CN111780612A - High-overload missile-borne comprehensive parameter testing system - Google Patents

High-overload missile-borne comprehensive parameter testing system Download PDF

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Publication number
CN111780612A
CN111780612A CN202010748389.3A CN202010748389A CN111780612A CN 111780612 A CN111780612 A CN 111780612A CN 202010748389 A CN202010748389 A CN 202010748389A CN 111780612 A CN111780612 A CN 111780612A
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CN
China
Prior art keywords
overload
chip
missile
sensor
parameter testing
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Pending
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CN202010748389.3A
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Chinese (zh)
Inventor
翟萌
王甫
鞠莉娜
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China North Industries Group Corp No 214 Research Institute Suzhou R&D Center
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China North Industries Group Corp No 214 Research Institute Suzhou R&D Center
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Priority to CN202010748389.3A priority Critical patent/CN111780612A/en
Publication of CN111780612A publication Critical patent/CN111780612A/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F41WEAPONS
    • F41AFUNCTIONAL FEATURES OR DETAILS COMMON TO BOTH SMALLARMS AND ORDNANCE, e.g. CANNONS; MOUNTINGS FOR SMALLARMS OR ORDNANCE
    • F41A31/00Testing arrangements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00Measuring or testing not otherwise provided for
    • G01D21/02Measuring two or more variables by means not covered by a single other subclass
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00Details of instruments
    • G01P1/12Recording devices
    • G01P1/127Recording devices for acceleration values
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions

Abstract

The invention relates to the field of high-overload shot shooting, and discloses a high-overload shot comprehensive parameter testing system. The high overload accelerometer completes system overload measurement and simultaneously serves as a trigger signal of the whole system, and the system controls the on-off state of the acquisition system by detecting an overload trigger threshold value and a power supply time sequence management chip. The high dynamic acquisition system acquires and records ballistic information such as overload, bullet bottom pressure, temperature and the like in real time, so that the ballistic information can be used as an important basis for ballistic analysis. The high-capacity data storage module is used as a black box, dynamic output data of the tested piece are stored in real time, and support is provided for subsequent product research and development work by combining ballistic characteristic analysis.

Description

High-overload missile-borne comprehensive parameter testing system
Technical Field
The invention relates to the technical field of high-overload gun shot projectile, in particular to a high-overload projectile comprehensive parameter testing system which can measure important parameters in a high-impact overload process and record flight data of a full trajectory.
Background
The cannon weapon environment is accompanied by the characteristics of high overload, high temperature and high pressure, and is a complex high dynamic process. In the process of developing the shot weapon, multiple rounds of live ammunition shooting are needed to verify the environmental suitability of each part of the system. In order to better analyze the dynamic performance of each component of the weapon, the test data and the ballistic characteristics of the weapon need to be recorded and analyzed in the process.
The prior art and the existing defects are as follows:
the invention patent of invention (CN 107168919A) provides a data acquisition and storage system and a data acquisition and storage method for a missile-borne platform, wherein different types of external signals are respectively read into a low-power Soc chip through a data acquisition module, the data are processed and stored in a Micro SD card, and finally the data are read back and analyzed through a USB interface upper computer. The patent focuses on data recording of the outer ballistic process and ignores acquisition records of highly dynamic processes within the bore.
The invention patent CN 106771352A provides an acceleration recording device for a missile-borne test system, wherein an acceleration signal is conditioned, a voltage signal is converted into a digital signal for storage through A/D conversion built in an STM32, and the digital signal can be transmitted to an upper computer through a USB port for real-time processing. The invention focuses on acceleration measurement, only considers the overload process in the bore, and can not complete multi-channel parameter acquisition and recording and data recording of the tested piece.
The invention patent of missile-borne data testing system (CN 102506617A) discloses a missile-borne data testing system, which comprises an acquisition module, a processing module, a communication module and a power supply module. The system has the advantages of strong anti-interference, high and low temperature resistance, dust prevention, repeated use, low cost, high reliability, low power consumption and the like. The system adopts a mechanical overload switch to work on, and parameter measurement in a bore can be missed due to the time delay of the switch. The system mainly completes parameter measurement in the flight stage, mainly completes analog-to-digital conversion on the sensor, and cannot give consideration to dynamic data recording of a test piece.
The above patents are all single-core systems, the external switch controls the whole system to be powered on, and the power-on is all power-on, so that the time sequence control cannot be performed on the trajectory process, and the sub-module power-on is performed according to the requirement. The problems of high-speed real-time acquisition of multi-channel data in a missile-borne environment and data recording of a tested part cannot be solved.
Disclosure of Invention
In view of the above technical problems, the present invention aims to: the high overload missile-borne comprehensive parameter testing system can measure important parameters in the high impact overload process and record flight data of a full trajectory. The dual-core system is adopted, the time sequence control is introduced, the system firstly runs in a low power consumption mode after being electrified, the high G value accelerometer signal is detected and used as a trigger signal of the whole system, the system is fast in response, and the ms-level high dynamic process in a chamber can be completely tested. The high-capacity data storage module can completely record dynamic data of the tested piece in a full ballistic range, and the time sequence control module can complete power-off self-protection before falling to the ground, so that the safe recovery of the data of the main system is ensured.
The technical scheme of the invention is as follows:
the utility model provides a high-overload missile-borne comprehensive parameter testing system, is including being fixed in the sensor module on the projectile body, sensor module includes acceleration sensor, the acceleration sensor signal is as system trigger signal connection chronogenesis management chip, chronogenesis management chip passes through power control switch and connects sensor module and is tested and test, test and test a connection main control chip, sensor module passes through signal conditioning module back connection main control chip, main control chip connects memory chip, main control chip still connects chronogenesis management chip, and the power passes through voltage conversion chip and connects chronogenesis management chip and power control switch respectively.
In the preferred technical scheme, the sensor module further comprises a temperature sensor and a pressure sensor, the temperature sensing head of the temperature sensor is exposed in the bottom device through the temperature measuring cavity, and the pressure measuring surface of the pressure sensor is connected with the bottom air chamber through the pressure measuring hole.
In the preferred technical scheme, when the timing of the time sequence management chip reaches a preset in-bore time threshold value, the sensor module is controlled to be powered off.
In an optimal technical scheme, when the timing of the time sequence management chip reaches a preset full trajectory flight time threshold, the whole system is controlled to be powered off.
In the preferred technical scheme, the main control chip receives test data of a tested test piece through an RS422 serial port and stores the test data into a high-capacity Flash.
In the preferred technical scheme, after the projectile is recovered, the control system is powered on, and the main control chip detects the writing state of the storage chip, reads the stored time and voltage value in a segmented manner according to the input reading operation instruction and transmits the time and voltage value to the upper computer; and reading test data in the high-capacity Flash through the reading instruction.
In the preferred technical scheme, the main control chip reads data acquired by acceleration through scanning, judges whether a set trigger threshold is reached, and circularly stores the acquired data in a cache when the trigger threshold is not reached; otherwise, sending a trigger signal to the time sequence management chip, controlling the switch according to the set power-on time period of each part, and finishing the time sequence control.
Compared with the prior art, the invention has the advantages that:
1. the invention respectively measures and stores the characteristics of the high dynamic projectile and the environmental parameters in the projectile launching and outer trajectory flying processes through the temperature sensor, the pressure sensor and the acceleration sensor, stores and records the output of the tested piece in the whole flying process, and provides a reference basis for the dynamic characteristic research of weapons in the shot environment.
2. The dual-core system is adopted, the time sequence control is introduced, the system firstly runs in a low power consumption mode after being electrified, the high G value accelerometer signal is detected and used as a trigger signal of the whole system, the system is fast in response, and the ms-level high dynamic process in a chamber can be completely tested. The high-capacity data storage module can completely record dynamic data of the tested piece in a full ballistic range, and the time sequence control module can complete power-off self-protection before falling to the ground, so that the safe recovery of the data of the main system is ensured.
Drawings
The invention is further described with reference to the following figures and examples:
FIG. 1 is a block diagram of a high overload missile-borne integrated parameter test system;
FIG. 2 is a flow chart of the internal software execution of the high overload missile-borne comprehensive parameter testing system.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings in conjunction with the following detailed description. It should be understood that the description is intended to be exemplary only, and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
As shown in fig. 1, the system hardware design of the high overload missile-borne comprehensive parameter testing system is divided into two modules: the power supply and time sequence management module and the signal conditioning and storage module. The power supply and time sequence management module is used for providing each path of power supply for the system and controlling the power-on time sequence of each module according to the use requirement. The signal conditioning and storing module is a system core and is used for conditioning signals of each sensor, controlling sequential logic through the main control chip, receiving multi-channel data and storing the data into the built-in Flash.
The dual-core system is adopted, the time sequence control is introduced, the system firstly runs in a low power consumption mode after being electrified, the high G value accelerometer signal is detected and used as a trigger signal of the whole system, the system is fast in response, and the ms-level high dynamic process in a chamber can be completely tested. The high-capacity data storage module can completely record dynamic data of the tested piece in a full ballistic range, and the time sequence control module can complete power-off self-protection before falling to the ground, so that the safe recovery of the data of the main system is ensured.
The sensor comprises a wide-range high-overload-resistant temperature sensor, a pressure sensor and a high G value acceleration sensor, the wide-range high-overload-resistant temperature sensor is fixed on the elastomer through a mounting seat, and a sensor temperature sensing head is exposed in the bottom device through a temperature measuring cavity. When the gunpowder in the chamber starts to work, the fuel gas enters the temperature measuring cavity, the temperature measuring head of the temperature sensor immediately senses the temperature of the fuel gas, and the bottom temperature in the full trajectory flight process is measured; the pressure sensor is fixed on the projectile body through a bow-shaped pressure measuring cavity mounting seat, and a pressure measuring surface of the sensor is connected with a bottom air chamber through a pressure measuring hole to measure the pressure of combustion gas during movement in a bore artillery bore; and the sensor is fixed on the projectile body through the mounting seat and measures the acceleration values of the projectile in the chamber in the three-axis direction during movement. Of course, other types of sensors may be provided, and the present embodiment is described by taking 3 types of sensors as an example.
The acceleration sensor signal is as system trigger signal connection chronogenesis management chip, and chronogenesis management chip passes through power control switch (switch 1-4 in the picture) and connects sensor module and the piece of examining by the test, and the piece of examining by the test is connected main control chip, and the sensor module passes through signal conditioning module back and connects main control chip, and main control chip connects memory chip, and main control chip still connects chronogenesis management chip, and the power passes through voltage conversion chip and connects chronogenesis management chip and power control switch respectively.
Before the projectile is launched and loaded into the chamber, a battery lead of a reserved projectile loading test system is connected with a system power supply lead, and power is supplied to the time sequence management chip and each sensor power supply through a control switch through the power supply conversion chip 1 and the power supply conversion chip 2. When the projectile is launched, the time sequence management chip detects a trigger signal provided by the high-G accelerometer, starts system timing and simultaneously starts power control switches of the sensors and the acquisition and storage system to simultaneously supply power to the tested piece, the temperature sensor, the pressure sensor and the acquisition and storage chip. In the power supply period of the sensor and the acquisition and storage system, the temperature, pressure and acceleration sensors and the corresponding signal conditioning circuits thereof convert the state quantity measured by the sensors into corresponding voltage signals and then input the voltage signals to the I/O port of the main control chip, and the main control chip transmits the data to the external storage chip at high speed for storage under the condition of correctly identifying effective signals.
When the timing of the timing management chip reaches a preset in-bore time threshold value, such as 1s (which can be modified according to actual shooting conditions), the temperature and pressure sensors and the high-G accelerometer are powered off. The system receives data of the tested test piece in the whole flight process through the RS422 serial port and stores the data into a high-capacity Flash.
When the timing of the power timing sequence management chip reaches a preset full trajectory flight time threshold value, for example, 100s (which can be modified according to actual shooting conditions), the whole system is powered off, so that the system is subjected to a landing impact process when the system is powered off, and the safety and reliability of the system are improved.
And after the shot is recovered, electrifying the system again, detecting the writing state of the storage chip by the main control chip, reading the stored time and voltage value in a segmentation mode according to the input reading operation instruction, transmitting the read time and voltage value to the upper computer, and converting the voltage value into a correct sensor measurement value according to circuit design and actual measurement parameters so as to serve as reference data for shot characteristic analysis. Test data in the high-capacity Flash are read through the read instruction and are used for analyzing the working characteristics of the tested piece in the full trajectory, and a basis is provided for subsequent design improvement.
As shown in fig. 2, after the system is powered on, initialization of a part of peripheral devices is performed, where the part of peripheral devices is mainly used for communication with an upper computer and communication with a memory chip. And after the initialization is finished, detecting the flag bit to judge whether one-time trigger acquisition is finished, and if the internal data exists, waiting for a serial port instruction. The serial port instructions are divided into three categories: reading back data collected by each sensor, reading the ballistic data stored in the high-speed Flash, and converting the ballistic data into unit numerical values of the types to be measured through calculation; reading back the dynamic data of the tested piece, wherein the dynamic data is stored in a high-capacity Flash; and clearing data, setting the system to be in a state to be triggered, and preparing for the next test. And after each type of instruction is finished, sending a specific finishing mark to the upper computer. If the program is in the to-be-triggered mode, the peripheral equipment is further started, and the peripheral equipment is mainly used for communicating with the sensor and the tested piece. The system reads data acquired by high G value acceleration through scanning and judges whether the data reaches a set triggering threshold value. Before the trigger threshold value is not reached, the part of data is circularly stored in the cache, and the Flash storage space is not occupied. And after the system is triggered, sending a trigger signal to the time sequence management module, and controlling the switch according to the set power-on time periods of each part to finish time sequence control. And after triggering, entering a data acquisition stage, and storing the value of the sensor in Flash after AD conversion. The tested piece and the main system complete data transmission through the serial port and the DMA, and the transmission and the recording of large-capacity data are completed. After the timing is reached, each switch finishes the power-off, and the system realizes the power-off protection before falling to the ground.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.

Claims (7)

1. The utility model provides a high-overload missile-borne comprehensive parameter testing system, its characterized in that, including being fixed in the sensor module on the projectile body, sensor module includes acceleration sensor, the acceleration sensor signal is as system trigger signal connection chronogenesis management chip, chronogenesis management chip passes through power control switch and connects sensor module and is tested and test, test and test a connection master control chip, sensor module passes through signal conditioning module back and connects master control chip, memory chip is connected to master control chip, master control chip still connects chronogenesis management chip, and the power passes through voltage conversion chip and connects chronogenesis management chip and power control switch respectively.
2. The high overload missile-borne comprehensive parameter testing system according to claim 1, wherein the sensor module further comprises a temperature sensor and a pressure sensor, the temperature sensing head of the temperature sensor is exposed in the bottom device through the temperature measuring cavity, and the pressure measuring surface of the pressure sensor is connected with the bottom air chamber through the pressure measuring hole.
3. The high overload missile-borne comprehensive parameter testing system according to claim 1, wherein the timing management chip controls the sensor module to be powered off when the timing reaches a preset in-bore time threshold.
4. The high overload missile-borne parameter testing system according to claim 1, wherein the timing management chip controls the system to be powered off when the timing reaches a preset full ballistic flight time threshold.
5. The high overload missile-borne comprehensive parameter testing system according to claim 1, wherein the main control chip receives test data of a tested test piece through an RS422 serial port and stores the test data into a high-capacity Flash.
6. The high overload projectile loading integrated parameter testing system according to claim 5, wherein after the projectile is recovered, the control system is powered on, and the main control chip reads the stored time and voltage values in a segmented manner according to the input reading operation instruction after detecting the writing state of the storage chip and transmits the time and voltage values to the upper computer; and reading test data in the high-capacity Flash through the reading instruction.
7. The high overload missile-borne comprehensive parameter testing system according to claim 1, wherein the main control chip reads data acquired by acceleration through scanning, judges whether a set trigger threshold is reached, and circularly stores the acquired data in a cache when the trigger threshold is not reached; otherwise, sending a trigger signal to the time sequence management chip, controlling the switch according to the set power-on time period of each part, and finishing the time sequence control.
CN202010748389.3A 2020-07-30 2020-07-30 High-overload missile-borne comprehensive parameter testing system Pending CN111780612A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113340150A (en) * 2021-04-26 2021-09-03 中国人民解放军海军工程大学 Mechanical state measuring system of complex loading mechanism
CN114372333A (en) * 2022-03-23 2022-04-19 中国空气动力研究与发展中心超高速空气动力研究所 Design method for high-emission overload resistant test model external power module
CN115371504A (en) * 2022-08-31 2022-11-22 南京理工大学 Light and small impact overload testing device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113340150A (en) * 2021-04-26 2021-09-03 中国人民解放军海军工程大学 Mechanical state measuring system of complex loading mechanism
CN114372333A (en) * 2022-03-23 2022-04-19 中国空气动力研究与发展中心超高速空气动力研究所 Design method for high-emission overload resistant test model external power module
CN114372333B (en) * 2022-03-23 2022-05-24 中国空气动力研究与发展中心超高速空气动力研究所 Design method for high-emission overload resistant test model external power module
CN115371504A (en) * 2022-08-31 2022-11-22 南京理工大学 Light and small impact overload testing device
CN115371504B (en) * 2022-08-31 2024-04-23 南京理工大学 Light and small impact overload testing device

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