CN111799374B - Display panel, preparation method and display device thereof - Google Patents
Display panel, preparation method and display device thereof Download PDFInfo
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- CN111799374B CN111799374B CN202010692546.3A CN202010692546A CN111799374B CN 111799374 B CN111799374 B CN 111799374B CN 202010692546 A CN202010692546 A CN 202010692546A CN 111799374 B CN111799374 B CN 111799374B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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Abstract
The specification provides a display panel, a preparation method and a display device thereof. Specifically, the display panel includes a polyimide substrate including polyimide and a polymer-based ultraviolet absorber; the polyimide substrate comprises a through hole, and the through hole is matched with a preset non-display area of the under-screen camera. According to the technical scheme, the polymer ultraviolet absorber is added into the polyimide substrate, so that the polyimide substrate can absorb part of ultraviolet light when the coating layer is removed through laser scanning, the laser energy actually absorbed by polyimide is reduced, the polyimide is prevented from being carbonized under the action of high-energy laser, and the technical effect of improving the transmittance of the display panel is achieved.
Description
Technical Field
One or more embodiments of the present disclosure relate to the field of display technologies, and in particular, to a display panel, a manufacturing method, and a display device thereof.
Background
Currently, in order to enlarge the area of a displayable area, a great deal of display of a mobile phone manufacturer is presented in the market, such as Liu Haibing, a water drop screen and the like, for improving the visual experience of users. The mobile phone screen is made into the structure, and the area of the display area is increased, but the area above the camera can not be displayed. In order to solve the problem, the technology of the under-screen camera is presented, and the area above the under-screen camera can be normally displayed and has higher transmittance, so that the camera can normally work, and the function of front photographing is realized. However, in the existing under-screen camera technology, the transmittance of the display panel needs to be improved compared with that of the water drop screen and Liu Haibing.
Disclosure of Invention
In view of the above, one or more embodiments of the present disclosure are directed to a display panel, a manufacturing method and a display device thereof, so as to solve the technical problem of insufficient transmittance of the display panel in the under-screen camera technology.
In view of the above object, a first aspect of the present specification provides a display panel including a polyimide substrate including polyimide and a polymer-based ultraviolet absorber; the polyimide substrate comprises a through hole, and the through hole is matched with a preset non-display area of the under-screen camera.
Further, the polymer-based ultraviolet absorber includes a polyamide-based ultraviolet absorber.
Further, the polyamide ultraviolet absorber comprises a polymer shown in a formula (I).
Further, the mass percentage of the polymer ultraviolet absorber in the polyimide substrate is 0.5-1.0%.
In a second aspect of the present specification, there is provided a method for manufacturing a display panel, including:
providing a substrate;
forming a polyimide substrate and a driving back plate on the substrate base plate; the polyimide substrate and the driving backboard are provided with through holes matched with a non-display area preset by the under-screen camera;
the step of forming the polyimide substrate and the driving backboard on the substrate base plate at least comprises the following steps:
and coating the solution of the polyimide and the polymer ultraviolet absorber which are uniformly mixed on the substrate base plate, and curing to form a polyimide layer.
Further, the mass percentage of the polymer ultraviolet absorber in the polyimide layer is 0.5-1.0%.
Further, when the polymeric ultraviolet absorber comprises a polymer represented by the formula (I),
the preparation method further comprises the following steps:
carrying out one-step condensation on cyanuric chloride and 4,4 '-diaminostilbene-2, 2' -disulfonic acid until the amino value is zero, so as to obtain a one-step condensation solution;
adding aniline into the one-step condensation solution, and performing two-step condensation until the amino value is zero to obtain a two-step condensation solution;
and adding diethanolamine and polyethylenetriamine into the two-step condensation solution, and condensing to obtain the polymer ultraviolet absorbent.
Further, the preparation method of the poly (ethylene diamine adipamide) comprises the following steps:
under the action of a catalyst, using diethylenetriamine and adipic acid to prepare the polyethylenetriamine.
Further, the step of forming the polyimide substrate and the driving back plate on the substrate base plate further comprises:
forming the driving back plate layer on the polyimide layer;
and carrying out gas etching on the polyimide layer and the driving backboard layer by using a mask plate to form the polyimide substrate and the driving backboard.
Further, the step of forming the polyimide substrate and the driving back plate on the substrate base plate further comprises:
coating photoresist on the polyimide layer, exposing by using a mask plate, and developing to form a patterned photoresist layer;
performing gas etching on the polyimide layer arranged below the patterned photoresist layer, and stripping the patterned photoresist layer to obtain the polyimide substrate;
forming a driving back plate layer on the polyimide substrate;
and carrying out gas etching on the driving backboard layer by using a mask plate to form the driving backboard.
Further, the method further comprises the following steps:
vacuum evaporation coating is carried out on the driving backboard to form a coating layer, and the coating layer is contacted with the substrate base plate at the position of the through hole;
forming a packaging layer on the coating layer;
scanning the substrate by laser to remove the coating layer corresponding to the position of the through hole; and
and removing the substrate.
Further, the energy of the laser scanning is 260-280 mJ/cm 2 。
In a third aspect of the present specification, there is also provided a display device including any one of the display panels described above.
From the above, it can be seen that, in the display panel provided in one or more embodiments of the present disclosure, by adding the polymer ultraviolet absorber into the polyimide substrate, the polyimide substrate can absorb a part of ultraviolet light when the coating layer is removed by laser scanning, so as to reduce the laser energy actually absorbed by the polyimide, avoid carbonization of the polyimide under the action of high-energy laser, and have the technical effect of improving the transmittance of the display panel.
Drawings
For a clearer description of one or more embodiments of the present description or of the solutions of the prior art, the drawings that are necessary for the description of the embodiments or of the prior art will be briefly described, it being apparent that the drawings in the description below are only one or more embodiments of the present description, from which other drawings can be obtained, without inventive effort, for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an under-screen camera display panel according to one or more embodiments of the present disclosure;
fig. 2 is a schematic layout diagram of a mobile phone screen unit on a substrate according to one or more embodiments of the present disclosure;
FIG. 3 is a schematic diagram illustrating a manufacturing process of a display panel according to one or more embodiments of the present disclosure;
FIG. 4 is a schematic illustration of a process flow for preparing a polyimide substrate and a drive backplate according to one or more embodiments of the present disclosure;
FIG. 5 is a schematic illustration of a process flow for preparing a polyimide substrate according to one or more embodiments of the present disclosure;
FIG. 6 is a schematic diagram of a layer structure of a display panel according to one or more embodiments of the present disclosure;
FIG. 7 is a schematic illustration of another process flow for preparing a polyimide substrate and a drive backplate provided in one or more embodiments of the present disclosure;
fig. 8 is a schematic diagram of another manufacturing process of a display panel according to one or more embodiments of the present disclosure.
Detailed Description
For the purposes of promoting an understanding of the principles and advantages of the disclosure, reference will now be made to the embodiments illustrated in the drawings and specific language will be used to describe the same.
It is noted that unless otherwise defined, technical or scientific terms used in one or more embodiments of the present disclosure should be taken in a general sense as understood by one of ordinary skill in the art to which the present disclosure pertains. The use of the terms "first," "second," and the like in one or more embodiments of the present description does not denote any order, quantity, or importance, but rather the terms "first," "second," and the like are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
Fig. 1 is a schematic structural diagram of an under-screen camera display panel provided in the present application. The display panel includes an Active Area 1 (AA Area for short) and an under-screen camera Area 2. The under-screen camera region 2 includes sub-pixels 3 and a non-display region 4.
At present, the technology widely adopted by the under-screen camera technology is to etch the position corresponding to the non-display Area 4 of the under-screen camera Area 2 in the back plate driving technology (BP technology) by a gas etching method to form a through Hole (AA Hole for short). Then, normal vacuum Evaporation coating process (EV process) and Encapsulation process (EN process) are performed. The through holes enable the coating layer formed by the vacuum evaporation coating process to be partially positioned in the through holes and directly contacted with the substrate. The Laser surface scanning is performed through a Laser Lift-Off (LLO) process in a post-cutting process (Even After Cutting, EAC process for short), so that a coating layer at the through hole can be removed, and the transmittance of the non-display area 4 can be ensured to meet the shooting requirement of the front camera.
The inventor of the application finds that compared with the low-energy laser, the high-energy laser has better effect of removing the coating layer and can meet the requirement of the front camera on the transmittance, such as high-energy ultraviolet laser with the wavelength of 308 nm. The coating layer comprises a hole transport layer, an organic light-emitting layer, an electron transport layer and a metal cathode; wherein the metal cathode seriously affects the transmittance and needs to be removed as much as possible.
As shown in fig. 2, a plurality of mobile phone screen units may be disposed on a substrate 501. Since it is difficult to determine the specific position of the through hole corresponding to the non-displayed area of the camera area 2, the entire substrate 501 is scanned by high-energy laser scanning in order to secure the removal effect of the coating layer at the through hole. However, for a display panel employing a polyimide flexible substrate, when the entire substrate 501 is scanned with a high energy uv laser, the high energy laser is too energetic for the polyimide substrate (corresponding to the display area in the active display area 1 and the under-screen camera area 2) at the non-via locations on the substrate, which will result in more Ash residues (Ash) of the polyimide, greatly affecting the transmittance of the display panel, and reducing the user experience.
It should be understood that ash residue here is that the organic matter is carbonized at high temperature after laser light has acted on the organic matter.
In view of this, in a first aspect of the present specification, there is provided a display panel. Specifically, referring to fig. 5 to 6, the display panel includes a polyimide substrate 506, the polyimide substrate 506 including polyimide and a polymer-based ultraviolet absorber; the polyimide substrate 506 includes through holes that match the pre-set non-display area of the under-screen camera.
It should be noted that, the through hole position in the polyimide substrate 506 is used for the front camera to obtain the ambient light, and the other positions can all meet the requirement of normal display, and belong to the normal display area, for example, the effective display area 1 and the display area in the under-screen camera area 2 (see fig. 1).
According to the technical scheme, the polymer ultraviolet absorber is added into the polyimide substrate, so that the polyimide substrate can absorb part of ultraviolet light when the coating layer is removed through laser scanning, the laser energy actually absorbed by polyimide is reduced, the polyimide is prevented from being carbonized under the action of high-energy laser, and the technical effect of improving the transmittance of the display panel is achieved.
In one or more embodiments herein, the polymeric uv absorber includes a polyamide-based uv absorber. Here, the polyamide-based ultraviolet absorber has a structure similar to that of polyimide, has properties closer to those of polyimide, and can realize that the overall properties of the polyimide substrate are not changed while absorbing ultraviolet rays, thereby meeting the requirements of flexible display on the polyimide substrate, such as stability, light transmittance and the like.
The ultraviolet absorber of other polymers has the characteristics of compatibility with polyimide, high transparency, good stability under high temperature conditions and the like, and can be also suitable for the technical scheme of the application. The present invention is not particularly limited herein.
The polymer-based ultraviolet absorber may also be, for example, a polyurethane-based polymer ultraviolet absorber, a benzotriazole-based polymer ultraviolet absorber, or a polyvinyl alcohol-based polymer ultraviolet absorber. It should be understood that the polymer-based ultraviolet light absorber may be one or a combination of more of polyurethane-based polymer ultraviolet light absorbers, benzotriazole-based polymer ultraviolet light absorbers, polyamide-based ultraviolet light absorbers, and polyvinyl alcohol-based polymer ultraviolet light absorbers.
In one or more embodiments herein, the polyamide-based ultraviolet light absorber includes a polymer of formula (i):
optionally, the polyamide-based ultraviolet absorber further comprises a polymer of formula (ii):
the polyamide ultraviolet absorber has outstanding thermal stability and light stability, good compatibility with polyimide, and is suitable for flexible display panels.
In one or more embodiments of the present disclosure, the mass percentage of the polymer-based ultraviolet absorber in the polyimide substrate is 0.5% to 1.0%. Optionally, the mass percentage of the polymer ultraviolet absorber in the polyimide substrate is 0.6-0.8%.
Here, the polyimide and the polymer ultraviolet absorbent adopt the mass ratio, so that the performance requirement of the display panel on the polyimide substrate can be met, and meanwhile, the polymer ultraviolet absorbent contained in the polyimide and the polymer ultraviolet absorbent can effectively absorb high-energy laser in the subsequent film coating layer removing process, so that the loss of the polyimide is reduced, ash generation is avoided, and the transmittance of the display panel is ensured. When the mass ratio is 0.6% -0.8%, the transmittance of the display panel is better and the stability is better.
Optionally, the display panel of the present specification is particularly suitable for Active-matrix organic light emitting diode (AMOLED) display technology.
In a second aspect of the present specification, there is also provided a method of manufacturing a display panel. Specifically, referring to fig. 3, the preparation method includes:
step 301: a substrate is provided.
The substrate may be a glass substrate, or any other suitable substrate, which is not particularly limited herein.
Step 302: forming a polyimide substrate and a driving back plate on the substrate base plate; the polyimide substrate and the driving backboard are provided with through holes matched with a non-display area preset by the under-screen camera.
It should be understood that through holes matched with the non-display area preset by the under-screen camera are arranged on the polyimide substrate and the driving backboard, so that the camera can acquire ambient light through the through holes; meanwhile, normal display of the screen is realized by means of the display area in the under-screen camera area, and further the technical effect of the full-screen is realized.
Further, referring to fig. 4, 6 and 7, the step of forming a polyimide substrate and a driving back plate on the substrate base plate at least includes:
step 3021: the polyimide layer 502 is formed by applying a solution of the uniformly mixed polyimide and polymer-based ultraviolet absorber to the substrate 501 and curing the same.
It should be noted that the curing may be achieved by a baking process.
Here, through adding polymer class ultraviolet absorber in the in-process of preparing polyimide layer, realize increasing the technical effect of ultraviolet absorbing material in polyimide substrate, can ensure that ultraviolet absorbing material evenly distributed in polyimide substrate, ensure the homogeneity stability of polyimide substrate, satisfy simultaneously can absorb the demand of partial ultraviolet light when laser scanning removes the coating film layer.
In one or more embodiments of the present disclosure, the mass percentage of the polymer-based ultraviolet absorber in the polyimide layer is 0.5% to 1.0%. Optionally, the mass percentage of the polymer ultraviolet absorber in the polyimide layer is 0.6-0.8%.
Here, the polyimide and the polymer ultraviolet absorbent adopt the mass ratio, so that the performance requirement of the display panel on the polyimide substrate can be met, and meanwhile, the polymer ultraviolet absorbent contained in the polyimide and the polymer ultraviolet absorbent can effectively absorb high-energy laser in the subsequent film coating layer removing process, so that the loss of the polyimide is reduced, ash generation is avoided, and the transmittance of the display panel is ensured. When the mass ratio is 0.6% -0.8%, the transmittance of the display panel is better and the stability is better.
In one or more embodiments of the present disclosure, when the polymeric ultraviolet light absorber comprises a polymer of formula (I),
the preparation method further comprises the following steps:
(1) Preparation of Poly (ethylene diamine adipamide) (PPC)
Specifically, referring to synthetic pathway I, a polyethylenetriamine is prepared from diethylenetriamine and adipic acid in the presence of a catalyst.
(2) Preparation of polyamide ultraviolet absorber
Specifically, referring to a synthesis path II, carrying out one-step condensation on cyanuric chloride and 4,4 '-diaminostilbene-2, 2' -disulfonic acid until an amino value is zero to obtain a one-step condensation solution;
adding aniline into the one-step condensation solution, and performing two-step condensation until the amino value is zero to obtain a two-step condensation solution;
and adding diethanolamine and the poly (ethylene diamine adipamide) into the two-step condensation solution, and condensing to obtain the polymer ultraviolet absorbent.
Illustratively, the examples herein also provide a process for preparing a poly (ethylene triamine) (PPC). Specifically, diethylenetriamine and deionized water are sequentially added into a three-neck flask equipped with a reflux condenser, a thermometer and a stirrer, and adipic acid and a small amount of catalyst are added under stirring. And after the automatic heat release of the system is finished, heating and reacting for a period of time, then cooling and slowly adding water to adjust the solid content to be 50%, thus obtaining the yellow transparent PPC intermediate.
Exemplary, embodiments of the present specification also provide a method of preparing a polyamide-based ultraviolet absorber. Specifically, 20g of an acetone solution containing 3g of cyanuric chloride was added to a three-necked flask, 20g of 15% alkali solution of DSD acid (4, 4 '-diaminostilbene-2, 2' -disulfonic acid, abbreviated as DSD acid) was added dropwise under strong stirring, and the reaction temperature was controlled at 0 to 5℃by adding 20% Na during this process 2 CO 3 Adjusting the pH value to 5-6, and reacting until the amino value is 0 (corresponding to one-step condensation); heating to 10 ℃, adding 1.5g of aniline, controlling the pH value to be 5-6, heating to 35-40 ℃ gradually, and reacting to aminoAfter disappearance of the values (corresponding to two-step condensation); continuously heating to 60-70 ℃, adding 1g of diethanolamine and a proper amount of polyamide (PPC) solution, slowly evaporating acetone, controlling the pH to be 5.5-6.5, slowly heating to 88-98 ℃, controlling the pH to be 6-7, and reacting until the pH is not changed any more to obtain the faint yellow polyamide ultraviolet absorbent emulsion (corresponding to three-step and four-step condensation).
The amounts of the reactants added in the examples in this specification are merely illustrative, and those skilled in the art will understand that the amounts of the reactants added may be adjusted according to the requirements for the polyamide-based ultraviolet absorber, and are not particularly limited herein.
Furthermore, the reaction conditions of the examples in this specification are not limitations on the preparation method of the polyamide-based ultraviolet absorber, but merely show one alternative reaction condition.
Illustratively, the polyamide-based ultraviolet absorber prepared in step 3021 according to the present embodiment may be: a proper amount of the above-prepared polyamide-based ultraviolet absorber emulsion was added to the polyimide solution, mixed uniformly, and then coated on the substrate base 501.
In one or more embodiments of the present disclosure, referring to fig. 4, the step of forming a polyimide substrate and a driving back plate on a substrate base plate further includes:
step 3022: the driving back plate layer is formed on the polyimide layer.
It should be appreciated that the step 3022 may not be performed until the foregoing step 3021 is completed.
Step 3023: and carrying out gas etching on the polyimide layer and the driving backboard layer by using a mask plate to form the polyimide substrate and the driving backboard.
The pattern of the mask is matched with a preset non-display area of the under-screen camera. In the process of gas etching, the polyimide layer and the driving back plate layer corresponding to the hollowed-out part on the mask plate can form the through hole; the polyimide layer and the driving back plate layer corresponding to the non-hollowed-out part on the mask plate can be completely reserved, so that normal display of the relative position is realized.
Alternatively, the gas used in the gas etching may be CF 4 And O 2 。
The through holes are formed in the polyimide layer and the driving back plate layer simultaneously by a one-time gas etching method, so that the preparation method is simplified, the preparation efficiency is improved, and the precision of the through holes can be effectively ensured.
As an alternative embodiment, one or more embodiments of the present disclosure also provide another method of forming a polyimide substrate and a driving back plate on the substrate base.
Referring to fig. 5 to 7, the preparation method further includes:
step 3024: photoresist is coated on the polyimide layer 502, and is exposed and developed by a mask 504 to form a patterned photoresist layer 505.
Here, as shown in fig. 5, a photoresist layer 503 is formed by applying a photoresist to the polyimide layer 502. It should be understood that the methods of gumming, exposing, and developing are known in the art and will not be described in detail herein.
Step 3025: and (3) performing gas etching on the polyimide layer 502 arranged below the patterned photoresist layer 505, and stripping the patterned photoresist layer 505 to obtain the polyimide substrate 506.
It should be noted that, the patterned photoresist layer 505 functions as a mask, and the area of the polyimide layer 502 not covered by the patterned photoresist layer 505 is etched by the gas, so that the area covered by the patterned photoresist layer 505 can be completely preserved.
Step 3026: a drive back plane layer (not shown in fig. 6) is formed on the polyimide substrate 506.
Step 3027: the drive backplate layer is gas etched using a reticle to form the drive backplate (corresponding to 603 in fig. 6).
It should be understood that the driving back plate 603 includes a buffer layer, an interlayer insulating layer, an anode, a pixel defining layer, and the like. The process of forming the layers of the driving back plate 603 is conventional and will not be described in detail herein.
According to the technical scheme, the through holes are formed in the polyimide layer and the driving back plate layer respectively through the gas etching method, so that compared with the method of simultaneously forming the through holes, the difficulty of gas etching is reduced, and the operation is convenient.
Referring to fig. 6 and 8, in one or more embodiments of the present disclosure, the preparation method further includes the steps of:
step 801: a vacuum evaporation coating is performed on the driving back plate 603 to form a coating layer 604.
As is apparent from referring to fig. 6, the plating layer 604 is in contact with the substrate 501 at the via position due to the presence of a via; in the non-through hole position, the plating layer 604 is in contact with the driving back plate 603, the driving back plate 603 is in contact with the polyimide substrate 506 including the polymer-based ultraviolet absorber, and the polyimide substrate 506 is bonded to the substrate board 501.
As described above, the coating layer 604 here includes a hole transport layer, an organic light emitting layer, an electron transport layer, and a metal cathode.
Step 802: an encapsulation layer (corresponding to 605, 606, and 607 in fig. 6) is formed over the plating layer 604.
The encapsulation layer herein includes a plating layer, such as a first vapor deposition layer 605, an inkjet printing layer 606, and a second vapor deposition layer 607.
Specifically, the first vapor deposition layer 605 is formed by first chemical vapor deposition (Chemical Vapour Deposition, abbreviated CVD), and a material of the first vapor deposition layer 605 may be SiON.
The IJP layer 606 is formed by an Ink Jet Printing technique (abbreviated IJP), and the corresponding material may be an acrylic ultraviolet resin.
The second vapor deposition layer 607 is formed by a second chemical vapor deposition, and the material of the second vapor deposition layer 607 may be SiN.
Step 803: and scanning the substrate 501 by adopting laser to remove the coating layer corresponding to the position of the through hole.
It should be noted that, the laser scanning herein can remove the coating layer corresponding to the through hole position, and due to the existence of the substrate 501, the corresponding material still adheres to the substrate 501.
As described above, the polyimide substrate in this embodiment includes the polymer-based ultraviolet absorber, and when the substrate 501 is scanned by the laser, the polymer-based ultraviolet absorber can absorb ultraviolet, so as to effectively reduce the influence of the high-energy laser on the polyimide while removing the coating layer corresponding to the through hole, reduce the ash generation of the polyimide under the action of the laser, and improve the transmittance of the display panel.
It should be appreciated that the substrate 501 may also be cleaned prior to laser scanning to remove dirt, particles, etc. from the back side of the substrate 501.
Step 804: the substrate base 501 is removed.
It should be understood that, after the substrate 501 is removed, the material of the coating layer corresponding to the through hole is removed thoroughly.
Optionally, the preparation method further comprises: and attaching a protective film on the packaging layer. Optionally, the step of attaching a protective film to the encapsulation layer is completed before step 804.
Optionally, the preparation method further comprises: and attaching a protective film on the polyimide substrate 506.
Further, the energy of the laser scanning is 260-280 mJ/cm 2 . Here, a high-energy laser is used (190 to 195mJ/cm compared with the laser surface scanning in the prior art) 2 ) The coating layer corresponding to the position of the through hole can be effectively removed.
Alternatively, the superposition of multiple lasers may be used for high energy lasers.
Illustratively, the lasers of the present application may be obtained by two lasers having 60% overlap with each other.
In a third aspect of the present specification, there is also provided a display device including any one of the display panels described above. Obviously, the display device of the embodiment adopts the display panel of the foregoing embodiment, which has the beneficial technical effect of high transmittance of the display panel.
The display device may be any device having a display function, including a mobile phone, a tablet computer, a PDA (Personal Digital Assistant ), a POS (Point of Sales), a car-mounted computer, and the like.
The foregoing describes specific embodiments of the present disclosure. Other embodiments are within the scope of the following claims. In some cases, the actions or steps recited in the claims can be performed in a different order than in the embodiments and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.
Those of ordinary skill in the art will appreciate that: the discussion of any of the embodiments above is merely exemplary and is not intended to suggest that the scope of the disclosure, including the claims, is limited to these examples; combinations of features of the above embodiments or in different embodiments are also possible within the spirit of the present disclosure, steps may be implemented in any order, and there are many other variations of the different aspects of one or more embodiments described above which are not provided in detail for the sake of brevity.
While the present disclosure has been described in conjunction with specific embodiments thereof, many alternatives, modifications, and variations of those embodiments will be apparent to those skilled in the art in light of the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may use the embodiments discussed.
The present disclosure is intended to embrace all such alternatives, modifications and variances which fall within the broad scope of the appended claims. Any omissions, modifications, equivalents, improvements, and the like, which are within the spirit and principles of the one or more embodiments of the disclosure, are therefore intended to be included within the scope of the disclosure.
Claims (11)
1. A display panel, comprising a polyimide substrate comprising a polyimide and a polymeric uv absorber;
the polyimide substrate comprises a through hole, and the through hole is matched with a preset non-display area of the under-screen camera;
the polymer ultraviolet absorber comprises polyamide ultraviolet absorber;
the polyamide ultraviolet absorber comprises a polymer shown in a formula (I);
2. the display panel according to claim 1, wherein the mass percentage of the polymer-based ultraviolet absorber in the polyimide substrate is 0.5% to 1.0%.
3. A method for manufacturing a display panel, comprising:
providing a substrate;
forming a polyimide substrate and a driving back plate on the substrate base plate; the polyimide substrate and the driving backboard are provided with through holes matched with a non-display area preset by the under-screen camera;
the step of forming the polyimide substrate and the driving backboard on the substrate base plate at least comprises the following steps:
coating the solution of the polyimide and the polymer ultraviolet absorber which are uniformly mixed on the substrate base plate, and curing to form a polyimide layer;
the polymer ultraviolet absorber comprises polyamide ultraviolet absorber;
the polyamide ultraviolet absorber comprises a polymer shown in a formula (I);
4. the method according to claim 3, wherein the mass percentage of the polymer-based ultraviolet absorber in the polyimide layer is 0.5% -1.0%.
5. The method of manufacturing according to claim 3, further comprising:
carrying out one-step condensation on cyanuric chloride and 4,4 '-diaminostilbene-2, 2' -disulfonic acid until the amino value is zero, so as to obtain a one-step condensation solution;
adding aniline into the one-step condensation solution, and performing two-step condensation until the amino value is zero to obtain a two-step condensation solution;
and adding diethanolamine and polyethylenetriamine into the two-step condensation solution, and condensing to obtain the polymer ultraviolet absorbent.
6. The method of claim 5, wherein the method of preparing the poly (ethylene diamine adipoyl) triamine comprises:
under the action of a catalyst, using diethylenetriamine and adipic acid to prepare the polyethylenetriamine.
7. The method of manufacturing according to claim 3, wherein the step of forming a polyimide substrate and a driving back plate on a substrate base plate further comprises:
forming the driving back plate layer on the polyimide layer;
and carrying out gas etching on the polyimide layer and the driving backboard layer by using a mask plate to form the polyimide substrate and the driving backboard.
8. The method of manufacturing according to claim 3, wherein the step of forming a polyimide substrate and a driving back plate on a substrate base plate further comprises:
coating photoresist on the polyimide layer, exposing by using a mask plate, and developing to form a patterned photoresist layer;
performing gas etching on the polyimide layer arranged below the patterned photoresist layer, and stripping the patterned photoresist layer to obtain the polyimide substrate;
forming a driving back plate layer on the polyimide substrate;
and carrying out gas etching on the driving backboard layer by using a mask plate to form the driving backboard.
9. A method of preparing as claimed in claim 3, further comprising:
vacuum evaporation coating is carried out on the driving backboard to form a coating layer, and the coating layer is contacted with the substrate base plate at the position of the through hole;
forming a packaging layer on the coating layer;
scanning the substrate by laser to remove the coating layer corresponding to the position of the through hole; and
and removing the substrate.
10. The method according to claim 9, wherein the energy of the laser scanning is 260-280 mJ/cm 2 。
11. A display device comprising the display panel of any one of claims 1-2.
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| WO2017072678A1 (en) | 2015-10-26 | 2017-05-04 | Oti Lumionics Inc. | Method for patterning a coating on a surface and device including a patterned coating |
| CN110785867B (en) | 2017-04-26 | 2023-05-02 | Oti照明公司 | Method for patterning a surface coating and apparatus comprising a patterned coating |
| JP7264488B2 (en) | 2017-05-17 | 2023-04-25 | オーティーアイ ルミオニクス インコーポレーテッド | Methods and devices containing conductive coatings for selectively depositing conductive coatings over patterned coatings |
| US11751415B2 (en) | 2018-02-02 | 2023-09-05 | Oti Lumionics Inc. | Materials for forming a nucleation-inhibiting coating and devices incorporating same |
| JP7390739B2 (en) | 2019-03-07 | 2023-12-04 | オーティーアイ ルミオニクス インコーポレーテッド | Materials for forming nucleation-inhibiting coatings and devices incorporating the same |
| KR20220046551A (en) | 2019-06-26 | 2022-04-14 | 오티아이 루미오닉스 인크. | Optoelectronic device comprising a light transmitting region having light diffraction properties |
| US11832473B2 (en) | 2019-06-26 | 2023-11-28 | Oti Lumionics Inc. | Optoelectronic device including light transmissive regions, with light diffraction characteristics |
| CN112349865B (en) * | 2020-10-26 | 2024-04-26 | 京东方科技集团股份有限公司 | OLED panel manufacturing method, OLED panel and electronic equipment |
| CN112397675B (en) * | 2020-11-18 | 2022-07-22 | 合肥维信诺科技有限公司 | Display panel preparation method and display panel |
| US11985841B2 (en) | 2020-12-07 | 2024-05-14 | Oti Lumionics Inc. | Patterning a conductive deposited layer using a nucleation inhibiting coating and an underlying metallic coating |
| CN114171572B (en) * | 2021-12-08 | 2023-05-02 | 武汉华星光电半导体显示技术有限公司 | Display module |
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