CN111807314A - Copper oxide nano whisker material with rapid sterilization and large contact surface - Google Patents

Copper oxide nano whisker material with rapid sterilization and large contact surface Download PDF

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Publication number
CN111807314A
CN111807314A CN202010577160.8A CN202010577160A CN111807314A CN 111807314 A CN111807314 A CN 111807314A CN 202010577160 A CN202010577160 A CN 202010577160A CN 111807314 A CN111807314 A CN 111807314A
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copper oxide
copper
electrolyte
oxide nano
nano whisker
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匡登峰
李文爽
杨卓
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Nankai University
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    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/04Networks or arrays of similar microstructural devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
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    • B81C1/00023Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00031Regular or irregular arrays of nanoscale structures, e.g. etch mask layer
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    • B82NANOTECHNOLOGY
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y5/00Nanobiotechnology or nanomedicine, e.g. protein engineering or drug delivery

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Abstract

The invention provides a preparation method of a copper oxide nano whisker structure attached to the surface of metal copper, which comprises the following steps: 1) selecting a cathode electrode; 2) preparing a copper oxide nano whisker structure on a metal copper substrate, and selecting the components and the content of an electrolyte; 3) preparing a copper oxide nano whisker structure on a metal copper substrate, and selecting oxidation time and voltage; 4) preparing the copper oxide nano whisker structure by using the cathode electrode, the electrolyte and the experimental parameters selected in the steps 1), 2) and 3). The preparation method adopted by the invention is simple to operate, low in cost and suitable for large-area preparation; larger specific surface area can be obtained by adjusting experiment parameters; the prepared copper oxide nano whisker structure has stronger sterilization activity on various bacteria, can be used for surfaces needing direct contact in hospitals and various environments, such as handrails, doorknobs and the like, and reduces the spread and infection of the bacteria; the copper oxide nano whisker structure is directly attached to the metal copper, and secondary pollution to the environment can not be caused.

Description

Copper oxide nano whisker material with rapid sterilization and large contact surface
Technical Field
The invention belongs to the field of material science, and relates to a preparation method of a copper oxide nano whisker structure which can realize rapid sterilization and is attached to the surface of metal copper.
Background
Improper or excessive use of antibiotics, as well as the inevitable evolutionary nature of bacteria, can lead to the production of resistant bacterial strains. For example: methicillin-resistant staphylococcus aureus (MRSA) was observed within two years after penicillin was found. Because the drug-resistant strains have the characteristics of wide propagation, rapid evolution and the like, and the effectiveness of the conventional antibacterial method on the drug-resistant strains is gradually reduced, the threat to human beings is increased. Therefore, researchers have begun to research and develop new materials having antibacterial effects. To date, a variety of materials have been developed and produced, including plastics, ceramics, clothing, metals and metal alloys, etc., having different antimicrobial properties. Metals and metal alloys exhibit cheaper and more stable antibacterial properties and are environmentally friendly compared to other chemical polymer based materials. Over the last several centuries, various metals having antibacterial properties have been reported to minimize the spread of infectious diseases by preventing bacterial contamination, and have been commercially used in industrial fields including agriculture, health care, food and pharmaceutical packaging, and the like. Copper and silver are the two most widely used metallic materials and can effectively inactivate different microorganisms by direct contact. Compared with silver, copper is lower in cost and is also an essential trace element for various biological systems, and can play a role of a catalytic cofactor. Copper is the first solid material registered with the United States Environmental Protection Agency (USEPA) for antimicrobial properties and more than 350 copper alloys have been registered for antimicrobial activity against six different bacteria. Compared with metal surfaces, metal nanomaterials and metal oxides have the advantage of increasing the contact area of microorganisms with metals or metal oxides to obtain better antibacterial effect, but they are easily permeated into the environment, thereby causing secondary pollution such as generation of active oxygen and other health problems.
The preparation method of the copper oxide nano whisker surface, which is low in cost, simple in operation and capable of being prepared in a large area, is provided, and the copper oxide nano whisker is attached to the surface of metal copper, so that secondary pollution to the environment can be avoided. The method can control the morphological characteristics of the copper oxide nanowhiskers by adjusting anodic oxidation voltage, time, electrolyte components and the like, thereby increasing the specific surface area of the copper oxide nanowhiskers to obtain higher antibacterial property, and can be used for surfaces needing direct contact in hospitals and other environments, such as handrails, door handles, elevator buttons and the like, so as to prevent and reduce bacterial infection.
Disclosure of Invention
The antimicrobial properties of copper and its oxides are achieved mainly by direct interaction between the surface of the material and the bacteria, causing its film to break, also known as "contact sterilization". This mechanism of antimicrobial properties highlights the importance of direct contact of microorganisms with the surface of the material for effective eradication and inactivation of bacteria. In the last decade, different copper and copper oxide nanomaterials have been developed to improve their antibacterial activity, and the unique small size of such nanomaterials provides a large specific surface area, thereby maximizing the direct contact area of microorganisms with the material and improving the antibacterial effect. The main methods for directly generating the nano-scale structure on the metal surface include vapor deposition, laser processing, chemical etching and the like, but the methods generally have the disadvantages of complex flow, high operation difficulty and high cost. In view of the above-mentioned shortcomings of the prior art, the present invention aims to provide a method for preparing a copper oxide nanowhisker structure directly attached to the surface of metallic copper, which is simple in operation, low in cost and capable of realizing large-area preparation. The specific surface area of the copper oxide nano whisker structure can be controlled by adjusting parameters such as anodic oxidation voltage, time, electrolyte components and the like, so that the sterilization effect of the copper oxide nano whisker structure is improved.
In order to achieve the above objects and other related objects, the present invention provides a preparation method comprising the steps of:
1) selecting a cathode electrode;
2) preparing a copper oxide nano whisker structure on the metal copper substrate, and selecting the components and the content of an electrolyte;
3) preparing a copper oxide nano whisker structure on the metal copper substrate, and selecting anodic oxidation time and voltage;
4) preparing a copper oxide nano whisker structure on a metal copper substrate by using the cathode electrode, the electrolyte and the experimental parameters selected in the steps 1), 2) and 3).
As a preferable scheme of the method for preparing the copper oxide nanowhisker structure of the present invention, the cathode electrode selected in step 1) mainly has a graphite electrode and a platinum sheet electrode.
As a preferable embodiment of the method for preparing the copper oxide nanowhisker structure of the present invention, the electrolyte selected in step 2) should be a medium strong acid or a weak acid.
As a preferable embodiment of the method for preparing a copper oxide nanowhisker structure of the present invention, the anodization voltage selected in step 3) should be 60V or less.
As a preferable embodiment of the method for preparing the copper oxide nanowhisker structure of the present invention, the anodic oxidation time selected in the step 3) should be 1 hour or less.
As a preferable embodiment of the method for preparing the copper oxide nanowhisker structure of the present invention, the step 4) further comprises the steps of:
4-1) preparing electrolyte according to the components and the content of the electrolyte selected in the step 2) and fully stirring the electrolyte;
4-2) respectively connecting the metal copper and the cathode electrode selected in the step 1) with the positive electrode and the negative electrode of direct current and immersing the metal copper and the cathode electrode in electrolyte;
4-3) preparing the copper oxide nano whisker structure according to the anodic oxidation time and voltage selected in the step 3).
As a preferable scheme of the preparation method of the copper oxide nanowhisker structure of the present invention, in the step 4-2), a beaker is selected as a reaction vessel while the distance between the anode and the cathode should be controlled.
As a preferable scheme of the preparation method of the copper oxide nanowhisker structure of the present invention, in the step 4-3) preparation process, the reaction temperature should be controlled and the electrolyte should be stirred in real time.
In addition, the morphology of the copper oxide nano whisker material can be regulated and controlled by adjusting parameters such as electrolyte components, anodic oxidation time, voltage, reaction temperature and the like, so that the copper oxide nano whisker material with the optimal sterilization effect can be obtained.
Drawings
FIG. 1 is a schematic diagram of an apparatus for preparing a copper oxide nanowhisker structure by an anodic oxidation method.
Figure 2 is a topographical view of a copper oxide nanowhisker structure taken with a scanning electron microscope.
Detailed Description
The invention will be further illustrated with reference to the following specific examples. It should be understood that the examples are only for the purpose of the present invention and are not intended to limit the scope of the present invention. It should be understood that various changes and modifications can be made by those skilled in the art after reading the disclosure of the present invention, and equivalents fall within the scope of the appended claims.
In the embodiment of the invention, the raw materials and equipment are commercially available and the purity is analytically pure or higher unless otherwise specified; in particular, the adopted oxalic acid is a commercial product, and the purity is analytical purity. The adopted metal copper foil is a commercial product, and the purity is industrial grade. The platinum sheet electrode, the direct current power supply, the constant temperature reaction bath, the beaker and the like are all commercial products.
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
(1) Firstly, cutting a metal copper foil into a size similar to that of a platinum sheet electrode, flattening, then respectively placing the sample in acetone, absolute ethyl alcohol and deionized water, respectively carrying out ultrasonic cleaning for 15min, and drying for later use. The surface of the pretreated sample is smooth and clean without dirt.
(2) An oxalic acid solution is adopted as electrolyte, wherein the content of oxalic acid is 0.3 mol/L; 5.4g of oxalic acid solid was dissolved in 200ml of deionized water and stirred well.
(3) As shown in figure 1, a 250ml beaker is used as a reaction vessel, a direct-current voltage-stabilizing and current-stabilizing power supply is used for supplying power, an anode is connected with a pretreated metal copper foil, a cathode is connected with a platinum sheet electrode with the area similar to that of the copper foil, the two electrodes are opposite, the distance between the two electrodes is controlled to be about 6cm, a magnetic stirrer is started for stirring, and electrolysis is carried out for 15min at the voltage of 40V. The temperature of the electrolyte was controlled at 5 ℃ throughout the experiment using a constant temperature reaction bath.
(4) The electrolyzed sample was ultrasonically cleaned in acetone and deionized water for 3min and dried.
(5) The sample was observed by a scanning electron microscope, and the copper oxide nanowhisker structure was found on the surface, as shown in FIG. 2.

Claims (5)

1. A preparation method of a copper oxide nano whisker structure is characterized by comprising the following steps: the preparation method comprises the following steps:
1) selecting a cathode electrode;
2) preparing a copper oxide nano whisker structure on the metal copper substrate, and selecting the components and the content of an electrolyte;
3) preparing a copper oxide nano whisker structure on the metal copper substrate, and selecting anodic oxidation time and voltage;
4) preparing a copper oxide nanowhisker structure on a metal copper substrate by using the substrate, the electrolyte and the experimental parameters selected in the steps 1), 2) and 3), wherein the preparation process comprises the following steps:
4-1) preparing electrolyte according to the components and the content of the electrolyte selected in the step 2) and fully stirring the electrolyte;
4-2) respectively connecting the metal copper and the cathode electrode selected in the step 1) with the positive electrode and the negative electrode of direct current and immersing the metal copper and the cathode electrode in electrolyte;
4-3) preparing the copper oxide nano whisker structure according to the anodic oxidation time and voltage selected in the step 3).
2. The method of claim 1, wherein the cathode electrode is selected in step 1) to be a material less noble than copper metal, typically a graphite electrode or a platinum sheet electrode.
3. The method of claim 1, wherein the electrolyte in step 2) is selected to react with copper metal under power-on conditions, wherein the electrolyte is a medium or weak acid, and the electrolyte is selected to be a strong acid or a weak acid, which may cause the formation of the copper oxide nanowhisker structure.
4. The method of claim 1, wherein the oxidation voltage in step 3) is selected to be too high to cause too severe a reaction and thus to prevent formation of the copper oxide nanowhisker structure, and is typically below 60V.
5. The method of claim 1, wherein the oxidation time in step 3) is selected to be too long to form the copper oxide nanowhisker structure, and is typically less than 1 hour.
CN202010577160.8A 2020-06-23 2020-06-23 Copper oxide nano whisker material with rapid sterilization and large contact surface Pending CN111807314A (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3716122A1 (en) * 1987-05-14 1988-12-01 Battelle Institut E V Method of incorporating whiskers in a metallic matrix
RU2464224C1 (en) * 2011-05-20 2012-10-20 Федеральное государственное бюджетное учреждение науки Институт высокотемпературной электрохимии Уральского отделения Российской Академии наук Method of producing copper oxide nanowhisker structures
CN103764544A (en) * 2011-07-26 2014-04-30 1D材料有限责任公司 Nanostructured battery active materials and methods of producing same
RU2574629C1 (en) * 2014-07-23 2016-02-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Тольяттинский государственный университет" Method for obtaining copper-containing material in form of metal substrate with copper microparticles applied on it
CN106835219A (en) * 2017-01-19 2017-06-13 中国科学院深圳先进技术研究院 A kind of super-hydrophobic stainless steel watch finishing coat and preparation method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3716122A1 (en) * 1987-05-14 1988-12-01 Battelle Institut E V Method of incorporating whiskers in a metallic matrix
RU2464224C1 (en) * 2011-05-20 2012-10-20 Федеральное государственное бюджетное учреждение науки Институт высокотемпературной электрохимии Уральского отделения Российской Академии наук Method of producing copper oxide nanowhisker structures
CN103764544A (en) * 2011-07-26 2014-04-30 1D材料有限责任公司 Nanostructured battery active materials and methods of producing same
RU2574629C1 (en) * 2014-07-23 2016-02-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Тольяттинский государственный университет" Method for obtaining copper-containing material in form of metal substrate with copper microparticles applied on it
CN106835219A (en) * 2017-01-19 2017-06-13 中国科学院深圳先进技术研究院 A kind of super-hydrophobic stainless steel watch finishing coat and preparation method thereof

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
李素等: "电化学方法制备氧化铜晶须", 《化工学报》, vol. 61, no. 1, 30 November 2010 (2010-11-30), pages 112 - 115 *
蒋婷婷: "形貌可控纳米氧化铜的制备及其性能研究", 《中国优秀硕士学位论文全文数据库 工程科技Ⅰ辑》, 15 February 2017 (2017-02-15), pages 56 - 68 *

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