CN111785767A - Mirror display device and manufacturing method thereof - Google Patents
Mirror display device and manufacturing method thereof Download PDFInfo
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- CN111785767A CN111785767A CN202010862254.XA CN202010862254A CN111785767A CN 111785767 A CN111785767 A CN 111785767A CN 202010862254 A CN202010862254 A CN 202010862254A CN 111785767 A CN111785767 A CN 111785767A
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
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- H—ELECTRICITY
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- H10K50/00—Organic light-emitting devices
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- H10K50/85—Arrangements for extracting light from the devices
- H10K50/856—Arrangements for extracting light from the devices comprising reflective means
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- H—ELECTRICITY
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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Abstract
The application provides a mirror display device and a manufacturing method thereof, and relates to the field of display equipment. Wherein, mirror display device, it includes: the array substrate, the light-emitting device layer, the packaging layer, the metal reflecting layer and the optical film layer are sequentially stacked; the optical film layer is provided with a plurality of openings, the openings are respectively opposite to the pixel units of the light-emitting device layer, the optical film layer is made of an inorganic material film layer, and the optical film layer is provided with a preset thickness so that the mirror display device can reflect and display in different colors. The mirror display device is additionally provided with the optical film layer, so that light in a part of wave bands in reflected light can interfere with each other by adjusting the thickness of the optical film layer, only light in a wave band corresponding to a certain specific color can be emitted out of the optical film layer, further reflective display with a certain color is realized, and emission display with different colors can be realized by adjusting the thickness of the optical film layer.
Description
Technical Field
The present disclosure relates to display devices, and particularly to a mirror display device and a method for manufacturing the same.
Background
Organic Light-Emitting diodes (OLEDs), also known as Organic electroluminescent displays, Organic Light-Emitting semiconductors, have the advantages of self-luminescence, wide viewing angle, almost infinite contrast, low power consumption, very high response speed, and the like.
In the prior art, an OLED display device with only a display function cannot meet the needs of a user, for example, when the OLED display device is used in a toilet or a rearview mirror inside a vehicle, the user needs the OLED display device to have a mirror reflection display function, so that a technician sets a reflective layer on a light-emitting surface of the OLED display device to realize the mirror display function.
However, the current OLED display device with mirror display function cannot realize reflective display with colors, and cannot realize reflective display with different colors, so that it cannot satisfy different application scenarios. The above technical problem needs to be further solved.
Disclosure of Invention
The present invention is directed to a mirror display device and a method for manufacturing the same, which can solve the technical problem that the conventional mirror display device cannot perform reflective display with color.
In order to solve the above technical problem, an embodiment of the present application provides the following technical solutions:
in one aspect, the present application provides a mirror display device, comprising:
the array substrate, the light-emitting device layer, the packaging layer, the metal reflecting layer and the optical film layer are sequentially stacked;
the optical film layer is provided with a plurality of openings, the openings are respectively opposite to the pixel units of the light-emitting device layer, the optical film layer is made of an inorganic material film layer, and the optical film layer is provided with a preset thickness so that the mirror display device can reflect and display in different colors.
The object of the present invention and the technical problems solved thereby can be further achieved by the following technical measures.
Optionally, in the mirror display device, the optical film layer includes at least one SiNx film layer and at least one SiO film layer alternately and sequentially stacked2And (5) film layer.
Optionally, in the mirror display device, the optical film layer includes the SiNx film layer and the SiO film layer which are stacked in a stacked manner2The SiNx film layer is 45-75 nm thick, and the SiO layer is made of silicon dioxide2The thickness of the film layer is 165nm-185 nm;
or, the optical film layer comprises two SiNx film layers and one SiO film layer2Film layer of said SiO2A film layer is arranged between the two SiNx film layers, the thickness of the SiNx film layer is 60nm, and the SiO layer is formed by2The thickness of the film layer is 50nm-170 nm.
Optionally, the mirror display device further includes:
the optical film layer and the protective layer are sequentially arranged on one side, away from the metal reflecting layer, of the optical film layer.
Optionally, in the mirror display device, a material of the metal reflective layer is MO, Al, Ti/Al/Ti, or a combination of two or more thereof.
Optionally, in the mirror display device, the encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer sequentially stacked.
Optionally, in the mirror display device, the array substrate is a flexible array substrate.
In another aspect, the present application provides a method for manufacturing a mirror display device, including:
sequentially laminating and manufacturing an array substrate, a light-emitting device layer, a packaging layer and a metal reflecting layer;
manufacturing an optical film layer with a preset thickness on one side of the metal reflecting layer, which is far away from the packaging layer, patterning the optical film layer by adopting a mask process, and forming a plurality of openings in the optical film layer through dry etching to enable the openings of the optical film layer to be opposite to the pixel units in the display area of the light-emitting device layer;
and when the optical film layer is subjected to dry etching, removing a part of the optical film layer and a part of the packaging layer corresponding to the non-display area of the light-emitting device layer.
Optionally, in the method for manufacturing a mirror display device, when the optical film layer is manufactured, an opening mask plate is used to perform deposition manufacturing of the film layer at a position corresponding to the display area of the light emitting device layer.
Alternatively, in the method for manufacturing a mirror display device, at least one SiNx film layer and at least one SiO film layer are alternately and sequentially stacked2The film layer forms the optical film layer.
By the technical scheme, the mirror display device and the manufacturing method thereof at least have the following advantages:
in the mirror display device provided by the embodiment of the invention, after the metal reflection layer is arranged on the surface of the packaging layer, the mirror reflection display is realized by reflecting light rays through the metal reflection layer, and further, the optical film layer is additionally arranged on the surface of the metal reflection layer, so that light in a part of wave bands in reflected light can be mutually interfered by adjusting the thickness of the optical film layer, only light in a wave band corresponding to a certain specific color can be emitted out of the optical film layer, further, the reflection display with a certain color is realized, and the emission display with different colors can be realized by adjusting the thickness of the optical film layer.
In addition, because can not paste tightly between mask and the base plate in the forming process of encapsulation layer, gaseous molecule gets into the filming during deposit encapsulating material, lead to forming the shadow between the base plate in encapsulation layer and non-display area, and because the design demand of the narrow frame of display panel, when the display panel of target size is made, reserve certain distance at the encapsulation layer edge and cut in order to form the display panel of required size usually, and the reservation region need exceed the shadow region, and then the width of frame about the direct influence display panel, influence the width of frame about mirror surface display device promptly. In the mirror display device manufacturing method provided by the embodiment of the invention, dry etching is adopted when the optical film layer is manufactured, so that part of the optical film layer and part of the packaging layer corresponding to the non-display area of the light-emitting device layer can be removed at the same time, and the shadow area generated by the packaging layer is removed, thereby avoiding the influence on the width of the frame, enabling the width of the left frame and the right frame of the mirror display device provided by the embodiment of the invention to be narrower, and further realizing the effect of the narrow frame.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.
Drawings
The above and other objects, features and advantages of exemplary embodiments of the present application will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. Several embodiments of the present application are illustrated by way of example and not by way of limitation in the figures of the accompanying drawings and in which like reference numerals refer to similar or corresponding parts and in which:
FIG. 1 is a schematic diagram illustrating a structure of a mirror display apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a mirror display apparatus according to another embodiment of the present invention;
fig. 3 is a schematic flow chart illustrating a method for manufacturing a mirror display device according to an embodiment of the present invention.
The reference numerals in fig. 1-3 are:
the array substrate comprises 1-an array substrate, 2-a light-emitting device layer, 3-a packaging layer, 4-a metal reflecting layer, 5-an optical film layer, 6-an optical adhesive layer and 7-a protective layer.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
It is to be noted that, unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which this application belongs.
Example one
As shown in fig. 1, a mirror display device according to an embodiment of the present invention includes: the array substrate 1, the light-emitting device layer 2, the packaging layer 3, the metal reflecting layer 4 and the optical film layer 5 are sequentially stacked; the optical film layer 5 is provided with a plurality of openings, the openings are respectively opposite to the pixel units of the light-emitting device layer 2, the optical film layer 5 is an inorganic material film layer, and the optical film layer 5 is provided with a preset thickness so that the mirror display device can reflect and display in different colors.
Specifically, the structure of the array substrate 1 is known to a skilled person, and may include, for example, a stacked substrate, a buffer layer, a gate insulating layer, an active layer, a source/drain layer, a passivation insulating layer, and a planarization layer, where the substrate may be rigid or flexible, that is, the array substrate 1 may be the rigid array substrate 1 or the flexible array substrate 1, and the embodiment is not limited thereto.
The light emitting device layer 2 is a structure for controlling light emission of the electroluminescent body through an electrode layer, and is also known to the skilled person, and may include, for example, a pixel defining layer, an anode layer, a light emitting layer, and a cathode layer, which are stacked, wherein the material of the light emitting layer may be selected according to the requirement of light emission.
The encapsulation layer 3 is a layer for preventing damage to the light emitting device layer 2 caused by water and oxygen, and can prevent the light emission from becoming dark due to the intrusion of water vapor or oxygen into the light emitting device layer 2, and prevent the entering of pollution particles from affecting the display effect. The encapsulation Layer 3 may include a first inorganic Layer, an organic Layer, and a second inorganic Layer, which are sequentially stacked, where the two inorganic layers are usually fabricated by a Plasma Enhanced Chemical Vapor Deposition (PECVD), Atomic Layer Deposition (ALD), or Physical Vapor Deposition (PVD), the organic Layer is mainly fabricated by a PECVD or Inkjet printing (IJP) method, the first inorganic Layer and the second inorganic Layer mainly function to block water and oxygen to prevent water Vapor or oxygen from entering, the organic Layer mainly functions to slow down stress of adjacent inorganic layers during bending, and simultaneously can flatten the substrate surface and coat contaminant particles. The first inorganic layer, the second inorganic layer and the organic layer may be materials commonly used by a skilled person, and the embodiment of the present invention is not limited thereto.
The metal reflection layer 4 is a reflection layer formed on the light emitting side of the display panel formed by the array substrate 1, the light emitting device layer 2 and the packaging layer 3, a plurality of openings are formed through a mask process, the openings correspond to the pixel units of the light emitting device layer 2, light emitted by the light emitting devices is guaranteed to be emitted normally, meanwhile, the metal reflection layer 4 can reflect light, and therefore electroluminescence display and mirror reflection display of the mirror display device are achieved. The metal reflective layer 4 can be made by the above deposition method, and the material thereof can be one, two or more of MO, Al, Ti/Al/Ti, or other materials can be selected according to the technical requirements of the skilled person.
The optical film layer 5 is an inorganic material film layer, and the specific material can be selected according to the needs of the skilled person as long as it can ensure that light can be reflected by the metal reflective layer 4 and emitted through the optical film layer 5. The thickness of the optical film 5 is used to adjust the color of the emitted light, and the thickness can be set according to the color of the light to be reflected and displayed, for example, when blue light is required to be emitted, the thickness of the optical film 5 is adjusted according to the wavelength of the blue light to ensure that the light wave of the blue light is emitted normally, and the lights in other bands interfere with each other in the optical film 5.
In the mirror display device provided by the embodiment of the invention, after the metal reflection layer 4 is arranged on the surface of the packaging layer 3, the light is reflected by the metal reflection layer 4 to realize mirror reflection display, and further, the optical film layer 5 is additionally arranged on the surface of the metal reflection layer 4, so that the light of a part of wave bands in the reflected light can be mutually interfered by adjusting the thickness of the optical film layer 5, only the light of the wave band corresponding to a certain specific color can be emitted out of the optical film layer 5, further, the reflection display with a certain color is realized, and the emission display with different colors can be realized by adjusting the thickness of the optical film layer 5.
In the specific implementation, as a preferred embodiment, the optical film layer 5 includes at least one SiNx film layer and at least one SiO film layer alternately and in a stacked manner in sequence2And (5) film layer.
In particular, when using a SiNx film layer and SiO layer arranged in a stack2When the optical film 5 is formed on the film, the SiNx film and SiO need to be ensured2The film layers are alternately laminated, and the SiNx film layer and SiO2The film layers are provided with at least one layer, or two or more layers, as long as proper light transmittance is ensured.
Further, when the optical film layer 5 is relatively thin, it may have only two layers, that is, the optical film layer 5 includes the SiNx film layer and the SiO film layer stacked together2The SiNx film layer is 45-75 nm thick, and the SiO layer is made of silicon dioxide2The thickness of the film layer is 165nm-185 nm. Wherein the thickness of the SiNx film layer is 45nm SiO2When the thickness of the film layer is 165nm, light in an orange wave band can be reflected out through the optical film layer 5, and orange reflection display is further achieved; the thickness of the SiNx film layer is 75nmSiO2When the thickness of the film layer is 185nm, light in a blue waveband can be reflected out through the optical film layer 5, and blue reflective display is further achieved.
Alternatively, the optical film layer 5 may be three layers, that is, the optical film layer 5 includes two SiNx film layers and one SiO film layer2Film layer of said SiO2A film layer is arranged between the two SiNx film layers, the thickness of the SiNx film layer is 60nm, and the SiO layer is formed by2The thickness of the film layer is 50nm-170 nm. Wherein SiO is prepared by reacting2The thickness of the film layer is adjusted within the range of 50nm-170nm, and the reflective display of yellow, orange, purple, blue and green colors can be realized.
Alternatively, the optical film layer 5 may be two layers of SiO2The film layer and the two SiNx film layers are specifically arranged in SiNx/SiO2/SiNx/SiO2/SiNx(ii) a OrThe optical film layer 5 can be further added with SiO2Number of layers and SiNx layers, e.g. SiNx/SiO2/SiNx/SiO2/SiNx/SiO2/SiNxThe arrangement mode. In summary, the optical film layer 5 can be set to a suitable thickness according to the color of the light to be reflected and the wavelength of the light, and the SiO in the film layer2The number of the film layers and the SiNx film layers is set to be appropriate in thickness.
As shown in fig. 2, in the specific implementation, an optical adhesive layer 6 and a protective layer 7 are sequentially disposed on the side of the optical film layer 5 away from the metal reflective layer 4.
Specifically, the protective layer may be a film layer having a certain strength, scratch resistance, wear resistance, and water resistance, and the specific material may be known by the skilled person, and the embodiment of the present invention is not limited.
Example two
A second embodiment of the present invention provides a method for manufacturing a mirror display device, which is used for the mirror display device provided in the first embodiment, and as shown in fig. 3, the method includes:
201. and sequentially laminating the array substrate and the metal reflecting layer.
Specifically, the array substrate and the light emitting device layer may be prepared by means known to a skilled person, for example, mainly by 9 mask processes, and the detailed preparation process of the present invention is not described in detail. The encapsulation layer can be formed by deposition and coating, for example, the inorganic film layer in the encapsulation layer can be prepared by deposition, and the organic film layer in the encapsulation layer can be prepared by coating or printing. The metal reflecting layer can be manufactured on the surface of the packaging layer in a deposition mode, then the metal reflecting layer is patterned through a mask process, an opening is formed in the metal reflecting layer through etching, the opening is opposite to a pixel unit of a display area of the light-emitting device layer, light-reflecting display is achieved, and normal display of the light-emitting device layer is guaranteed.
202. Manufacturing an optical film layer with a preset thickness on one side of the metal reflecting layer, which is far away from the packaging layer, patterning the optical film layer by adopting a mask process, and forming a plurality of openings in the optical film layer through dry etching to enable the openings of the optical film layer to be opposite to the pixel units in the display area of the light-emitting device layer;
and when the optical film layer is subjected to dry etching, removing a part of the optical film layer and a part of the packaging layer corresponding to the non-display area of the light-emitting device layer.
Specifically, the optical film layer is formed in a manner different from that of the metal reflective layer, and holes are etched by dry etching, so that openings corresponding to pixel units in the display area of the light emitting device layer are formed in the optical film layer.
Specifically, because can not paste tightly between mask and the base plate in the forming process of encapsulation layer, gaseous molecule gets into the filming during deposit encapsulating material, lead to forming the shadow between the base plate in encapsulation layer and non-display area, and because the design demand of the narrow frame of display panel, when the display panel of target size is made, reserve certain distance at the encapsulation layer edge usually and cut in order to form the display panel of required size, and the reservation region need surpass the shadow region, and then the width of frame about the direct influence display panel, influence the width of frame about mirror surface display device promptly. According to the above, the mirror display device manufacturing method provided by the embodiment of the invention adopts dry etching when manufacturing the optical film layer, and can simultaneously remove a part of the optical film layer and a part of the encapsulation layer corresponding to the non-display area of the light emitting device layer, so as to remove the shadow area generated by the encapsulation layer, thereby avoiding the influence on the width of the border frame, making the width of the left and right borders of the mirror display device provided by the embodiment of the invention narrower, and further realizing the effect of the narrow border.
In a specific implementation, when the optical film layer is manufactured, an open mask (open mask) is used to perform deposition manufacturing of the film layer at a position corresponding to the display area of the light emitting device layer.
Specifically, the optical film layer is manufactured in the display area through deposition of the open-hole mask, preliminary patterning can be achieved, and subsequent mask patterning is more accurate.
In a specific implementation, the optical film layer can be formed by manufacturing SiNx film layers and SiO films which are alternately stacked2Film formation, and of note are SiNx film and SiO2The film layers are at least one and can be made of SiNx film layer and SiO by adjusting2The thickness of the film layer is matched with the wavelength of light to be reflected, so that light in the rest wave bands in the reflected light is interfered in the optical film layer.
When the optical film layer is relatively thin, only two layers, namely a SiNx film layer and a SiO film layer, can be prepared2A SiNx film layer with a thickness of 45-75 nm and SiO2The thickness of the film layer may be 165nm-185 nm. Wherein the thickness of the SiNx film layer is 45nm SiO2When the thickness of the film layer is 165nm, light in an orange wave band can be reflected out through the optical film layer, and orange reflection display is further achieved; the thickness of the SiNx film layer is 75nmSiO2When the thickness of the film layer is 185nm, light in a blue waveband can be reflected out through the optical film layer, and blue reflective display is further achieved.
Alternatively, two SiNx film layers and one SiO layer may be prepared2Film layer of SiO2The film layer is arranged between two SiNx film layers, and the thickness of the SiNx film layer can be 60nm and SiO2The thickness of the film layer can be made to be 50nm-170 nm. Wherein SiO is prepared by reacting2The thickness of the film layer is adjusted within the range of 50nm-170nm, and the reflective display of yellow, orange, purple, blue and green colors can be realized.
Alternatively, two layers of SiO may be prepared2The film layer and the two SiNx film layers are specifically arranged in SiNx/SiO2/SiNx/SiO2/SiNx(ii) a Or the optical film layer can be further added with SiO2Number of layers and SiNx layers, e.g. SiNx/SiO2/SiNx/SiO2/SiNx/SiO2/SiNxThe arrangement mode. In general, the optical film layer can reflect the color of the displayed light and the light according to the requirementSet a suitable thickness, and according to the SiO in the film layer set2The number of the film layers and the SiNx film layers is set to be appropriate in thickness.
It will be appreciated that the relevant features of the devices described above may be referred to one another. In addition, "first", "second", and the like in the above embodiments are for distinguishing the embodiments, and do not represent merits of the embodiments.
In the description provided herein, numerous specific details are set forth. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A mirror display device, comprising:
the array substrate, the light-emitting device layer, the packaging layer, the metal reflecting layer and the optical film layer are sequentially stacked;
the optical film layer is provided with a plurality of openings, the openings are respectively opposite to the pixel units of the light-emitting device layer, the optical film layer is made of an inorganic material film layer, and the optical film layer is provided with a preset thickness so that the mirror display device can reflect and display in different colors.
2. Mirror display device according to claim 1,
the optical film layer comprises at least one SiNx film layer and at least one SiO film layer which are sequentially arranged alternately in a stacked mode2And (5) film layer.
3. Mirror display device according to claim 2,
the optical film layer comprises the SiNx film layer and the SiO film layer which are arranged in a stacked mode2The SiNx film layer is 45-75 nm thick, and the SiO layer is made of silicon dioxide2The thickness of the film layer is 165nm-185 nm;
or, the optical film layer comprises two SiNx film layers and one SiO film layer2Film layer of said SiO2A film layer is arranged between the two SiNx film layers, the thickness of the SiNx film layer is 60nm, and the SiO layer is formed by2The thickness of the film layer is 50nm-170 nm.
4. The mirror display device according to claim 1, further comprising:
the optical film layer and the protective layer are sequentially arranged on one side, away from the metal reflecting layer, of the optical film layer.
5. Mirror display device according to claim 1,
the metal reflecting layer is made of one, two or more of MO, Al, Ti and Ti/Al/Ti.
6. Mirror display device according to claim 1,
the packaging layer comprises a first inorganic layer, an organic layer and a second inorganic layer which are sequentially stacked.
7. Mirror display device according to claim 1,
the array substrate is a flexible array substrate.
8. A method for manufacturing a mirror display device is characterized by comprising the following steps:
sequentially laminating and manufacturing an array substrate, a light-emitting device layer, a packaging layer and a metal reflecting layer;
manufacturing an optical film layer with a preset thickness on one side of the metal reflecting layer, which is far away from the packaging layer, patterning the optical film layer by adopting a mask process, and forming a plurality of openings in the optical film layer through dry etching to enable the openings of the optical film layer to be opposite to the pixel units in the display area of the light-emitting device layer;
and when the optical film layer is subjected to dry etching, removing a part of the optical film layer and a part of the packaging layer corresponding to the non-display area of the light-emitting device layer.
9. The mirror display device manufacturing method according to claim 8,
and when the optical film layer is manufactured, an opening mask plate is adopted to perform deposition manufacturing of the film layer at a position corresponding to the display area of the light-emitting device layer.
10. The mirror display device manufacturing method according to claim 8 or 9,
sequentially and alternately manufacturing at least one SiNx film layer and at least one SiO film layer in a laminated manner2The film layer forms the optical film layer.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113451527A (en) * | 2021-06-28 | 2021-09-28 | 京东方科技集团股份有限公司 | Display panel and display device |
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| JP2007034061A (en) * | 2005-07-28 | 2007-02-08 | Murakami Corp | Semi-transparent mirror for display device |
| CN109326222A (en) * | 2018-09-28 | 2019-02-12 | 合肥鑫晟光电科技有限公司 | A kind of display base plate and preparation method thereof, adjusting method, display device |
| CN110828695A (en) * | 2019-11-19 | 2020-02-21 | 京东方科技集团股份有限公司 | Mirror array substrate, preparation method thereof, mirror display panel and display device |
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| JP2007034061A (en) * | 2005-07-28 | 2007-02-08 | Murakami Corp | Semi-transparent mirror for display device |
| CN109326222A (en) * | 2018-09-28 | 2019-02-12 | 合肥鑫晟光电科技有限公司 | A kind of display base plate and preparation method thereof, adjusting method, display device |
| CN110828695A (en) * | 2019-11-19 | 2020-02-21 | 京东方科技集团股份有限公司 | Mirror array substrate, preparation method thereof, mirror display panel and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113451527A (en) * | 2021-06-28 | 2021-09-28 | 京东方科技集团股份有限公司 | Display panel and display device |
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