CN111812447A - Array component testing device and array component detecting method - Google Patents

Array component testing device and array component detecting method Download PDF

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Publication number
CN111812447A
CN111812447A CN202010797682.9A CN202010797682A CN111812447A CN 111812447 A CN111812447 A CN 111812447A CN 202010797682 A CN202010797682 A CN 202010797682A CN 111812447 A CN111812447 A CN 111812447A
Authority
CN
China
Prior art keywords
array
detected
probe
moving assembly
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010797682.9A
Other languages
Chinese (zh)
Inventor
张小东
蔡建镁
袁昊冉
苏荣
黄新青
周竞斌
幸刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Hi Test Semiconductor Equipment Co ltd
Original Assignee
Shenzhen Hi Test Semiconductor Equipment Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Hi Test Semiconductor Equipment Co ltd filed Critical Shenzhen Hi Test Semiconductor Equipment Co ltd
Priority to CN202010797682.9A priority Critical patent/CN111812447A/en
Publication of CN111812447A publication Critical patent/CN111812447A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0425—Test clips, e.g. for IC's
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

The invention discloses a testing device and a detection method for array components. A testing device for array components comprises a moving mechanism and a detection mechanism arranged at the power output end of the moving mechanism; the moving mechanism is used for driving the detection mechanism to move so as to detect the workpieces to be detected which are arranged in an array mode. The workpieces to be detected are arranged in an array mode, and the detection mechanism is arranged on the moving mechanism, so that the detection mechanism can detect the workpieces to be detected one by one. The invention directly tests on the fixed disk without peeling off the workpiece to be tested, thereby saving working procedures, reducing equipment, lowering cost and improving efficiency.

Description

Array component testing device and array component detecting method
Technical Field
The invention relates to the technical field of detection equipment, in particular to a device and a method for testing an array component.
Background
When the existing electronic component is tested, the electronic component is basically stripped into a single component by stripping equipment, then the single component is placed on a vibrating disc and a turntable through a material taking mechanism, and the turntable rotates to a station to drive the component to a testing mechanism for testing. The whole process is complicated, the testing efficiency is low, extra stripping equipment needs to be purchased, and the production cost is high.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a testing device and a detection method of an array component.
In order to achieve the purpose, the invention adopts the following technical scheme:
a testing device for array components comprises a moving mechanism and a detection mechanism arranged at the power output end of the moving mechanism; the moving mechanism is used for driving the detection mechanism to move so as to detect the workpieces to be detected which are arranged in an array mode.
The further technical scheme is as follows: also comprises a fixing mechanism; the fixing mechanism is used for fixing the workpieces to be detected which are arranged in an array mode.
The further technical scheme is as follows: the moving mechanism comprises a Y-direction moving assembly and an X-direction moving assembly fixed at the power output end of the Y-direction moving assembly; the detection mechanism is fixed on the power output end of the X-direction moving assembly.
The further technical scheme is as follows: the Y-direction moving assembly comprises a Y-direction motor and a Y-direction screw rod arranged at the power output end of the Y-direction motor; the X-direction moving assembly is arranged on a transmission nut of the Y-direction screw rod.
The further technical scheme is as follows: the X-direction moving assembly comprises an X-direction motor and an X-direction screw rod arranged at the power output end of the X-direction motor; the detection mechanism is arranged at the power output end of the X-direction motor.
The further technical scheme is as follows: the detection mechanism comprises a probe; the probe is used for carrying out power-on detection on the array type workpiece to be detected.
The further technical scheme is as follows: the detection mechanism further comprises an optical probe; the optical probe is used for positioning the array type workpiece to be detected; the optical probe is positioned on the upper side of the workpiece to be detected, and the probe is positioned on the lower side of the workpiece to be detected.
The further technical scheme is as follows: the fixing mechanism comprises a fixing frame; the fixed frame is used for fixing the array workpiece to be detected.
The further technical scheme is as follows: the system also comprises a control center; the control center is electrically connected with the detection mechanism to record the detection condition of the array type workpiece to be detected.
An array type component detection method is characterized in that workpieces to be detected are fixed on a fixed disc in an array type, the fixed disc is fixed, and a probe and an optical probe are respectively positioned on the lower side and the upper side of the fixed disc; the X-direction moving assembly and the Y-direction moving assembly drive the probe and the optical probe to move along X, Y directions so that the optical probe positions the workpiece to be detected, the probe detects the workpiece to be detected, and then detection data are stored
Compared with the prior art, the invention has the beneficial effects that: the workpieces to be detected are arranged in an array mode, and the detection mechanism is arranged on the moving mechanism, so that the detection mechanism can detect the workpieces to be detected one by one. The invention directly tests on the fixed disk without peeling off the workpiece to be tested, thereby saving working procedures, reducing equipment, lowering cost and improving efficiency.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented according to the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more apparent, the following detailed description will be given of preferred embodiments.
Drawings
FIG. 1 is a three-dimensional structure diagram of a testing device for array components according to the present invention;
FIG. 2 is a perspective view of another embodiment of the testing apparatus for array devices of the present invention;
FIG. 3 is a front view of a testing apparatus for an array device of the present invention;
fig. 4 is a side view of a testing apparatus for an array device according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings and the detailed description.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be connected or detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above should not be understood to necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by one skilled in the art.
Referring to fig. 1 to 4, the present embodiment provides a testing apparatus for an array device, which includes a moving mechanism 10 and a detecting mechanism 20 disposed at a power output end of the moving mechanism 10. The moving mechanism 10 is used for driving the detection mechanism 20 to move so as to detect the workpieces to be detected 40 which are arranged in an array. The workpieces to be detected are arranged in an array mode with a set distance, the detection mechanism 20 moves under the action of the moving mechanism 10, the moving distance is carried out according to the array distance, and the detection mechanism 20 detects the workpieces to be detected 40 one by one.
Wherein, also includes the fixed establishment 30. The fixing mechanism 30 is used for fixing the workpieces to be detected in an array arrangement. The fixing mechanism 30 is used for fixing and primarily positioning the array workpiece 40 to be detected, so as to ensure the accuracy of the moving position of the detection mechanism 20.
The moving mechanism 10 comprises a Y-direction moving component 11 and an X-direction moving component 12 fixed at the power output end of the Y-direction moving component 11. The detection mechanism 20 is fixed to the power output end of the X-direction moving assembly 12. The Y-direction moving assembly 11 and the X-direction moving assembly 12 can drive the detecting mechanism 20 to move in the XY direction, and the array workpiece to be detected 40 is parallel to the XY direction, so that the detecting mechanism 20 can reach any position of the array workpiece to be detected 40 in a straight line, and detection is convenient.
The Y-direction moving assembly 11 comprises a Y-direction motor 111 and a Y-direction screw rod 112 arranged at the power output end of the Y-direction motor 111. The X-direction moving assembly 12 is arranged on a transmission nut of the Y-direction screw rod 112. The Y-direction moving assembly 11 is provided with a Y-direction sliding rail 113 parallel to the moving direction (i.e. the Y direction) of the Y-direction moving assembly, and the X-direction moving assembly 12 is connected with the Y-direction sliding rail 113 in a sliding manner, so that the X-direction moving assembly 12 can move stably and the moving position is more accurate.
The X-direction moving assembly 12 includes an X-direction motor 121, and an X-direction screw 122 disposed at a power output end of the X-direction motor 121. The detection mechanism 20 is provided at a power output end of the X-direction motor 121. The X-direction component is provided with an X-direction sliding rail 123 parallel to the moving direction (namely the X direction), and the detection mechanism 20 is connected with the X-direction sliding rail 123 in a sliding manner, so that the detection mechanism 20 can move stably and the moving position is more accurate.
The detection mechanism 20 stably and accurately reaches the workpieces 40 to be detected arranged in an array mode through the Y-direction moving assembly 11 and the X-direction moving assembly 12, and the detection mechanism 20 can detect the workpieces 40 to be detected one by one.
The detection mechanism 20 includes a probe 21 and an optical probe 22. The probe 21 is used for conducting power-on detection with the arrayed workpiece to be detected 40 and sending detection information. The optical probe 22 is used to position the array workpiece 40 to be measured. Generally, electronic components are small in size, so that the optical probe 22 is required to identify the position of the component, and then the probe 21 tests the component.
The optical probe 22 is located on the upper side of the workpiece 40 to be measured, and the probe 21 is located on the lower side of the workpiece 40 to be measured.
Preferably, the probe 21 and the optical probe 22 are fixed on the transmission nut of the X-direction screw 122 through the fixing plate 23.
The fixing mechanism 30 includes a fixing frame 31. The fixing frame 31 is used for fixing the array type workpiece 40 to be measured. The fixing frame 31 is located right below the probe 21 and the optical probe 22.
The workpieces 40 to be measured are fixed on the fixed disc 32 in an array manner. The fixing bracket 31 is provided with a fixing groove 33 for fixing the fixing plate 32. The fixed groove 33 is arranged to facilitate the positioning of the workpiece 40 to be detected, and the probe 21 and the optical probe 22 can detect the workpiece quickly.
Wherein, still include the control center. The control center is electrically connected to the detecting mechanism 20 for recording the detecting condition of the array-type workpiece 40 to be detected. The probes 21 transmit the detected condition of the workpiece 40 to be measured to the control center, and trace an electronic grid similar to the array of the workpiece 40 to be measured, and record the measured condition in the electronic grid so as to record the test condition of a certain workpiece.
In other embodiments, the Y-direction moving assembly 11 is fixed on the Z-direction moving assembly, so that the detecting mechanism 20 has movements in three directions of XYZ, and the workpiece 40 to be detected is more conveniently detected.
In other embodiments, the power members of the X-direction moving assembly 12 and the Y-direction moving assembly 11 may be air cylinders.
An array type workpiece detection method is characterized in that workpieces 40 to be detected are fixed on a fixed disc 32 in an array mode, then the fixed disc 32 is fixed on a fixed groove 33, a probe 21 and an optical probe 22 are respectively located on the lower side and the upper side of the fixed disc 32, an X-direction moving assembly 12 and a Y-direction moving assembly 11 drive the probe 21 and the optical probe 22 to move along X, Y, so that the optical probe 22 positions the workpieces 40 to be detected, then the probe 21 detects the workpieces to be detected, and then detection data are stored.
Compared with the prior art, the workpieces to be detected 40 are arranged in an array mode, and the detection mechanism 20 is arranged on the moving mechanism 10, so that the detection mechanism 20 can detect the workpieces to be detected one by one. The invention does not need to strip the workpiece 40 to be tested, and directly tests on the fixed disk, thereby saving working procedures, reducing equipment, lowering cost and improving efficiency.
The technical contents of the present invention are further illustrated by the examples only for the convenience of the reader, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation based on the present invention is protected by the present invention. The protection scope of the invention is subject to the claims.

Claims (10)

1. The device for testing the array components is characterized by comprising a moving mechanism and a detection mechanism arranged at the power output end of the moving mechanism; the moving mechanism is used for driving the detection mechanism to move so as to detect the workpieces to be detected which are arranged in an array mode.
2. The device for testing the array components as claimed in claim 1, further comprising a fixing mechanism; the fixing mechanism is used for fixing the workpieces to be detected which are arranged in an array mode.
3. The device for testing the array components as claimed in claim 1, wherein the moving mechanism comprises a Y-direction moving assembly and an X-direction moving assembly fixed at a power output end of the Y-direction moving assembly; the detection mechanism is fixed on the power output end of the X-direction moving assembly.
4. The device for testing the array components as claimed in claim 3, wherein the Y-direction moving assembly comprises a Y-direction motor and a Y-direction screw rod arranged at a power output end of the Y-direction motor; the X-direction moving assembly is arranged on a transmission nut of the Y-direction screw rod.
5. The device for testing the array components as claimed in claim 3, wherein the X-direction moving assembly comprises an X-direction motor and an X-direction screw rod arranged at a power output end of the X-direction motor; the detection mechanism is arranged at the power output end of the X-direction motor.
6. The device for testing the array components as claimed in any one of claims 1 to 5, wherein the detection mechanism comprises a probe; the probe is used for carrying out power-on detection on the array type workpiece to be detected.
7. The device for testing an array component of claim 6, wherein the detection mechanism further comprises an optical probe; the optical probe is used for positioning the array type workpiece to be detected; the optical probe is positioned on the upper side of the workpiece to be detected, and the probe is positioned on the lower side of the workpiece to be detected.
8. The device for testing the array components as claimed in claim 2, wherein the fixing mechanism comprises a fixing frame; the fixed frame is used for fixing the array workpiece to be detected.
9. The device for testing the array components as claimed in claim 8, wherein the workpieces to be tested are fixed on the fixed disc in an array manner; the fixing frame is provided with a fixing groove for fixing the fixing disc.
10. The detection method of array components is characterized in that workpieces to be detected are fixed on a fixed disc in an array mode, the fixed disc is fixed, and a probe and an optical probe are respectively positioned on the lower side and the upper side of the fixed disc; the X-direction moving assembly and the Y-direction moving assembly drive the probe and the optical probe to move along X, Y directions, so that the optical probe positions the workpiece to be detected, the probe detects the workpiece to be detected, and then detection data are stored.
CN202010797682.9A 2020-08-10 2020-08-10 Array component testing device and array component detecting method Pending CN111812447A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010797682.9A CN111812447A (en) 2020-08-10 2020-08-10 Array component testing device and array component detecting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010797682.9A CN111812447A (en) 2020-08-10 2020-08-10 Array component testing device and array component detecting method

Publications (1)

Publication Number Publication Date
CN111812447A true CN111812447A (en) 2020-10-23

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102236032A (en) * 2010-05-07 2011-11-09 北京京东方光电科技有限公司 Array detection equipment
KR20190071140A (en) * 2017-12-14 2019-06-24 세메스 주식회사 Array tester
CN109959498A (en) * 2019-03-29 2019-07-02 珠海达明科技有限公司 A kind of array light-emitting component quality detecting system and its application method
CN209858171U (en) * 2019-03-29 2019-12-27 珠海达明科技有限公司 Array type light-emitting element quality detection system
CN212364467U (en) * 2020-08-10 2021-01-15 深圳市华腾半导体设备有限公司 Testing arrangement of array components and parts

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102236032A (en) * 2010-05-07 2011-11-09 北京京东方光电科技有限公司 Array detection equipment
KR20190071140A (en) * 2017-12-14 2019-06-24 세메스 주식회사 Array tester
CN109959498A (en) * 2019-03-29 2019-07-02 珠海达明科技有限公司 A kind of array light-emitting component quality detecting system and its application method
CN209858171U (en) * 2019-03-29 2019-12-27 珠海达明科技有限公司 Array type light-emitting element quality detection system
CN212364467U (en) * 2020-08-10 2021-01-15 深圳市华腾半导体设备有限公司 Testing arrangement of array components and parts

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