CN111799347A - Solar skin and preparation method thereof - Google Patents
Solar skin and preparation method thereof Download PDFInfo
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- CN111799347A CN111799347A CN202010738060.9A CN202010738060A CN111799347A CN 111799347 A CN111799347 A CN 111799347A CN 202010738060 A CN202010738060 A CN 202010738060A CN 111799347 A CN111799347 A CN 111799347A
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- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
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- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
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- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
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- B32B2457/00—Electrical equipment
- B32B2457/12—Photovoltaic modules
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
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Abstract
The invention provides a solar skin and a preparation method thereof, relates to the technical field of solar energy, and solves the technical problems that a solar cell module in the prior art adopts an assembly type, a sticking type and an embedded type installation mode, is not easy to be effectively combined with the surface of a vehicle body, and is easy to influence the appearance of the vehicle body. The solar skin comprises a protective plate layer, a first film clamping layer, a first blocking layer, a second film clamping layer, a solar chip layer, a third film clamping layer, a second blocking layer, a fourth film clamping layer and a back plate layer which are laminated and compounded in sequence, wherein the solar chip layer is internally arranged and wrapped between the second film clamping layer and the third film clamping layer.
Description
Technical Field
The invention relates to the technical field of solar energy, in particular to solar skin and a preparation method thereof.
Background
A solar cell is also called a solar chip or a photovoltaic cell, and is a photoelectric semiconductor sheet that directly generates electricity by using sunlight.
The solar cell module for the automobile generally adopts an assembly type application scheme, a sticking type application scheme and an embedded type application scheme at present, and the solar cell module for the assembly type automobile is mechanically and physically connected with an automobile body, so that the cost is low, the construction is easy, and the appearance and the reliability of the design of the automobile body can be influenced. The adhesive type solar cell module for the vehicle directly adopts the high-molecular weather-resistant structural adhesive to be adhered on the application surface of the vehicle body, is easy to construct and light in weight, can conform to the single-curved-surface modeling of the vehicle body to a certain degree, but can not meet the requirements of double-curved-surface and multi-curved-surface complex design. The embedded automotive solar cell module generally adopts a glass-based component, such as an automobile skylight, and the solar cell is embedded and packaged in the component to form the automotive photovoltaic application with the power generation function.
Therefore, how to solve the technical problems that the solar battery module in the prior art adopts an assembly type, a sticking type and an embedded type installation mode, is not easy to be effectively combined with the surface of the vehicle body and is easy to influence the appearance of the vehicle body becomes an important technical problem to be solved by people in the field.
Disclosure of Invention
The invention aims to provide a solar energy skin and a preparation method thereof, and solves the technical problems that a solar energy battery component in the prior art adopts an assembly type, a sticking type and an embedded type installation mode, is not easy to be effectively combined with the surface of a vehicle body, and is easy to influence the appearance of the vehicle body. The technical effects that can be produced by the preferred technical scheme in the technical schemes provided by the invention are described in detail in the following.
In order to achieve the purpose, the invention provides the following technical scheme:
the invention provides solar skin, which comprises: from top to bottom laminate protection sheet layer, first doubling lamella, first barrier layer, second doubling lamella, solar energy chip layer, third doubling lamella, second barrier layer, fourth doubling lamella and the backsheet layer that compound set up in proper order, solar energy chip layer embeds the package and locates second doubling lamella with between the third doubling lamella.
Preferably, the material of the protective plate layer is a material with high light transmittance and high weather resistance.
Preferably, the material of the back plate layer is hard and high-weather-resistance material.
Preferably, a junction box is included that is electrically connected to the solar chip layer.
The invention provides a preparation method of solar skin, which comprises the following steps:
arranging a solar chip layer, interconnecting and arranging solar chips into a preset required specification to form a string, and arranging leading-out wires of a positive electrode and a negative electrode on the string to form a chip module;
step two, laying for the first time, and laying the second barrier layer, the third film clamping layer, the chip module, the second film clamping layer and the first barrier layer from bottom to top in sequence;
thirdly, carrying out first vacuum hot pressing, conveying the integral module after the first laying into a laminating machine, forming a substring after the first vacuum hot pressing, and pre-laying high-temperature cloth before hot pressing the upper part and the lower part of the integral module;
wherein, the parameters of the laminating machine for the first vacuum hot pressing are as follows: the temperature value is 140-180 ℃, and the vacuumizing time is 1-10 minutes;
the pressure value of the first stage is-90 KPa to-60 KPa, and the time value is 30 seconds to 300 seconds;
the pressure value of the second stage is-60 KPa to-20 KPa, and the time value is 30 seconds to 300 seconds;
the pressure value of the third stage is-20 KPa to 0KPa, and the time value is 600 seconds to 5400 seconds;
step four, laying for the second time, and laying the protective plate layer, the first film clamping layer, the substring, the fourth film clamping layer and the back plate layer from bottom to top in sequence;
step five, carrying out second vacuum hot pressing, conveying the integral module after the second laying into a laminating machine, and pre-laying high-temperature cloth before hot pressing the upper part and the lower part of the integral module;
wherein, the parameters of the laminator for the second vacuum hot pressing are as follows: the temperature value is 100-140 ℃, and the vacuumizing time is 1-10 minutes;
the pressure value of the first stage is-90 KPa to-60 KPa, and the time value is 30 seconds to 600 seconds;
the pressure value of the second stage is-60 KPa to-30 KPa, and the time value is 30 seconds to 300 seconds;
the pressure value of the third stage is-30 KPa-0 KPa, and the time value is 600 seconds-5400 seconds;
step six, cooling;
and seventhly, performing appearance quality inspection, trimming, IV test and insulation and voltage resistance test on the cooled integral module, and assembling a junction box.
Preferably, the laminator parameters of the first vacuum hot pressing are:
the temperature value is 150-160 ℃, and the vacuumizing time is 3-7 minutes;
the pressure value of the first stage is-80 KPa to-70 KPa, and the time value is 30 seconds to 180 seconds;
the pressure value of the second stage is-50 KPa to-30 KPa, and the time value is 30 seconds to 180 seconds;
the pressure value of the third stage is-10 KPa-0 KPa, and the time value is 900 seconds-2400 seconds.
Preferably, the laminator parameters of the second vacuum hot pressing are:
the temperature value is 110-130 ℃, and the vacuumizing time is 3-7 minutes;
the pressure value of the first stage is-80 KPa to-70 KPa, and the time value is 30 seconds to 300 seconds;
the pressure value of the second stage is-50 KPa to-40 KPa, and the time value is 30 seconds to 180 seconds;
the pressure value of the third stage is-20 KPa-0 KPa, and the time value is 1800 seconds-3600 seconds.
The invention also provides another preparation method of the solar skin, which comprises the following steps:
arranging a solar chip layer, interconnecting and arranging solar chips into a preset required specification to form a string, and arranging leading-out wires of a positive electrode and a negative electrode on the string to form a chip module;
step two, laying for the first time, and laying a second barrier layer, a third film clamping layer, the chip module, the second film clamping layer and the first barrier layer from bottom to top in sequence;
step three, carry out vacuum hot pressing for the first time, send into the laminator with above whole module after laying for the first time, open the vacuum bag upper strata of laminator, pile up the lamination spare on lower floor's screen cloth, close vacuum bag upper strata and pressfitting vacuum bag border, form airtight space in the vacuum bag, connect outside vacuum tube and carry out vacuum cold pump to airtight space in the vacuum bag, wherein, set up furnace temperature parameter and be:
the temperature value of the first stage is 80-110 ℃, and the time value is 5-30 minutes;
the temperature value of the second stage is 110-140 ℃, and the time value is 5-30 minutes;
the temperature value of the third stage is 140-150 ℃, and the time value is 5-30 minutes;
the temperature value of the fourth stage is 150-170 ℃, and the time value is 5-90 minutes;
after confirming that the vacuum degree in the vacuum bag reaches a pressure value of-90 KPa to-100 KPa, disconnecting the external vacuum tube, sending the laminating table top into the heating chamber, connecting the internal vacuum tube to carry out vacuum hot pressing, taking out the laminating table top, sending the laminating table top into a cooling area to carry out cooling so as to form a substring, taking out the substring from the vacuum bag, and then conveying the substring to an appearance inspection table top to carry out quality inspection;
step four, laying for the second time, and laying the protective plate layer, the first film clamping layer, the substring, the fourth film clamping layer and the back plate layer from bottom to top in sequence;
step five, carry out second time vacuum hot pressing, send into the laminator with above whole module after laying for the second time, open the vacuum bag upper strata of laminator, pile up the lamination spare on lower floor's screen cloth, close vacuum bag upper strata and pressfitting vacuum bag border, form airtight space in the vacuum bag, connect outside vacuum tube and carry out vacuum cold pump to airtight space in the vacuum bag, wherein, set up furnace temperature parameter and be:
the temperature value of the first stage is 70-90 ℃, and the time value is 5-30 minutes;
the temperature value of the second stage is 90-100 ℃, and the time value is 5-30 minutes;
the temperature value of the third stage is 100-110 ℃, and the time value is 5-30 minutes;
the temperature value of the fourth stage is 110-140 ℃, and the time value is 5-90 minutes;
after confirming that the vacuum degree in the vacuum bag reaches a pressure value of-95 KPa, disconnecting the external vacuum tube, conveying the laminated table board into the heating chamber, connecting the internal vacuum tube to carry out vacuum hot pressing, taking out the laminated table board, conveying the laminated table board into a cooling area to carry out cooling, taking out the cooled integral assembly from the vacuum bag, and conveying the integral assembly to an appearance inspection table board to carry out quality inspection;
and sixthly, trimming, IV testing, insulating and pressure-resistant testing and assembling the junction box on the whole assembly.
Preferably, when the first vacuum hot pressing is performed, the furnace temperature parameters are set as follows:
the temperature value of the first stage is 100 ℃, and the time value is 5-10 minutes;
the temperature value of the second stage is 130 ℃, and the time value is 5-10 minutes;
the temperature value of the third stage is 150 ℃, and the time value is 5-10 minutes;
the temperature value of the fourth stage is 160 ℃, and the time value is 10-70 minutes.
Preferably, when the second vacuum hot pressing is performed, the furnace temperature parameters are set as follows:
the temperature value of the first stage is 80 ℃, and the time value is 5-10 minutes;
the temperature value of the second stage is 100 ℃, and the time value is 5-10 minutes;
the temperature value of the third stage is 105 ℃, and the time value is 5-10 minutes;
the temperature value of the fourth stage is 110-130 ℃, and the time value is 10-70 minutes.
Compared with the prior art, the invention has the following beneficial effects:
(1) according to the invention, the protective plate layer, the first adhesive film clamping layer, the first blocking layer, the second adhesive film clamping layer, the solar chip layer, the third adhesive film clamping layer, the second blocking layer, the fourth adhesive film clamping layer and the back plate layer are laminated and compounded from top to bottom in sequence, so that a firm whole body can be formed, the solar chip layer is firmly bonded and internally wrapped between the second adhesive film clamping layer and the third adhesive film clamping layer, so that foreign object damage is avoided, the integrity and the weather resistance of the assembly are greatly improved, the laminated and compounded whole body can directly replace the existing cover plate of a vehicle body, the whole vehicle design can be perfectly matched, the appearance shape of the vehicle is not influenced, the laminated and compounded whole body is attached to the surface of the vehicle body as an external component, the reliability of the structure of the vehicle body is not influenced, meanwhile, the invention has strong adaptability and can be flexibly applied to any surface;
(2) according to the invention, the protective plate layer is used as the outer surface and can bear scraping and is used for protecting the solar chip layer on the inner side of the protective plate layer, so that the surface mechanical property requirements of all parts on the surface of an automobile can be met under the condition that the solar chip layer on the inner side of the protective plate layer can work efficiently, and the service life of the protective plate layer is prolonged;
(3) according to the invention, the back plate layer is used as the outermost layer structure of the back, can cover the internal part structure of the automobile body and is fixedly connected with the automobile body, and can play a role in supporting and protecting the solar chip layer, and simultaneously avoid the damage of the external object to the solar chip layer, and the back plate layer is made of high-weather-resistance material, so that the service life of the whole body is prolonged.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic view of the overall structure of a solar skin provided by an embodiment of the invention.
FIG. 1-protective sheet layer; 2-a first film-sandwiched layer; 3-a first barrier layer; 4-a second film-sandwiched layer; 5-a solar chip layer; 6-a third film-sandwiched layer; 7-a second barrier layer; 8-a fourth film-sandwiched layer; 9-a backsheet layer; 10-junction box.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without any inventive step, are within the scope of the present invention.
The invention aims to provide a solar energy skin and a preparation method thereof, and solves the technical problems that a solar energy battery component in the prior art adopts an assembly type, a sticking type and an embedded type installation mode, is not easy to be effectively combined with the surface of a vehicle body, and is easy to influence the appearance of the vehicle body.
Hereinafter, embodiments will be described with reference to the drawings. The embodiments described below do not limit the contents of the invention described in the claims. The entire contents of the configurations shown in the following embodiments are not limited to those required as solutions of the inventions described in the claims.
Referring to fig. 1, the invention provides a solar skin, which comprises a protective plate layer 1, a first adhesive film sandwiched layer 2, a first blocking layer 3, a second adhesive film sandwiched layer 4, a solar chip layer 5, a third adhesive film sandwiched layer 6, a second blocking layer 7, a fourth adhesive film sandwiched layer 8 and a back plate layer 9 which are laminated and compounded from top to bottom in sequence, wherein the solar chip layer 5 is arranged between the second adhesive film sandwiched layer 4 and the third adhesive film sandwiched layer 6 in a built-in manner, the solar chip layer 5 can be selected as a thin film solar cell layer, preferably, the solar chip layer 5 can be selected as a copper-indium-selenium thin film cell layer, and the protective plate layer 1 is arranged as an outer surface and can bear scraping so as to protect the solar chip layer 5 on the inner side. First barrier layer 3 and second barrier layer 7 set up respectively in the upper and lower both sides of solar energy chip layer 5 for carry out the separation to steam, in order to avoid steam to the erosion of inboard solar energy chip layer 5, improve its weatherability. The material of the first barrier layer 3 and the second barrier layer 7 may be, but is not limited to, a composite film layer. The solar chip layer 5 is a core power generation component, and can generate power by using light energy, thereby effectively utilizing energy. First doubling ply 2, second doubling ply 4, third doubling ply 6 and fourth doubling ply 8 are as connecting the glue film, can be at lamination composite in-process, with protection sheet layer 1, first barrier layer 3, solar energy chip layer 5, second barrier layer 7 and backsheet layer 9 bond powerfully, so that it can form firm whole, and solar energy chip layer 5 firmly bonds built-in parcel between second doubling ply 4 and third doubling ply 6, in order to avoid foreign object damage, the wholeness and the weatherability of subassembly have greatly been improved. The back plate layer 9 is used as the outermost layer structure of the back, can cover the internal part structure of the automobile body and is fixedly connected with the automobile body, the connection mode can refer to the connection between the automobile external cover plate and the automobile body in the prior art, and the back plate layer 9 can play a role in supporting and protecting the upper part of the back plate layer. Compared with the common cover plate for the vehicle in the prior art, such as a vehicle front cover and a vehicle top cover, the protective plate layer 1, the first film clamping layer 2, the first blocking layer 3, the second film clamping layer 4, the solar chip layer 5, the third film clamping layer 6, the second blocking layer 7, the fourth film clamping layer 8 and the back plate layer 9 are laminated and compounded into a whole according to the appearance of the corresponding positions, and then the whole can be directly replaced, so that the design of the whole vehicle can be perfectly conformed, the appearance shape of the vehicle is not influenced, and the solar battery pack is attached to the surface of the vehicle body as an external component, so that the reliability of the structure of the vehicle body is not influenced, meanwhile, the invention has strong adaptability, can be flexibly applied to any surface position of the vehicle, can be directly arranged as the internal component of the vehicle cover plate, adopts light and reliable plastic appearance materials, not only meets the shape diversity of external components of the vehicle, but also is easy, meanwhile, the solar chip layer 5 is guaranteed to effectively convert and utilize light energy, waste of energy is greatly avoided, and the technical problems that in the prior art, a solar battery assembly is assembled, pasted and embedded in an installation mode, is not easily combined with the surface of a vehicle body effectively and the appearance of the vehicle body is easily affected are solved.
The first film laminating layer 2, the second film laminating layer 4, the third film laminating layer 6 and the fourth film laminating layer 8 can be made of but not limited to ethylene-vinyl acetate copolymer (EVA) or polyolefin elastomer (POE), and the ethylene-vinyl acetate hot melt adhesive has the advantages of strong adhesive force, good adhesive layer toughness and high strength, and can simultaneously meet the requirements of heat resistance and cold resistance. The polyolefin elastomer hot melt adhesive has the advantages of no peculiar smell, low density, high flowing coating property and good wetting property.
As an optional implementation manner of the embodiment of the present invention, the material of the protective sheet layer 1 is a material with high light transmittance and high weather resistance, which may be, but not limited to, Polycarbonate (PC) or polymethyl methacrylate (PMMA), and under the condition that the solar chip layer 5 inside the protective sheet layer can work efficiently, the requirement of the surface mechanical performance of each part on the surface of the automobile can be met, and the service life of the protective sheet layer is prolonged.
As an optional implementation manner of the embodiment of the present invention, the back plate layer 9 is made of a hard material with high weather resistance, and can support and protect the solar chip layer 5 while avoiding damage to the solar chip layer by an object outside the solar chip layer, and the back plate layer 9 is made of a material with high weather resistance, so as to improve the service life of the whole solar chip. The material of the back plate layer 9 may be, but is not limited to, Polycarbonate (PC), polymethyl methacrylate (PMMA) or a metal plate, and the back plate layer 9 may also be a composite material plate such as a carbon fiber plate and a glass fiber plate.
As an optional implementation manner of the embodiment of the present invention, the present invention includes a junction box 10 electrically connected to the solar chip layer 5, so as to perform electrical output of the solar chip layer 5, and the front-out or back-out installation can be performed according to actual needs. The waterproof grade of the junction box 10 can meet the requirement of IP67 and the connection is reliable.
The invention provides a preparation method of solar skin, which comprises the following steps:
arranging a solar chip layer, interconnecting and arranging the solar chips into a preset required specification to form a string, and arranging leading-out wires of a positive electrode and a negative electrode on the string to form a chip module;
and step two, laying for the first time, laying the second barrier layer, the third film clamping layer, the chip module, the second film clamping layer and the first barrier layer in sequence from bottom to top, namely preparing the chip module, each barrier layer and each film clamping layer, and then laying each layer on the laying workbench in sequence.
Thirdly, carrying out first vacuum hot pressing, conveying the integral module after the first laying into a laminating machine, forming a substring after the first vacuum hot pressing, and pre-laying high-temperature cloth before hot pressing the upper part and the lower part of the integral module;
wherein, the parameters of the laminating machine for the first vacuum hot pressing are as follows:
the temperature value is 140-180 ℃, and the vacuumizing time is 1-10 minutes;
the pressure value of the first stage is-90 KPa to-60 KPa, and the time value is 30 seconds to 300 seconds;
the pressure value of the second stage is-60 KPa to-20 KPa, and the time value is 30 seconds to 300 seconds;
the pressure value of the third stage is-20 KPa to 0KPa, and the time value is 600 seconds to 5400 seconds;
the second barrier layer, the third film clamping layer, the solar chip layer, the second film clamping layer and the first barrier layer are pre-pressed, so that each layer is tightly pressed at proper temperature and pressure, the connection is firm, and the phenomenon that the lamination bonding performance is affected due to overhigh or overlow temperature is avoided.
And fourthly, laying for the second time, and laying the protection plate layer, the first film clamping layer, the string, the fourth film clamping layer and the back plate layer in sequence from bottom to top, namely, laying the protection plate layer, the first film clamping layer, the string, the fourth film clamping layer and the back plate layer on the laying workbench in advance.
Step five, carrying out second vacuum hot pressing, conveying the integral module after the second laying into a laminating machine, and pre-laying high-temperature cloth before hot pressing the upper part and the lower part of the integral module;
wherein, the parameters of the laminator for the second vacuum hot pressing are as follows: the temperature value is 100-140 ℃, and the vacuumizing time is 1-10 minutes;
the pressure value of the first stage is-90 KPa to-60 KPa, and the time value is 30 seconds to 600 seconds;
the pressure value of the second stage is-60 KPa to-30 KPa, and the time value is 30 seconds to 300 seconds;
the pressure value of the third stage is-30 KPa-0 KPa, and the time value is 600 seconds-5400 seconds;
protection sheet layer, first doubling film layer, substring, fourth doubling film layer and backplate layer carry out the pressfitting under suitable temperature and pressure here promptly, can make the substring better with the connectivity of each layer between protection sheet layer, first doubling film layer, fourth doubling film layer and the backplate layer and in the substring, and all suit with corresponding material through twice vacuum hot pressing and its temperature and pressure, each layer bonding property is better, and life is longer.
And step six, cooling, namely after the second vacuum hot pressing is finished, conveying the whole module into a cold press for pressure maintaining cooling until the surface temperature of the whole module is reduced to 60 ℃. (ii) a
And seventhly, performing appearance quality inspection, trimming, IV testing and insulation and voltage resistance testing on the cooled integral module, assembling a junction box, namely sending the integral module into the appearance inspection process for quality inspection, and removing the edge glue overflow of the integral module by using a hot cutter in the trimming process. The IV test is a common procedure in the production process of solar cell production components, and the insulation and voltage withstand test is a technical means for checking and evaluating the insulation and voltage withstand capability of electrical equipment, and is similar to the prior art and is not repeated herein.
Further, the laminator parameters of the first vacuum hot pressing are as follows:
the temperature value is 150-160 ℃, and the vacuumizing time is 3-7 minutes;
the pressure value of the first stage is-80 KPa to-70 KPa, and the time value is 30 seconds to 180 seconds;
the pressure value of the second stage is-50 KPa to-30 KPa, and the time value is 30 seconds to 180 seconds;
the pressure value of the third stage is-10 KPa-0 KPa, and the time value is 900 seconds-2400 seconds.
Further, the laminator parameters of the second vacuum hot pressing are as follows:
the temperature value is 110-130 ℃, and the vacuumizing time is 3-7 minutes;
the pressure value of the first stage is-80 KPa to-70 KPa, and the time value is 30 seconds to 300 seconds;
the pressure value of the second stage is-50 KPa to-40 KPa, and the time value is 30 seconds to 180 seconds;
the pressure value of the third stage is-20 KPa-0 KPa, the time value is 1800 seconds-3600 seconds,
on the premise of ensuring the connection performance of each layer after lamination, the production efficiency is improved.
The invention also provides another preparation method of the solar skin, which comprises the following steps:
arranging a solar chip layer, interconnecting and arranging the solar chips into a preset required specification to form a string, and arranging leading-out wires of a positive electrode and a negative electrode on the string to form a chip module;
and step two, laying for the first time, laying the second barrier layer, the third laminated film layer, the chip module, the second laminated film layer and the first barrier layer in sequence from bottom to top, preparing the chip module, each barrier layer and each laminated film layer, laying the operation bench in sequence, and cleaning the barrier layer before laying.
Step three, carry out vacuum hot pressing for the first time, send into the laminator with above whole module after laying for the first time, open the vacuum bag upper strata of laminator, pile up the lamination spare on lower floor's screen cloth, close vacuum bag upper strata and pressfitting vacuum bag border, form airtight space in the vacuum bag, connect outside vacuum tube and carry out vacuum cold pump to airtight space in the vacuum bag, wherein, set up furnace temperature parameter and be:
the temperature value of the first stage is 80-110 ℃, and the time value is 5-30 minutes;
the temperature value of the second stage is 110-140 ℃, and the time value is 5-30 minutes;
the temperature value of the third stage is 140-150 ℃, and the time value is 5-30 minutes;
the temperature value of the fourth stage is 150-170 ℃, and the time value is 5-90 minutes;
and after confirming that the vacuum degree in the vacuum bag reaches a pressure value of-90 KPa to-100 KPa, disconnecting the external vacuum tube, conveying the laminated table board into the heating chamber, connecting the internal vacuum tube for vacuum hot pressing, namely closing a chamber door of the heating chamber, sequentially opening the vacuum pumping valve, the heating switch and the hot air forced convection fan for vacuum hot pressing, and sequentially closing the hot air forced convection fan, the heating switch and the vacuum pumping valve after the lamination is finished. Taking out the laminating table top and sending the laminating table top into a cooling area for cooling to form a substring, namely, opening a cooling fan during cooling until the surface temperature of the vacuum bag is reduced to 60 ℃, opening the upper layer of the vacuum bag, taking out the substring from the vacuum bag and then conveying the substring to an appearance inspection table top for quality inspection;
step four, laying for the second time, and laying the protective plate layer, the first film clamping layer, the string, the fourth film clamping layer and the back plate layer from bottom to top in sequence, wherein the protective plate layer can be cleaned in advance before laying;
step five, carry out the second time vacuum hot pressing, send into the laminator with above-mentioned whole module after laying for the second time, open the vacuum bag upper strata of laminator, pile up the lamination spare on lower floor's screen cloth, close the vacuum bag upper strata and pressfitting vacuum bag border, form airtight space in the vacuum bag, connect outside vacuum tube and carry out vacuum chill pump to airtight space in the vacuum bag, so that the vacuum bag adapts to the shape of whole module and exerts pressure to it, it needs to explain, protection sheet layer and backsheet layer all have predetermined shape, through vacuum lamination so that it closely laminates with other layer bodys between the two, wherein, set up furnace temperature parameter and be:
the temperature value of the first stage is 70-90 ℃, and the time value is 5-30 minutes;
the temperature value of the second stage is 90-100 ℃, and the time value is 5-30 minutes;
the temperature value of the third stage is 100-110 ℃, and the time value is 5-30 minutes;
the temperature value of the fourth stage is 110-140 ℃, and the time value is 5-90 minutes;
and after confirming that the vacuum degree in the vacuum bag reaches a pressure value of-95 KPa, disconnecting the external vacuum tube, conveying the laminated table board into the heating chamber, connecting the internal vacuum tube for vacuum hot pressing, namely closing a chamber door of the heating chamber, sequentially opening the vacuumizing valve, the heating switch and the hot air forced convection fan to perform vacuum hot pressing, and sequentially closing the hot air forced convection fan, the heating switch and the vacuumizing valve after the lamination is finished. Taking out the laminating table top and sending the laminating table top into a cooling area for cooling, namely opening a cooling fan during cooling until the surface temperature of the vacuum bag is reduced to 60 ℃, opening the upper layer of the vacuum bag, taking out the cooled integral assembly from the vacuum bag and then conveying the assembly to an appearance inspection table top for quality inspection;
and sixthly, trimming, IV testing, insulating and pressure-resistant testing and assembling the junction box on the whole assembly.
By adopting the steps, firm lamination and compounding can be still performed when the solar skin has a large special-shaped curved surface, so that the appearance processing of the solar skin is more flexible.
Further, when the first vacuum hot pressing is carried out, furnace temperature parameters are set as follows:
the temperature value of the first stage is 100 ℃, and the time value is 5-10 minutes;
the temperature value of the second stage is 130 ℃, and the time value is 5-10 minutes;
the temperature value of the third stage is 150 ℃, and the time value is 5-10 minutes;
the temperature value of the fourth stage is 160 ℃, and the time value is 10-70 minutes.
Further, when the second vacuum hot pressing is carried out, the furnace temperature parameters are set as follows:
the temperature value of the first stage is 80 ℃, and the time value is 5-10 minutes;
the temperature value of the second stage is 100 ℃, and the time value is 5-10 minutes;
the temperature value of the third stage is 105 ℃, and the time value is 5-10 minutes;
the temperature value of the fourth stage is 110-130 ℃, and the time value is 10-70 minutes, so that the production efficiency is improved on the premise of ensuring the connection performance of each layer after barrier lamination.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A solar skin, comprising: from top to bottom laminate protection sheet layer (1), first doubling piece layer (2), first barrier layer (3), second doubling piece layer (4), solar energy chip layer (5), third doubling piece layer (6), second barrier layer (7), fourth doubling piece layer (8) and backsheet layer (9) that the complex set up in proper order, solar energy chip layer (5) built-in package is located second doubling piece layer (4) with between third doubling piece layer (6).
2. The solar skin according to claim 1, characterized in that the material of the protective sheet layer (1) is a highly light-transmissive and weather-resistant material.
3. Solar skin according to claim 1, characterised in that the material of said backsheet layer (9) is a rigid and highly weather-resistant material.
4. Solar skin according to claim 1, characterized by comprising a junction box (10) electrically connected with the solar chip layer (5).
5. A method for preparing solar skin, based on the solar skin according to any one of claims 1 to 4, comprising:
arranging a solar chip layer, interconnecting and arranging solar chips into a preset required specification to form a string, and arranging leading-out wires of a positive electrode and a negative electrode on the string to form a chip module;
step two, laying for the first time, and laying the second barrier layer, the third film clamping layer, the chip module, the second film clamping layer and the first barrier layer from bottom to top in sequence;
thirdly, carrying out first vacuum hot pressing, conveying the integral module after the first laying into a laminating machine, forming a substring after the first vacuum hot pressing, and pre-laying high-temperature cloth before hot pressing the upper part and the lower part of the integral module;
wherein, the parameters of the laminating machine for the first vacuum hot pressing are as follows: the temperature value is 140-180 ℃, and the vacuumizing time is 1-10 minutes;
the pressure value of the first stage is-90 KPa to-60 KPa, and the time value is 30 seconds to 300 seconds;
the pressure value of the second stage is-60 KPa to-20 KPa, and the time value is 30 seconds to 300 seconds;
the pressure value of the third stage is-20 KPa to 0KPa, and the time value is 600 seconds to 5400 seconds;
fourthly, laying for the second time, and laying the protective plate layer, the first film clamping layer, the substring, the fourth film clamping layer and the back plate layer from bottom to top in sequence;
step five, carrying out second vacuum hot pressing, conveying the integral module after the second laying into a laminating machine, and pre-laying high-temperature cloth before hot pressing the upper part and the lower part of the integral module;
wherein, the parameters of the laminator for the second vacuum hot pressing are as follows: the temperature value is 100-140 ℃, and the vacuumizing time is 1-10 minutes;
the pressure value of the first stage is-90 KPa to-60 KPa, and the time value is 30 seconds to 600 seconds;
the pressure value of the second stage is-60 KPa to-30 KPa, and the time value is 30 seconds to 300 seconds;
the pressure value of the third stage is-30 KPa-0 KPa, and the time value is 600 seconds-5400 seconds;
step six, cooling;
and seventhly, performing appearance quality inspection, trimming, IV test and insulation and voltage resistance test on the cooled integral module, and assembling a junction box.
6. The method of claim 5, wherein the laminator parameters of the first vacuum hot pressing are:
the temperature value is 150-160 ℃, and the vacuumizing time is 3-7 minutes;
the pressure value of the first stage is-80 KPa to-70 KPa, and the time value is 30 seconds to 180 seconds;
the pressure value of the second stage is-50 KPa to-30 KPa, and the time value is 30 seconds to 180 seconds;
the pressure value of the third stage is-10 KPa-0 KPa, and the time value is 900 seconds-2400 seconds.
7. The method of claim 5, wherein the laminator parameters of the second vacuum hot pressing are:
the temperature value is 110-130 ℃, and the vacuumizing time is 3-7 minutes;
the pressure value of the first stage is-80 KPa to-70 KPa, and the time value is 30 seconds to 300 seconds;
the pressure value of the second stage is-50 KPa to-40 KPa, and the time value is 30 seconds to 180 seconds;
the pressure value of the third stage is-20 KPa-0 KPa, and the time value is 1800 seconds-3600 seconds.
8. A method for preparing solar skin, based on the solar skin according to any one of claims 1 to 4, comprising:
arranging a solar chip layer, interconnecting and arranging solar chips into a preset required specification to form a string, and arranging leading-out wires of a positive electrode and a negative electrode on the string to form a chip module;
step two, laying for the first time, and laying the second barrier layer, the third film clamping layer, the chip module, the second film clamping layer and the first barrier layer from bottom to top in sequence;
step three, carry out vacuum hot pressing for the first time, send into the laminator with above whole module after laying for the first time, open the vacuum bag upper strata of laminator, pile up the lamination spare on lower floor's screen cloth, close vacuum bag upper strata and pressfitting vacuum bag border, form airtight space in the vacuum bag, connect outside vacuum tube and carry out vacuum cold pump to airtight space in the vacuum bag, wherein, set up furnace temperature parameter and be:
the temperature value of the first stage is 80-110 ℃, and the time value is 5-30 minutes;
the temperature value of the second stage is 110-140 ℃, and the time value is 5-30 minutes;
the temperature value of the third stage is 140-150 ℃, and the time value is 5-30 minutes;
the temperature value of the fourth stage is 150-170 ℃, and the time value is 5-90 minutes;
after confirming that the vacuum degree in the vacuum bag reaches a pressure value of-90 KPa to-100 KPa, disconnecting the external vacuum tube, sending the laminating table top into the heating chamber, connecting the internal vacuum tube to carry out vacuum hot pressing, taking out the laminating table top, sending the laminating table top into a cooling area to carry out cooling so as to form a substring, taking out the substring from the vacuum bag, and then conveying the substring to an appearance inspection table top to carry out quality inspection;
fourthly, laying for the second time, and laying the protective plate layer, the first film clamping layer, the substring, the fourth film clamping layer and the back plate layer from bottom to top in sequence;
step five, carry out second time vacuum hot pressing, send into the laminator with above whole module after laying for the second time, open the vacuum bag upper strata of laminator, pile up the lamination spare on lower floor's screen cloth, close vacuum bag upper strata and pressfitting vacuum bag border, form airtight space in the vacuum bag, connect outside vacuum tube and carry out vacuum cold pump to airtight space in the vacuum bag, wherein, set up furnace temperature parameter and be:
the temperature value of the first stage is 70-90 ℃, and the time value is 5-30 minutes;
the temperature value of the second stage is 90-100 ℃, and the time value is 5-30 minutes;
the temperature value of the third stage is 100-110 ℃, and the time value is 5-30 minutes;
the temperature value of the fourth stage is 110-140 ℃, and the time value is 5-90 minutes;
after confirming that the vacuum degree in the vacuum bag reaches a pressure value of-95 KPa, disconnecting the external vacuum tube, conveying the laminated table board into the heating chamber, connecting the internal vacuum tube to carry out vacuum hot pressing, taking out the laminated table board, conveying the laminated table board into a cooling area to carry out cooling, taking out the cooled integral assembly from the vacuum bag, and conveying the integral assembly to an appearance inspection table board to carry out quality inspection;
and sixthly, trimming, IV testing, insulating and pressure-resistant testing and assembling the junction box on the whole assembly.
9. The method for preparing solar energy skin according to claim 8, wherein the furnace temperature parameter is set as follows when the first vacuum hot pressing is carried out:
the temperature value of the first stage is 100 ℃, and the time value is 5-10 minutes;
the temperature value of the second stage is 130 ℃, and the time value is 5-10 minutes;
the temperature value of the third stage is 150 ℃, and the time value is 5-10 minutes;
the temperature value of the fourth stage is 160 ℃, and the time value is 10-70 minutes.
10. The method for preparing solar energy skin according to claim 8, wherein the furnace temperature parameter is set as follows when the second vacuum hot pressing is performed:
the temperature value of the first stage is 80 ℃, and the time value is 5-10 minutes;
the temperature value of the second stage is 100 ℃, and the time value is 5-10 minutes;
the temperature value of the third stage is 105 ℃, and the time value is 5-10 minutes;
the temperature value of the fourth stage is 110-130 ℃, and the time value is 10-70 minutes.
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