backflow prevention structure 20 includes a wind deflector 21 disposed opposite to the air inlet 121 and located in the installation cavity 111, and a sensing member 22, wherein the wind deflector 21 is slidably connected to the fixing frame 11, and optionally, a plate edge of the wind deflector 21 is disposed in a gap with an inner wall of the installation cavity 111, so that air can flow into the heat dissipation fan 12 from the gap when the heat dissipation fan 12 is in normal operation. The sensing member 22 is located between the wind shield 21 and the heat dissipation fan 12 and senses a flow direction of the gas. The driving structure is used for driving the wind deflector 21 to slide towards the air inlet 121. When the sensing member 22 senses that the air flows from the air inlet 121 to the air blocking plate 21, the driving structure is triggered, so that the driving structure drives the air blocking plate 21 to slide towards the heat dissipating fan 12 and seal the air inlet 121.
Referring to fig. 1 and 2, after the heat dissipation fan 12 fails, the reflowing gas enters the installation cavity 111 from the heat dissipation hole 112 and flows to the wind shield 21 from the air inlet 121, the flow direction of the gas is as shown in fig. 2, at this time, the sensing element 22 triggers the driving structure to work after sensing the flow direction of the gas, so that the driving structure drives the wind shield 21 to slide towards the air inlet 121, and the air inlet 121 is sealed after sliding to a proper position, so that the gas for dissipating heat of the motherboard cannot pass through the air inlet 121, and the gas is prevented from reflowing at the heat dissipation fan 12.
In one embodiment, the driving structure comprises an elastic member 32 having an elastic restoring force and a latch mechanism 31, the latch mechanism 31 has a latched state and an unlatched state, and when the latch mechanism 31 is in the latched state, the latch mechanism 31 restricts the sliding of the wind deflector 21; when the latch mechanism 31 is in the unlocked state, the latch mechanism 31 releases the sliding restriction on the wind deflector 21, one end of the elastic member 32 is fixedly disposed, and the other end of the elastic member 32 abuts against and pushes the wind deflector 21 toward the heat dissipation fan 12, and optionally, the elastic member 32 is in a compressed state, thereby generating a continuous thrust on the wind deflector 21. When the sensing member 22 senses that gas flows from the air inlet 121 to the air deflector 21, the latching mechanism 31 is triggered to be in an unlocked state, so that the elastic member 32 pushes the air deflector 21 to slide towards the air inlet 121 by means of self deformation, and the air inlet 121 is sealed after the elastic member slides in place.
Referring to fig. 1 and 2, in an embodiment, the sensor 22 includes a wind direction sensing plate 221 and a lever arm 222 rotatably connected to the fixed frame 11, one end of the lever arm 222 is connected to the wind direction sensing plate 221, and the other end of the lever arm 222 is connected to the locking mechanism 31, when air flows from the air inlet 121 to the wind deflector 21, the wind direction sensing plate 221 is pushed by the air and drives the lever arm 222 to rotate, so that the other end of the lever arm 222 triggers the locking mechanism 31 to switch to the unlocking state. Alternatively, the lever arm 222 is set to rotate only in a predetermined direction and triggers the latch mechanism 31 to switch to the unlocked state, so that the elastic member 32 can push the wind deflector 21 to slide toward the wind inlet 121.
In one embodiment, the length from the transition point of the lever arm 222 and the fixed frame 11 to the wind direction sensing plate 221 is greater than the length from the transition point to the latching mechanism 31. Thus, according to the lever principle, only a slight gas flow is required to trigger the lever arm 222 to rotate, so that the locking mechanism 31 is switched to the unlocked state.
In one embodiment, the locking mechanism 31 includes a female button 311 disposed on the windshield 21 and a male button 312 engaged with the female button 311, the male button 312 being connected to the lever arm 222. The male buckle 312 and the female buckle 311 are engaged with each other to lock the latch mechanism 31, thereby restricting the sliding of the windshield 21. By disengaging the male snap 312 and the female snap 311, the latch mechanism 31 is in the unlocked state, and the restriction of the sliding of the wind deflector 21 is released.
Referring to fig. 1 and fig. 2, in an embodiment, a buckle slot is formed at one end of the female buckle 311, which is matched with the male buckle 312, and one end of the male buckle 312 is clamped into the buckle slot.
In one embodiment, the resilient member 32 is a tube spring. Alternatively, the tube spring may be provided in plural at intervals. The driving structure further includes a fixing member 33, and the fixing member 33 is used for fixing the elastic member 32.
Referring to fig. 1 and 2, in an embodiment, the heat dissipation device 100 further includes a guiding structure 40, the guiding structure 40 includes a guide rail 41 disposed in the installation cavity 111 and a slider connected to the wind deflector 21 and cooperating with the guide rail 41, and a length direction of the guide rail 41 is the same as a flowing direction of the air. The wind deflector 21 can be guided to slide smoothly by the cooperation of the guide rail 41 and the slider.
In one embodiment, two guide structures 40 are spaced apart.
In one embodiment, a plurality of heat dissipation holes 112 are formed, a heat dissipation fan 12 is correspondingly disposed at each heat dissipation hole 112, and a backflow prevention structure 20 and a driving structure are correspondingly disposed at each heat dissipation fan 12.
Referring to fig. 1 and fig. 2, the present invention further provides a server, where the server includes a heat dissipation device 100, and the specific structure of the heat dissipation device 100 refers to the above embodiments, and since the server employs all technical solutions of all the above embodiments, the server also has all beneficial effects brought by the technical solutions of the above embodiments, which are not repeated herein.
In an embodiment, the server further includes a chassis and a motherboard disposed in the chassis, and the heat dissipation device 100 is connected to the chassis and configured to dissipate heat of the motherboard. Alternatively, the fixing frame 11 may be located in the case, and the plurality of heat dissipation fans 12 dissipate heat of the main board at the same time.
The present invention is not intended to be limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed.
Claims (8)
1. A heat dissipating device, comprising:
the heat dissipation structure comprises a fixed frame with a mounting cavity and a heat dissipation fan which is positioned in the mounting cavity and used for driving air to flow, wherein the fixed frame is provided with heat dissipation holes communicated with the mounting cavity and vent holes for allowing external air to flow into the mounting cavity;
the anti-backflow structure comprises a wind shield and a sensing piece, wherein the wind shield is arranged opposite to the air inlet and is positioned in the placement cavity, the wind shield is connected with the fixing frame in a sliding mode, and the sensing piece is positioned between the wind shield and the heat dissipation fan and is used for sensing the flow direction of the gas; and
the driving structure is used for driving the wind deflector to slide;
when the sensing piece senses that the air flows to the wind shield from the air inlet, the driving structure is triggered, so that the driving structure drives the wind shield to slide towards the heat dissipation fan and seal the air inlet;
the driving structure comprises an elastic piece with elastic restoring force and a locking mechanism, and the locking mechanism has a locking state and an unlocking state; when the locking mechanism is in the locking state, the wind shield is limited to slide; when the locking mechanism is in the unlocking state, the sliding limitation on the wind shield is removed; one end of the elastic piece is fixedly arranged, the other end of the elastic piece is abutted against and pushes the wind shield towards the heat dissipation fan, and the sensing piece triggers the locking mechanism to be in an unlocking state when sensing that the gas flows to the wind shield from the air inlet;
the response piece includes wind direction tablet and rotates and connects the lever arm of fixed frame, the one end of lever arm is connected wind direction tablet, the other end of lever arm is connected latched device, gas is followed the air intake flow direction deep bead promotes wind direction tablet, wind direction tablet drives lever arm rotates, so that lever arm triggers latched device switches to the unblock state, the elastic component promotes the deep bead court the air intake slides.
2. The heat dissipating device of claim 1, wherein: the length from the transfer point of the lever arm and the fixed frame to the wind direction sensing plate is greater than the length from the transfer point to the locking mechanism.
3. The heat dissipating device of claim 1, wherein: the locking mechanism comprises a female buckle arranged on the wind shield and a male buckle matched with the female buckle, and the male buckle is connected with the lever arm.
4. The heat dissipating device of claim 3, wherein: the female buckle and the male buckle matched end are provided with a buckle groove, and one end of the male buckle is clamped into the buckle groove.
5. The heat dissipating device of any of claims 1-4, wherein: the elastic member is a tube spring.
6. The heat dissipating device of any of claims 1-4, wherein: the heat dissipation device further comprises a guide structure, the guide structure comprises a guide rail arranged in the placement cavity and a sliding block connected with the wind shield and matched with the guide rail, and the length direction of the guide rail is the same as the flowing direction of the gas.
7. The heat dissipating device of any of claims 1-4, wherein: the radiating holes are provided with a plurality of radiating fans, and the radiating fans are correspondingly arranged at the radiating holes and are correspondingly provided with anti-backflow structures and driving structures.
8. A server, comprising the heat dissipation device as recited in any one of claims 1 to 7, the server further comprising a chassis and a motherboard disposed in the chassis, wherein the heat dissipation device is connected to the chassis and configured to dissipate heat from the motherboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202010597722.5A CN111813187B (en) | 2020-06-28 | 2020-06-28 | Heat dissipation device and server |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010597722.5A CN111813187B (en) | 2020-06-28 | 2020-06-28 | Heat dissipation device and server |
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| CN111813187A CN111813187A (en) | 2020-10-23 |
| CN111813187B true CN111813187B (en) | 2022-04-12 |
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| US11789841B2 (en) * | 2021-10-07 | 2023-10-17 | Dell Products L.P. | Systems and methods for monitor and alert for pollutants in an environment of an information handling system |
| CN114721476B (en) * | 2022-03-28 | 2024-04-09 | 西安易朴通讯技术有限公司 | Heat abstractor and server |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105722369A (en) * | 2014-12-03 | 2016-06-29 | 鸿富锦精密工业（深圳）有限公司 | Heat dissipation module and electronic device with same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101621914B (en) * | 2008-07-01 | 2012-12-19 | 鸿富锦精密工业（深圳）有限公司 | Device for preventing air current reflux and thermal module provided with same |
| CN103133418B (en) * | 2011-11-25 | 2015-11-18 | 台达电子工业股份有限公司 | Counterflow-preventing blower module and backflow protection device thereof |
| CN104613201B (en) * | 2015-02-10 | 2017-04-05 | 周学辉 | A kind of automatic open-close check-valves |
| CN106194832B (en) * | 2016-08-15 | 2019-02-05 | 联想(北京)有限公司 | Fluid drive apparatus and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105722369A (en) * | 2014-12-03 | 2016-06-29 | 鸿富锦精密工业（深圳）有限公司 | Heat dissipation module and electronic device with same |
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