CN111782005A

CN111782005A - Input/output (IO) module and electronic equipment

Info

Publication number: CN111782005A
Application number: CN202010608341.2A
Authority: CN
Inventors: 李月明; 石玉萍
Original assignee: Xian Yep Telecommunication Technology Co Ltd
Current assignee: Xian Yep Telecommunication Technology Co Ltd
Priority date: 2020-06-30
Filing date: 2020-06-30
Publication date: 2020-10-16
Anticipated expiration: 2040-06-30
Also published as: CN111782005B

Abstract

The application provides an input/output (IO) module and electronic equipment. The IO module includes: an IO board; the first end of the IO board is provided with a connector which is used for being detachably connected with a main board of the electronic equipment; the second end of IO board is equipped with at least one IO interface, first end with the second end is relative both ends on the IO board. The IO board of the embodiment of the application can be connected with the mainboard in a detachable mode, so that the IO module is separated from the mainboard, the installation and the disassembly of the IO module are more convenient, the operation is simple, and the compatibility is stronger.

Description

Input/output (IO) module and electronic equipment

Technical Field

The application relates to the technical field of electronic hardware, in particular to an input/output (IO) module and electronic equipment.

Background

With the development of electronic technology, functions of electronic devices, such as Personal Computers (PCs) or servers, are increasing, and therefore, in order to implement more function expansion, Input/Output (IO) interface modules are provided in the electronic devices. Some IO interface modules are arranged in front of the equipment, and some IO interface modules are arranged behind the equipment.

For the IO interface module arranged behind the equipment, namely the rear IO module, as shown in fig. 1, the IO interface module 1 is fixed behind the main board 2, and a rear window of the chassis is provided with a hole and an IO baffle plate. In the above scheme, when the user detaches or replaces the IO interface module, the operation is more cumbersome.

Disclosure of Invention

The application provides an input/output (IO) module and electronic equipment to improve the flexibility of IO module disassembly and assembly.

In a first aspect, the present application provides an input/output (IO) module, which is applied to an electronic device, the IO module includes: an IO board; the first end of the IO board is provided with a connector which is used for being detachably connected with a main board of the electronic equipment;

the second end of IO board is equipped with at least one IO interface, first end with the second end is relative both ends on the IO board.

In a possible implementation manner, an opening is provided on the IO board, and the IO module further includes: a back plate; the backboard is arranged on the opening and is electrically connected with the IO board;

one side of the backboard far away from the main board is provided with at least one slot position for inserting at least one expansion assembly.

In one possible implementation, the extension component includes at least one of: hard disk, high-speed serial computer expansion bus PCIE card or other types of expansion cards.

In one possible implementation manner, the method further includes: a fixed seat; the IO board is fixed on the fixed seat; the fixed seat comprises a bottom plate and two side plates; the two side plates are oppositely arranged at two ends of the bottom plate; the IO board and the bottom board are arranged in parallel.

In one possible implementation manner, the IO module further includes: a handle; the handle sets up the bottom plate is in the orientation on the outside part that extends of second end of IO board, the handle is used for the installation and dismantles the IO module.

In one possible implementation, the handle includes: a connecting portion and a locking portion;

wherein the connecting portion is rotatably connected with the locking portion;

the connecting part is rotatably connected with the bottom plate;

the locking part is used for matching with a locking part on the bottom plate, and when the handle is locked, the locking part is fixed on the locking part.

In a possible implementation manner, the IO module is detachably connected to one end of the main board through a board-to-board connector.

In a possible implementation manner, the number of the IO boards is multiple, and the IO interfaces included in the multiple IO boards are different.

In a second aspect, the present application provides an electronic device comprising:

a motherboard, and the IO module of any one of the first aspect.

According to the input/output IO module and the electronic equipment provided by the embodiment of the application, the IO module comprises an IO board; the first end of the IO board is provided with a connector for detachably connecting with the mainboard of the electronic equipment, the second end of the IO board is provided with at least one IO interface, and the IO board is detachably connected with the mainboard, so that the IO module is separated from the mainboard, the installation and the disassembly of the IO module are more convenient, and the operation is simple.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.

FIG. 1 is a schematic structural diagram of a motherboard in the prior art;

FIG. 2 is a schematic diagram of an IO board structure according to an embodiment of the disclosure;

FIG. 3 is a schematic diagram of a motherboard and an IO board structure according to an embodiment of the disclosure;

fig. 4 is a schematic structural diagram of a motherboard and an IO module according to an embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of an IO module according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of an IO module according to another embodiment of the present disclosure.

Description of reference numerals:

1. an IO interface module;

2. a main board;

10. an IO board;

11. a connector for an IO board;

12. an IO interface;

13. a back plate;

14. an expansion component;

15. a handle;

20. a fixed seat;

21. a connector of the motherboard;

22. a base plate;

23. a side plate;

151. a connecting portion;

152. a locking portion;

153. a locking member;

154. a rotating shaft.

With the foregoing drawings in mind, certain embodiments of the disclosure have been shown and described in more detail below. These drawings and written description are not intended to limit the scope of the disclosed concepts in any way, but rather to illustrate the concepts of the disclosure to those skilled in the art by reference to specific embodiments.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

The terms "comprising" and "having," and any variations thereof, in the description and claims of this application and the drawings described herein are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.

The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

First, a part of words related to embodiments of the present application will be described.

PCIE is an abbreviation of PCI-Express, and is a high-speed serial computer expansion bus standard, including multiple protocols such as PCI-Express2X, 4X, 8X, and 16X, and a PCI-E card refers to a board card inserted into a PCI-E bus slot to connect the electronic device with an external device or data.

In the related art, for the rear IO module, as shown in fig. 1, an IO interface module 1 is fixed behind a main board 2, and a rear window of a chassis is provided with an opening and an IO baffle plate.

The number, arrangement mode and specification of IO interfaces of the rear IO module cannot be changed after the mainboard is manufactured, and more compatible requirements cannot be met. When a user has more compatibility requirements on the IO interface function of the rear IO module of the server, the IO interface is difficult to detach or replace.

The technical concept of the IO module of the embodiment of the application is as follows:

the IO module is characterized in that the IO interface is arranged on the IO board, the IO board is connected to the main board through the connector in a detachable mode, so that the IO module is separated from the main board, the IO module containing different interfaces and slots can be installed according to requirements, the function of the IO module is more diversified, and the compatibility is stronger.

The technical solution of the present application will be described in detail below with specific examples. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments.

Fig. 2 is a schematic view of an IO plate structure according to an embodiment of the present disclosure. As shown in fig. 2 and fig. 3, the IO module provided in this embodiment is applied to an electronic device, and the IO module includes an IO board 10;

a connector 11 is arranged at a first end of the IO board 10 and is used for detachably connecting with a main board of the electronic device;

the second end of IO board 10 is equipped with at least one IO interface 12, first end with the second end is relative both ends on IO board 10.

Specifically, the IO module includes IO boards 10, and the number of IO boards 10 in the IO module may be one or more.

If the number of IO boards in the IO module is multiple, the IO interfaces included in different IO boards may be different or may also be the same, which is not limited in this embodiment of the present application.

The plurality of IO interfaces included in the same IO board may also be different. For example, the types and specifications of IO interfaces are different. Such as a Universal Serial Bus (USB) Interface, a High Definition Multimedia Interface (HDMI) Interface, an RS232 Interface, a Peripheral Component Interconnect (PCIE) Interface, and the like.

In practical application, different IO boards can be replaced according to specific requirements.

Fig. 2 shows that the structure of IO board 10 shows, and the both ends that IO board 10 is relative are equipped with connector 11 respectively to and IO interface 12, as shown in fig. 3, connector 11 is used for being connected with connector 21 detachable of mainboard, in practical application, can change different IO modules according to specific demand, contains the IO module of different IO boards promptly. The connector 11 and the connector 21 realize the transfer of data.

The IO interface 12 is used to provide an interface for data input and output for the motherboard.

In an embodiment, the IO module may be a rear IO module, and is connected to an end of the motherboard near the rear of the chassis.

The main board can also be connected with a plurality of rear IO modules, and each IO module comprises one or a plurality of IO boards.

In an embodiment, the main board 2 may be provided with other modules, which is not limited in the embodiment of the present application. The style of the main board in fig. 2 is merely an example.

In this embodiment, the IO module is connected through can dismantling with the mainboard for the IO module separates with the mainboard, can install the IO board that contains different interfaces according to the demand, makes the function of IO module more diversified, and compatible stronger.

The IO module of the embodiment comprises an IO board; the first end of the IO board is provided with a connector for detachably connecting with the mainboard of the electronic equipment, the second end of the IO board is provided with at least one IO interface, and the IO board is detachably connected with the mainboard, so that the IO module is separated from the mainboard, the installation and the disassembly of the IO module are more convenient, and the operation is simple.

In an embodiment, the IO module is detachably connected to one end of the motherboard through a board-to-board connector.

As shown in fig. 3, the IO board 10 of the IO module is inserted into the slot of the corresponding connector 21 of the motherboard 2 through the connector 11.

The board-to-board connector is a connector with strong transmission capability, and data transfer between the IO board and the mainboard is realized through the board-to-board connector.

In the above embodiment, the IO module and the main board are connected through the board-to-board connector, so that the IO module can be quickly mounted and dismounted, the mounting and dismounting are convenient and flexible, and the data transfer efficiency is high. When the IO interface function needs to be changed, the IO module can be directly detached, the IO board meeting the requirement is changed, and the requirement for compatible change of various IO interfaces is met.

In an embodiment, as shown in fig. 4, the IO module further includes: a back plate 13;

wherein the back plate 13 is connected to the IO plate 10;

one side of the back plate 13, which is far away from the main plate 2, is provided with at least one slot for inserting at least one expansion component.

In one embodiment, an opening is disposed on the IO board, and the backplane is disposed on the opening and electrically connected to the IO board.

Specifically, as shown in fig. 4, the backplane 13 is connected to the IO board 10, and the backplane 13 may be connected to the IO board 10 through a connector, for example, a board-to-board connector. The back plate 13 is connected to the IO plate 10 on the side where the IO interface is provided.

The opening of the IO board may be provided with a corresponding connector interface.

In other embodiments, the connection may be made through other types of connectors, which are not limited in the embodiments of the present application.

The back plate 13 in fig. 4 has a gap, which is only an example, and in practical use, the back plate 13 may be designed according to practical requirements.

The backplane 20 is provided with at least one slot for inserting at least one expansion component on a side thereof away from the motherboard 2, i.e. a side thereof facing the IO interface 12.

In an embodiment, the expansion component comprises at least one of: hard disk, PCIE card, other types of expansion cards. The IO module can add corresponding trench according to the demand, extension subassemblies such as extension installation hard disk, PCIE, expansion card realize stronger compatibility.

In the embodiment, when the functions of the expansion assembly are required to be replaced, the IO module can be directly detached, the expansion assembly meeting the requirements is replaced, and the requirement of compatible replacement of various expansion assemblies is met. The method is suitable for electronic equipment with various expansion requirements, such as a server.

On the basis of the above embodiment, in order to realize the modular design of the IO module, the IO module further includes a fixing seat, and the IO board 10 is fixed on the fixing seat.

Specifically, the fixing base is used for fixing a plurality of components included in the IO module.

In one embodiment, as shown in fig. 5, the fixing base 20 includes a bottom plate 22 and two side plates 23; the two side plates 23 are oppositely arranged at two ends of the bottom plate 22; the IO board 10, the backplane 13 and the expansion assembly 14 are fixed in the fixing seat 20.

Specifically, as shown in fig. 5, through bottom plate 22 and curb plate 23 that sets up at bottom plate 22 both ends, open-ended fixing base 20 around having formed, the relative first end and the second end of IO board 10 expose from the front and back opening of fixing base respectively, and first end passes through the connector and is connected with the mainboard, and the second end is equipped with IO interface 12.

In fig. 5, IO board 10 is disposed parallel to bottom board 22, back board 13 is perpendicular to bottom board 22, and back board 13 is perpendicular to side board 23.

In an embodiment, the fixing base 20 is further provided with a baffle at the second end of the IO board, and the baffle is opened at a position corresponding to the IO interface of the IO board to expose the IO interface.

In one embodiment, the fixing base is made of metal, such as iron, stainless steel, etc.

In fig. 5, a Hard Disk Drive (HDD) 14 of a computer is inserted into the back plate 13, and the back plate 13 is used as a Hard Disk back plate.

In fig. 5, the hard disk is mounted in a hard disk cage.

In the above embodiment, the fixing base is used for fixing each component included in the IO module, so that the modular design of the IO module is realized, that is, the IO module is detachably connected with the main board as a whole module.

In an embodiment, the fixing base may accommodate one or more IO boards, which is not limited in this application.

In an embodiment, as shown in fig. 5, the IO module further includes: a handle 15; handle 15 sets up the bottom plate 22 of fixing base is close to the edge of the second end of IO board, handle 15 is used for the installation and dismantles the IO module.

Specifically, as shown in fig. 5, base plate 22 of the anchor block extends outwardly from the second end of the IO plate, and the extended portion is used for placing handle 15. The IO module can be mounted and dismounted through the handle 15.

In fig. 5, the handle 15 is disposed on the bottom plate, and in other embodiments, the handle 15 may be disposed on the side plate, which is not limited in the embodiments of the present application.

When the IO module is disassembled, the handle 15 is unlocked from the extension part of the bottom plate 22, and the handle 15 is pulled outwards to disassemble the IO module from the mainboard; when the IO module is installed, the IO module is pushed towards the case of the electronic equipment through the handle 15, so that the connector of the main board is connected with the connector on the IO board in the IO module, then the handle is locked on the extending part of the base plate, and the installation is completed.

In one embodiment, as shown in fig. 6, the handle 15 includes: a connecting portion 151 and a locking portion 152;

wherein the connecting portion 151 is rotatably connected with the locking portion 152;

the connecting part 151 is rotatably connected with the bottom plate 22;

the locking part 152 is adapted to cooperate with a locking member 153 on the base plate 22, and the locking part 152 is fixed to the locking member 153 when the handle 15 is locked.

Specifically, as shown in fig. 6, the connection part 151 is rotatably connected to the locking part 152 by a rotation shaft 154, and the connection part 151 is connected to the extension part of the base plate by the rotation shaft.

The locking portion 152 is provided with a locking hook for cooperating with the locking member to lock the handle.

When the IO module is to be detached, the handle 15 is unlocked from the extended portion of the base plate, that is, the locking portion is rotated in the arrow direction in fig. 6, so that the latch hook is disengaged from the locking member 153 of the base plate, and then the handle 15 is pulled outward to detach the IO module from the main board.

When the IO module is installed, the IO module is pushed towards the case of the electronic device through the handle 15, so that the connector of the main board is connected with the connector on the IO board in the IO module, the handle is locked on the extension part of the bottom board, namely, the locking part is rotated along the direction opposite to the arrow direction in fig. 6, so that the locking part 153 of the bottom board is hooked by the locking hook, and the installation is completed.

In one embodiment, the connecting portion 151 of the handle 15 may be made of a metal material, such as iron, stainless steel, etc.

In one embodiment, the locking portion 152 of the handle 15 may be made of plastic material and have a certain elasticity.

The handle structure in fig. 6 is only an example, and in other embodiments, the handle structure may be implemented in other ways, which is not limited in this application.

In the above embodiment, the rapid installation and disassembly of the IO module are realized through the handle, and the assembly and disassembly are convenient and flexible.

An embodiment of the present application further provides an electronic device, including:

a motherboard and an IO module as claimed in any one of claims 1 to 8.

Specifically, as shown in fig. 3, the IO module is detachably connected to the main board through the connector of the IO board, so that the IO module is separated from the main board, the IO module including different interfaces and slots can be installed as required, the function of the IO module is diversified, and the compatibility is stronger.

In an embodiment, the IO module is a rear IO module of the electronic device.

The IO module can be dismantled and connect at the mainboard rear, sets up this IO module promptly at the rear of electronic equipment's quick-witted case.

The electronic device of this embodiment may be used to implement the technical solution of the above IO module embodiment, and the implementation principle and the technical effect are similar, which are not described herein again.

In an embodiment, the electronic device may further include other functional modules.

The other functional modules include at least one of the following modules: the device comprises a hard disk module, a front IO module, an expansion module, a power module and a fan module.

Any one of the functional modules can be detachably connected with the mainboard through the corresponding connectors, so that each functional module is not required to be connected with the mainboard through a cable, the installation and the disassembly of the functional module are more convenient, the operation is simple, and the compatibility is strong.

Each functional module can carry out data conversion and transmission work through board to board connector and mainboard. The board-to-board connector is a connector with strong transmission capability, and data transfer between each functional module and the mainboard is realized through the board-to-board connector.

The board-to-board modular data docking mode ensures that the influence of excessive cable routing between modules does not exist in the space above the mainboard, the internal structure is simple, and the heat dissipation effect of the case is better; and because the board to board data switching mode has saved the connecting cable of multiple model, length between the module, still saved the line structure of need special design and the auxiliary of fixed cable when each way cable was walked the line simultaneously, very big saving the cost.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. An input/output (IO) module is applied to electronic equipment and comprises an IO board;

the first end of the IO board is provided with a connector which is used for being detachably connected with a main board of the electronic equipment;

2. The IO module of claim 1, wherein the IO board has an opening disposed thereon, the IO module further comprising: a back plate; the backboard is arranged on the opening and is electrically connected with the IO board;

3. The IO module of claim 2 wherein,

the expansion component includes at least one of: hard disk, high-speed serial computer expansion bus PCIE card or other types of expansion cards.

4. The IO module of claim 1 or 2, further comprising: a fixed seat; the IO board is fixed on the fixed seat; the fixed seat comprises a bottom plate and two side plates; the two side plates are oppositely arranged at two ends of the bottom plate; the IO board and the bottom board are arranged in parallel.

5. The IO module of claim 4, further comprising: a handle; the handle sets up the bottom plate is in the orientation on the outside part that extends of second end of IO board, the handle is used for the installation and dismantles the IO module.

6. The IO module of claim 5, wherein said handle comprises: a connecting portion and a locking portion;

wherein the connecting portion is rotatably connected with the locking portion;

the connecting part is rotatably connected with the bottom plate;

7. IO module according to claim 1 or 2,

the IO module passes through board to board connector detachable and connects the one end of mainboard.

8. IO module according to claim 1 or 2,

the number of the IO boards is multiple, and the IO interfaces included in the IO boards are different.

9. An electronic device, comprising:

a motherboard and an IO module as claimed in any one of claims 1 to 8.

10. The device of claim 9, wherein the IO module is a rear IO module for the electronic device.