CN111796648A - Installation mechanism for heat dissipation plate of professional virtual cloud test environment simulation system processor - Google Patents

Installation mechanism for heat dissipation plate of professional virtual cloud test environment simulation system processor Download PDF

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Publication number
CN111796648A
CN111796648A CN202010647554.6A CN202010647554A CN111796648A CN 111796648 A CN111796648 A CN 111796648A CN 202010647554 A CN202010647554 A CN 202010647554A CN 111796648 A CN111796648 A CN 111796648A
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main part
fixedly connected
heat dissipation
main body
simulation system
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CN202010647554.6A
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CN111796648B (en
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吴晓茹
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Ma Yong
Information and Telecommunication Branch of State Grid Anhui Electric Power Co Ltd
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Individual
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a heat dissipation plate mounting mechanism of a professional virtualized cloud test environment simulation system processor, which comprises a main board body, a heat dissipation plate body and a fan body, wherein the top of the main board body is fixedly connected with a mounting rail, the top of the mounting rail is provided with a mounting groove, two sides of the heat dissipation plate body are fixedly connected with connecting columns, one ends of the connecting columns, far away from the heat dissipation plate body, are fixedly connected with mounting insertion blocks, one sides of the mounting insertion blocks, far away from the connecting columns, are provided with ratchets, the side walls of the mounting rail are provided with clamping mechanisms corresponding to the mounting insertion blocks, the front surface of the heat dissipation plate body is provided with. The invention has the beneficial effects that: the device is convenient for clear up and overhaul long-term heating panel main part and fan main part of using, clears away its surface dust, and the reinforcing is to the radiating effect of treater main part, also is convenient for change the silicone grease between heating panel main part and the treater main part simultaneously.

Description

Installation mechanism for heat dissipation plate of professional virtual cloud test environment simulation system processor
Technical Field
The invention relates to a cloud test environment simulation system processor, in particular to a heat dissipation plate installation mechanism of a professional virtualized cloud test environment simulation system processor, and belongs to the technical field of hardware simulation systems.
Background
The CPU is a core component in the computer, which is mainly used for interpreting computer instructions and processing data in computer software, and is a core component in the computer, which is responsible for reading instructions, decoding the instructions and executing the instructions.
The existing professional virtualization cloud test environment simulation system needs to use a processor with high performance during operation, when the processor is used, the processor can generate high heat, a heating panel is further required to be installed on the surface of the processor for heat dissipation, and the existing heating panel installation mechanism is generally fixed by bolts, so that the processor is not convenient to install or detach during operation.
Disclosure of Invention
The invention aims to solve the problems and provide a heat dissipation plate mounting mechanism of a processor of a professional virtualized cloud test environment simulation system, which is simple and convenient in mounting process, time-saving and labor-saving, convenient to detach, clean and replace the heat dissipation plate main body in the later period and convenient to detach and assemble and disassemble the same fan main body by arranging a main board main body, a mounting rail, a heat dissipation plate main body, a fan main body and a clamping mechanism.
The invention achieves the aim through the following technical scheme, and the heat dissipation plate mounting mechanism of the professional virtualized cloud test environment simulation system processor comprises a main board body, a heat dissipation plate body and a fan body, the upper surface of the main board body is fixedly provided with a processor main body, the top of the main board body is fixedly connected with a mounting rail, the top of the mounting rail is provided with a mounting groove, the two sides of the heat dissipation plate main body are fixedly connected with connecting columns, one end of the connecting column, which is far away from the main body of the heat dissipation plate, is fixedly connected with an installation inserting block, one side of the installation inserting block, which is far away from the connecting column, is provided with a ratchet, the mounting insert is movably inserted in the mounting groove, the side wall of the mounting rail is provided with a clamping mechanism corresponding to the mounting insert, the front of the heat dissipation plate main body is provided with a heat dissipation through groove, and the fan main body is movably clamped on the front of the heat dissipation plate main body.
Preferably, the clamping mechanism comprises a rectangular opening, the rectangular opening is formed in the side wall of the mounting rail, a pawl plate is connected in the rectangular opening in a sliding mode, and the pawl plate is movably clamped with the ratchet.
Preferably, the side wall of the mounting rail is fixedly connected with a fixing rod, one end of the fixing rod, far away from the mounting rail, is fixedly connected with a side plate, the side wall of the pawl plate is fixedly connected with a resisting rod, and one end of the resisting rod, far away from the pawl plate, penetrates through the fixing rod to extend outwards and is fixedly connected with a first handle.
Preferably, the abutting rod is sleeved with a first spring, one end of the first spring abuts against the side wall of the pawl plate, the side wall of the side plate at the other end of the first spring abuts against the side wall of the pawl plate, the first spring is in a compressed state, the abutting rod is fixedly connected with a limiting clamp ring, and the side wall of the limiting clamp ring abuts against one side of the side plate, away from the first spring.
Preferably, square sleeves are fixedly connected to two sides of the heat dissipation plate main body, two groups of inserting strips are fixedly connected to the back face of the fan main body, the inserting strips are movably inserted into a tube cavity of the square sleeves, and locking holes are formed in the side walls of the inserting strips.
Preferably, one side of the square sleeve, which is far away from the heat dissipation plate main body, is fixedly connected with a hollow cylinder, an inner cavity is formed in the hollow cylinder, and a sliding block is connected in the inner cavity of the hollow cylinder in a sliding manner.
Preferably, the side wall of the sliding block is fixedly connected with a locking rod, and one end of the locking rod, which is far away from the sliding block, penetrates through the hollow cylinder and the square sleeve and is movably inserted into the locking hole.
Preferably, one end of the sliding block, which is far away from the locking rod, is fixedly connected with a pull rod, and one end of the pull rod, which is far away from the sliding block, penetrates through the hollow cylinder to extend outwards and is fixedly connected with a second handle.
Preferably, the pull rod is sleeved with a second spring, one end of the second spring abuts against the side wall of the sliding block, the other end of the second spring abuts against the inner cavity of the hollow cylinder, and the second spring is in a compressed state.
Preferably, the bottom of the heat dissipation plate main body abuts against the upper surface of the processor main body, and heat-conducting silicone grease is arranged between the heat dissipation plate main body and the processor main body.
The invention has the beneficial effects that:
this professional virtual cloud test environmental simulation system treater heating panel installation mechanism, through setting up the mainboard main part, the installation rail, the heating panel main part, fan main part and chucking mechanism, realized when carrying out the installation of heating panel main part to the treater main part, the installation is simple convenient, time saving and labor saving, later stage also is convenient for pull down clearance and change the heating panel main part, dismouting is also convenient for carry out to same fan main part, the device is convenient for clear up and overhaul heating panel main part and fan main part of long-term use, clear away its surface dust, the reinforcing is to the radiating effect of treater main part, also be convenient for simultaneously change the silicone grease between heating panel main part and the treater main part, the problem of the silicone grease hardening of long-time back of using is not convenient for change is solved.
This installation mechanism of professional virtual cloud test environment simulation system treater heating panel through the fixed cutting at the back of fan main part, has realized that the fan main part is convenient for install on the heating panel main part, and the fan main part is just to the front of heating panel main part, and the fan main part can pass the air current from the logical inslot that dispels the heat, strengthens the heat dispersion of heating panel main part to logical groove through the heat dissipation has increased the heat radiating area of heating panel main part.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a block diagram of the mounting rail of the present invention;
FIG. 3 is a block diagram of the detent plate of the present invention;
FIG. 4 is an installation view of the fan body of the present invention;
fig. 5 is a structural view of the heat radiating plate main body of the present invention;
FIG. 6 is an enlarged view of portion A of FIG. 5 in accordance with the present invention;
fig. 7 is a structural view of a fan body according to the present invention.
In the figure: 1. a main board main body; 101. a processor body; 2. mounting a rail; 201. mounting grooves; 202. a rectangular opening; 203. fixing the rod; 204. a side plate; 205. a pawl plate; 206. a tightening rod; 2061. a limit snap ring; 2062. a first handle; 207. a first spring; 3. a heat dissipation plate main body; 301. a heat dissipation through groove; 302. connecting columns; 303. installing an inserting block; 3031. a ratchet; 4. a fan main body; 401. cutting; 4011. a locking hole; 5. a square sleeve; 6. a hollow cylinder; 601. a slider; 6011. a locking lever; 6012. a pull rod; 6013. a second handle; 602. a second spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-7, a heat sink mounting mechanism for a processor of a professional virtualized cloud test environment simulation system comprises a main board body 1, a heat sink main body 3 and a fan main body 4, wherein a processor main body 101 is fixedly mounted on the upper surface of the main board body 1, a mounting rail 2 is fixedly connected to the top of the main board body 1, a mounting groove 201 is formed in the top of the mounting rail 2, connecting posts 302 are fixedly connected to both sides of the heat sink main body 3, a mounting insert 303 is fixedly connected to one end of each connecting post 302 away from the heat sink main body 3, ratchets 3031 are arranged on one side of the mounting insert 303 away from the connecting post 302, the mounting insert 303 is movably inserted into the mounting groove 201, a clamping mechanism corresponding to the mounting insert 303 is arranged on the side wall of the mounting rail 2, a heat dissipation through groove 301 is formed in the front of the heat sink, through setting up mainboard main part 1, installation rail 2, heating panel main part 3, fan main part 4 and chucking mechanism, realized when carrying out the installation of heating panel main part 3 to treater main part 101, the installation is simple convenient, time saving and labor saving, the later stage is also convenient for pull down clearance and change heating panel main part 3, the dismouting is also convenient for carry out to same fan main part 4, the device is convenient for clear up and overhaul heating panel main part 3 and fan main part 4 of long-term use, clear away its surface dust, the reinforcing is to the radiating effect of treater main part 101, also be convenient for simultaneously change the silicone grease between heating panel main part 3 and the treater main part 101, the problem of the silicone grease hardening of long-time back of using is not convenient for change is solved.
As a technical optimization scheme of the invention, the clamping mechanism comprises a rectangular opening 202, the rectangular opening 202 is arranged on the side wall of the mounting rail 2, a pawl plate 205 is connected in the rectangular opening 202 in a sliding manner, the pawl plate 205 is movably clamped with a ratchet 3031, the heat dissipation plate main body 3 can be inserted downwards by aligning a mounting insertion block 303 with the mounting groove 201 at first during mounting, the ratchet 3031 is clamped with the pawl plate 205 during insertion, so that the heat dissipation plate main body 3 can only do downward unidirectional movement, when the clamping mechanism is tightly abutted against the processor main body 101, the mounting of the heat dissipation plate main body 3 is completed, and the clamping mechanism is simple and convenient to operate, time-saving and labor-saving, and is convenient to mount and fix the heat dissipation plate main body 3.
As a technical optimization scheme of the invention, a fixing rod 203 is fixedly connected to a side wall of the mounting rail 2, a side plate 204 is fixedly connected to one end of the fixing rod 203 far away from the mounting rail 2, a resisting rod 206 is fixedly connected to a side wall of the pawl plate 205, one end of the resisting rod 206 far away from the pawl plate 205 penetrates through the fixing rod 203 to extend outwards and is fixedly connected with a first handle 2062, and the first handle 2062 is arranged to facilitate pulling of the resisting rod 206 and the pawl plate 205, facilitate disengaging of the ratchet 3031 and the pawl plate 205, and facilitate later-period detachment of the heat dissipation plate body 3.
As a technical optimization scheme of the invention, the tightening rod 206 is sleeved with the first spring 207, one end of the first spring 207 abuts against the side wall of the pawl plate 205, the side wall of the side plate 204 at the other end of the first spring 207 abuts against, the first spring 207 is in a compressed state, the tightening rod 206 is fixedly connected with the limit snap ring 2061, the side wall of the limit snap ring 2061 abuts against one side of the side plate 204 far away from the first spring 207, and the counterforce of the first spring 207 can push the pawl plate 205 to be clamped with the ratchet 3031, so that the tightness of connection is ensured, and the clamping effect is ensured.
As a technical optimization scheme of the invention, the two sides of the heat dissipation plate main body 3 are fixedly connected with the square sleeves 5, the back of the fan main body 4 is fixedly connected with the two groups of inserting strips 401, the inserting strips 401 are movably inserted into the tube cavities of the square sleeves 5, the side walls of the inserting strips 401 are provided with the locking holes 4011, the back of the fan main body 4 is fixedly provided with the inserting strips 401, the fan main body 4 is conveniently arranged on the heat dissipation plate main body 3, the fan main body 4 is right opposite to the front of the heat dissipation plate main body 3, the fan main body 4 can enable airflow to pass through the heat dissipation through grooves 301, the heat dissipation performance of the heat dissipation plate main body 3 is enhanced, and the heat dissipation area of the.
As a technical optimization scheme of the invention, a hollow cylinder 6 is fixedly connected to one side of the square sleeve 5 away from the heat dissipation plate main body 3, an inner cavity is formed inside the hollow cylinder 6, a sliding block 601 is slidably connected in the inner cavity of the hollow cylinder 6, and the hollow cylinder 6 is convenient for arranging a corresponding mechanism inside to fix the inserting strip 401.
As a technical optimization scheme of the invention, the side wall of the slide block 601 is fixedly connected with a locking rod 6011, one end of the locking rod 6011 far away from the slide block 601 penetrates through the hollow cylinder 6 and the square sleeve 5 and is movably inserted into the locking hole 4011, and the locking rod 6011 is inserted into the locking hole 4011, so that the fan main body 4 is fixed.
As a technical optimization scheme of the invention, one end of the sliding block 601, which is far away from the locking rod 6011, is fixedly connected with a pull rod 6012, one end of the pull rod 6012, which is far away from the sliding block 601, penetrates through the hollow cylinder 6 to extend outwards and is fixedly connected with a second handle 6013, and the second handle 6013 is arranged to facilitate pulling of the pull rod 6012 and the sliding block 601.
As a technical optimization scheme of the invention, the pull rod 6012 is sleeved with a second spring 602, one end of the second spring 602 abuts against the side wall of the slider 601, the other end of the second spring 602 abuts against the inner cavity of the hollow cylinder 6, the second spring 602 is in a compressed state, and the reaction force of the second spring 602 pushes the slider 601 to abut against the inner wall of the hollow cylinder 6, so that the locking rod 6011 is ensured to be stably inserted into the locking hole 4011, and the locking effect is ensured.
As a technical optimization scheme of the invention, the bottom of the heat dissipation plate main body 3 is abutted against the upper surface of the processor main body 101, heat-conducting silicone grease is arranged between the heat dissipation plate main body 3 and the processor main body 101, the heat dissipation plate main body 3 is convenient to detach, clean and replace at the later stage, the same fan main body 4 is also convenient to detach, clean and overhaul the heat dissipation plate main body 3 and the fan main body 4 which are used for a long time, remove surface dust of the heat dissipation plate main body and the fan main body 4, enhance the heat dissipation effect of the processor main body 101, simultaneously facilitate replacement of the silicone grease between the heat dissipation plate main body 3 and the processor main body 101, and solve the problem that the silicone grease is hardened and is inconvenient to replace after long-time use.
When the heat dissipation plate main body 3 and the fan main body 4 are used, the heat dissipation plate main body 3 and the fan main body 4 can be quickly installed or detached, so that the heat dissipation plate main body 3 and the fan main body 4 which are used for a long time can be conveniently cleaned and maintained, surface dust can be removed, the heat dissipation effect on the processor main body 101 is enhanced, meanwhile, silicone grease between the heat dissipation plate main body 3 and the processor main body 101 can be conveniently replaced, and the problem that the silicone grease is hardened and is not convenient to replace after long-time use is solved.
When the heat dissipation plate main body 3 and the fan main body 4 are installed, the heat dissipation plate main body 3 is installed firstly, when the heat dissipation plate main body 3 is installed, the installation insertion block 303 can be aligned with the installation groove 201 and inserted downwards, the ratchets 3031 are clamped with the pawl plates 205 during insertion, so that the heat dissipation plate main body 3 can only do downward unidirectional movement, when the heat dissipation plate main body 3 is abutted against the processor main body 101, the installation of the heat dissipation plate main body 3 is completed, the operation is simple and convenient, time and labor are saved, when the heat dissipation plate main body 3 needs to be detached, the first handle 2 is pulled firstly, the first handle 2062 drives the abutting rod 206 to move, the abutting rod 206 drives the pawl plates 206205 to slide in the rectangular opening 202 and break away from the clamping with the ratchets 3031, the first spring 207 is compressed when the pawl plates 205 move, at the moment, the heat dissipation plate main body 3 is pulled upwards to pull out, the heat dissipation plate main, the position of the pawl plate 205 is limited by the presence of the limit snap ring 2061 that ensures that the pawl plate 205 is disposed within the rectangular opening 202 and does not fully enter the mounting slot 201.
After the heat dissipation plate main body 3 is installed, the fan main body 4 can be installed at this time, during installation, the second handle 6013 can be pulled first, the second handle 6013 drives the pull rod 6012 to move, the pull rod 6012 drives the slider 601 to slide in the inner cavity of the hollow cylinder 6 and compress the second spring 602, the slider 601 drives the locking rod 6011 to move and retract into the inner cavity of the hollow cylinder 6 when moving, at this time, the insert strip 401 is aligned with the tube cavity of the square sleeve 5 and inserted, after the insert strip is completely inserted, the second handle 6013 is loosened, the second spring 602 stretches and drives the slider 601 to move, the slider 601 drives the locking rod 1 to be inserted into the locking hole 4011, at this time, fixing and installation of the fan main body 4 are completed, when the fan main body 4 needs to be detached, the operation is opposite to the installation process, the fan main body 4 is aligned with the front side of the heat dissipation plate main body 3, and the fan main body 4 can pass through the heat dissipation through groove 301, the heat radiation performance of the heat radiation plate main body 3 is enhanced, and the heat radiation area of the heat radiation plate main body 3 is increased by the heat radiation through grooves 301.
To the technical personnel in the field, this device is through setting up mainboard main part 1, installation rail 2, heating panel main part 3, fan main part 4 and chucking mechanism, realized when carrying out the installation of heating panel main part 3 to treater main part 101, the installation is simple convenient, time saving and labor saving, later stage also is convenient for pull down clearance and change heating panel main part 3, dismouting is also convenient for to carry out to same fan main part 4, the device is convenient for clear up and overhaul heating panel main part 3 and fan main part 4 of long-term use, clear away its surface dust, the radiating effect of reinforcing to treater main part 101, also be convenient for simultaneously change the silicone grease between heating panel main part 3 and the treater main part 101, the problem that the silicone grease hardening is not convenient for change after the long-time use is solved.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (10)

1. The utility model provides a professional virtualization cloud test environment simulation system treater heating panel installation mechanism, includes mainboard main part (1), heating panel main part (3) and fan main part (4), the last fixed surface of mainboard main part (1) installs treater main part (101), its characterized in that: the utility model discloses a fan of heating panel, including mainboard main part (1), the top fixedly connected with installation rail (2) of mainboard main part (1), mounting groove (201) have been seted up at the top of installation rail (2), the both sides fixedly connected with spliced pole (302) of heating panel main part (3), one end fixedly connected with installation inserted block (303) of heating panel main part (3) are kept away from to spliced pole (302), one side that spliced pole (302) were kept away from in installation inserted block (303) is equipped with ratchet (3031), installation inserted block (303) activity is pegged graft in mounting groove (201), the lateral wall of installation rail (2) is equipped with the chucking mechanism corresponding with installation inserted block (303), heat dissipation logical groove (301) have been seted up in the front of heating panel main part (3), fan main part (4) activity joint is in the front of.
2. The specialized virtualized cloud test environment simulation system processor heat sink mounting mechanism of claim 1, wherein: the clamping mechanism comprises a rectangular opening (202), the rectangular opening (202) is formed in the side wall of the mounting rail (2), a pawl plate (205) is connected in the rectangular opening (202) in a sliding mode, and the pawl plate (205) is movably clamped with a ratchet (3031).
3. The specialized virtualized cloud test environment simulation system processor heat sink mounting mechanism of claim 2, wherein: the side wall of the mounting rail (2) is fixedly connected with a fixing rod (203), one end of the fixing rod (203) far away from the mounting rail (2) is fixedly connected with a side plate (204), the side wall of the pawl plate (205) is fixedly connected with a resisting rod (206), and one end of the resisting rod (206) far away from the pawl plate (205) penetrates through the fixing rod (203) to extend outwards and is fixedly connected with a first handle (2062).
4. The specialized virtualized cloud test environment simulation system processor heat sink mounting mechanism of claim 3, wherein: the utility model discloses a keep away from tight pole (206), including support pole (206), first spring (207) has been cup jointed on the support pole (206), the one end of first spring (207) offsets with the lateral wall of pawl board (205), the lateral wall of the other end curb plate (204) of first spring (207) offsets, first spring (207) are in compression state, support pole (206) and go up fixedly connected with spacing snap ring (2061), the lateral wall of spacing snap ring (2061) offsets with one side that first spring (207) were kept away from to curb plate (204).
5. The specialized virtualized cloud test environment simulation system processor heat sink mounting mechanism of claim 1, wherein: the both sides fixedly connected with square sleeve pipe (5) of heating panel main part (3), the back fixedly connected with two sets of cutting (401) of fan main part (4), cutting (401) activity is pegged graft in the lumen of square sleeve pipe (5), locking hole (4011) have been seted up to the lateral wall of cutting (401).
6. The specialized virtualized cloud test environment simulation system processor heat sink mounting mechanism of claim 5, wherein: one side, far away from the heat dissipation plate main body (3), of the square sleeve (5) is fixedly connected with a hollow cylinder (6), an inner cavity is formed in the hollow cylinder (6), and a sliding block (601) is connected in the inner cavity of the hollow cylinder (6) in a sliding mode.
7. The specialized virtualized cloud test environment simulation system processor heat sink mounting mechanism of claim 6, wherein: the side wall of slider (601) fixedly connected with check lock pole (6011), the one end that slider (601) is kept away from in check lock pole (6011) passes hollow cylinder (6) and square sleeve pipe (5) and activity grafting is in locking hole (4011).
8. The specialized virtualized cloud test environment simulation system processor heat sink mounting mechanism of claim 6, wherein: one end fixedly connected with pull rod (6012) that the slider (601) is kept away from check lock pole (6011), the one end that slider (601) was kept away from in pull rod (6012) passes hollow cylinder (6) and outwards extends and fixedly connected with second handle (6013).
9. The specialized virtualized cloud test environment simulation system processor heat sink mounting mechanism of claim 8, wherein: a second spring (602) is sleeved on the pull rod (6012), one end of the second spring (602) abuts against the side wall of the sliding block (601), the other end of the second spring (602) abuts against the inner cavity of the hollow cylinder (6), and the second spring (602) is in a compressed state.
10. The specialized virtualized cloud test environment simulation system processor heat sink mounting mechanism of claim 1, wherein: the bottom of the heat dissipation plate main body (3) is abutted to the upper surface of the processor main body (101), and heat-conducting silicone grease is arranged between the heat dissipation plate main body (3) and the processor main body (101).
CN202010647554.6A 2020-07-07 2020-07-07 Installation mechanism for heat dissipation plate of processor of professional virtualized cloud test environment simulation system Expired - Fee Related CN111796648B (en)

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CN112930025A (en) * 2021-01-26 2021-06-08 林思琪 Radiating fin loading assembly for communication equipment circuit
CN113329364A (en) * 2021-08-02 2021-08-31 山东辛丁技术有限公司 Underground gas concentration detection equipment based on wireless sensor network

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