CN111781487A - Multichannel thermal resistance testing arrangement and test system - Google Patents

Multichannel thermal resistance testing arrangement and test system Download PDF

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Publication number
CN111781487A
CN111781487A CN202010793632.3A CN202010793632A CN111781487A CN 111781487 A CN111781487 A CN 111781487A CN 202010793632 A CN202010793632 A CN 202010793632A CN 111781487 A CN111781487 A CN 111781487A
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current
testing
thermal resistance
power supply
test
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CN111781487B (en
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胡久恒
胡久旺
安浙文
代凯旋
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Hangzhou Gaokun Electronic Technology Co ltd
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Hangzhou Gaokun Electronic Technology Co ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2601Apparatus or methods therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/14Measuring resistance by measuring current or voltage obtained from a reference source
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2607Circuits therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The invention discloses a multichannel thermal resistance testing device and a testing system, which comprise a testing device main body, wherein the testing device main body comprises an operating state indicator lamp, a control button, a display, an industrial control computer, a keyboard combination, a Vce/IM/IH testing terminal, a 20V/100A power supply and a monitoring unit box, the Vce/IM/IH testing terminal is responsible for automatically calculating Tj by software after sampling VF, accurately detecting the voltage drop of a device, accurately testing a current constant current source, and controlling the mode and the output size of the 20V/100A power supply by the industrial control computer.

Description

Multichannel thermal resistance testing arrangement and test system
Technical Field
The invention relates to a multi-channel thermal resistance testing device and a testing system.
Background
With the continuous development of the electronic industry, the power of semiconductor discrete devices is made to be larger, so that the dissipated power of products is increased. Meanwhile, due to the cost control, the sizes of the chip and the finished product are continuously reduced, and the heat dissipation of the product is limited to a certain extent. This results in products that often find poor thermal resistance during testing. The thermal resistance is based on the testing principle that the voltage of the PN junction of the semiconductor device at two ends changes along with the temperature change under the specified current, so as to test the thermal stability of the power device or the heat dissipation characteristics of packaging and the like. By applying specified power to a power device to be tested, specifying the large voltage change (delta VBE/delta VF/delta VT/delta DS/delta VGK) at two ends of the applied PN junction as the heat dissipation basis of the device to be tested, comparing specified standard values, screening products with poor heat dissipation according to the detection result, avoiding the failure of the products with poor heat dissipation due to the temperature rise in the application process,
the measurement of the thermal resistance of the existing device adopts an electrical method for measurement, namely the change of the positive PN junction voltage of a transistor along with the temperature is taken as a temperature sensitive parameter, the change of the junction voltage before and after the device is heated is measured, the temperature rise before and after the device is heated can be obtained, and the shell temperature is kept constant, and the following expression is as follows: θ ═ T2-T1)/IV ═ V2-V1)/KIV; wherein V2 is the voltage after heating, V1 bit voltage before heating, K is the junction temperature coefficient, I is the heating current, and V is the heating voltage.
The defects of the prior art are mainly shown in the following steps: most of the products in the market are imported from foreign countries, are expensive, and do not measure the thermal resistance of high-power devices; meanwhile, the thermal resistance test in the market can only test one product at a time, the requirement of a client for large-batch test cannot be met, the operation is relatively complex, and the fixed clamp is specially packaged and cannot be used. There is therefore a need for improvements to the prior art.
Disclosure of Invention
The invention aims to solve the technical problem of providing a multichannel thermal resistance testing device and a multichannel thermal resistance testing system which are convenient to use, simple to operate, have more protections such as overvoltage protection, overcurrent protection, overtemperature protection, overpower protection and the like, can simultaneously test the thermal resistance of 12 elements, can provide a 0-20V adjustable Vge power supply, provide 0-100mA adjustable trigger current, provide 0-500mAIM testing current, 0-100AIF heating current, provide T (cooling water), VCE, TJ and Rth (thermal resistance) real-time display functions, can test VF within 50us after the IF is switched on and switched off, have VF resolution ratio of 1nV, and have practicability and wide application.
In order to solve the problems, the invention adopts the following technical scheme:
a multi-channel thermal resistance testing device and a testing system comprises a testing device body, wherein the testing device body comprises an operating state indicator light, a control button, a display, an industrial control computer, a keyboard combination, a Vce/IM/IH testing terminal, a 20V/100A power supply and a monitoring unit box, the control button is used for controlling the power supply of the whole device and the immediate power off in case of emergency, the industrial control computer is used for matching with self-control upper computer software to realize the intelligent control of the whole system, the upper computer software sets device information and experimental parameters including IH current, VDD voltage and on-off time, the Vce/IM/IH testing terminal is responsible for automatically calculating Tj by software after sampling VF, the voltage drop of the device is accurately detected, an accurate testing current constant current source is IM, and the industrial control computer controls the mode and the output size of the 20V/100A power supply, the monitoring unit box is used for data acquisition, communication, data processing, test control, setting of IH size and time of software heating, setting of IM size, setting of ON/OFF time and setting of Vge voltage.
Preferably, the status indicator light, the control button, the display, the industrial control computer, the keyboard combination, the 20V/100A power supply and the monitoring unit box are arranged on the front face of the testing device body, and the Vce/IM/IH testing terminal is arranged on the side face of the testing device body.
Preferably, the 20V/100A power supply has the functions of constant-current and constant-voltage mode, over-temperature protection, short-circuit protection, over-current protection and overvoltage protection, and can perform monitoring feedback through upper computer software.
Preferably, the 20V/100A power supply is in a constant-current constant-voltage mode, a heating current IH is provided for the device, the output end of the heating current IH is 100A at the maximum, the adjustable electronic load provides a test current IM for the device, the test current is 0-500mA, whether the emitter lead of the device falls off is judged by detecting the change of Vce through the test current, and the junction temperature is calculated to draw a junction temperature curve.
Preferably, each polarity in the circuit design is connected with an electronic switch, so that fast on-off and switching between IH and IM are realized.
Preferably, under the test current IM, the voltage drop VF at two ends of the device is acquired by high-speed AD, and the AD is an 18-bit high-precision high-speed AD chip.
Preferably, the test system comprises the following test steps:
1) leading out the signal line, the IF line and the IM line to a device for good contact, and paying attention to the current direction and the Vce direction;
2) setting device information and experimental parameters including IH current, VDD voltage, on-off time and the like on upper computer software;
3) pressing an operation button to supply power to the equipment, checking the power supply condition, the refrigeration condition and the like;
4) when the time of turning off is reached, the IH heating current is stopped, the IH heating current is quickly switched to generate a 10mA test current IM, VF is measured in 400us through high-precision and high-speed AD, and Tj is converted from the characteristic that the voltage drop VF of a silicon device is in linear relation with the junction temperature of the device;
5) and (3) quickly drawing a Tj curve and a VF curve on software and calculating the thermal resistance value.
The invention has the beneficial effects that:
1. the voltage and the heating current IH are collected in real time to be fed back, so that the conduction of the device is ensured, and the device cannot be damaged due to overlarge current.
2. More protection, can not cause the device to damage and influence system stability because of reasons such as short circuit, high temperature, improper operation.
3. The high-precision and high-speed AD ensures that the result of the data is more accurate and reliable.
4. Each channel is independent, 12 units can be measured simultaneously without mutual influence, and the control part and the adjustment protection part are separated to avoid interference.
5. The temperature is reduced through the liquid cooling plate, and cold water is introduced after the device is turned off to rapidly reduce the temperature of the device.
6. The on-off speed is high, on one hand, the power supply is turned off in a program-controlled manner during the turn-off process, and on the other hand, the IGBT is adopted for switch double protection.
Drawings
In order to clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, but the protection scope of the present invention is not limited.
FIG. 1 is a schematic front view of the present invention;
FIG. 2 is a side schematic view of the present invention;
the system comprises an operation state indicating lamp 1, a control button 2, a display 3, an industrial control computer 4, a keyboard combination 5, a Vce/IM/IH test terminal 6, a power supply 7.20V/100A and a monitoring unit box 8.
Detailed Description
Referring to fig. 1-2, a multi-channel thermal resistance testing device and testing system includes a testing device body, the testing device body includes an operation status indicator lamp 1, a control button 2, a display 3, an industrial control computer 4, a keyboard combination 5, a Vce/IM/IH testing terminal 6, a 20V/100A power supply 7 and a monitoring unit box 8, the operation status indicator lamp is yellow for stopping, red for alarming and green for normal operation, the control button 2 is used for controlling the power supply of the whole device and immediately powering off when an emergency occurs, the industrial control computer 4 is used for matching with self-control upper computer software to realize intelligent control of the whole system, the upper computer software sets device information and experimental parameters including IH current, VDD voltage, on-off time, the Vce/IM/IH testing terminal 6 is responsible for software automatic computation Tj after sampling VF, the voltage drop of the device is accurately detected, the current IM constant current source is accurately tested, the industrial control computer 4 controls the mode and the output size of the 20V/100A power supply 7, and the monitoring unit box 8 is used for data acquisition, communication, data processing, test control, setting of IH size and time of software heating, setting of IM size, setting of ON/OFF setting time and setting of Vge voltage.
Further, the status indicator lamp 1, the control button 2, the display 3, the industrial control computer 4, the keyboard combination 5, the 20V/100A power supply 7 and the monitor unit box 8 are disposed on the front face of the testing device body, and the Vce/IM/IH test terminal 6 is disposed on the side face of the testing device body.
Further, the 20V/100A power supply 7 has the functions of constant-current and constant-voltage mode, over-temperature protection, short-circuit protection, over-current protection and over-voltage protection, and can perform monitoring feedback through upper computer software.
Further, the 20V/100A power supply is in a constant-current constant-voltage mode, heating current IH is provided for the device, the output end of the heating current IH is 100A at the maximum, the adjustable electronic load provides testing current IM for the device, the testing current is 0-500mA, whether emitter leads of the device fall off or not is judged through detecting the change of Vce through the testing current, and junction temperature is calculated to draw a junction temperature curve.
Furthermore, each polarity in the circuit design is connected with an electronic switch, so that the fast on-off and the switching between IH and IM are realized.
Further, under the test current IM, the high-speed AD acquires the voltage drop VF at two ends of the device, and the AD is an 18-bit high-precision high-speed AD chip.
Further, the test system comprises the following test steps:
1) leading out the signal line, the IF line and the IM line to a device for good contact, and paying attention to the current direction and the Vce direction;
2) setting device information and experimental parameters including IH current, VDD voltage, on-off time and the like on upper computer software;
3) pressing an operation button to supply power to the equipment, checking the power supply condition, the refrigeration condition and the like;
4) when the time of turning off is reached, the IH heating current is stopped, the IH heating current is quickly switched to generate a 10mA test current IM, VF is measured in 400us through high-precision and high-speed AD, and Tj is converted from the characteristic that the voltage drop VF of a silicon device is in linear relation with the junction temperature of the device;
5) and (3) quickly drawing a Tj curve and a VF curve on software and calculating the thermal resistance value.
The main body of the testing device is of a tetragonal structure.
The invention has the advantages that:
1. the whole machine can simultaneously measure the thermal resistances of 12 elements, each channel is independent and does not influence each other, and the control part and the adjustment protection part are separated to avoid interference.
2. After the IF is switched on and off, VF can be measured within 50us, and the VF resolution is 1 nV.
3. The protection circuit is provided with more protections, overvoltage protection, overcurrent protection, over-temperature protection, over-power protection and the like, voltage and heating current IH are collected in real time to be fed back to ensure that a device is conducted and cannot be damaged due to overlarge current, and the protection circuit is more protected and cannot cause device damage and influence on system stability due to short circuit, overhigh temperature, improper operation and the like.
4. The device is quickly cooled by cooling the liquid cooling plate, cold water is introduced after the device is turned off, so that the device can be rapidly cooled, the turning-on and turning-off speed is high, on one hand, the power supply is turned off in a program-controlled manner, and on the other hand, IGBT is adopted for switch double protection during turning-off.
5. The sampling rate is 1MHz, the real-time junction temperature is obtained very quickly, and the high-precision and high-speed AD ensures that the data result is more accurate and reliable.
6. And a 0-20V adjustable Vge power supply (suitable for IGBT) is provided, and a 0-100mA adjustable trigger current (suitable for silicon controlled rectifier) is provided.
7. Providing 0-500mA IM test current, 0-100A IF heating current.
8. The liquid cooling plate dissipates heat and provides a real-time display function of T (cooling water), VCE, TJ and Rth (thermal resistance).
9. And providing the SDK for the client to meet the requirement of client program control development.
The above is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the inventive work should be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope defined by the claims.

Claims (7)

1. The utility model provides a multichannel thermal resistance testing arrangement and test system, includes the testing arrangement main part, its characterized in that: the main body of the testing device comprises an operation state indicator light, a control button, a display, an industrial control computer, a keyboard combination, a Vce/IM/IH testing terminal, a 20V/100A power supply and a monitoring unit box, wherein the control button is used for controlling the power supply of the whole equipment and the immediate power off in case of emergency, the industrial control computer is used for matching with self-made upper computer software to realize the intelligent control of the whole system, the upper computer software sets device information and experimental parameters comprising IH current, VDD voltage and on-off time, the Vce/IM/IH testing terminal is responsible for automatically calculating Tj by the software after sampling VF, accurately detecting the voltage drop of the device, and accurately testing a current IM constant current source, the industrial control computer controls the mode and the output size of the 20V/100A power supply, and the monitoring unit box is used for data acquisition, communication and data processing, Setting of the magnitude and time of the IH, setting of the magnitude of the IM, setting of the ON/OFF setting time, and setting of the Vge voltage in the test control and software heating.
2. The multi-channel thermal resistance testing device and system of claim 1, wherein: the state indicator light, the control button, the display, the industrial control computer, the keyboard combination, the 20V/100A power supply and the monitoring unit box are arranged on the front face of the testing device body, and the Vce/IM/IH testing terminal is arranged on the side face of the testing device body.
3. The multi-channel thermal resistance testing device and system of claim 2, wherein: the 20V/100A power supply has the functions of constant-current and constant-voltage mode, over-temperature protection, short-circuit protection, overcurrent protection and overvoltage protection, and can perform monitoring feedback through upper computer software.
4. The multi-channel thermal resistance testing device and system of claim 3, wherein: the 20V/100A power supply is in a constant-current constant-voltage mode, a heating current IH is provided for the device, the output end of the heating current IH is 100A at the maximum, the adjustable electronic load provides a test current IM for the device, the test current is 0-500mA, whether the emitter lead of the device falls off is judged by detecting the change of Vce through the test current, and the junction temperature is calculated to draw a junction temperature curve.
5. The multi-channel thermal resistance testing device and system of claim 4, wherein: in the circuit design, each polarity is connected with an electronic switch, so that the fast on-off and the switching between IH and IM are realized.
6. The multi-channel thermal resistance testing device and system of claim 5, wherein: and under the test current IM, the high-speed AD acquires the voltage drop VF at two ends of the device, and the AD is an 18-bit high-precision high-speed AD chip.
7. The multi-channel thermal resistance testing device and system of claim 6, wherein: the test system comprises the following test steps:
1) leading out the signal line, the IF line and the IM line to a device for good contact, and paying attention to the current direction and the Vce direction;
2) setting device information and experimental parameters including IH current, VDD voltage, on-off time and the like on upper computer software;
3) pressing an operation button to supply power to the equipment, checking the power supply condition, the refrigeration condition and the like;
4) when the time of turning off is reached, the IH heating current is stopped, the IH heating current is quickly switched to generate a 10mA test current IM, VF is measured in 400us through high-precision and high-speed AD, and Tj is converted from the characteristic that the voltage drop VF of a silicon device is in linear relation with the junction temperature of the device;
5) and (3) quickly drawing a Tj curve and a VF curve on software and calculating the thermal resistance value.
CN202010793632.3A 2020-08-10 2020-08-10 Multichannel thermal resistance testing arrangement and test system Active CN111781487B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117148124A (en) * 2023-11-01 2023-12-01 杭州高坤电子科技有限公司 Integrated circuit thermal resistance testing method, system and storage medium

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CN101093241A (en) * 2006-06-20 2007-12-26 北京航空航天大学 Test equipment of steady state operation life in use for controlling junction temperature of transistor
CN101266280A (en) * 2008-05-13 2008-09-17 上海大学 High power light-emitting diode heat resistance and junction temperature test system
CN104458799A (en) * 2014-11-27 2015-03-25 天津大学 Method and device for measuring transient thermal resistance of IGBT module
CN105929316A (en) * 2016-07-10 2016-09-07 北京工业大学 Multi-path IGBT junction temperature and thermal fatigue real-time monitoring system
CN109270381A (en) * 2018-10-30 2019-01-25 杭州高坤电子科技有限公司 The load of four tunnel independent electronics controls and measures junction temperature system and its junction temperature measurement method
CN111060798A (en) * 2019-12-18 2020-04-24 中国测试技术研究院流量研究所 Automatic power aging test system and test method for MOS (metal oxide semiconductor) tube

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101093241A (en) * 2006-06-20 2007-12-26 北京航空航天大学 Test equipment of steady state operation life in use for controlling junction temperature of transistor
CN101266280A (en) * 2008-05-13 2008-09-17 上海大学 High power light-emitting diode heat resistance and junction temperature test system
CN104458799A (en) * 2014-11-27 2015-03-25 天津大学 Method and device for measuring transient thermal resistance of IGBT module
CN105929316A (en) * 2016-07-10 2016-09-07 北京工业大学 Multi-path IGBT junction temperature and thermal fatigue real-time monitoring system
CN109270381A (en) * 2018-10-30 2019-01-25 杭州高坤电子科技有限公司 The load of four tunnel independent electronics controls and measures junction temperature system and its junction temperature measurement method
CN111060798A (en) * 2019-12-18 2020-04-24 中国测试技术研究院流量研究所 Automatic power aging test system and test method for MOS (metal oxide semiconductor) tube

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117148124A (en) * 2023-11-01 2023-12-01 杭州高坤电子科技有限公司 Integrated circuit thermal resistance testing method, system and storage medium
CN117148124B (en) * 2023-11-01 2024-02-20 杭州高坤电子科技有限公司 Integrated circuit thermal resistance testing method, system and storage medium

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