CN111778490B - Semiconductor device and lower electrode assembly thereof - Google Patents

Semiconductor device and lower electrode assembly thereof Download PDF

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Publication number
CN111778490B
CN111778490B CN202010674069.8A CN202010674069A CN111778490B CN 111778490 B CN111778490 B CN 111778490B CN 202010674069 A CN202010674069 A CN 202010674069A CN 111778490 B CN111778490 B CN 111778490B
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bottom wall
fixing plate
electrode assembly
positioning
lower electrode
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CN111778490A (en
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赵磊
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Beijing Naura Microelectronics Equipment Co Ltd
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Beijing Naura Microelectronics Equipment Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The embodiment of the application provides a semiconductor device and a lower electrode assembly thereof. The lower electrode assembly comprises a bearing device and a fastening assembly, wherein: the bearing device is arranged on the bottom wall in the cavity body of the semiconductor equipment; the adjustable end of the fastening component is arranged on the outer side of the bottom wall, and the non-adjustable end of the fastening component penetrates through the bottom wall to be connected with the bearing device and used for fixing the bearing device on the bottom wall. The embodiment of the application sets up the adjustable end of fastening component in the diapire outside of cavity body, when maintaining the change to bearing device, the position and the structure of fastening component clearly and definitely that maintainer can be clear to be convenient for maintain the dismouting of bearing device, and then improved bearing device's maintenance efficiency by a wide margin.

Description

Semiconductor device and lower electrode assembly thereof
Technical Field
The application relates to the technical field of semiconductor processing, in particular to a semiconductor device and a lower electrode assembly thereof.
Background
At present, physical Vapor Deposition (PVD) is widely used in the process of coating integrated circuit chips. The magnetron sputtering coating film is used as one of physical vapor deposition, and has the advantages of good compactness of formed film, easy control of deposition speed and thickness of the coating film, good repeatability, good uniformity of the coated film and the like. The magnetron sputtering coating is mainly characterized in that plasma is generated by discharging process gas in a process chamber, then cations of the plasma bombard a target material under the action of an electric field with negative voltage on the target material, atoms in the target material are bombarded out and migrate to the surface of a wafer placed on a base, and a layer of compact film is formed on the surface of the wafer. The base plays a role in supporting and clamping the wafer in the coating process, so that the position of the wafer is fixed. Meanwhile, in different magnetron sputtering coating processes, the base also has the function of heating or cooling the wafer.
Modern integrated circuit production lines tend to be miniaturized and intelligentized, one integrated circuit production line needs to have dozens or even hundreds of devices, and the device in a certain link has problems, so that the capacity of the whole integrated circuit production line is influenced. In addition, the equipment of the integrated circuit production line needs to be maintained regularly, so that the equipment can be operated and produced more safely and more efficiently, and a set of effective maintenance system is required to be established for the integrated circuit production line so as to ensure that the integrated circuit production line can operate in a high-efficiency low-cost system. In order to ensure the high efficiency of maintenance, the equipment maintenance space of the integrated circuit production line is one of the most basic items. If the maintenance space of the pedestal in the magnetron sputtering device is too small, the maintenance is difficult for maintenance personnel. Therefore, the maintenance time of the whole integrated circuit equipment is influenced, and the capacity of the whole integrated circuit production line is finally influenced.
Disclosure of Invention
The present application provides a semiconductor device and a lower electrode assembly thereof, which are used to solve the technical problem of difficult maintenance in the prior art.
In a first aspect, an embodiment of the present application provides a lower electrode assembly of a semiconductor device, including a carrier and a fastening assembly, wherein: the bearing device is arranged on the bottom wall in the cavity body of the semiconductor equipment; the adjustable end of the fastening component is arranged on the outer side of the bottom wall, and the non-adjustable end of the fastening component penetrates through the bottom wall to be connected with the bearing device and used for fixing the bearing device on the bottom wall.
In an embodiment of the present application, the carrying device includes a mounting plate and a base, the mounting plate is disposed on the bottom wall in the chamber body, and the base is disposed on the mounting plate; the non-adjustable end of the fastener assembly is connected to the mounting plate through the bottom wall.
In an embodiment of the present application, the base includes a carrier and a lifting shaft that are integrated, and the carrier is located in the chamber body and is used for carrying a workpiece to be processed; the bottom end of the lifting shaft penetrates through the mounting disc and then is positioned on the outer side of the cavity body; the bearing device also comprises a telescopic pipe, and the telescopic pipe is sleeved outside the lifting shaft and is positioned between the carrier and the mounting plate.
In an embodiment of the present application, the supporting device further includes a linear bearing and a sleeve, the linear bearing is sleeved outside the lifting shaft and located below the mounting plate; the sleeve is sleeved on the outer side of the linear bearing, the top end of the sleeve is connected with the mounting disc, and the linear bearing is used for achieving positioning between the mounting disc and the lifting shaft.
In an embodiment of the present application, a limiting groove is formed in a bottom surface of the mounting plate, and a top end of the linear bearing extends into the limiting groove for matching limiting; the inner wall of the bottom end of the sleeve is provided with a stop ring, and the stop ring is used for realizing the positioning between the sleeve and the linear bearing.
In an embodiment of the present application, the fastening assembly includes a fixing plate and a first fastening member, the fixing plate is disposed on the outer side of the bottom wall of the chamber body, the non-adjustable ends of the first fastening members penetrate through the fixing plate to be connected to the mounting plate, and the adjustable ends of the first fastening members are located on the outer side of the fixing plate.
In an embodiment of the present application, a first receiving groove is formed in a top surface of the fixing plate, and a first positioning pin is convexly disposed in the first receiving groove; the bottom surface of the mounting disc is provided with a first positioning hole; the bottom surface of the mounting disc is embedded into the first accommodating groove, and the first positioning pin extends into the first positioning hole to be matched and positioned.
In an embodiment of the present application, a second accommodating groove is formed in the bottom wall of the chamber body, and a second positioning hole is formed in the second accommodating groove; a second positioning pin is convexly arranged on the top surface of the fixing plate; the top surface of the fixing plate is embedded into the second accommodating groove, and the second positioning pin extends into the second positioning hole for matching positioning.
In an embodiment of the application, the carrying device further includes a lifting assembly, the lifting assembly is disposed on the fixing plate, and the lifting assembly is in transmission connection with the bottom end of the lifting shaft, and is used for driving the carrying platform to lift through the lifting shaft.
In a second aspect, embodiments of the present application provide a semiconductor device including a lower electrode assembly of the semiconductor device as provided in the first aspect.
The technical scheme provided by the embodiment of the application has the following beneficial technical effects:
the bearing device is arranged on the bottom wall in the cavity body, the adjustable end of the fastening assembly is arranged on the outer side of the bottom wall of the cavity body, and the non-adjustable end of the fastening assembly penetrates through the bottom wall of the cavity body and then is connected with the bearing device, so that the bearing device is fixed on the bottom wall of the cavity body. Because the adjustable end of the fastening component is arranged on the outer side of the bottom wall of the chamber body, maintenance personnel can clearly determine the position and the structure of the fastening component, so that the bearing device can be conveniently disassembled, assembled and maintained, and the maintenance efficiency of the lower electrode component is greatly improved.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic cross-sectional view of a chamber body provided in an embodiment of the present application;
fig. 2 is a schematic cross-sectional view of a carrier according to an embodiment of the present disclosure;
fig. 3 is a schematic perspective view of a carrying device according to an embodiment of the present disclosure;
fig. 4 is a schematic perspective view of a fixing plate according to an embodiment of the present disclosure;
fig. 5 is a schematic bottom structure view of a chamber body according to an embodiment of the present disclosure.
Detailed Description
The present application is described in detail below and examples of embodiments of the present application are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements with the same or similar functionality throughout. In addition, if a detailed description of the known art is not necessary for illustrating the features of the present application, it is omitted. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
It will be understood by those within the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
The following describes the technical solutions of the present application and how to solve the above technical problems with specific embodiments.
The embodiment of the application provides a lower electrode assembly of a semiconductor device. The structural schematic diagram of the lower electrode assembly is shown in fig. 1, and includes: the bearing device 2 and the fastening component 3; wherein: the bearing device 2 is arranged on the bottom wall 13 in the chamber body 1 of the semiconductor equipment; the adjustable end of the fastening component 3 is arranged outside the bottom wall 13, and the non-adjustable end of the fastening component 3 passes through the bottom wall 13 to be connected with the bearing device 2, so as to fix the bearing device 2 on the bottom wall 13.
As shown in fig. 1, the chamber body 1 is specifically a hollow structure made of a metal material, and it can be specifically used for performing a magnetron sputtering process, but the embodiment of the present application is not limited thereto, and a person skilled in the art can adjust the setting according to actual situations. The carrier 2 is arranged on a bottom wall 13 within the chamber body 1. The adjustable end of the fastening component 3 is arranged outside the bottom wall 13 of the chamber body 1, and the non-adjustable end of the fastening component 3 passes through the bottom wall 13 of the chamber body 1 and then is connected with the bearing device 2, so that the bearing device 2 is fixed on the bottom wall 13 of the chamber body 1.
The bearing device is arranged on the bottom wall in the cavity body, the adjustable end of the fastening assembly is arranged on the outer side of the bottom wall of the cavity body, and the non-adjustable end of the fastening assembly penetrates through the bottom wall of the cavity body and then is connected with the bearing device, so that the bearing device is fixed on the bottom wall of the cavity body. Because the adjustable end of the fastening assembly is arranged on the outer side of the bottom wall of the chamber body, maintenance personnel can clearly and clearly determine the position and the structure of the fastening assembly, so that the bearing device can be conveniently disassembled, assembled and maintained, and the maintenance efficiency of the lower electrode assembly is greatly improved.
It should be noted that the present embodiment does not limit the type of the chamber body 1 in which the lower electrode assembly is disposed, and the specific process performed, for example, the chamber body 1 may be a cylindrical structure made of stainless steel. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 1, the carrying device 2 includes a mounting plate 21 and a base 22, the mounting plate 21 is disposed on the bottom wall 13 in the chamber body, and the base 22 is disposed on the mounting plate 21; the non-adjustable end of the fastening assembly 2 is connected to the mounting plate 21 through the bottom wall 13.
As shown in fig. 1, the mounting plate 21 is a plate-like structure made of a metal material, and is disposed on the bottom wall 13 in the chamber body 1, and the susceptor 22 is disposed on the mounting plate 21 in the chamber body 1. The adjustable end of the fastening component 3 is arranged outside the bottom wall 13 of the chamber body 1, and the non-adjustable end of the fastening component 3 passes through the bottom wall 13 of the chamber body 1 and then is connected with the mounting disc 21, so that the mounting disc 21 is fixed on the bottom wall 13 of the chamber body 1. By adopting the design, the structure of the embodiment of the application is simple, so that the disassembly, assembly and maintenance efficiency is further improved.
In an embodiment of the present application, as shown in fig. 2, the base 22 includes a carrier 221 and a lifting shaft 222, which are integrally formed, the carrier 221 is located in the chamber body 1 for carrying a workpiece to be processed; the bottom end of the lifting shaft 222 passes through the mounting disc 21 and then is positioned outside the chamber body 1; the carrying device 2 further includes a telescopic tube 25, the telescopic tube 25 is sleeved on the lifting shaft 222 and is located between the carrier 221 and the mounting plate 21.
As shown in fig. 2, the base 22 is made of a metal material, the stage 221 and the lifting shaft 222 are integrally formed, a top surface of the stage 221 is used for bearing a workpiece to be processed, the workpiece to be processed may be a wafer, and the stage 221 can drive the workpiece to be processed to lift in the chamber body 1 and heat the workpiece to be processed, but the embodiment of the present application is not limited thereto. The top end of the lifting shaft 222 is connected to the bottom surface of the carrier 221, the bottom end of the lifting shaft 222 passes through the mounting plate 21 and then extends out of the chamber body 1, that is, the lifting shaft 222 is movably disposed on the mounting plate 21, and the lifting shaft 222 can move up and down relative to the mounting plate 21, so as to drive the carrier 221 to lift. Further, the telescopic tube 25 may be a metal corrugated tube, which is specifically sleeved outside the lifting shaft 222, a top end of the telescopic tube 25 may be connected to a bottom surface of the carrier 221 by welding, and a bottom end of the telescopic tube 25 may be connected to a top surface of the mounting plate 21 by welding. Since the elevating shaft 222 partially extends outside the chamber body 1, the bellows 25 is provided to isolate foreign substances, thereby preventing foreign substances from entering the chamber body 1. With the above design, the base 22 is of an integral structure, so that the carrying device 2 is simple in structure, and the telescopic tube 25 is arranged to prevent external impurities from entering the chamber body 1, thereby ensuring clean environment in the chamber body 1.
It should be noted that the embodiment of the present application is not limited to the specific structure of the base 22 and the connection manner with the extension tube 25, for example, a split structure may be adopted between the carrier 221 and the lifting shaft 222, and the base 22 and the extension tube 25 may be connected by a bolt connection or a snap connection. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 2, the supporting device 2 further includes a linear bearing 23 and a sleeve 24, the linear bearing 23 is sleeved outside the lifting shaft 222 and is located below the mounting plate 21; the sleeve 24 is sleeved outside the linear bearing 23, the top end of the sleeve 24 is connected with the mounting disc 21, and the linear bearing 23 is used for positioning between the mounting disc 21 and the lifting shaft 222. Alternatively, the linear bearing 23 is a straight cylindrical linear bearing 23.
As shown in fig. 2, the linear bearing 23 is a straight cylindrical linear bearing, that is, the linear bearing 23 does not include a flange, but is mounted on the mounting plate 21 through a sleeve 24. Specifically, the linear bearing 23 is sleeved outside the lifting shaft 222 and located below the mounting plate 21, that is, the bottom of the linear bearing 23 is located outside the chamber body 1, and the linear bearing 23 is used for limiting the lifting shaft 222 to lift in the vertical direction, so as to guide the lifting of the stage 221. Sleeve 24 specifically adopts metal hollow structure, and sleeve 24 is established by linear bearing 23's bottom cover, and its top is connected with the bottom surface of mounting disc 21, and for example sleeve 24's top is provided with the flange, and is provided with blind hole on the bottom surface of mounting disc 21, and the bolt is connected with blind hole on mounting disc 21 after passing through the flange at sleeve 24's top. Since the inner diameter of the sleeve 24 is matched with the outer diameter of the linear bearing 23, the linear bearing 23 realizes the positioning between the mounting disc 21 and the lifting shaft 222. With the above design, since the linear bearing 23 is directly positioned on the mounting plate 21 by the sleeve 24, the positioning accuracy between the mounting plate 21 and the lifting shaft 222 is greatly improved, so that the positioning accuracy of the susceptor 22 with respect to the chamber body 1 is high.
It should be noted that, in the embodiment of the present application, a connection manner between the sleeve 24 and the mounting plate 21 is not limited, for example, the sleeve 24 and the mounting plate 21 are connected by a screw connection manner or a snap connection manner. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 2 and 3, a limiting groove 211 is formed on the bottom surface of the mounting plate 21, and the top end of the linear bearing 23 extends into the limiting groove 211 for matching limiting; the inner wall of the bottom end of the sleeve 24 is provided with a stop ring 241, and the stop ring 241 is used for realizing the positioning between the sleeve 24 and the linear bearing 23.
As shown in fig. 2 and 3, an annular limiting groove 211 may be formed in the bottom surface of the mounting plate 21, the top end of the linear bearing 23 may extend into the limiting groove 211, and the limiting groove 211 is matched with the outer diameter of the top end of the linear bearing 23 to further limit the position of the linear bearing 23, so as to further improve the positioning accuracy of the base 22. The inner wall of the bottom end of the sleeve 24 is provided with a groove along the circumferential direction, and the stop ring 241 can be specifically an elastic buckle and is arranged in the groove to realize the positioning between the sleeve 24 and the linear bearing 23, namely the positioning of the linear bearing 23 in the vertical direction. With the above design, the positioning accuracy of the base 22 can be further improved because the bottom surface of the mounting plate 21 is provided with the limit groove 211. In addition, the stop ring 241 is arranged, so that the linear bearing 23 is more convenient to disassemble, and the maintenance efficiency of the embodiment of the application is improved.
It should be noted that the embodiment of the present application is not limited to the case that the stop ring 241 must be disposed inside the sleeve 24, and for example, the bottom end of the sleeve 24 can also be directly closed to achieve the above function. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 1 and 4, the fastening assembly 3 includes a fixing plate 31 and a first fastening member 32, the fixing plate 31 is disposed outside the bottom wall 13 of the chamber body 1, the non-adjustable ends of the first fastening members 32 pass through the fixing plate 31 to be connected to the mounting plate 21, and the adjustable ends of the first fastening members 32 are located outside the fixing plate 31.
As shown in fig. 1 and 4, the fixing plate 31 is a plate-shaped structure made of a metal material. The fixed plate 31 is disposed outside the bottom wall 13 of the chamber body 1 and is attached to the bottom wall 13, and the non-adjustable ends of the first fasteners 32 are connected to blind holes in the bottom surface of the mounting plate 21 after passing through the through holes of the fixed plate 31. The adjustable ends of the plurality of first fasteners 32 are located outside the fixed plate 31. The first fastening member 32 may be made of a bolt, a threaded portion of a top of a shank of the bolt is a non-adjustable end of the first fastening member 32, and a nut portion of the bolt is an adjustable end of the first fastening member 32, but the embodiment of the present invention is not limited thereto. Adopt above-mentioned design, only can be fixed in bearing device 2 on cavity body 1's bottom 13 through fixed plate 31 and a plurality of first fastener 32, it is simple structure convenient to detach not only, but also all set up cavity body 1's the outside by fixed plate 31 and first fastener 32's adjustable end, so that dismantle fastening component 3 from cavity body 1 outside, then directly take out bearing device 2 in by cavity body 1 again, thereby the dismouting maintenance efficiency has been improved by a wide margin, and then semiconductor equipment's productivity has been improved by a wide margin.
Optionally, the fastening assembly 3 further comprises a plurality of second fasteners 33, and the non-adjustable ends of the plurality of second fasteners 33 pass through the through holes of the fixing plate 31 and then are connected with the blind holes of the bottom wall 13 of the chamber body 1 to fix the fixing plate 31 on the bottom wall 13 of the chamber body 1. The second fastening member 33 is identical in structure to the first fastening member 32, and thus, will not be described in detail. By adopting the design, the second fastening piece can further improve the stability and the positioning precision of the bearing device.
In the embodiment of the present application, the material and shape of the fixing plate 31 are not limited, and for example, the fixing plate 31 may have a rectangular structure made of stainless steel. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 3 and 4, a first receiving slot 311 is formed on a top surface of the fixing plate 31, and a first positioning pin 312 is disposed in the first receiving slot 311; a first positioning hole 212 is formed in the bottom surface of the mounting plate 21; the bottom surface of the mounting plate 21 is inserted into the first receiving groove 311, and the first positioning pin 312 is inserted into the first positioning hole 212 for positioning.
As shown in fig. 3 and 4, a circular first receiving groove 311 is formed in the top surface of the fixing plate 31, for example, a circular protruding block is disposed on the top surface of the fixing plate 31, the circular protruding block and the top surface of the fixing plate 31 surround to form the first receiving groove 311, the first receiving groove 311 is used for receiving and limiting the mounting plate 21, and the mounting plate 21 may specifically adopt a flange, but the embodiment of the present application is not limited thereto. Two first positioning pins 312 symmetrically disposed are protruded into the first receiving slot 311, and the first positioning pins 312 may be integrally protruded from the top surface of the fixing plate 31, but the embodiment of the present invention is not limited thereto. Two first positioning holes 212 corresponding to the first positioning pins 312 are formed in the bottom surface of the mounting plate 21, and the first positioning holes 212 may be blind holes. In practical application, the bottom surface of the mounting disc 21 is embedded into the first receiving groove 311, and the outer peripheral surface of the mounting disc 21 is attached to the inner side surface of the first receiving groove 311, and the two cooperate to limit the position of the base 22; further, the first positioning pin 312 on the fixing plate 31 extends into the first positioning hole 212 on the bottom surface of the mounting plate 21, and the two pins cooperate to position the base 22. With the above design, the mounting plate 21 is positioned with the fixing plate 31 by the cooperation of the first receiving groove 311, the first positioning pin 312 and the first positioning hole 212, so as to ensure the positioning accuracy of the base 22 and the chamber body 1.
It should be noted that, the embodiment of the present application does not limit the specific arrangement manner of the first positioning pins 312, for example, the plurality of first positioning pins 312 are uniformly distributed in the first receiving slot 311, and the first positioning holes 212 and the first positioning pins 312 are correspondingly arranged. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 4 and 5, a second receiving groove 11 is formed on the bottom wall of the chamber body 1, and a second positioning hole 12 is formed in the second receiving groove 11; the top surface of the fixing plate 31 is convexly provided with a second positioning pin 313; the top surface of the fixing plate 31 is embedded in the second receiving groove 11, and the second positioning pin 313 extends into the second positioning hole 12 for matching and positioning.
As shown in fig. 4 and 5, the bottom wall 13 of the chamber body 1 is provided with a polygonal second receiving groove 11, for example, the bottom wall 13 of the chamber body 1 is provided with a second receiving groove 11 in a concave manner, and the specific shape of the second receiving groove may correspond to the shape of the fixing plate 31, but the embodiment of the present invention is not limited thereto. Two second positioning holes 12 symmetrically disposed are further formed in the second receiving slot 11, and the second positioning holes 12 may be blind holes, but the embodiment of the present invention is not limited thereto. The top surface of the fixing plate 31 is convexly provided with two second positioning pins 313 corresponding to the second positioning holes 12, the positions of the two second positioning pins 313 are located outside the first receiving slot 311 of the fixing plate 31, and the two second positioning pins 313 may be arranged along the length direction of the fixing plate 31, but the embodiment of the present application is not limited thereto, as long as the positions of the second positioning pins 313 and the second positioning holes 12 are correspondingly arranged. In practical application, the top surface of the fixing plate 31 is embedded into the second receiving groove 11, and the outer peripheral surface of the fixing plate 31 is attached to the inner side surface of the second receiving groove 11, and the fixing plate 31 and the inner side surface are matched to limit the position of the fixing plate 31; further, a second positioning pin 313 located on the fixing plate 31 extends into a second positioning hole 12 located on the bottom wall of the chamber body 1, and the two positioning pins cooperate to position the fixing plate 31. With the above design, the fixing plate 31 is matched with the chamber body 1 through the second accommodating groove 11, the second positioning pin 313 and the second positioning hole 12, so that the fixing plate 31 and the chamber body 1 are positioned, the mounting disc 21 and the fixing plate 31 are further positioned, and the positioning accuracy of the base 22 and the chamber body 1 is further ensured.
It should be noted that, in the embodiment of the present application, the specific arrangement manner of the second positioning pins 313 is not limited, for example, the plurality of second positioning pins 313 are uniformly distributed on the fixing plate 31, as long as the second positioning pins 313 are arranged corresponding to the positions of the second positioning holes 12. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
In an embodiment of the present application, as shown in fig. 1 and fig. 2, the carrying device 2 further includes a lifting assembly 26, the lifting assembly 26 is disposed on the fixing plate 31, and the lifting assembly 26 is in transmission connection with a bottom end of the lifting shaft 222 for driving the carrier 221 to lift through the lifting shaft 222. The lifting assembly 26 is specifically a servo motor and a screw mechanism, the lifting assembly 26 is disposed on the fixing plate 31 in a bolt connection manner, and the lifting assembly 26 is in transmission connection with the bottom end of the lifting shaft 222. In practical applications, the lifting assembly 26 drives the lifting shaft 222 to move linearly relative to the linear bearing 23, so as to lift the stage 221 and the workpiece to be processed carried on the stage 221. By adopting the design, the movement precision of the base 22 is high, and the application cost can be effectively reduced. It should be noted that the embodiment of the present application is not limited to a specific type of the lifting assembly 26, and for example, the lifting assembly 26 may also adopt a telescopic cylinder mechanism. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust the settings according to actual situations.
Based on the same inventive concept, embodiments of the present application provide a semiconductor device including a lower electrode assembly of the semiconductor device as provided in the above embodiments.
By applying the embodiment of the application, at least the following beneficial effects can be realized:
the bearing device is arranged on the bottom wall in the cavity body, the adjustable end of the fastening assembly is arranged on the outer side of the bottom wall of the cavity body, and the non-adjustable end of the fastening assembly penetrates through the bottom wall of the cavity body and then is connected with the bearing device, so that the bearing device is fixed on the bottom wall of the cavity body. Because the adjustable end of the fastening component is arranged on the outer side of the bottom wall of the chamber body, maintenance personnel can clearly determine the position and the structure of the fastening component, so that the bearing device can be conveniently disassembled, assembled and maintained, and the maintenance efficiency of the lower electrode component is greatly improved.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The foregoing is only a partial embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations should also be regarded as the protection scope of the present application.

Claims (9)

1. A lower electrode assembly of a semiconductor device, comprising a carrier and a fastening assembly, wherein:
the bearing device is arranged on the bottom wall in the cavity body of the semiconductor equipment;
the adjustable end of the fastening component is arranged on the outer side of the bottom wall, and the non-adjustable end of the fastening component penetrates through the bottom wall to be connected with the bearing device and is used for fixing the bearing device on the bottom wall;
the bearing device comprises a mounting disc and a base, the mounting disc is arranged on the bottom wall in the cavity body, and the base is arranged on the mounting disc;
the non-adjustable end of the fastener assembly is connected to the mounting plate through the bottom wall.
2. The lower electrode assembly of claim 1, wherein the base includes a platform and a lift shaft of unitary construction, the platform being located within the chamber body for carrying a workpiece to be machined; the bottom end of the lifting shaft penetrates through the mounting disc and then is positioned on the outer side of the cavity body; the bearing device also comprises a telescopic pipe which is sleeved outside the lifting shaft and is positioned between the carrier and the mounting plate.
3. The lower electrode assembly of claim 2, wherein the carrier further comprises a linear bearing and a sleeve, the linear bearing is sleeved outside the lift shaft and located below the mounting plate; the sleeve is sleeved on the outer side of the linear bearing, the top end of the sleeve is connected with the mounting disc, and the linear bearing is used for achieving positioning between the mounting disc and the lifting shaft.
4. The lower electrode assembly according to claim 3, wherein the bottom surface of the mounting plate is provided with a limiting groove, and the top end of the linear bearing extends into the limiting groove to be matched and limited; the inner wall of the bottom end of the sleeve is provided with a stop ring, and the stop ring is used for realizing the positioning between the sleeve and the linear bearing.
5. The lower electrode assembly according to any one of claims 1 to 4, wherein the fastening assembly includes a fixing plate and first fastening members, the fixing plate is disposed outside the bottom wall of the chamber body, the non-adjustable ends of the first fastening members penetrate the fixing plate to be coupled to the mounting plate, and the adjustable ends of the first fastening members are disposed outside the fixing plate.
6. The lower electrode assembly according to claim 5, wherein the top surface of the fixing plate defines a first receiving groove, and a first positioning pin is disposed in the first receiving groove; the bottom surface of the mounting disc is provided with a first positioning hole; the bottom surface of the mounting disc is embedded into the first accommodating groove, and the first positioning pin extends into the first positioning hole to be matched and positioned.
7. The bottom electrode assembly of claim 5, wherein the bottom wall of the chamber body defines a second receiving cavity, and the second receiving cavity defines a second positioning hole; a second positioning pin is convexly arranged on the top surface of the fixing plate; the top surface of the fixing plate is embedded into the second accommodating groove, and the second positioning pin extends into the second positioning hole for matching and positioning.
8. The bottom electrode assembly of claim 5, wherein the carrier further comprises a lifting assembly disposed on the fixing plate and drivingly connected to the bottom end of the lifting shaft for driving the carrier to move up and down via the lifting shaft.
9. A semiconductor device comprising the lower electrode assembly according to any one of claims 1 to 8.
CN202010674069.8A 2020-07-14 2020-07-14 Semiconductor device and lower electrode assembly thereof Active CN111778490B (en)

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