CN111799391B - Packaging structure, display panel and packaging method - Google Patents
Packaging structure, display panel and packaging method Download PDFInfo
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- CN111799391B CN111799391B CN202010498753.5A CN202010498753A CN111799391B CN 111799391 B CN111799391 B CN 111799391B CN 202010498753 A CN202010498753 A CN 202010498753A CN 111799391 B CN111799391 B CN 111799391B
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Abstract
The invention discloses a packaging structure, a display panel and a packaging method, which relate to the technical field of display, and the packaging structure comprises: a first inorganic layer; an organic layer stacked with the first inorganic layer; the first self-assembled monomolecular film is positioned between the first inorganic layer and the organic layer and is respectively contacted with the first inorganic layer and the organic layer; wherein the first self-assembled monolayer comprises a first self-assembled monolayer, wherein the first self-assembled monolayer comprises a first anchoring group, a first terminal group and a first connecting group for connecting the first anchoring group and the first terminal group; the first anchor group is covalently bonded to the first inorganic layer, the first terminal group is bonded to the organic layer by van der waals force, and the first anchor group is aligned between the adjacent first connecting groups in a direction parallel to a plane of the first inorganic layer by van der waals force. The invention improves the bonding strength between the first inorganic layer and the organic layer and improves the packaging effect.
Description
Technical Field
The invention relates to the technical field of display, in particular to a packaging structure, a display panel and a packaging method.
Background
Organic Light Emitting Diode (OLED) devices generally employ a substrate as a carrier, and are constructed by depositing an anode, a metal cathode, and an organic light emitting layer sandwiched therebetween. The OLED device is very sensitive to oxygen and water vapor, and when oxygen and water vapor penetrate into the OLED device, black spots, pinholes, electrode oxidation, chemical reaction of organic materials, and the like may occur.
In order to prevent the components from being failed due to permeation of water and oxygen into the components, thin film encapsulation (TFF) is required for the display panel, and the thin film encapsulation technology is to realize water and oxygen resistance by stacking one or more layers of inorganic materials or inorganic/organic materials. The thin film encapsulation structure generally includes an inorganic layer, an organic layer, and an inorganic layer connected in sequence. In the inorganic substance/organic substance/inorganic substance packaging structure, due to poor compatibility and poor adhesion between the inorganic substance and the organic substance, the organic layer and the inorganic layer are easily peeled off from each other, which affects the packaging effect of the device and the service life of the device, and even the organic layer is printed on the inorganic layer by ink-jet printing, the organic layer shrinks and gathers, thereby leaving air bubbles or air holes in the organic layer film, which affects the display effect.
Disclosure of Invention
In view of this, the present invention provides a package structure, a display panel and a packaging method, which improve the bonding strength between an organic layer and an inorganic layer and enhance the packaging effect.
In a first aspect, the present application provides a package structure, comprising:
a first inorganic layer;
an organic layer stacked with the first inorganic layer;
a first self-assembled monolayer between the first inorganic layer and the organic layer and in contact with the first inorganic layer and the organic layer, respectively;
wherein the first self-assembled monolayer comprises a first self-assembled monolayer, wherein the first self-assembled monolayer comprises a first anchoring group, a first terminal group, and a first linking group for linking the first anchoring group and the first terminal group; the first anchor group is covalently bonded to the first inorganic layer, the first terminal group is bonded to the organic layer by van der waals force, and the first anchor group and the first inorganic layer are arranged adjacent to each other in a direction parallel to a plane of the first inorganic layer by van der waals force.
On the other hand, the invention also provides a display panel, which comprises a substrate, a light-emitting element layer and the packaging structure;
the light-emitting element layer is located on the substrate, the packaging structure covers the light-emitting element layer, and the first inorganic layer is located on one side, close to the light-emitting element layer, of the organic layer.
Based on the same idea, the invention also provides a packaging method, which comprises the following steps:
providing an array substrate to be packaged, wherein the array substrate comprises a substrate and a light-emitting element layer positioned on the substrate, and a first inorganic layer is formed on the light-emitting element layer;
forming a first self-assembled monolayer on the first inorganic layer, comprising:
preparing a first self-assembling monomolecular solution, wherein the first self-assembling monomolecular solution comprises a first anchoring group, a first terminal group and a first connecting group for connecting the first anchoring group and the first terminal group; coating a layer of the first self-assembly monomolecular solution on the surface of the first inorganic layer or soaking the first inorganic layer in the first self-assembly monomolecular solution, wherein the first anchoring group generates a covalent bond with the first inorganic layer after being hydrolyzed, and the first self-assembly monomolecular is connected with the first inorganic layer; the first connecting groups are arranged in order by van der waals force in the direction parallel to the plane of the first inorganic layer, and the first terminal group faces to the side far away from the first inorganic layer;
annealing to remove the solvent;
and forming an organic layer on the side of the first self-assembled monomolecular film far away from the first inorganic layer, wherein the first terminal group of the first self-assembled monomolecular film is combined with the organic molecules of the organic layer through van der Waals force.
Compared with the prior art, the packaging structure, the display panel and the packaging method provided by the invention at least realize the following beneficial effects:
the first self-assembled monomolecular film is additionally arranged between the first inorganic layer and the organic layer, and comprises a first self-assembled monomolecular film, wherein the first self-assembled monomolecular film comprises a first self-assembled monomolecular, the first self-assembled monomolecular film comprises a first anchoring group, a first terminal group and a first connecting group for connecting the first anchoring group and the first terminal group, the first anchoring group and the first inorganic layer are combined by covalent bonds, the first terminal group and the organic layer are combined by van der Waals force, and the first connecting group is arranged by van der Waals force in the direction parallel to the plane of the first inorganic layer, so that the combination strength between the first inorganic layer and the organic layer is improved, and the packaging effect is improved.
Of course, it is not necessary for any product in which the present invention is practiced to achieve all of the above-described technical effects simultaneously.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
FIG. 1 is a cross-sectional view of a package structure provided by the present invention;
FIG. 2 is a cross-sectional view of yet another package structure provided by the present invention;
FIG. 3 is a cross-sectional view of a display panel provided by the present invention;
FIG. 4 is a cross-sectional view of yet another display panel provided by the present invention;
FIG. 5 is a flow chart of a packaging method provided by the present invention;
FIGS. 6 and 7 are block diagrams corresponding to steps in the packaging process;
FIG. 8 is a flow chart of yet another packaging method provided by the present invention;
fig. 9 to 13 are structural diagrams corresponding to respective steps in the packaging process;
FIG. 14 is a flow chart of yet another packaging method provided by the present invention;
fig. 15 is a corresponding block diagram in the packaging process.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
The invention provides an encapsulation structure, which is used for solving the problem of poor binding force between an inorganic layer and an organic layer.
Referring to fig. 1, fig. 1 is a cross-sectional view of a package structure provided in the present invention. The package structure 100 in fig. 1 includes a first inorganic layer 10, an organic layer 30, and a first self-assembled monolayer 20 sandwiched between the first inorganic layer 10 and the organic layer 30.
The first inorganic layer may be between 500nm and 1500nm thick. The first inorganic layer 10 may include one or more of silicon oxide, silicon nitride, or silicon oxynitride, and the first inorganic layer 10 may be formed by a method such as a Chemical Vapor Deposition (CVD) method or an Atomic Layer Deposition (ALD) method. The first inorganic layer 10 may have a relatively high density film that may substantially reduce or prevent the penetration of, for example, moisture or oxygen.
The organic layer 30 is stacked with the first inorganic layer 10; the organic layer 30 may have a thickness in a range from about 100nm to about 8000 nm. The organic layer 30 may include acrylic resin, methacrylic resin, polyester, polyethylene, polypropylene, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), epoxy resin, polyimide, polyamide, polyurethane, hexamethyldisiloxane (HMDSO), which are polymer-based materials. The organic layer may be prepared by means of ink-jet printing or coating.
The organic layer 30 may have a relatively low moisture permeation prevention effect. Meanwhile, the organic layer may be a buffer layer. Accordingly, the organic layer 30 may reduce stress between the first inorganic layers 10. The organic layer 30 may also have a moisture permeation prevention function. In addition, since the organic layer 30 may have a planarization characteristic, the thin film encapsulation structure 100 may be planarized by the organic layer 30.
The first self-assembled monolayer 20 is located between the first inorganic layer 10 and the organic layer 30, and is in contact with the first inorganic layer 10 and the organic layer 30, respectively.
The thickness of the optional first self-assembled monolayer 20 is D1, wherein D1 is more than 0 and less than 10nm. Preferably between 2 and 5 nm. The thickness of the first self-assembled monolayer 20 is determined by the molecular chain of the first self-assembled monolayer, and the longer the molecular chain, the greater the thickness of the first self-assembled monolayer 20, and vice versa.
The first self-assembled monolayer 20 of the present application comprises a first self-assembled monolayer 40, wherein the first self-assembled monolayer 40 comprises a first anchoring group, a first terminal group, and a first linking group for linking the first anchoring group and the first terminal group; the first anchor group is covalently bonded to the first inorganic layer 10, the first terminal group is bonded to the organic layer 30 by van der waals force, and the first anchor group is aligned between the adjacent first connecting groups in a direction parallel to the plane of the first inorganic layer 10 by van der waals force.
The first self-assembled monomolecular film 40 of the present invention belongs to the field of molecular chemistry, the first self-assembled monomolecular film 40 has orientation and order, the first self-assembled monomolecular film 20 only has one layer of the first self-assembled monomolecular film 40, the first anchoring group of the first self-assembled monomolecular film 40 has inotropic and organophilic properties, and the first self-assembled monomolecular film can connect interfaces with opposite polarities together through the first self-assembled monomolecular film 40, such as an organic interface and an inorganic interface, so as to improve the contact performance of the inorganic interface and the organic interface.
The first inorganic layer 10 is composed of silicon oxide and the first self-assembled monolayer is
For example, a first self-assembled monolayer in which the first anchoring group is SiCl is bonded to the first inorganic layer 10, the organic layer 3 The first terminal group is-CH 3 The first linking group is- (CH) 2 ) 7 ：
First of all a first anchoring group-SiCl 3 Hydrolyzed with water in the air or water on the surface of the first inorganic layer 10 to generate silanol-Si (OH) 3 The reaction is as follows:
while the surface of the first inorganic layer 10 is relatively liable to form hydroxyl-OH, silanol-Si (OH) 3 with-OH on the surface of the first inorganic layer 10 as a Si-O-Si polysiloxane chain
And (4) polymerizing.
In some alternative embodiments, there is also a self-polymerization reaction between adjacent first self-assembled single molecules 40, forming covalent bonds between adjacent first linking groups, e.g.
The first terminal group-CH after the first anchor group is bonded to the first inorganic layer 10 3 Naturally aligned towards the side remote from the first inorganic layer 10. Due to the first terminal group-CH of the first self-assembled monomolecular 40 3 In the presence ofHas an organophilic property, and can be bonded to the organic layer 30 by van der waals force; intermolecular van der waals forces align adjacent first linking groups in a direction parallel to the plane of the first inorganic layer 10, forming a structure as in fig. 1, with the first self-assembled monolayer 40 of fig. 1 aligned between the first inorganic layer 10 and the organic layer.
It is understood that the functional group of the first anchor group is different from the covalent bond formed with the first inorganic layer 10.
Since the first self-assembled single molecules 40 can be orderly arranged between the first inorganic layer 10 and the organic layer, and form covalent bonds with the first inorganic layer 10 and van der waals force with the organic layer, the bonding strength between the first inorganic layer and the organic layer is improved, and the encapsulation effect is improved.
The molecule self-assembly is utilized to adjust the oleophobic interface of the inorganic substance into the lipophilic interface, so that the film forming property of the ink-jet printing layer of the oily organic substance on the surface of the inorganic substance is improved; meanwhile, the hydrophobic interface of the organic ink-jet printing layer is adjusted into a hydrophilic interface, so that the deposition effect of inorganic matters on the surface of the organic ink-jet printing layer is improved.
It should be noted that each film layer in fig. 1 is only schematically illustrated, and does not represent the actual film thickness.
Compared with the prior art, the packaging structure at least has the following beneficial effects:
the packaging structure of the invention is provided with a first self-assembled monomolecular film 20 between a first inorganic layer 10 and an organic layer 30, wherein a first self-assembled monomolecular film 40 in the first self-assembled monomolecular film 20 is provided with a first anchoring group, a first end group and a first connecting group, the first anchoring group is combined with the first inorganic layer 10 by a covalent bond, the first end group is combined with the organic layer 30 by Van der Waals force, and the first connecting group is arranged between the adjacent first connecting groups in the direction parallel to the plane of the first inorganic layer 10 by Van der Waals force, so that the combination strength between the first inorganic layer and the organic layer is improved, and the packaging effect is improved.
In some alternative embodiments, the first anchoring group of the first self-assembling monomolecular comprises-SR, -COR, -PO (R)) 2 ，-SiR 3 Wherein R comprises at least one of hydrogen atom, hydroxyl, halogen, alkyl and alkoxy.
In some alternative embodiments, the first terminal group includes one of a hydrogen atom, a fluorine atom, an alkyl group, an alkenyl group, an alkynyl group, an alkoxy group, an amino group, a trifluoromethyl group, a substituted or unsubstituted aryl group having 6 to 30 carbon atoms, and a substituted or unsubstituted heteroaryl group having 6 to 30 carbon atoms.
May have one of phenyl, thienyl, naphthyl, or anthracenyl.
In some alternative embodiments, the first linking group comprises one of an alkyl group, a heteroalkyl group, an aryl group, or a heteroaryl group.
May be- (CX) 2 ) n-, heteroalkyl may be- (OCX) 2 ) n-, wherein n is between 4 and 30 and X comprises a hydrogen atom or a fluorine atom.
Alternatively, the first self-assembling single molecule 40 may be of the following formula 1 to formula 37:
each of the above formulas 1 to 37 has a first anchor group, a first terminal group, and a first connecting group, the first anchor group is covalently bonded to the first inorganic layer 10, the first terminal group is bonded to the organic layer 30 by van der waals force, and the adjacent first connecting groups are arranged by van der waals force in a direction parallel to a plane of the first inorganic layer 10, so that the bonding strength between the first inorganic layer and the organic layer is improved, and the encapsulation effect is improved.
Referring to fig. 2, fig. 2 is a cross-sectional view of another package structure provided by the present invention, the package structure in fig. 2 further includes a second inorganic layer 50 and a second self-assembled molecular film 60, the second inorganic layer 50 is located on a side of the organic layer 30 away from the first inorganic layer 10, the second self-assembled molecular film 60 is located between the organic layer 30 and the second inorganic layer 50, and the second self-assembled molecular film 60 is in contact with the organic layer 30 and the second inorganic layer 50, respectively;
the second self-assembled molecular film 60 includes a second self-assembled monomolecular 70, the second self-assembled monomolecular 70 including a second anchoring group, a second terminal group, and a second connecting group for connecting the second anchoring group and the second terminal group; the second anchor group is covalently bonded to the second inorganic layer 60, the second terminal group is bonded to the organic layer 30 by van der waals force, and the second anchor group is arranged between the adjacent second connecting groups in a direction parallel to the plane of the second inorganic layer 50 by van der waals force.
The chemical composition of the second self-assembled monolayer 70 may be the same as or different from that of the first self-assembled monolayer 40, and the process of forming a covalent bond between the second anchor group and the second inorganic layer 60 may be the same as the process of forming a covalent bond between the first anchor group and the first inorganic layer 10, which is not described herein again.
In some alternative embodiments, the second self-assembled molecular film has a thickness D2, wherein 0.5nm ≦ D2 ≦ 7nm.
Optionally, the thickness of the second inorganic encapsulation layer is between 500nm and 1500 nm.
In this embodiment, the second self-assembled monolayer 60 is disposed between the organic layer 30 and the second inorganic layer 50, the second self-assembled monolayer 70 in the second self-assembled monolayer 60 has a second anchoring group, a second terminal group and a second connecting group, the second anchoring group is covalently bonded to the second inorganic layer 50, the first terminal group is bonded to the organic layer 30 by van der waals force, and the second connecting groups adjacent to each other in a direction parallel to the plane of the second inorganic layer 50 are arranged by van der waals force, so that the bonding strength between the second inorganic layer 50 and the organic layer 30 is improved, and the encapsulation effect is further improved.
Based on the same invention idea, the invention also provides a display panel. Referring to fig. 3 and 4, fig. 3 is a cross-sectional view of a display panel provided by the present invention, and fig. 4 is a cross-sectional view of another display panel provided by the present invention.
The display panel 200 in fig. 3 and 4 includes a substrate 1, a light emitting element layer 2, and an encapsulation structure 100;
the light emitting device layer 2 is disposed on the substrate 1, the package structure 100 covers the light emitting device layer 2, and the first inorganic layer 10 is disposed on the organic layer 30 near the light emitting device layer 2.
It is to be understood that the light-emitting element layer 2 may include a cathode, an anode, and an organic light-emitting layer between the cathode and the anode. The light-emitting layer includes one or more of a hole injection layer, a hole transport layer, an electron blocking layer, a light-emitting layer, a hole blocking layer, an electron transport layer, and an electron injection layer (not shown in the drawings).
The encapsulation structure 100 covers the light emitting element layer 2 to protect the light emitting elements in the light emitting element layer 2, and may reduce or prevent external air such as moisture or oxygen from penetrating into the OLED.
The display panel 200 of the present invention has the beneficial effects of the above-mentioned encapsulation structure 100, and the first self-assembled monolayer 20 is disposed between the first organic layer 10 and the organic layer 30, so that the bonding force between the first organic layer 10 and the organic layer 30 is improved, the encapsulation effect is improved, and the reliability of the display panel 200 is improved.
Optionally, the display panel 200 in fig. 4 further includes a second inorganic layer 50 and a second self-assembled molecular film 60, the second inorganic layer 50 is located on a side of the organic layer 30 away from the first inorganic layer 10, the second self-assembled molecular film 60 is located between the organic layer 30 and the second inorganic layer 50, and the second self-assembled molecular film 60 is in contact with the organic layer 30 and the second inorganic layer 50, respectively, and the second self-assembled monolayer molecules 70 in the second self-assembled molecular film 60 improve the bonding strength between the second inorganic layer 50 and the organic layer 30, thereby further improving the encapsulation effect.
Referring to fig. 5 to 7 and fig. 3, fig. 5 is a flowchart of a packaging method provided by the present invention, fig. 6 and 7 are structural diagrams corresponding to steps in a packaging process, and the packaging method in fig. 5 includes the following steps:
s11, providing an array substrate to be packaged, wherein the array substrate comprises a substrate and a light-emitting element layer positioned on the substrate, and a first inorganic layer is formed on the light-emitting element layer;
referring to fig. 6, an array substrate 00 to be packaged is shown in fig. 6, the array substrate 00 includes a substrate 1 and a light emitting element layer 2 on the substrate 1, a first inorganic layer 10 is first formed on the light emitting element layer 2, and optionally, the first inorganic layer 10 may be formed by a method of a Chemical Vapor Deposition (CVD) method or an Atomic Layer Deposition (ALD) method.
S12, forming a first self-assembled monolayer on the first inorganic layer, including:
preparing a first self-assembled monomolecular solution, the first self-assembled monomolecular solution including a first anchoring group, a first terminal group, and a first linking group for linking the first anchoring group and the first terminal group; coating a layer of first self-assembly monomolecular solution on the surface of the first inorganic layer or soaking the first inorganic layer in the first self-assembly monomolecular solution, hydrolyzing the first anchoring group and then generating a covalent bond with the first inorganic layer, and connecting the first self-assembly monomolecular with the first inorganic layer; the first connecting groups are orderly arranged by van der Waals force between the adjacent first connecting groups in the direction parallel to the plane of the first inorganic layer, and the first terminal group faces to the side far away from the first inorganic layer;
in some alternative embodiments, the solvent in the first self-assembled monomolecular solution may be a solvent such as toluene or xylene, or an alcohol solvent, which is not particularly limited herein.
Referring to fig. 7, fig. 7 is a schematic structural view of the first inorganic layer 10 to which the first self-assembled monolayer is bonded.
One specific embodiment may be: preparing a first self-assembly monomolecular solution with the concentration of 1mmol/mL, wherein the first self-assembly monomolecular comprises a first anchoring group, a first terminal group and a first connecting group for connecting the first anchoring group and the first terminal group, coating a layer of the first self-assembly monomolecular solution on the surface of a first inorganic layer at room temperature or soaking the first inorganic layer in the first self-assembly monomolecular solution for 3min, hydrolyzing the first anchoring group to generate a covalent bond with the first inorganic layer, connecting the first self-assembly molecule with the first inorganic layer, and orderly arranging adjacent first connecting groups in a direction vertical to the plane of the first inorganic layer through van der Waals force, wherein the first terminal group faces to the side far away from the first inorganic layer;
another specific embodiment may be: preparing a first self-assembly monomolecular solution with the concentration of 50mmol/mL, wherein the first self-assembly monomolecular comprises a first anchoring group, a first terminal group and a first connecting group for connecting the first anchoring group and the first terminal group, coating a layer of the first self-assembly monomolecular solution on the surface of a first inorganic layer under the room temperature condition or soaking the first inorganic layer in the first self-assembly monomolecular solution for 5min, hydrolyzing the first anchoring group to generate a covalent bond with the first inorganic layer, connecting the first self-assembly molecule with the first inorganic layer, and orderly arranging adjacent first connecting groups in a direction vertical to the plane of the first inorganic layer through van der Waals force, wherein the first terminal group faces to the side far away from the first inorganic layer;
another specific embodiment may be: preparing a first self-assembly monomolecular solution with the concentration of 25mmol/mL, wherein the first self-assembly monomolecular comprises a first anchoring group, a first terminal group and a first connecting group for connecting the first anchoring group and the first terminal group, coating a layer of the first self-assembly monomolecular solution on the surface of a first inorganic layer under the room temperature condition or soaking the first inorganic layer in the first self-assembly monomolecular solution for 4min, hydrolyzing the first anchoring group to generate a covalent bond with the first inorganic layer, connecting the first self-assembly molecule with the first inorganic layer, and orderly arranging adjacent first connecting groups in a direction vertical to the plane of the first inorganic layer through van der Waals force, wherein the first terminal group faces to the side far away from the first inorganic layer;
of course, the concentration of the first self-assembling monomolecular solution may be any concentration of 5mmol/mL, 10mmol/mL, 15mmol/mL, 25mmol/mL, 30mmol/mL, 35mmol/mL, 40mmol/mL, 45mmol/mL, or 50mmol/mL, or may be any concentration of 1mmol/mL to 50mmol/mL, and is not particularly limited herein.
The first self-assembly single molecule can complete the self-assembly with the first inorganic layer under the room temperature condition, and the process condition is easy to operate. The first anchoring group of the first self-assembly molecule and the first inorganic layer can form a covalent bond, and are adsorbed on the first inorganic packaging layer in a covalent bond mode, the first terminal group at the other end has hydrophobicity (organophilic property), so that the first anchoring group can be in good contact with an organic packaging layer which is prepared above the first self-assembly molecule in the next step, and the interface characteristic is improved, wherein the improved interface characteristic means that the binding force between the first inorganic layer and the organic layer is enhanced.
S13, annealing to remove the solvent;
optionally, annealing at 80-120 deg.C for 20min to remove solvent;
and S14, forming an organic layer on the side of the first self-assembled monolayer far away from the first inorganic layer, wherein the first end group of the first self-assembled monolayer is bonded with the organic molecules of the organic layer through Van der Waals force.
In some alternative embodiments, the organic layer may be formed by ink jet printing.
The structure after the organic layer is formed can be referred to fig. 3.
In some alternative embodiments the organic layer is 1um to 15um thick. Preferably 6um to 10um thick.
The packaging method of the embodiment has a simple and easily-realized process, can complete the self-assembly of the first self-assembly single molecule on the surface of the first inorganic layer at room temperature, improves the bonding strength between the first inorganic layer and the organic layer, and improves the packaging effect.
Referring to fig. 8, 6, 7, 3, and 9 to 12, fig. 8 is a flowchart of another packaging method provided by the present invention, fig. 9 to 13 are structural diagrams corresponding to steps in a packaging process, and the packaging method in fig. 8 further includes:
s15, providing a glass substrate;
s16, attaching a transfer film on the glass substrate;
in some alternative embodiments, the transfer film comprises one of Polydimethylsiloxane (PDMS), polycarbonate, polyester fiber, polymethylmethacrylate, and polyamide fiber. In the embodiment, the transfer film is polydimethylsiloxane, which is one of organic silicon, and the polydimethylsiloxane is a polymer material widely used in the fields of microfluidics and the like due to the characteristics of low cost, simple use, good adhesion with a silicon wafer, good chemical inertness and the like.
Specifically, the transfer film may be treated for 50s under air plasma to adjust the surface hydrophilicity.
Referring to fig. 9, fig. 9 is a structural view of the transfer film 4 attached to the glass substrate 3. It can be understood that the transfer film and the glass substrate are only in an attached relationship and do not have adhesion, and after the subsequent steps are completed, both the glass substrate and the transfer film need to be peeled off, and the transfer film is not a film layer in the packaging structure.
S17, forming a second inorganic layer on the transfer film;
referring to fig. 10, a second inorganic layer 50 is formed on the transfer film, where the second inorganic layer may be formed by a method of a Chemical Vapor Deposition (CVD) method or an Atomic Layer Deposition (ALD) method.
S18, forming a second self-assembled monolayer on the second inorganic layer, comprising:
preparing a second self-assembling monomolecular solution, wherein the second self-assembling monomolecular solution comprises a second anchoring group, a second terminal group and a second connecting group for connecting the second anchoring group and the second terminal group; coating a layer of second self-assembly monomolecular solution on the surface of the second inorganic layer or soaking the second inorganic layer in the second self-assembly monomolecular solution, hydrolyzing the second anchoring group to generate a covalent bond with inorganic molecules of the second inorganic layer, and connecting the second self-assembly monomolecular layer with the second inorganic layer; the second connecting groups are orderly arranged by van der waals force between the adjacent second connecting groups in the direction parallel to the plane of the second inorganic layer, and the second terminal group faces to the side far away from the second inorganic layer;
referring to fig. 11, fig. 11 shows a structure after the second self-assembled monomolecular is formed on the second inorganic layer 50, and the second anchoring group of the second self-assembled monomolecular in fig. 11 forms a covalent bond with the second inorganic layer 50, and the bonding force is stronger.
The process of forming covalent bond between the second self-assembled single molecule and the second inorganic layer is not described in detail herein.
The process conditions for forming the second self-assembled monolayer can refer to the process conditions for forming the first self-assembled monolayer in S12, and the details are not repeated herein.
S19, annealing to remove the solvent;
optionally, annealing at 80-120 deg.C for 20min to remove solvent.
S20, separating the transfer film from the glass substrate;
because the transfer film and the glass substrate are only in an adhesion relationship, the glass substrate can be easily separated. Referring to fig. 12, the glass substrate 3 is peeled from the transfer film 4 in fig. 12.
And S21, overturning the transfer film with the second self-assembled monomolecular film, attaching the surface of the second self-assembled monomolecular film to the surface of the organic layer, peeling the transfer film to expose the second inorganic layer, and combining a second end group of the second self-assembled monomolecular film and organic molecules of the organic layer through van der Waals force to connect the second self-assembled monomolecular film and the organic layer.
It is understood that the transfer film 4 and the second inorganic layer 50 are flexible and can be bent, and can be completely contacted with the surface of the organic layer 30 by bending after being turned over, and referring to fig. 13, fig. 13 shows that the transfer film 4 with the second self-assembled monolayer 60 is turned over, the surface of the second self-assembled monolayer is attached to the surface of the organic layer 30, and then the transfer film is peeled off to expose the second inorganic layer 50, and the structure in fig. 4 is obtained.
In this embodiment, the second inorganic layer 50 is first fabricated by using the transfer film 4, and then the second self-assembled monolayer 50 is formed on the surface of the second inorganic layer 50, so as to complete the covalent bonding between the second self-assembled monolayer 50 and the second inorganic layer 50, and then the second self-assembled monolayer 50 is bonded to the organic layer 30, so as to complete the encapsulation. The bonding force between the first inorganic layer 10 and the organic layer 30 and the bonding force between the organic layer 30 and the second inorganic layer 50 are improved by the action of the first self-assembled monolayer 20 and the second self-assembled monolayer 60, and the encapsulation effect is improved.
In some optional embodiments, referring to fig. 14, fig. 15 and fig. 4, fig. 14 is a flowchart of another packaging method provided by the present invention, fig. 15 is a corresponding structural diagram in a packaging process, and the packaging method in fig. 14 further includes:
s25, forming a second self-assembled monolayer on the organic layer, comprising:
preparing a second self-assembling monomolecular solution, wherein the second self-assembling monomolecular solution comprises a second anchoring group, a second terminal group and a second connecting group for connecting the second anchoring group and the second terminal group; coating a layer of second self-assembly monomolecular solution on the surface of the organic layer or soaking the organic layer in the second self-assembly monomolecular solution, wherein a second terminal group of the second self-assembly monomolecular film is combined with organic molecules of the organic layer through van der Waals force, so that the second self-assembly monomolecular film is connected with the organic layer; the adjacent second connecting groups are orderly arranged by van der Waals force in the direction parallel to the plane of the organic layer, and the second anchoring group faces to the side far away from the organic layer;
the process conditions for forming the second self-assembled monolayer can refer to the process conditions for forming the first self-assembled monolayer in S12, and are not described herein again.
The second terminal group on the second self-assembly monomolecular has hydrophobicity, can form good interface contact with the organic layer, improves the interface property, and the second anchoring group on the other side has hydrophilicity and can be regularly arranged towards the outer side.
Referring to fig. 15, a second self-assembled monolayer is formed on the organic layer 30.
In some alternative embodiments, the first self-assembling single molecule has a different chemical formula than the second self-assembling single molecule.
The first self-assembled monolayer 40 is required to form a covalent bond with the first inorganic layer 10, and the second self-assembled monolayer is required to be firstly bonded to the organic layer 30 by van der waals force, which is smaller than the bonding force of the covalent bond, so that the second end group of the second self-assembled monolayer 70 is required to have stronger performance and be more easily bonded to the organic layer 30. Optionally, the first self-assembling single molecule is
And the second self-assembling single molecule 70 is
S26, annealing to remove the solvent;
optionally, annealing at 80-120 deg.C for 20min to remove solvent.
And S27, forming a second inorganic layer on the surface of the second self-assembled monomolecular film, wherein the second inorganic layer is connected with the second self-assembled monomolecular film by forming a covalent bond with inorganic molecules of the second inorganic layer after the second anchoring group is hydrolyzed.
Structure referring to fig. 4, the description is omitted.
The packaging method of the embodiment has simple and easily realized process, can complete the self-assembly of the second self-assembly single molecule on the surface of the organic layer under the room temperature condition, improves the bonding strength between the second inorganic layer and the organic layer, and further improves the packaging effect.
As can be seen from the above embodiments, the package structure, the display panel and the packaging method provided by the present invention at least achieve the following advantages:
the first self-assembled monomolecular film is additionally arranged between the first inorganic layer and the organic layer, and comprises first self-assembled monomolecular molecules, wherein the first self-assembled monomolecular molecules comprise first anchoring groups, first terminal groups and first connecting groups for connecting the first anchoring groups and the first terminal groups, the first anchoring groups are combined with the first inorganic layer through covalent bonds, the first terminal groups are combined with the organic layer through van der Waals force, and the first connecting groups are arranged between the adjacent first connecting groups in the direction parallel to the plane of the first inorganic layer through van der Waals force, so that the combination strength between the first inorganic layer and the organic layer is improved, and the packaging effect is improved.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (10)
1. A package structure, comprising:
a first inorganic layer;
an organic layer stacked with the first inorganic layer;
a first self-assembled monomolecular film which is positioned between the first inorganic layer and the organic layer and is respectively contacted with the first inorganic layer and the organic layer;
wherein the first self-assembled monolayer comprises a first self-assembled monolayer, wherein the first self-assembled monolayer comprises a first anchoring group, a first terminal group, and a first linking group for linking the first anchoring group and the first terminal group; the first anchoring group is covalently bonded to the first inorganic layer, the first terminal group is bonded to the organic layer by van der waals force, and the first anchoring group and the first connecting group are arranged by van der waals force between adjacent first connecting groups in a direction parallel to a plane of the first inorganic layer;
the organic film is characterized by further comprising a second inorganic layer and a second self-assembled molecular film, wherein the second inorganic layer is positioned on one side, away from the first inorganic layer, of the organic layer, the second self-assembled molecular film is positioned between the organic layer and the second inorganic layer, and the second self-assembled molecular film is respectively in contact with the organic layer and the second inorganic layer; the second self-assembled molecular film comprises a second self-assembled single molecule, wherein the chemical formula of the first self-assembled single molecule is different from that of the second self-assembled single molecule.
2. The encapsulation structure of claim 1, wherein the first anchoring group of the first self-assembled monolayer comprises-SR, -COR, -PO (R) 2 ，-SiR 3 Wherein R comprises at least one of hydrogen atom, hydroxyl, halogen, alkyl and alkoxy.
3. The package structure of claim 1, wherein the first terminal group comprises one of a hydrogen atom, a fluorine atom, an alkyl group, an alkenyl group, an alkynyl group, an alkoxy group, an amino group, a trifluoromethyl group, a substituted or unsubstituted aryl group having 6 to 30 carbon atoms, and a substituted or unsubstituted heteroaryl group having 6 to 30 carbon atoms.
4. The encapsulation structure of claim 1, wherein the first linking group comprises one of an alkyl group, a heteroalkyl group, an aryl group, or a heteroaryl group.
5. The package structure according to claim 1, wherein the second self-assembled monolayer comprises a second anchoring group, a second terminal group, and a second linking group for linking the second anchoring group and the second terminal group; the second anchor group is covalently bonded to the second inorganic layer, the second terminal group is bonded to the organic layer by van der waals force, and the second anchor group and the second inorganic layer are arranged adjacent to each other by van der waals force in a direction parallel to a plane of the second inorganic layer.
6. A display panel comprising a substrate, a light-emitting element layer, and the package structure according to any one of claims 1 to 5;
the light-emitting element layer is located on the substrate, the packaging structure covers the light-emitting element layer, and the first inorganic layer is located on one side, close to the light-emitting element layer, of the organic layer.
7. A method of packaging, comprising:
providing an array substrate to be packaged, wherein the array substrate comprises a substrate and a light-emitting element layer positioned on the substrate, and a first inorganic layer is formed on the light-emitting element layer;
forming a first self-assembled monolayer on the first inorganic layer, comprising:
preparing a first self-assembling monomolecular solution, wherein the first self-assembling monomolecular solution comprises a first anchoring group, a first terminal group and a first connecting group for connecting the first anchoring group and the first terminal group; coating a layer of the first self-assembly monomolecular solution on the surface of the first inorganic layer or soaking the first inorganic layer in the first self-assembly monomolecular solution, wherein the first anchoring group generates a covalent bond with the first inorganic layer after being hydrolyzed, and the first self-assembly monomolecular is connected with the first inorganic layer; the first connecting groups are arranged in order by van der waals force in the direction parallel to the plane of the first inorganic layer, and the first terminal group faces to the side far away from the first inorganic layer;
annealing to remove the solvent;
forming an organic layer on a side of the first self-assembled monolayer remote from the first inorganic layer, wherein the first end group of the first self-assembled monolayer is bonded to the organic molecules of the organic layer by van der waals force;
forming a second self-assembled monolayer on the organic layer, comprising: preparing a second self-assembly monomolecular solution; alternatively, the first and second electrodes may be,
providing a glass substrate;
attaching a transfer film on the glass substrate;
forming a second inorganic layer on the transfer film;
forming a second self-assembled monolayer on the second inorganic layer, comprising: preparing a second self-assembly monomolecular solution;
the first self-assembled single molecule has a different chemical formula than the second self-assembled single molecule.
8. The method of packaging of claim 7, further comprising:
when a second self-assembled monomolecular film is formed on the second inorganic layer, the second self-assembled monomolecular film includes a second anchoring group, a second terminal group, and a second connecting group for connecting the second anchoring group and the second terminal group; coating a layer of the second self-assembly monomolecular solution on the surface of the second inorganic layer or soaking the second inorganic layer in the second self-assembly monomolecular solution, wherein the second anchoring group generates a covalent bond with the inorganic molecules of the second inorganic layer after hydrolysis, and the second self-assembly monomolecular is connected with the second inorganic layer; the second connecting groups are arranged in order by van der waals force in the direction parallel to the plane of the second inorganic layer, and the second terminal group faces to the side far away from the second inorganic layer;
annealing to remove the solvent;
separating the transfer film from the glass substrate;
and turning over the transfer film with the second self-assembled monomolecular film to ensure that the surface of the second self-assembled monomolecular film is attached to the surface of the organic layer, peeling off the transfer film to expose the second inorganic layer, and combining the second end group of the second self-assembled monomolecular film and the organic molecules of the organic layer through van der Waals force to ensure that the second self-assembled monomolecular film is connected with the organic layer.
9. The encapsulation method of claim 8, wherein the transfer film comprises one of polydimethylsiloxane, polycarbonate, polyester fiber, polymethyl methacrylate, and polyamide fiber.
10. The method of packaging of claim 7, further comprising:
when a second self-assembled monomolecular film is formed on the organic layer, the second self-assembled monomolecular film includes a second anchoring group, a second terminal group, and a second connecting group for connecting the second anchoring group and the second terminal group; coating a layer of the second self-assembled monomolecular solution on the surface of the organic layer or soaking the organic layer in the second self-assembled monomolecular solution, wherein the second terminal group of the second self-assembled monomolecular film is combined with the organic molecules of the organic layer through van der Waals force, so that the second self-assembled monomolecular film is connected with the organic layer; the second anchoring groups are arranged orderly through van der waals force between the adjacent second connecting groups in the direction parallel to the plane of the organic layer, and the second anchoring groups face to the side far away from the organic layer;
annealing to remove the solvent;
and forming a second inorganic layer on the surface of the second self-assembled monomolecular film, wherein the second inorganic layer is connected with the second self-assembled monomolecular film by forming a covalent bond with inorganic molecules of the second inorganic layer after the second anchoring group is hydrolyzed.
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