CN111783381A - Calculation method of layout analysis control standard and management control method of layout analysis - Google Patents
Calculation method of layout analysis control standard and management control method of layout analysis Download PDFInfo
- Publication number
- CN111783381A CN111783381A CN202010609716.7A CN202010609716A CN111783381A CN 111783381 A CN111783381 A CN 111783381A CN 202010609716 A CN202010609716 A CN 202010609716A CN 111783381 A CN111783381 A CN 111783381A
- Authority
- CN
- China
- Prior art keywords
- standard
- value
- management
- layout analysis
- product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/18—Manufacturability analysis or optimisation for manufacturability
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Architecture (AREA)
- General Factory Administration (AREA)
Abstract
The invention provides a calculation method of a layout analysis management and control standard and a management and control method of layout analysis, which comprise the following steps: selecting a plurality of products with qualified yields in the process platform as standard samples; extracting a first mean value and a first standard deviation of the inspection values of all the standard samples; obtaining the upper limit and the lower limit of the process platform through the first average value and the first standard deviation; obtaining a second average value and a second standard deviation of the inspection values of all products of the process platform; obtaining a first inspection distribution value of the product according to the upper process limit, the lower process limit, the second average value and the second standard deviation; and performing linear analysis on the first inspection distribution value of the product and the yield of the product, and making a control standard of layout analysis. In the management and control method for layout analysis provided by the invention, the management and control standard can be set in the process of the manufacturability design analysis of the layout, so that the manufacturability design check is more accurate.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a calculation method of a layout analysis management and control standard and a management and control method of layout analysis.
Background
Design for manufacturability (DFM) refers to new design techniques, tools, and methods employed to ensure efficient transfer of patterns, control parameter variations, and improve yield. As integrated circuit technology continues to advance and the size of the features continues to shrink, a single defect may cause a chip containing millions of transistors to fail, which highlights the importance of DFM.
With the increasing complexity of layout graphics, the number of items to be checked by DFM is also increasing. Accurately checking the layout, finding out a high-risk process area, early warning the occurrence of dangerous products, facilitating various module engineers to timely know the specific positions and graphic characteristics of high-risk process hotspots of the products, making corresponding countermeasures as soon as possible, and smoothly achieving the flow and mass production of the products.
In the traditional DFM layout analysis, because Spec (specification) is not defined in Design Rule or Spec definition in Design Rule is unreasonable, the layout analysis is only carried out on distribution diagram analysis, quantification and comparison are not carried out on distribution conditions, no control mechanism is provided, and some defects of DFM inspection can be caused.
Disclosure of Invention
The invention aims to provide a calculation method of layout analysis control standards and a management and control method of layout analysis, which can set the control standards in the layout analysis setting process of manufacturability design, so that manufacturability design check is more accurate.
In order to achieve the above object, the present invention provides a method for calculating a management and control standard of layout analysis, including:
selecting a plurality of products with high yield in the process platform as standard samples;
extracting a first mean value and a first standard deviation of the inspection values of all the standard samples;
obtaining the upper limit and the lower limit of the process platform through the first average value and the first standard deviation;
obtaining a second average value and a second standard deviation of the inspection values of all products of the process platform;
obtaining a first inspection distribution value of the product according to the upper process limit, the lower process limit, the second average value and the second standard deviation;
and performing linear analysis on the first inspection distribution value of the product and the yield of the product, and making a control standard of layout analysis.
Optionally, in the method for calculating the management and control standard of layout analysis, the layout analysis includes:
analyzing the perimeter proportion of the layout;
analyzing the minimum line width of the layout;
and analyzing the minimum clearance of the layout.
Optionally, in the method for calculating the management and control standard of layout analysis, the check value includes a perimeter ratio value, a minimum line width value, or a minimum gap value.
Optionally, in the method for calculating the management and control standard of layout analysis, the method for obtaining the upper limit of the process platform is as follows: USL ═ M + k × S; wherein: USL is the upper limit of the process, M is a first average value, S is a first standard value, and k is more than or equal to 1.
Optionally, in the method for calculating the management and control standard of layout analysis, the method for obtaining the lower limit of the process platform is as follows: LSL ═ M-k × S; wherein: LSL is the lower limit of the process, M is the first average value, S is the first standard value, and k is more than or equal to 1.
Optionally, in the method for calculating the management and control standard of layout analysis, the method for obtaining the inspection distribution value of the process platform includes: cd ═ min ((USL- μ)/k · σ, (μ -LSL)/k ·); wherein: cd is the inspection distribution value, USL is the upper limit of the process platform, LSL is the lower limit of the process platform, mu is the second average value, sigma is the second standard deviation, and k is more than or equal to 1.
Optionally, in the method for calculating the management and control standard of layout analysis, the first inspection distribution value of the product and the yield of the product are linearly analyzed, and the method for making the management and control standard of layout analysis includes:
obtaining a linear relation between the first inspection distribution value and the yield of the product;
and obtaining a control standard according to the yield of the product.
Optionally, in the method for calculating the management and control standard of layout analysis, the method for obtaining the linear relationship between the first inspection distribution value and the yield of the product is as follows: y ═ R Cd + a, wherein: y is the yield, Cd is the first inspection distribution value, R is the linear coefficient, and A is a constant.
The invention also provides a management and control method for layout analysis, which comprises the following steps:
selecting a product to be detected;
determining a process platform to which a product to be detected belongs;
determining the control standard of the process platform by using the calculation method of the control standard of the layout analysis;
calculating a second inspection distribution value of the product to be detected;
and comparing the second inspection distribution value with the control standard, and giving an alarm if the second inspection distribution value exceeds the control standard.
Optionally, in the management and control method for layout analysis, the method for calculating the second inspection distribution value of the product to be detected is the same as the method for calculating the first inspection distribution value.
In the method for calculating the management and control standard of layout analysis and the method for managing and controlling layout analysis provided by the invention, the method for calculating the management and control standard of layout analysis comprises the following steps: selecting a plurality of products with qualified yields in the process platform as standard samples; extracting a first mean value and a first standard deviation of the inspection values of all the standard samples; obtaining the upper limit and the lower limit of the process platform through the first average value and the first standard deviation; obtaining a second average value and a second standard deviation of the inspection values of all products of the process platform; obtaining a first inspection distribution value of the product according to the upper process limit, the lower process limit, the second average value and the second standard deviation; and performing linear analysis on the first inspection distribution value of the product and the yield of the product, and making a control standard of layout analysis, wherein the control standard method of the layout analysis can set the control standard in the process of manufacturability design analysis of the layout. The management and control standard obtained by using the management and control standard method of layout analysis in the management and control method of layout analysis can make the manufacturability design check more accurate.
Drawings
Fig. 1 is a flowchart of a method for calculating a management and control standard of layout analysis according to an embodiment of the present invention.
Detailed Description
The following describes in more detail embodiments of the present invention with reference to the schematic drawings. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
In the following, the terms "first," "second," and the like are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances. Similarly, if the method described herein comprises a series of steps, the order in which these steps are presented herein is not necessarily the only order in which these steps may be performed, and some of the described steps may be omitted and/or some other steps not described herein may be added to the method.
Referring to fig. 1, the present invention provides a method for calculating a management and control standard of layout analysis, including:
s11: selecting a plurality of products with qualified yields in the process platform as standard samples;
s12: extracting a first mean value and a first standard deviation of the inspection values of all the standard samples;
s13: obtaining the upper limit and the lower limit of the process platform through the first average value and the first standard deviation;
s14: obtaining a second average value and a second standard deviation of the inspection values of all products of the process platform;
s15: obtaining a first inspection distribution value of the product according to the upper process limit, the lower process limit, the second average value and the second standard deviation;
s16: and performing linear analysis on the first inspection distribution value of the product and the yield of the product, and making a control standard of layout analysis.
The standard sample may be a product with the highest yield, for example, the product with the highest yield and the product with the next highest yield, and the selection method is the prior art and will not be described herein again. The first mean and the first standard deviation are the mean and the standard deviation, respectively, of the inspection values of the standard samples, and the second mean and the second standard deviation are the mean and the standard deviation, respectively, of the inspection values of all the products. The inspection values of the standard sample and all the products are already available, the first average and the second average are the method of averaging in the conventional art, and the first standard deviation and the second standard deviation are the method of standard deviation in the conventional art.
Preferably, the analysis of the layout comprises analyzing the perimeter proportion of the layout; analyzing the minimum line width of the layout; and analyzing the minimum clearance of the layout. Thus, the inspection values include a value of the perimeter ratio, a value of the minimum line width, and a value of the minimum gap. The DFM inspection can analyze a plurality of inspection values to be inspected in layout analysis, each inspection value can independently calculate a control standard, and the control standards are different if the attributes of the inspection values are different. Meanwhile, if the process platforms are different, the control standards are also different. The layout analysis of the embodiment of the invention selects one or more of analyzing the perimeter proportion of the layout, analyzing the minimum line width of the layout and analyzing the minimum gap of the layout, and correspondingly, the check value comprises one or more of a value of the perimeter proportion, a value of the minimum line width and a value of the minimum gap. Meanwhile, the analysis of the layout includes but is not limited to analyzing the perimeter proportion of the layout, analyzing the minimum line width of the layout and analyzing the minimum gap of the layout; the inspection values include, but are not limited to, a value of a perimeter ratio, a value of a minimum line width, and a value of a minimum gap. For example, in other embodiments of the present invention, layout analysis also includes analysis of other features, such as the density of the layout. Therefore, the check value also includes the density of the layout.
Preferably, the method for obtaining the upper limit of the process platform comprises the following steps: USL ═ M + k × S; wherein: USL is the upper limit of the process, M is a first average value, S is a first standard value, and k is more than or equal to 1. The method for acquiring the lower limit of the process platform comprises the following steps: LSL ═ M-k × S; wherein: LSL is the lower limit of the process, M is the first average value, S is the first standard value, and k is more than or equal to 1.
Preferably, the method for obtaining the inspection distribution value of the process platform includes: cd ═ min ((USL- μ)/k · σ, (μ -LSL)/k ·); wherein: cd is an inspection distribution value, USL is an upper limit of a process platform, LSL is a lower limit of the process, mu is a second average value, sigma is a second standard deviation, and k is more than or equal to 1.
Preferably, the method for performing linear analysis on the first inspection distribution value of the product and the yield of the product and making the control standard of the layout analysis includes:
obtaining a linear relation between the first inspection distribution value and the yield of the product;
and obtaining a control standard according to the yield of the product.
Preferably, the method of obtaining a linear relationship between the first inspection distribution value and the yield of the product includes: y ═ R Cd + a, wherein: y is the yield, Cd is the first inspection distribution value, R is the linear coefficient, and A is a constant. Linear analysis is a more common analysis method, for example, the relationship between the inspection distribution value and the yield can be calculated by a plurality of inspection values and a plurality of yields, wherein the coefficient R and the constant a can be varied, and the specific value depends on the calculation result after linear analysis.
The embodiment of the invention also provides a management and control method for layout analysis, which comprises the following steps:
selecting a product to be detected;
determining a process platform to which a product to be detected belongs;
determining the control standard of the process platform by using a calculation method of the control standard of layout analysis;
calculating a second inspection distribution value of the product to be detected;
and comparing the second inspection distribution value with the control standard, and giving an alarm if the second inspection distribution value exceeds the control standard.
Further, the method for calculating the second inspection distribution value of the product to be tested is the same as the calculation method for calculating the first inspection distribution value.
For example, analyzing the perimeter proportion of the layout, selecting three products B1/B2/B3 with the best yield from the A-type process products as standard samples, and respectively calculating the average values of the perimeter proportion values of B1/B2/B3 to be 3, 4 and 5; the standard deviation was then determined to be 0.9, 1 and 1.1, respectively. The average 4 of 3, 4 and 5 was determined as the first average, and the average 1 of 0.9, 1 and 1.1 was determined as the first standard deviation. And calculating the upper limit and the lower limit of the process of the platform by taking the first average value as a target value of the A-type process platform, wherein if the value of k is 3, the value of k is determined by the inventor, and the limit is that k is more than or equal to 1. The upper limit USL is 4+3 × 1 — 7 and the lower limit LSL is 4-3 × 1 — 1. And a second step of calculating a second average value and a second standard deviation of all products in the class A process platform. The inspection distribution value of each product was calculated from Cd ═ min ((USL- μ)/k · σ, (μ -LSL)/k ·) respectively. Carrying out linear analysis on the inspection distribution value and the yield to obtain a linear relation: y is 4 Cd +92, Y is the yield value, and Cd is the inspection distribution value. If the yield requirement is greater than 95%, the Cd standard can be found to be greater than 0.75, which is the control standard.
And step three, applying the control standard to all products of the A-class process, wherein each product is calculated once, and an alarm is given when the product does not reach the standard. This approach may then be applied to all products of other types of processes, and the governing criteria for the products of each different type of process may be different.
In summary, in the method for calculating a management and control standard of layout analysis and the method for managing and controlling layout analysis provided in the embodiments of the present invention, the method for calculating a management and control standard of layout analysis includes: selecting a plurality of products with qualified yields in the process platform as standard samples; extracting a first mean value and a first standard deviation of the inspection values of all the standard samples; obtaining the upper limit and the lower limit of the process platform through the first average value and the first standard deviation; obtaining a second average value and a second standard deviation of the inspection values of all products of the process platform; obtaining a first inspection distribution value of the product according to the upper process limit, the lower process limit, the second average value and the second standard deviation; and performing linear analysis on the first inspection distribution value of the product and the yield of the product, and making a control standard of layout analysis, wherein the control standard method of the layout analysis can set the control standard in the process of manufacturability design analysis of the layout. The management and control standard obtained by using the management and control standard method of layout analysis in the management and control method of layout analysis can make the manufacturability design check more accurate.
The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any way. It will be understood by those skilled in the art that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A method for calculating a layout analysis management and control standard is characterized by comprising the following steps:
selecting a plurality of products with qualified yields in the process platform as standard samples;
extracting a first mean value and a first standard deviation of the inspection values of all the standard samples;
obtaining the upper limit and the lower limit of the process platform according to the first average value and the first standard deviation;
obtaining a second average value and a second standard deviation of the inspection values of all products of the process platform;
obtaining a first inspection distribution value of the product according to the upper process limit, the lower process limit, the second average value and the second standard deviation;
and performing linear analysis on the first inspection distribution value of the product and the yield of the product, and making a control standard of layout analysis.
2. The method for calculating the management and control standard of layout analysis according to claim 1, wherein the layout analysis includes:
analyzing the perimeter proportion of the layout;
analyzing the minimum line width of the layout;
and analyzing the minimum clearance of the layout.
3. The method for calculating the management and control standard of layout analysis according to claim 2, wherein the checking the value comprises:
a value of the perimeter ratio, a value of the minimum line width, and a value of the minimum gap.
4. The method for calculating the management and control standard of layout analysis according to claim 3, wherein the method for obtaining the upper limit of the process platform comprises the following steps:
USL＝M+k*S；
wherein: USL is the upper limit of the process, M is a first average value, S is a first standard value, and k is more than or equal to 1.
5. The method for calculating the management and control standard of layout analysis according to claim 4, wherein the method for obtaining the lower limit of the process platform comprises the following steps:
LSL＝M-k*S；
wherein: LSL is the lower limit of the process, M is the first average value, S is the first standard value, and k is more than or equal to 1.
6. The method for calculating the management and control standard of layout analysis according to claim 5, wherein the method for obtaining the inspection distribution value of the process platform comprises:
Cd＝min((USL-μ)/k*σ,(μ-LSL)/k*σ))；
wherein: cd is the inspection distribution value, USL is the upper limit of the process platform, LSL is the lower limit of the process platform, mu is the second average value, sigma is the second standard deviation, and k is more than or equal to 1.
7. The method for calculating the management and control standard of layout analysis according to claim 6, wherein the first inspection distribution value of the product and the yield of the product are linearly analyzed, and the method for making the management and control standard of layout analysis comprises:
obtaining a linear relation between the first inspection distribution value and the yield of the product;
and obtaining a control standard according to the yield of the product.
8. The method for calculating the management and control standard of layout analysis according to claim 7, wherein the method for obtaining the linear relationship between the first inspection distribution value and the yield of the product comprises:
Y＝R*Cd+A；
wherein: y is the yield, Cd is the first inspection distribution value, R is the linear coefficient, and A is a constant.
9. A management and control method for layout analysis is characterized by comprising the following steps:
selecting a product to be detected;
determining a process platform to which a product to be detected belongs;
determining a management and control standard of the process platform by using a calculation method of the management and control standard of layout analysis according to any one of claims 1 to 8;
calculating a second inspection distribution value of the product to be detected;
and comparing the second inspection distribution value with the control standard, and giving an alarm if the second inspection distribution value exceeds the control standard.
10. The management and control method for layout analysis according to claim 9, wherein a method for calculating the second inspection distribution value of the product to be tested is the same as a calculation method for calculating the first inspection distribution value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010609716.7A CN111783381A (en) | 2020-06-29 | 2020-06-29 | Calculation method of layout analysis control standard and management control method of layout analysis |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010609716.7A CN111783381A (en) | 2020-06-29 | 2020-06-29 | Calculation method of layout analysis control standard and management control method of layout analysis |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111783381A true CN111783381A (en) | 2020-10-16 |
Family
ID=72761014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010609716.7A Pending CN111783381A (en) | 2020-06-29 | 2020-06-29 | Calculation method of layout analysis control standard and management control method of layout analysis |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111783381A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112487737A (en) * | 2020-11-26 | 2021-03-12 | 上海华力微电子有限公司 | DFM comprehensive scoring method |
-
2020
- 2020-06-29 CN CN202010609716.7A patent/CN111783381A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112487737A (en) * | 2020-11-26 | 2021-03-12 | 上海华力微电子有限公司 | DFM comprehensive scoring method |
| CN112487737B (en) * | 2020-11-26 | 2024-02-27 | 上海华力微电子有限公司 | DFM comprehensive scoring method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112382582B (en) | Wafer test classification method and system | |
| US5761093A (en) | Quality forecasting engine | |
| CN104062305B (en) | A kind of analysis method of integrated circuit defect | |
| CN106446317A (en) | Mathematic model-based sealed relay storage life prediction method | |
| US7584162B2 (en) | Manufacture data analysis method and manufacture data analyzer apparatus | |
| JP4568786B2 (en) | Factor analysis apparatus and factor analysis method | |
| US11688052B2 (en) | Computer assisted weak pattern detection and quantification system | |
| US20030208286A1 (en) | Method for analyzing manufacturing data | |
| CN101118422A (en) | Virtual measurement prediction generated by semi-conductor, method for establishing prediction model and system | |
| CN111783381A (en) | Calculation method of layout analysis control standard and management control method of layout analysis | |
| US20070180411A1 (en) | Method and apparatus for comparing semiconductor-related technical systems characterized by statistical data | |
| JP2011058926A (en) | Method and device for inspecting image | |
| US6828776B2 (en) | Method for analyzing defect inspection parameters | |
| CN1920863A (en) | Real time management system for production management and yield analytical integration and processing method thereof | |
| CN114911085A (en) | Method for analyzing defects | |
| JP2004186374A (en) | Manufacturing data analyzing method and program for making computer practice the same | |
| JP7281708B2 (en) | Manufacturing condition calculation device, manufacturing condition calculation method, and manufacturing condition calculation program for identifying equipment that contributes to the generation of defective products | |
| JP3492226B2 (en) | Method of narrowing down the cause of semiconductor failure | |
| JP4276503B2 (en) | Methods for narrowing down the causes of semiconductor defects | |
| US7137085B1 (en) | Wafer level global bitmap characterization in integrated circuit technology development | |
| US7634127B1 (en) | Efficient storage of fail data to aid in fault isolation | |
| CN111782695B (en) | MPW multi-product joint measurement data processing method, storage medium and computer equipment | |
| JPH10107111A (en) | Manufacturing method of semiconductor device | |
| Langford et al. | The identification and analysis of systematic yield loss | |
| Hsu et al. | Main branch decision tree algorithm for yield enhancement with class imbalance |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |