CN111785648A - Mold temperature compensation device and plastic packaging machine - Google Patents
Mold temperature compensation device and plastic packaging machine Download PDFInfo
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- CN111785648A CN111785648A CN202010618542.0A CN202010618542A CN111785648A CN 111785648 A CN111785648 A CN 111785648A CN 202010618542 A CN202010618542 A CN 202010618542A CN 111785648 A CN111785648 A CN 111785648A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 18
- 238000010438 heat treatment Methods 0.000 claims abstract description 231
- 238000004891 communication Methods 0.000 claims description 14
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- 239000000463 material Substances 0.000 description 10
- 238000012545 processing Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 230000001976 improved effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
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- 230000009286 beneficial effect Effects 0.000 description 1
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- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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Abstract
The invention discloses a mold temperature compensation device and a plastic packaging machine, wherein the mold temperature compensation device comprises: the first heating pipe and the second heating pipe are respectively arranged at two sides of the length direction of the die; the temperature sensor module comprises a plurality of temperature sensors, and the number and the positions of the plurality of temperature sensors are arranged corresponding to the first heating pipe and the second heating pipe; the electric control assembly is electrically connected with each temperature sensor, the first heating pipe and the second heating pipe respectively; the electric control component is configured to output corresponding driving power according to the working time for controlling the first heating pipe and the second heating pipe and the temperature value detected by each temperature sensor so as to drive the first heating pipe and the second heating pipe to work. The invention solves the problem that the temperature deviation causes the mold flow problems such as air holes or incomplete plastic package and the like caused by the temperature deviation to the package of the electronic device due to the temperature deviation caused by the entering of cold air during the mold opening.
Description
Technical Field
The invention relates to the technical field of dies, in particular to a die temperature compensation device and a plastic packaging machine.
Background
In a molding machine, such as a standard molding machine (TOWA type), a heating tube is generally provided to heat the mold. However, the temperature of the mold is reduced due to the entrance of cold air when the mold is opened, and the mold temperature is reduced, which has a certain influence on the mold flow of the molding compound, especially for some products with large substrate panels, the area of the product is large, the edge of the substrate is closer to the edge of the mold, and the temperature of the edge of the substrate is likely to be low, which is not beneficial to the mold flow.
Disclosure of Invention
The invention mainly aims to provide a mold temperature compensation device and a plastic packaging machine, and aims to solve the problem that temperature deviation causes air holes or incomplete plastic packaging and other mold flow problems caused by temperature deviation due to the fact that cold air enters during mold opening.
In order to achieve the above object, the present invention provides a mold temperature compensation apparatus, comprising:
the first heating pipe and the second heating pipe are respectively arranged at two sides of the length direction of the die;
the temperature sensor module comprises a plurality of temperature sensors, and the number and the positions of the plurality of temperature sensors are arranged corresponding to the first heating pipe and the second heating pipe;
the electric control assembly is electrically connected with each temperature sensor, the first heating pipe and the second heating pipe respectively; the electric control assembly is configured to output corresponding driving power according to the working time of the first heating pipe and the second heating pipe and the temperature value detected by each temperature sensor, so as to drive the first heating pipe and the second heating pipe to work.
Optionally, the electronic control assembly is specifically configured to:
when the electric control assembly determines that the current temperature value of the corresponding position of the first heating pipe and/or the second heating pipe is less than or equal to a target set value according to the temperature value detected by each temperature sensor, the working time of the first heating pipe and/or the second heating pipe is obtained in real time, and the driving power of the first heating pipe and/or the second heating pipe is increased according to the working time obtained in real time.
Optionally, the electronic control assembly is further configured to:
and when the current temperature value of the corresponding position of the first heating pipe and/or the second heating pipe after the driving power is increased is larger than a first preset temperature threshold value and smaller than the target set value, reducing the driving power of the first heating pipe and/or the second heating pipe.
Optionally, the mold temperature compensation device further includes:
the third heating pipe and the fourth heating pipe are respectively arranged at two sides of the width direction of the die;
the number of the first heating pipes is two, and the two first heating pipes are respectively arranged at one ends of the third heating pipe and the fourth heating pipe;
the number of the second heating pipes is two, and the two second heating pipes are respectively arranged at the other ends of the third heating pipe and the fourth heating pipe.
Optionally, the electric control assembly comprises a main controller, a power switch and a driving power supply, a control end of the main controller is connected with a controlled end of the power switch, one end of the power switch is connected with the driving power supply, and the other end of the power switch is electrically connected with the first heating pipe and the second heating pipe respectively; wherein,
the main controller is configured to output a corresponding driving pulse voltage output signal to the power switch according to the temperature value detected by each temperature sensor, so that the power switch controls the driving power supply to work and output corresponding driving power to the first heating pipe and the second heating pipe.
Optionally, the electronic control assembly comprises:
the main controller is arranged on the electric control board;
the parameter key switch is electrically connected with the main controller; the parameter key switch is configured to output a parameter setting signal to the main controller when triggered by a user.
Optionally, the mold temperature compensation device further includes:
the communication interface circuit is configured to realize communication connection between the main controller and external equipment.
Optionally, the mold temperature compensation device further includes:
the current sensor is electrically connected with the main controller; the current sensor is configured to detect a value of current flowing through the first and second heating pipes and output the detected value to the main controller;
the main controller is further configured to output an alarm control signal when detecting that the current value flowing through the first heating pipe and the second heating pipe is smaller than a preset current threshold value.
Optionally, the electronic control assembly is further configured to output an alarm control signal when determining that a current temperature value of a corresponding position of the first heating pipe and/or the second heating pipe is smaller than a second preset temperature threshold value according to the temperature value detected by each of the temperature sensors, or when determining that the current temperature value of the corresponding position of the first heating pipe and/or the second heating pipe is larger than a third preset temperature threshold value.
The invention also provides a plastic packaging machine, which comprises a die and the die temperature compensation device;
the first heating pipe and the second heating pipe of the mold temperature compensation device are respectively arranged on two sides of the mold in the length direction.
According to the invention, the first heating pipe and the second heating pipe are arranged on two sides of the length direction of the die, namely the direction in which cold air enters is arranged, and the corresponding temperature sensors are arranged corresponding to the number and the positions of the first heating pipe and the second heating pipe, so that temperature values on two sides of the length direction of the die are detected and fed back to the electric control component, and the electric control component outputs corresponding driving power according to the working time of controlling the first heating pipe and the second heating pipe and the temperature value detected by each temperature sensor to drive the first heating pipe and the second heating pipe to work, thereby compensating the temperature difference caused by the flow of the cold air when the die is opened at two ends of the length direction of the die. The invention solves the problem that the temperature deviation causes the mold flow problems such as air holes or incomplete plastic package and the like caused by the temperature deviation to the package of the electronic device due to the temperature deviation caused by the entering of cold air during the mold opening.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a mold temperature compensation device according to an embodiment of the present invention;
fig. 2 is a schematic circuit diagram of a mold temperature compensation device according to an embodiment of the invention.
The reference numbers illustrate:
the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a mold temperature compensation device, which is applied to a plastic packaging machine.
Referring to fig. 1 and 2, in an embodiment of the present invention, the mold temperature compensation apparatus includes:
the first heating pipe 10 and the second heating pipe 20 are respectively arranged at two sides of the length direction of the die;
the temperature sensor module 30 comprises a plurality of temperature sensors (31-34), and the number and the positions of the plurality of temperature sensors (31-34) are arranged corresponding to the first heating pipe 10 and the second heating pipe 20;
an electric control component 40 electrically connected to each of the temperature sensors, the first heating pipe 10 and the second heating pipe 20, respectively; the electronic control component 40 is configured to output corresponding driving power according to the operation time of the first heating pipe 10 and the second heating pipe 20 and the temperature value detected by each temperature sensor, so as to drive the first heating pipe 10 and the second heating pipe 20 to operate.
It can be understood that, in the process of injection molding electronic components such as semiconductors and chip wafers, the following steps are generally required to be performed, and a processing material is put into the plastic package mold 100; heating the processing material to enable the processing material to reach and keep a preset temperature; pressing the mold 100, and applying pressure to the processing material to deform the processing material; keeping the mold 100 in a pressing state, stopping heat preservation of the processing material, and cooling the processing material; the work material is cooled to room temperature and the mold 100 is opened and the stress is removed. Wherein, the processing material can be plastic particles, plastic sealant and the like. In this process, it is generally necessary to heat the mold 100 so that the gas and the like in the molding compound are discharged through the vent hole of the mold 100. Therefore, the temperature compensation device of the mold 100 of the present embodiment further includes a third heating pipe 51 and a fourth heating pipe 52, and the third heating pipe 51 and the fourth heating pipe 52 are respectively disposed on two sides of the mold 100 in the width direction; the number of the third heating pipes 51 and the number of the fourth heating pipes 52 may be two, two third heating pipes 51 are arranged at one end of the mold 100 in the width direction at intervals, and two fourth heating pipes 52 are arranged at the other end of the mold 100 in the width direction at intervals. The third heating pipe 51 and the fourth heating pipe 52 may be provided on an upper die (movable die) of the die 100, or may be provided on a lower die (stationary die) of the die 100, or the same number of third heating pipes 51 and fourth heating pipes 52 may be provided at positions opposite to each other on the upper die (movable die) and the lower die (stationary die) of the die 100. The third heating pipe 51 and the fourth heating pipe 52 are controlled by the electronic control component 40, and according to the temperature required by the injection molding process of the electronic component, the electronic control component 40 provides corresponding driving power to the third heating pipe 51 and the fourth heating pipe 52, so as to heat the mold 100, and maintain the corresponding temperature of the molding compound in the mold 100. In the process of plastic encapsulation, the temperature of the plastic encapsulation material at each part of the mold 100 needs to be kept constant, and if the temperature is different, for example, the temperature deviation caused by the entry of cold air during mold opening, the mold flow problem, such as air holes, incomplete plastic encapsulation and the like, caused by the temperature deviation to the chip encapsulation can occur. However, for larger substrate products, where the area is larger, the edge of the substrate is closer to the edge of the mold 100, and the temperature of the substrate edge is likely to be lower, which is not conducive to mold flow.
In order to solve the above problem, in the present embodiment, the first heating pipe 10 and the second heating pipe 20 are respectively disposed at two ends of the third heating pipe 51 and the fourth heating pipe 52, and the first heating pipe 10 and the second heating pipe 20 are disposed in the direction of the cold air entering, so as to compensate the temperature difference of the mold 100 caused by the flow of the cold air at the two ends of the third heating pipe 51 and the fourth heating pipe 52 when the mold is opened.
In the temperature sensor module 30, temperature sensors (31-34) are disposed at both ends of the third heating pipe 51 and the fourth heating pipe 52, so as to detect the temperatures of the two ends of the third heating pipe 51 and the fourth heating pipe 52 and feed the detected temperature values back to the electronic control component 40, the electronic control component 40 determines whether the temperatures of the two ends of the third heating pipe 51 and the fourth heating pipe 52 need to be compensated according to the temperature values detected by the temperature sensors, when it is determined that the temperature at the two ends of the third heating pipe 51 and the fourth heating pipe 52 needs to be compensated, the electronic control component 40 further determines, according to the mold opening time of the mold 100, and the heating time of the first heating tube 10 and the second heating tube 20, adjusting the driving power output to the first heating tube 10 and the second heating tube 20, adjusting the temperature at both ends of the mold 100 in real time, the temperatures of both ends of the mold 100 are kept consistent with the temperature of the central position, thereby reducing the temperature difference caused by the flow of cold air when opening the mold. In addition, the first heating pipe 10 and the second heating pipe 20 are disposed at both ends of the mold 100 in the length direction, so that the cold air entering from both ends of the length direction is heated by the first heating pipe 10 and the second heating pipe 20, and when the heated air is blown into the mold 100, the temperature difference to be supplied to the mold 100 due to the air entering is avoided. Wherein, each temperature sensor in the temperature sensor module 30 can be realized by adopting a PT100 type temperature sensor.
According to the invention, the first heating pipe 10 and the second heating pipe 20 are arranged on two sides of the die 100 in the length direction, namely in the direction in which cold air enters, and the corresponding temperature sensors are arranged corresponding to the number and the positions of the first heating pipe 10 and the second heating pipe 20, so that temperature values on two sides of the die 100 in the length direction are detected and fed back to the electric control component 40, and the electric control component 40 outputs corresponding driving power according to the working time for controlling the first heating pipe 10 and the second heating pipe 20 and the temperature values detected by the temperature sensors to drive the first heating pipe 10 and the second heating pipe 20 to work, thereby compensating the temperature difference caused by the flow of the cold air when the die is opened at two ends of the die 100 in the length direction. The invention solves the problem that the temperature deviation causes the mold flow problems such as air holes or incomplete plastic package and the like caused by the temperature deviation to the package of the electronic device due to the temperature deviation caused by the entering of cold air during the mold opening.
Referring to fig. 1 and 2, in an embodiment, the electronic control assembly 40 is specifically configured to:
when the electronic control component 40 determines that the current temperature value of the corresponding position of the first heating pipe 10 and/or the second heating pipe 20 is less than or equal to a target set value according to the temperature value detected by each temperature sensor, the working duration of the first heating pipe 10 and/or the second heating pipe 20 is obtained in real time, and the driving power of the first heating pipe 10 and/or the second heating pipe 20 is increased according to the working duration obtained in real time.
In the present embodiment, when the temperature sensor detects the current temperature, for example, the temperature sensor detects that the current temperature PV near the first heating pipe 10 is 50 ℃ and is less than the target set value, for example, the current required temperature SV of the electronic device is 150 ℃, and the target set value may be 15 ℃, the electronic control assembly 40 controls the first heating pipe 10 to operate. When the difference time between the currently detected real-time temperature and the target set value temperature is longer, that is, the time interval between the time corresponding to the current temperature and the operation of the first heating pipe 10 is longer, the larger the driving power output by the electronic control component 40 is, the larger the heat output by the first heating pipe 10 is. According to the embodiment, the temperature value near the heating pipe can be obtained in real time, and the power of the heater is changed and controlled according to the working duration corresponding to the working time of the first heating pipe 10 and the moment corresponding to the current temperature value, so that the temperatures on the two sides of the length direction of the die 100 are increased, the temperature difference between the two ends of the length direction of the die 100 and the middle position is reduced, and the packaging yield of electronic devices is improved.
Referring to fig. 1 and 2, in an embodiment, the electronic control assembly 40 is further configured to:
when the current temperature value of the corresponding position of the first heating pipe 10 and/or the second heating pipe 20 after the driving power is increased is greater than a first preset temperature threshold value and is smaller than a target set value, the driving power of the first heating pipe 10 and/or the second heating pipe 20 is reduced.
In this embodiment, as the power of the driving power to the first heating pipe 10 and/or the second heating pipe 20 is increased, the heat generated by the first heating pipe 10 and/or the second heating pipe 20 is increased, so that the temperatures at the two sides of the length direction of the mold 100 are increased, and the temperature difference between the two ends of the length direction of the mold 100 and the middle position is decreased, so as to avoid the phenomenon that the temperature difference between the two ends of the length direction of the mold 100 and the middle position is reversed, that is, the temperatures at the two ends of the length direction of the mold 100 are higher than the temperature at the middle position of the mold 100, so that an overshoot phenomenon occurs, the electronic control component 40 determines that the driving power of the first heating pipe 10 and/or the second heating pipe 20 is greater than a first preset temperature threshold according to the temperature detected by the temperature sensor, and when the driving power. The first preset temperature threshold may be set to a temperature slightly lower than the target temperature of the mold 100, for example, when the target temperature is set to 150 ℃, the first preset temperature may be set to 140-145 ℃.
Referring to fig. 1 and 2, in an embodiment, the third heating pipe 51 and the fourth heating pipe 52 are respectively disposed at two sides of the mold 100 in the width direction;
the number of the first heating pipes 10 is two, and the two first heating pipes 10 are respectively arranged at one end of the third heating pipe 51 and one end of the fourth heating pipe 52;
the number of the second heating pipes 20 is two, and the two second heating pipes 20 are respectively disposed at the other ends of the third heating pipe 51 and the fourth heating pipe 52.
In this embodiment, the number of the first heating pipes 10 and the second heating pipes 20 may be one or two, and the two first heating pipes 10 are correspondingly disposed at one ends of the third heating pipe 51 and the fourth heating pipe 52. The two second heating pipes 20 are correspondingly disposed at the other ends of the third heating pipe 51 and the fourth heating pipe 52. The number of the temperature sensors corresponds to the number of the first heating pipes 10 and the number of the second heating pipes 20, the number of the temperature sensors is four in the embodiment, and the four temperature sensors can respectively detect the temperatures at two ends of the mold 100 in the length direction, so that the accuracy of the temperature compensation device of the mold 100 can be improved. Each heating pipe is independently controlled by the electronic control component 40, that is, the electronic control component 40 has a plurality of control signal output ends, and the electronic control component 40 outputs driving power with corresponding magnitude according to the temperature values of the temperature compensation areas of the mold 100 detected by the four temperature sensors, so as to drive each heating pipe to work. Through the independent control of the four power heating pipes, the temperature deviation caused by cold air is solved, the balance of multipoint temperature is realized, and therefore better die flow is realized, and the packaging process efficiency and the product yield of products are improved.
Referring to fig. 1 and 2, in an embodiment, the electronic control assembly 40 includes a main controller 41, a power switch 42 and a driving power supply 43, a control end of the main controller 41 is connected to a controlled end of the power switch 42, one end of the power switch 42 is connected to the driving power supply 43, and the other end of the power switch 42 is electrically connected to the first heating pipe 10 and the second heating pipe 20 respectively; wherein,
the main controller 41 is configured to output a corresponding driving pulse voltage output signal to the power switch 42 according to the temperature value detected by each temperature sensor, so that the power switch 42 controls the driving power supply 43 to output corresponding driving power to the first heating pipe 10 and the second heating pipe 20.
In this embodiment, the main controller 41 may be implemented by a controller such as a PLC, a single chip, or a DSP, the electronic control component 40 may further be provided with a memory, the main controller 41 is a control center of the temperature compensation device of the mold 100, and various interfaces and lines are used to connect various parts of the temperature compensation device of the entire mold 100, and various functions and processing data of the temperature compensation device of the mold 100 are executed by running or executing software programs and/or modules stored in the memory and calling data stored in the memory, thereby integrally monitoring the temperature compensation device of the mold 100. The main controller 41 may include one or more processing units; preferably, the main controller 41 may integrate the application main controller 41 and the modem main controller 41, wherein the application main controller 41 mainly handles an operating system, a user interface, an application program, and the like, and the modem main controller 41 mainly handles wireless communication. The temperature controller supporting the multi-channel temperature control system can also be adopted to realize the temperature sensor input, the pulse voltage output (SSR), the analog quantity current output, the switch control output, the position control output and the like. The power switch 42 may be implemented using a relay, such as a solid state relay. Air flowing inside the machine can exist at two ends of the die 100 in the length direction, the air flowing brings temperature difference to the two ends of the die 100, and when the electric control assembly is automatically adjusted, the die 100 is in a static state instead of a die opening and closing action state, and is not suitable for differential compensation. Therefore, in the present embodiment, the first heating pipe 10 and the second heating pipe 20 are added, the plurality of temperature sensors are arranged to detect the temperatures at the two ends of the mold 100 in the longitudinal direction, respectively, and output the detected temperature values to the main controller 41, and the main controller 41 outputs the corresponding driving powers to the first heating pipe 10 and the second heating pipe 20 respectively. The main controller 41 may specifically output the control pulse in a pulse width modulation manner, where the width of the control pulse is% of the control output, the abscissa is the control period percentage, and the longer the period time is, the longer the pulse on time is, that is, the longer the heating pipe on time is. In order to prevent oscillation, the present embodiment may further adopt a PID control manner to realize the control of the power switch 42. Specifically, when the temperature sensor PT6 detects that the current temperature (PV 50 ℃) is lower than the target set value (SV150 ℃), the temperature controller outputs SSR to be turned on, the longer the difference between the detected real-time temperature and the target set value is, the larger the control percentage output is, the larger the heating pipe output heat is, and when the detected real-time temperature approaches the target set value, the control cycle of the main controller 41 may be correspondingly shortened according to the PID algorithm to prevent overshoot. Of course, in some embodiments, the main controller 41 may also dynamically change the assigned temperature of the PID temperature controller according to the temperature difference between the temperature feedback value and the target set value, so as to control the power of the heating pipe and complete the PID control of the packaging process.
Referring to fig. 1 and 2, in an embodiment, the electronic control assembly 40 includes:
the electronic control board 44, the main controller 41 is arranged on the electronic control board 44;
a parameter key switch 45 electrically connected to the main controller 41; the parameter key switch 45 is configured to output a parameter setting signal to the main controller 41 when triggered by a user.
In this embodiment, when different electronic devices are packaged, the target set value of the temperature during packaging may be different and the packaging time may also be different according to the difference of the packaging materials, the size of the electronic device, and the like. The user can input corresponding parameters through the parameter key switch 45 to realize the setting of temperature, packaging time, voltage, current and the like and the uploading of data such as packaging results and the like. The parameter key switch 45 may be one or more of a physical keyboard, a trackball, a mouse, an operation rod, and the like, which is not limited herein.
Referring to fig. 1 and 2, in an embodiment, the mold temperature compensation apparatus further includes:
a communication interface circuit 60 configured to enable communication connection of the main controller 41 with an external device.
In this embodiment, the communication interface circuit 60 may include a wired or wireless data port, a memory card port, and the like, and the communication interface circuit 60 may be a wired interface circuit, such as a USB interface circuit, a Type-C interface circuit, and the like, and is connected to an upper computer through the communication interface circuit 60, so as to implement setting of temperature, package time, voltage, current, and the like. The communication interface circuit 60 may also be a wireless communication circuit, such as a WIFI, an infrared transceiver module, a bluetooth module, etc., and may be in communication connection with an external mobile terminal, a background server, etc. through the wireless communication module, so as to implement settings of temperature, package time, voltage, current, etc., and upload data such as package results.
Referring to fig. 1 and 2, in an embodiment, the mold temperature compensation apparatus further includes:
a current sensor 70 electrically connected to the main controller 41; the current sensor 70 is configured to detect the value of current flowing through the first and second heating pipes 10 and 20 and output to the main controller 41;
the main controller 41 is further configured to output an alarm control signal when detecting that the value of the current flowing through the first heating pipe 10 and the second heating pipe 20 is smaller than a preset current threshold value.
The current sensor 70 may detect a current value between the electronic control component 40 and the power tube, and the current sensor 70 may be one or more of an inductive resistor, a hall sensor, a giant magnetoresistance sensor, and a rogowski current sensor 70. The preset current threshold value can be set to be half of the full current when the driving power tube works, and whether the wire between the electric control component 40 and the heating tube is broken can be determined according to the comparison result of the detected current detection value and the preset current threshold value.
Referring to fig. 1 and 2, in an embodiment, the electronic control assembly 40 is further configured to output an alarm control signal when determining that the current temperature value of the corresponding position of the first heating pipe 10 and/or the second heating pipe 20 is smaller than a second preset temperature threshold value or when determining that the current temperature value of the corresponding position of the first heating pipe 10 and/or the second heating pipe 20 is larger than a third preset temperature threshold value according to the temperature values detected by the temperature sensors. In this embodiment, the mold temperature compensation device may further be provided with an audible and visual alarm circuit, and when the temperature of the mold is too high to exceed a preset threshold, or the temperature of the mold is too low to be lower than the preset threshold, the electronic control assembly 40 may control the audible and visual alarm circuit to work, so as to realize alarm prompt.
In the above embodiment, the electronic control assembly may further include a display screen, which may be a touch screen, and the display screen may display information input by a user or information provided to the user, such as the temperature of the mold during testing, the packaging time, and the like, based on the control of the main controller 41.
The invention also provides a chip packaging die, which comprises the die temperature compensation device; the detailed structure of the mold temperature compensation device can refer to the above embodiments, and is not described herein again; it can be understood that, because the die temperature compensation device is used in the die for chip packaging of the present invention, the embodiment of the die for chip packaging of the present invention includes all technical solutions of all embodiments of the die temperature compensation device, and the achieved technical effects are also completely the same, and are not described herein again. The first heating pipe and the second heating pipe of the mold temperature compensation device are respectively arranged on two sides of the mold in the length direction.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A mold temperature compensation device, comprising:
the first heating pipe and the second heating pipe are respectively arranged at two sides of the length direction of the die;
the temperature sensor module comprises a plurality of temperature sensors, and the number and the positions of the plurality of temperature sensors are arranged corresponding to the first heating pipe and the second heating pipe;
the electric control assembly is electrically connected with each temperature sensor, the first heating pipe and the second heating pipe respectively; the electric control assembly is configured to output corresponding driving power according to the working time of the first heating pipe and the second heating pipe and the temperature value detected by each temperature sensor, so as to drive the first heating pipe and the second heating pipe to work.
2. The mold temperature compensation apparatus of claim 1, wherein the electronic control assembly is specifically configured to:
when the electric control assembly determines that the current temperature value of the corresponding position of the first heating pipe and/or the second heating pipe is less than or equal to a target set value according to the temperature value detected by each temperature sensor, the working time of the first heating pipe and/or the second heating pipe is obtained in real time, and the driving power of the first heating pipe and/or the second heating pipe is increased according to the working time obtained in real time.
3. The mold temperature compensation apparatus of claim 2, wherein the electronic control assembly is further configured to:
and when the current temperature value of the corresponding position of the first heating pipe and/or the second heating pipe after the driving power is increased is larger than a first preset temperature threshold value and smaller than the target set value, reducing the driving power of the first heating pipe and/or the second heating pipe.
4. The mold temperature compensation apparatus of claim 1, further comprising:
the third heating pipe and the fourth heating pipe are respectively arranged at two sides of the width direction of the die;
the number of the first heating pipes is two, and the two first heating pipes are respectively arranged at one ends of the third heating pipe and the fourth heating pipe;
the number of the second heating pipes is two, and the two second heating pipes are respectively arranged at the other ends of the third heating pipe and the fourth heating pipe.
5. The mold temperature compensation device according to claim 1, wherein the electrical control assembly comprises a main controller, a power switch and a driving power supply, a control end of the main controller is connected to a controlled end of the power switch, one end of the power switch is connected to the driving power supply, and the other end of the power switch is electrically connected to the first heating tube and the second heating tube respectively; wherein,
the main controller is configured to output a corresponding driving pulse voltage output signal to the power switch according to the temperature value detected by each temperature sensor, so that the power switch controls the driving power supply to work and output corresponding driving power to the first heating pipe and the second heating pipe.
6. The mold temperature compensation apparatus of claim 5, wherein the electrical control assembly comprises:
the main controller is arranged on the electric control board;
the parameter key switch is electrically connected with the main controller; the parameter key switch is configured to output a parameter setting signal to the main controller when triggered by a user.
7. The mold temperature compensation apparatus of claim 5, further comprising:
the communication interface circuit is configured to realize communication connection between the main controller and external equipment.
8. The mold temperature compensation apparatus of claim 5, further comprising:
the current sensor is electrically connected with the main controller; the current sensor is configured to detect a value of current flowing through the first and second heating pipes and output the detected value to the main controller;
the main controller is further configured to output an alarm control signal when detecting that the current value flowing through the first heating pipe and the second heating pipe is smaller than a preset current threshold value.
9. The mold temperature compensation device according to any one of claims 1 to 8, wherein the electronic control component is further configured to output an alarm control signal when determining that the current temperature value of the corresponding position of the first heating tube and/or the second heating tube is smaller than a second preset temperature threshold value or when determining that the current temperature value of the corresponding position of the first heating tube and/or the second heating tube is larger than a third preset temperature threshold value according to the temperature value detected by each temperature sensor.
10. A plastic packaging machine, characterized by comprising a mold and the mold temperature compensation device of any one of claims 1 to 9;
the first heating pipe and the second heating pipe of the mold temperature compensation device are respectively arranged on two sides of the mold in the length direction.
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| CN202010618542.0A CN111785648B (en) | 2020-06-30 | 2020-06-30 | Mold temperature compensation device and plastic packaging machine |
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| CN202010618542.0A CN111785648B (en) | 2020-06-30 | 2020-06-30 | Mold temperature compensation device and plastic packaging machine |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09155870A (en) * | 1995-12-04 | 1997-06-17 | Ricoh Co Ltd | Plastic molding apparatus |
| CN101544030A (en) * | 2008-03-25 | 2009-09-30 | 鸿富锦精密工业（深圳）有限公司 | Mould |
| CN108556296A (en) * | 2018-04-04 | 2018-09-21 | 安徽安缆模具有限公司 | A kind of injection mold temperature precise control device |
| CN109049591A (en) * | 2018-08-02 | 2018-12-21 | 太仓求精塑模有限公司 | A kind of injection mold temperature controller and its control method |
-
2020
- 2020-06-30 CN CN202010618542.0A patent/CN111785648B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09155870A (en) * | 1995-12-04 | 1997-06-17 | Ricoh Co Ltd | Plastic molding apparatus |
| CN101544030A (en) * | 2008-03-25 | 2009-09-30 | 鸿富锦精密工业（深圳）有限公司 | Mould |
| CN108556296A (en) * | 2018-04-04 | 2018-09-21 | 安徽安缆模具有限公司 | A kind of injection mold temperature precise control device |
| CN109049591A (en) * | 2018-08-02 | 2018-12-21 | 太仓求精塑模有限公司 | A kind of injection mold temperature controller and its control method |
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| CN111785648B (en) | 2022-05-24 |
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