CN111783281B - Optimization method for thickness of multilayer heat insulation medium - Google Patents
Optimization method for thickness of multilayer heat insulation medium Download PDFInfo
- Publication number
- CN111783281B CN111783281B CN202010536217.XA CN202010536217A CN111783281B CN 111783281 B CN111783281 B CN 111783281B CN 202010536217 A CN202010536217 A CN 202010536217A CN 111783281 B CN111783281 B CN 111783281B
- Authority
- CN
- China
- Prior art keywords
- layer
- thickness
- medium
- temperature
- skin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000005457 optimization Methods 0.000 title claims abstract description 26
- 238000009413 insulation Methods 0.000 title claims abstract description 15
- 238000002474 experimental method Methods 0.000 claims abstract description 5
- 239000011810 insulating material Substances 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 11
- 239000012774 insulation material Substances 0.000 claims description 8
- 239000004744 fabric Substances 0.000 claims description 3
- 238000012804 iterative process Methods 0.000 claims description 3
- 238000012827 research and development Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 7
- 238000012546 transfer Methods 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005315 distribution function Methods 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000006261 foam material Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011491 glass wool Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000011140 metalized polyester Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
-
- G—PHYSICS
- G16—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR SPECIFIC APPLICATION FIELDS
- G16C—COMPUTATIONAL CHEMISTRY; CHEMOINFORMATICS; COMPUTATIONAL MATERIALS SCIENCE
- G16C60/00—Computational materials science, i.e. ICT specially adapted for investigating the physical or chemical properties of materials or phenomena associated with their design, synthesis, processing, characterisation or utilisation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2111/00—Details relating to CAD techniques
- G06F2111/04—Constraint-based CAD
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2111/00—Details relating to CAD techniques
- G06F2111/06—Multi-objective optimisation, e.g. Pareto optimisation using simulated annealing [SA], ant colony algorithms or genetic algorithms [GA]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2111/00—Details relating to CAD techniques
- G06F2111/10—Numerical modelling
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2113/00—Details relating to the application field
- G06F2113/12—Cloth
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/08—Thermal analysis or thermal optimisation
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computing Systems (AREA)
- Life Sciences & Earth Sciences (AREA)
- Bioinformatics & Computational Biology (AREA)
- Bioinformatics & Cheminformatics (AREA)
- Computer Hardware Design (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a method for optimizing the thickness of a multilayer heat insulation medium, which comprises the following steps: for a given insulating material with n layers of medium, wherein n is a positive integer, according to the law of conservation of energy and the law of Fourier, a heat conduction model is built, and the following steps are that: selecting an ith layer thickness as an optimization target, constructing an index function, establishing a corresponding optimization problem, wherein i is a positive integer and is more than or equal to 1 and less than or equal to n, and the third step: and finally, carrying out numerical solution on the optimization model based on a mode searching method to obtain the optimal thickness of the ith layer of medium. According to the invention, the optimal medium thickness is determined in a numerical experiment mode, so that the research and development cost is reduced, and the research and development period is shortened.
Description
Technical Field
The invention relates to the technical field of heat insulation materials, in particular to a method for optimizing the thickness of a multi-layer heat insulation medium.
Background
Insulation materials often consist of a variety of media, with the thickness of the different media having a significant impact on the performance and cost of the insulation material. The heat insulating material has wide application, and is classified into porous material, heat reflecting material and vacuum material. The former is insulated by the pores contained in the material itself, because the air or inert gas in the pores has low heat conductivity coefficient, such as foam material, fiber material and the like; the heat reflecting material has high reflecting coefficient and can reflect heat out, such as gold, silver, nickel, aluminum foil, metallized polyester, polyimide film, etc. The vacuum heat insulating material is insulated by utilizing the internal vacuum of the material to achieve the blocking convection. The aerospace industry has severe requirements on the weight and volume of the heat insulation material, and the heat insulation material has the properties of sound insulation, vibration reduction, corrosion resistance and the like. The need for insulation is not the same for various aircraft. Foam plastic, superfine glass wool, high silica wool and vacuum heat insulation boards are commonly used in the aircraft cabin and the cockpit for heat insulation.
Through mass search, the prior art with publication number of CN104732010A discloses a rapid optimization method of a multi-layer heat-proof structure, which can be used for rapid analysis and design of the heat-proof structure and belongs to the technical field of structural thermal analysis. 1) Establishing a one-dimensional heat transfer analysis finite element model for the heat-proof structure; 2) Applying initial conditions to the model obtained in step 1); 3) Applying boundary conditions to the model obtained in step 1); 4) Performing unit division on the finite element model obtained in the step 1) by adopting a finite element tool to obtain a unit model; 5) Calculating a heat transfer analysis model by adopting a finite element tool, and extracting the temperature of a shell; 6) Outputting the parameters used in the steps 1), 2) and 3) and the shell temperature parameters extracted in the step 5) to a document, and storing the parameters as a parameter file 1; 7) And checking whether the parameter file 1 meets the heat-proof design requirement. The method can rapidly complete the optimal design of the multi-layer heat-proof structure, and improves the working efficiency.
In summary, the existing method can only optimize the thickness of the coating, cannot optimize the thickness of any dielectric layer, has poor adaptability, and cannot set dynamic constraint conditions according to actual requirements, for example, the temperature of one side of the dielectric layer does not exceed m minutes in t time. In order to reduce the development cost and shorten the development period, a numerical experiment method is needed to optimize the thickness of the multi-layer heat insulation medium.
Disclosure of Invention
The invention aims to provide a method for optimizing the thickness of a multi-layer heat insulation medium, so as to solve the problems in the background art.
In order to achieve the above purpose, the present invention provides the following technical solutions: a method for optimizing the thickness of a multi-layer heat insulation medium comprises the following steps:
The first step: for a given heat insulation material with n layers of media, wherein n is a positive integer, and a heat conduction model is built according to the law of conservation of energy and the Fourier law;
and a second step of: selecting an ith layer thickness as an optimization target, constructing an index function, and establishing a corresponding optimization problem, wherein i is a positive integer and is more than or equal to 1 and less than or equal to n;
and a third step of: and finally, carrying out numerical solution on the optimization model based on a mode searching method to obtain the optimal thickness of the ith layer of medium.
Preferably, the heat insulating medium is composed of three layers of fabric material, respectively denoted as layer I, layer II and layer III, wherein the layer I is in contact with the external environment, an air gap exists between the layer III and the skin, and the gap is denoted as layer IV;
When the ambient temperature is 65 ℃ and the thickness of the IV layer is 5.5mm, the optimal thickness of the II layer is determined, ensuring that the temperature outside the skin of the dummy does not exceed 47 ℃ and the time exceeding 44 ℃ does not exceed 5 minutes when working for 60 minutes.
Preferably, when the one-dimensional heat conduction model of the multilayer medium is established, the temperature at any point x in the medium of the I layer-IV layer is recorded as u (x, t) at the moment t, wherein x is the distance from the origin O, and the one-dimensional heat conduction model of the multilayer medium can be obtained according to a one-dimensional heat conduction equation of the uniform medium.
Preferably, when constructing the index function and creating the optimization problem, in order to optimize the thickness of layer II, the index function is customized, the time at which the temperature is greater than 44 ℃ is represented by T w, and the skin surface temperature after the end of the experiment is represented by T 5.
Preferably, when solving the optimization problem by using the pattern search method, the temperature of the outer side of the skin of the dummy is not higher than 47 ℃ and the time of higher than 44 ℃ is not higher than 5 minutes in the iterative process when working for 60 minutes. The correctness of the optimization result is verified from the side.
Compared with the prior art, the invention has the beneficial effects that: aiming at the problems that the existing method only can optimize the thickness of a coating, the thickness of any medium layer cannot be optimized, the method has poor adaptability, dynamic constraint conditions cannot be set according to actual requirements, such as the temperature of one side of a medium does not exceed m minutes in t time, and the like, the method can obtain the optimal thickness of an ith medium by establishing a heat conduction model and constructing an index function, and carrying out numerical solution on the optimization model based on a mode search method, so that the optimal medium thickness can be effectively determined, the research and development cost is reduced, and the research and development period is shortened.
Drawings
FIG. 1 is a schematic diagram of the main steps of the optimization method of the present invention;
FIG. 2 is a schematic diagram of the relationship between the external environment, the heat insulation medium and the human body space according to the present invention;
FIG. 3 is a schematic diagram of a one-dimensional thermal conduction model equation for a multi-layered medium according to the present invention;
FIG. 4 is a schematic diagram of a one-dimensional thermal conduction model equation II for a multi-layer medium according to the present invention;
FIG. 5 is a schematic diagram of a pattern search iteration process of the present invention;
FIG. 6 is a schematic view of skin surface temperature profile for an optimal thickness of layer II of the present invention;
Fig. 7 is a schematic diagram of main symbols and an explanatory diagram of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
An embodiment of the present invention provides:
Embodiment one:
Referring to fig. 1, a method for optimizing the thickness of a multi-layer heat insulation medium includes the following steps:
The first step: for a given heat insulation material with n layers of media, wherein n is a positive integer, and a heat conduction model is built according to the law of conservation of energy and the Fourier law;
and a second step of: selecting an ith layer thickness as an optimization target, constructing an index function, and establishing a corresponding optimization problem, wherein i is a positive integer and is more than or equal to 1 and less than or equal to n;
and a third step of: and finally, carrying out numerical solution on the optimization model based on a mode searching method to obtain the optimal thickness of the ith layer of medium.
Aiming at the problems that the existing method can only optimize the thickness of a coating, cannot optimize the thickness of any medium layer and has poor adaptability of the method, and cannot set dynamic constraint conditions according to actual demands, such as the temperature of one side of a medium does not exceed m minutes in t time, and the like, the method is improved, and the optimal thickness of an ith medium can be obtained by establishing a heat conduction model and constructing an index function of the medium, and carrying out numerical solution on an optimization model based on a mode search method.
Referring to fig. 2, the relationship between the external environment, the heat insulation medium and the human body space is specifically described; the heat insulating medium is composed of three layers of fabric materials and is respectively marked as a layer I, a layer II and a layer III, wherein the layer I is contacted with the external environment, an air gap exists between the layer III and the skin, and the gap is marked as a layer IV;
When the ambient temperature is 65 ℃ and the thickness of the IV layer is 5.5mm, the optimal thickness of the II layer is determined, ensuring that the temperature outside the skin of the dummy does not exceed 47 ℃ and the time exceeding 44 ℃ does not exceed 5 minutes when working for 60 minutes.
Embodiment two:
Referring to fig. 2,3 and 4, when a one-dimensional heat conduction model of a multi-layer medium is established, at a time t, the temperature at any point x in the I-IV-layer medium is denoted as u (x, t), where x is the distance from the origin O, and according to a one-dimensional heat conduction equation of a uniform medium, a one-dimensional heat conduction model of the multi-layer medium can be obtained, as shown in fig. 3, The initial values and boundary conditions of equation one shown in FIG. 3 are shown in FIG. 4, where k 0 is the convective heat transfer coefficient of the external environment and the layer I surface, and k 5 is the convective heat transfer coefficient of the layer IV and the skin surface,/>Is a temperature distribution function at the initial time.
Embodiment III:
when constructing the index function and creating the optimization problem, in order to optimize the thickness of layer II, the index function is customized,
s.t.0.6<l2＜25,(4),(5)
The time at which the temperature was greater than 44℃was denoted by T w, and the skin surface temperature after the end of the experiment was denoted by T 5. The last two are added because neither T w nor T 5 are optimization variables. Because it is difficult to constrain it, we incorporate it into the index term in a penalty function manner, converting it into a nonlinear optimization problem that only solves the domain constraint. (t w > 300) is a judgment statement whose value is:
Embodiment four:
Referring to fig. 5 and 6, when the optimization problem is solved by using the pattern search method, the temperature of the outer side of the skin of the dummy is not more than 47 ℃ and the time of the outer side of the skin of the dummy is not more than 44 ℃ for 5 minutes in the iterative process when the operation is performed for 60 minutes. The correctness of the optimization result is verified from the side.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (3)
1. The optimizing method of the thickness of the multi-layer heat insulation medium is characterized in that: the method comprises the following steps:
The first step: for a given heat insulation material with n layers of media, wherein n is a positive integer, and a heat conduction model is built according to the law of conservation of energy and the Fourier law;
and a second step of: selecting an ith layer thickness as an optimization target, constructing an index function, and establishing a corresponding optimization problem, wherein i is a positive integer and is more than or equal to 1 and less than or equal to n;
Wherein the index function is:
s.t.0.6<l2＜25,(4),(5)，
l 2 is the thickness of the second layer material, T w is the time that the temperature is higher than 44 ℃, T 5 is the skin surface temperature after the experiment is finished, and the last two are added because T w and T 5 are not optimal variables, and because the constraint is difficult to carry out, the method of penalty function is adopted to incorporate the second layer material into an index term, the second layer material is converted into a nonlinear optimization problem only solving the domain constraint, and (T w > 300) is a judgment statement that the value is:
And a third step of: and (3) carrying out numerical solution on the optimized model based on a mode search method, wherein when the optimized model is solved by adopting the mode search method, the temperature of the outer side of the skin of the dummy is not more than 47 ℃ and the time of the outer side of the skin of the dummy is not more than 44 ℃ is not more than 5 minutes in the iterative process, and finally, the optimal thickness of the ith medium can be obtained.
2. A method for optimizing the thickness of a multi-layered insulating medium according to claim 1, characterized in that: the heat insulating material is formed by three layers of fabric materials and is respectively marked as a layer I, a layer II and a layer III, wherein the layer I is contacted with the external environment, an air gap exists between the layer III and the skin, and the gap is marked as a layer IV;
When the ambient temperature is 65 ℃ and the thickness of the IV layer is 5.5mm, the optimal thickness of the II layer is determined, ensuring that the temperature outside the skin of the dummy does not exceed 47 ℃ and the time exceeding 44 ℃ does not exceed 5 minutes when working for 60 minutes.
3. A method for optimizing the thickness of a multi-layered insulating medium according to claim 1, characterized in that: at time t, the temperature at any point x in the I-IV medium is recorded as u (x, t), wherein x is the distance from the origin O, and a one-dimensional heat conduction model of the multilayer medium can be obtained according to a one-dimensional heat conduction equation of the uniform medium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010536217.XA CN111783281B (en) | 2020-06-12 | 2020-06-12 | Optimization method for thickness of multilayer heat insulation medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010536217.XA CN111783281B (en) | 2020-06-12 | 2020-06-12 | Optimization method for thickness of multilayer heat insulation medium |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111783281A CN111783281A (en) | 2020-10-16 |
| CN111783281B true CN111783281B (en) | 2024-05-07 |
Family
ID=72756251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010536217.XA Active CN111783281B (en) | 2020-06-12 | 2020-06-12 | Optimization method for thickness of multilayer heat insulation medium |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111783281B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113300026B (en) * | 2021-04-26 | 2022-07-01 | 东风汽车集团股份有限公司 | Design method and device of battery pack heat insulation layer and electronic equipment |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1538439A1 (en) * | 2003-12-01 | 2005-06-08 | Alstom Technology Ltd | Method to determine the internal structure of a heat conducting body |
| CN102360171A (en) * | 2011-11-09 | 2012-02-22 | 北京理工大学 | Optimization method of lithography configuration parameter based on pattern search method |
| CN105843996A (en) * | 2016-03-18 | 2016-08-10 | 中国飞机强度研究所 | Optimization method of heat-proof structure |
| CN109799007A (en) * | 2019-03-14 | 2019-05-24 | 常州工学院 | Each layer temperature profile analysis model of high-temperature operation clothes based on Fourier's therorem |
| CN109858068A (en) * | 2018-11-30 | 2019-06-07 | 阜阳师范学院 | Multilyer armor heat transfer model research method based on ant group algorithm |
| CN110147566A (en) * | 2019-04-02 | 2019-08-20 | 阜阳师范学院 | Based on genetic algorithm and Non-Linear Programming to the research method of high-temperature protective clothes |
| CN111444594A (en) * | 2020-03-04 | 2020-07-24 | 湖南科技大学 | Simulation method for optimizing structure of gas cooling suit |
-
2020
- 2020-06-12 CN CN202010536217.XA patent/CN111783281B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1538439A1 (en) * | 2003-12-01 | 2005-06-08 | Alstom Technology Ltd | Method to determine the internal structure of a heat conducting body |
| CN102360171A (en) * | 2011-11-09 | 2012-02-22 | 北京理工大学 | Optimization method of lithography configuration parameter based on pattern search method |
| CN105843996A (en) * | 2016-03-18 | 2016-08-10 | 中国飞机强度研究所 | Optimization method of heat-proof structure |
| CN109858068A (en) * | 2018-11-30 | 2019-06-07 | 阜阳师范学院 | Multilyer armor heat transfer model research method based on ant group algorithm |
| CN109799007A (en) * | 2019-03-14 | 2019-05-24 | 常州工学院 | Each layer temperature profile analysis model of high-temperature operation clothes based on Fourier's therorem |
| CN110147566A (en) * | 2019-04-02 | 2019-08-20 | 阜阳师范学院 | Based on genetic algorithm and Non-Linear Programming to the research method of high-temperature protective clothes |
| CN111444594A (en) * | 2020-03-04 | 2020-07-24 | 湖南科技大学 | Simulation method for optimizing structure of gas cooling suit |
Non-Patent Citations (5)
| Title |
|---|
| 基于Fourier导热定律的高温防护服优化设计;王伟伟;王成;潘嵩岳;王慧;;电子测试(第23期);全文 * |
| 基于改进混合PSO算法的隔热材料仿真优化;韩金亮;张鹏;张欣茹;;计算机仿真(第06期);全文 * |
| 基于热传导模型的高温作业服装设计;尹晓倩;王淑蕾;翁佳仪;王思蒙;张馨月;;科技经济导刊(第16期);全文 * |
| 多层热防护服的温度分布与最优厚度研究;张品戈;于泳博;兰天然;;科技资讯(第16期);全文 * |
| 韩金亮 ; 张鹏 ; 张欣茹 ; .基于改进混合PSO算法的隔热材料仿真优化.计算机仿真.2020,(06),全文. * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111783281A (en) | 2020-10-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102573417B (en) | Shell structure and electronic device having the same | |
| CN111783281B (en) | Optimization method for thickness of multilayer heat insulation medium | |
| CN108738290B (en) | A kind of Meta Materials wave absorbing device and design method | |
| CN105161803A (en) | Graphene film frequency selective surface | |
| CN110901885B (en) | Thermal protection system of aircraft | |
| CN105235307A (en) | Heat-conductive film graphite composite material | |
| Yang et al. | Application analysis of efficient heat dissipation of electronic equipment based on flexible nanocomposites | |
| Chen et al. | A Calderón preconditioner for the electric field integral equation with layered medium Green's function | |
| Tsai et al. | Transient temperature distribution of a multilayer composite wall with effects of internal thermal radiation and conduction | |
| CN110654526A (en) | Temperature equalizing method and structure for high-temperature and high-heat part | |
| CN103241391A (en) | Heat insulation component for heat control of a Mars landing machine, and manufacturing method thereof | |
| Sun et al. | Thermal Characteristics of Multilayer Insulation Materials for Flexible Thin‐Film Solar Cell Array of Stratospheric Airship | |
| Wang et al. | Low frequency waterborne sound insulation based on sandwich panels with quasi-zero-stiffness truss core | |
| Shi et al. | Design and demonstration of composite mufflers based on dissipative and reactive units | |
| CN112560309B (en) | Heat insulation prevention and analysis method suitable for being influenced by multidimensional variables | |
| CN108491676A (en) | The heat-proof quality simulating analysis and system of heat shield | |
| Qiao et al. | Multioctagonal ring metamaterial with broadband microwave absorption at elevated temperature | |
| Wu et al. | Thin Absorber with Dispersive Medium Simulated by Conformal Hybrid Explicit Implicit FDTD Method | |
| CN110941882A (en) | Thermal performance analysis method of composite material with curved interface | |
| Wang et al. | A mechanically adjustable acoustic metamaterial for low-frequency sound absorption with load-bearing and fire resistance | |
| Ma et al. | Electromagnetic-Thermal Multiphysical Modeling of Substrate Integrated Waveguide | |
| Dong et al. | Underwater sound absorption characteristics of compliant acoustic coatings with adjustable stiffness | |
| Wang et al. | Low-frequency broadband absorber with coherent coupling based on perforated panel and space-coiling channels | |
| CN217740972U (en) | Heating structure of He-Ne laser | |
| CN220129688U (en) | Heat shield structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |