CN111770405A - Earphone set - Google Patents
Earphone set Download PDFInfo
- Publication number
- CN111770405A CN111770405A CN202010544604.8A CN202010544604A CN111770405A CN 111770405 A CN111770405 A CN 111770405A CN 202010544604 A CN202010544604 A CN 202010544604A CN 111770405 A CN111770405 A CN 111770405A
- Authority
- CN
- China
- Prior art keywords
- earphone
- microphone
- moving iron
- silica gel
- bone conduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 57
- 210000000988 bone and bone Anatomy 0.000 claims abstract description 42
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000000741 silica gel Substances 0.000 claims abstract description 38
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 38
- 229910052742 iron Inorganic materials 0.000 claims abstract description 13
- 238000004026 adhesive bonding Methods 0.000 claims description 10
- 229920001296 polysiloxane Polymers 0.000 claims description 10
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 210000005069 ears Anatomy 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1016—Earpieces of the intra-aural type
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1091—Details not provided for in groups H04R1/1008 - H04R1/1083
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R11/00—Transducers of moving-armature or moving-core type
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/02—Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electromagnetism (AREA)
- Headphones And Earphones (AREA)
Abstract
The invention discloses an earphone, which comprises an earphone face shell, an earphone main shell, an earplug, a lead, a bone conduction microphone, an integrated silica gel sleeve, a moving iron unit and a pickup microphone module, wherein the earphone face shell is arranged on the earphone main shell; the earplug is sleeved on the sound outlet pipeline of the earphone face shell, and an air bag for inserting the human ear is arranged on the earplug; the moving iron unit and the bone conduction microphone are respectively welded on core wires of the wires, the moving iron unit and the bone conduction microphone are assembled in the integrated silica gel sleeve, and the bone conduction microphone is positioned above the moving iron unit; the earphone panel shell is assembled above the integrated silica gel sleeve; a microphone hole communicated with the bone conduction microphone is formed in the integrated silica gel sleeve, the microphone hole is opposite to a microphone hole position on the earphone face shell, and the microphone hole is communicated with the air bag; the flexible pipe of integrated silica gel cover assembles in going out the sound pipeline, is equipped with the moving iron sound outlet pipe that goes out with moving iron unit intercommunication in the flexible pipe, and the moving iron sound outlet pipe just goes out the main phonate hole on the earphone face-piece. The earphone has good environment noise reduction effect and can meet the requirement of an application scene with larger noise.
Description
Technical Field
The invention relates to the technical field of earphones, in particular to an earphone.
Background
With the development and progress of information technology, various technical products are continuously entering into people's daily life, wherein, an earphone is widely used as an audio output device in people's daily life, and has become an essential device.
In an application scenario with relatively large environmental noise, for example, in places such as airport ground service, shopping malls, and industrial environments, the conventional earphone cannot meet the requirements of the application scenario with relatively large noise because the ambient noise cannot hear the voice of the other party at all and the voice cannot be sent out in a conversation state.
Disclosure of Invention
The invention aims to provide an earphone with a good environment noise reduction effect so as to meet the requirement of an application scene with high noise.
An earphone comprises an earphone face shell and an earphone main shell, and further comprises an earplug, a lead, a bone conduction microphone, an integrated silica gel sleeve, a moving iron unit and a pickup microphone module;
the earplug is sleeved on the sound outlet pipeline of the earphone face shell, and an air bag for inserting human ears is arranged on the earplug;
the moving iron unit and the bone conduction microphone are respectively welded on a core wire of the lead, the moving iron unit and the bone conduction microphone are both assembled in the integrated silica gel sleeve, and the bone conduction microphone is positioned above the moving iron unit;
the earphone face shell is assembled above the integrated silica gel sleeve;
a microphone hole communicated with the bone conduction microphone is formed in the integrated silica gel sleeve, the microphone hole is over against a microphone hole on the earphone face shell, and the microphone hole is communicated with the air bag;
the flexible pipe integrated with the silica gel sleeve is assembled in the sound outlet pipeline, a moving iron sound outlet pipe communicated with the moving iron unit is arranged in the flexible pipe, and the moving iron sound outlet pipe is over against a main sound outlet hole in the earphone panel shell;
the integrated silica gel cover, the wire, the pickup microphone module group are all installed in the earphone main shell.
According to the earphone, the moving iron unit and the bone conduction microphone are integrated in the integrated silica gel sleeve, the microphone hole communicated with the bone conduction microphone is arranged in the integrated silica gel sleeve, the microphone hole is over against the microphone hole on the earphone face shell, the transmitting definition of the bone conduction microphone can be improved, meanwhile, the hose integrated with the silica gel sleeve is assembled in the sound outlet pipeline, a moving iron sound outlet pipe communicated with the moving iron unit is arranged in the hose, the moving iron sound outlet pipe is opposite to the main sound outlet hole on the earphone face shell, and the air bag on the earplug is inserted into the ear of a person, so that the air bag can vibrate along with the vibration of the ear when the person speaks to form pressure difference acoustics, thereby adjusting the stroke of the air bag, the air in the air bag is stressed and compressed, the air bag is communicated with the microphone hole, the earphone can transmit and receive sound clearly in a place with high noise, and can well meet the requirement of an application scene with high noise.
In addition, the earphone provided by the invention can also have the following additional technical characteristics:
further, the surface of integrated silica gel cover and earphone face shell contact is the plane.
Further, the earphone further comprises a bone conduction pipe cover plate, the bone conduction pipe cover plate is installed above the earphone face shell, and the bone conduction pipe cover plate is connected with the integrated silica gel sleeve.
Further, the bone conduction tube cover plate is connected with the integrated silica gel sleeve in a gluing mode.
Furthermore, a steel mesh is arranged in the sound outlet pipeline.
Further, the moving iron unit and the bone conduction microphone are assembled in the integrated silica gel sleeve in a gluing mode.
Furthermore, the earphone further comprises a main shell cover plate, a cover plate mounting opening is formed in the main shell of the earphone, and the main shell cover plate is assembled in the cover plate mounting opening.
Further, the main shell cover plate is assembled in the cover plate mounting opening in an adhesive applying mode.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is an exploded view of a headset according to an embodiment of the present invention;
fig. 2 is a schematic structural view of an assembled earphone according to an embodiment of the present invention;
FIG. 3 is a cross-sectional view taken along the plane A-A in FIG. 2;
FIG. 4 is an enlarged view of area II of FIG. 3;
fig. 5 is a schematic structural view of an integrated silicone sleeve (a moving iron unit and a bone conduction microphone are assembled in the integrated silicone sleeve);
fig. 6 is a cross-sectional view taken along the plane B-B in fig. 5.
Detailed Description
In order to make the objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. Several embodiments of the invention are presented in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical," "horizontal," "left," "right," "up," "down," and the like are for illustrative purposes only and do not indicate or imply that the referenced device or element must be in a particular orientation, constructed or operated in a particular manner, and is not to be construed as limiting the present invention.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 6, an earphone according to an embodiment of the present invention includes an earphone face shell 11, an earphone main shell 12, an earplug 13, a wire 14, a bone conduction microphone 15, an integrated silicone sleeve 16, a moving iron unit 17, a pickup microphone module 18, a bone conduction tube cover plate 19, a main shell cover plate 20, and an end buckle 21.
The earplug 13 is sleeved on the sound outlet pipe 111 of the earphone face shell 11, and an air bag 131 for inserting human ears is arranged on the earplug 13.
The moving iron unit 17 and the bone conduction microphone 15 are respectively welded on the core wire of the lead 14, and then an end buckle 21 is arranged on the lead 14.
The moving iron unit 17 and the bone conduction microphone 15 are both assembled in the integrated silica gel sleeve 16, and the bone conduction microphone 15 is located above the moving iron unit 17. Optionally, the moving iron unit 17 and the bone conduction microphone 15 are assembled in the integrated silica gel sleeve 16 in a gluing manner.
The earphone face shell 11 is assembled above the integrated silica gel sleeve 16. Preferably, the surface of the integrated silica gel sleeve 16 contacting the earphone face shell 11 is a plane, so that the attaching effect is ensured.
A microphone hole 161 communicated with the bone conduction microphone 15 is formed in the integrated silica gel sleeve 16, the microphone hole 161 is right opposite to a microphone hole position on the earphone face shell 11, and the microphone hole 161 is communicated with the air bag 131.
The hose 162 of the integrated silica gel sleeve 16 is assembled in the sound outlet pipeline 111, a moving iron sound outlet pipe 163 communicated with the moving iron unit 17 is arranged in the hose 162, and the moving iron sound outlet pipe 163 is over against the main sound outlet hole on the earphone panel shell 11.
The integrated silica gel cover 16, the wire 14 and the pickup microphone module 18 are all installed in the earphone main shell 12, and the earphone face shell 11 is located above the earphone main shell 12.
The bone conduction pipe cover plate 19 is installed above the earphone face shell 11, and the bone conduction pipe cover plate 19 is connected with the integrated silica gel sleeve 16. Optionally, the bone conduction tube cover plate 19 is connected with the integrated silica gel sleeve 16 in a gluing manner.
The earphone main casing 12 is provided with a cover plate mounting opening 121, and the main casing cover plate 20 is assembled in the cover plate mounting opening 121. Optionally, the main casing cover plate 20 is assembled in the cover plate mounting opening 121 by gluing.
Preferably, a steel mesh (not shown) is disposed in the sound outlet pipe 111 for providing a dust-proof effect.
When the earphone is assembled, the moving iron unit 17 and the bone conduction microphone 15 are welded on a core wire of the lead 14, then the moving iron unit 17 is assembled into the integrated silica gel sleeve 16, then the bone conduction microphone 15 is also synchronously assembled into the integrated silica gel sleeve 16, finally sponge is added behind the moving iron unit 17, glue is applied, and silica gel is applied to the back of the bone conduction microphone 15, so that a semi-finished product integrating the moving iron unit 17 and the bone conduction microphone 15 is formed.
Then, the semi-finished product is assembled with the earphone face shell 11, the microphone hole 161 of the integrated silica gel sleeve 16 is aligned with the microphone hole position on the earphone face shell 11, the moving iron sound outlet pipe 163 is aligned with the main sound outlet hole of the earphone face shell 11, the hose 162 of the integrated silica gel sleeve 16 is placed in the sound outlet pipeline 111 of the earphone face shell 11, the middle combination part is finished by gluing, and then the bone conduit cover plate 19 and the earphone face shell 11 are assembled together by gluing.
According to the earphone provided by the embodiment, the moving iron unit 17 and the bone conduction microphone 15 are integrated in the integrated silicone sleeve 16, the microphone hole 161 communicated with the bone conduction microphone 15 is arranged in the integrated silicone sleeve 16, the microphone hole 161 is opposite to the microphone hole on the earphone face shell 11, the speech clarity of the bone conduction microphone can be improved, meanwhile, the flexible tube 162 of the integrated silicone sleeve 16 is assembled in the speech outlet pipe 111, the moving iron speech outlet pipe 163 communicated with the moving iron unit 17 is arranged in the flexible tube 162, the moving iron speech outlet pipe 163 is opposite to the main speech outlet on the earphone face shell 11, the air bag 131 on the earplug 13 is inserted into the ear of a person, therefore, the air bag 131 can vibrate along with the vibration of the ear when the person speaks to form pressure difference acoustics, so that the stroke of the air bag 131 is adjusted, the air in the air bag 131 is compressed by force, and the air bag 131 is communicated with the microphone hole 161, so that the earphone can clearly transmit and receive sound in a place with high noise, the method can well meet the requirements of application scenes with large noise.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (8)
1. An earphone comprises an earphone face shell and an earphone main shell, and is characterized by further comprising earplugs, a lead, a bone conduction microphone, an integrated silica gel sleeve, a moving iron unit and a pickup microphone module;
the earplug is sleeved on the sound outlet pipeline of the earphone face shell, and an air bag for inserting human ears is arranged on the earplug;
the moving iron unit and the bone conduction microphone are respectively welded on a core wire of the lead, the moving iron unit and the bone conduction microphone are both assembled in the integrated silica gel sleeve, and the bone conduction microphone is positioned above the moving iron unit;
the earphone face shell is assembled above the integrated silica gel sleeve;
a microphone hole communicated with the bone conduction microphone is formed in the integrated silica gel sleeve, the microphone hole is over against a microphone hole on the earphone face shell, and the microphone hole is communicated with the air bag;
the flexible pipe integrated with the silica gel sleeve is assembled in the sound outlet pipeline, a moving iron sound outlet pipe communicated with the moving iron unit is arranged in the flexible pipe, and the moving iron sound outlet pipe is over against a main sound outlet hole in the earphone panel shell;
the integrated silica gel cover, the wire, the pickup microphone module group are all installed in the earphone main shell.
2. The earphone according to claim 1, wherein the surface of the integrated silicone sleeve contacting the earphone face shell is a plane.
3. The headset of claim 1, further comprising a bone-conduit cover plate mounted over the headset face shell, the bone-conduit cover plate and the integrated silicone sleeve being connected together.
4. The earphone according to claim 3, wherein the bone-conduction tube cover plate is connected with the integrated silicone sleeve by gluing.
5. The earphone according to claim 1, wherein a steel mesh is provided in the sound outlet duct.
6. The headset of claim 1, wherein the moving-iron unit and the bone-conduction microphone are both mounted within the integrated silicone sleeve by gluing.
7. The headset of claim 1, further comprising a main housing cover, wherein the headset main housing has a cover mounting opening, and wherein the main housing cover fits into the cover mounting opening.
8. The headset of claim 7, wherein the main housing cover is mounted in the cover mounting opening by gluing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010544604.8A CN111770405B (en) | 2020-06-15 | 2020-06-15 | Earphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010544604.8A CN111770405B (en) | 2020-06-15 | 2020-06-15 | Earphone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111770405A true CN111770405A (en) | 2020-10-13 |
| CN111770405B CN111770405B (en) | 2024-07-26 |
Family
ID=72721260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010544604.8A Active CN111770405B (en) | 2020-06-15 | 2020-06-15 | Earphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111770405B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113382332A (en) * | 2021-05-14 | 2021-09-10 | 江西联创宏声电子股份有限公司 | Earphone set |
| CN113709612A (en) * | 2021-08-03 | 2021-11-26 | 江西联创宏声电子股份有限公司 | In-ear earplug and earphone |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190297406A1 (en) * | 2016-05-30 | 2019-09-26 | Goertek Inc. | Wind noise prevention microphone and earphone cable control apparatus |
| CN209882011U (en) * | 2018-03-29 | 2019-12-31 | 诸爱道 | Noise-reducing and radiation-proof earphone |
| CN210274472U (en) * | 2019-10-12 | 2020-04-07 | 江西联创宏声电子股份有限公司 | Earphone set |
| CN212486747U (en) * | 2020-06-15 | 2021-02-05 | 江西联创宏声电子股份有限公司 | Earphone set |
-
2020
- 2020-06-15 CN CN202010544604.8A patent/CN111770405B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190297406A1 (en) * | 2016-05-30 | 2019-09-26 | Goertek Inc. | Wind noise prevention microphone and earphone cable control apparatus |
| CN209882011U (en) * | 2018-03-29 | 2019-12-31 | 诸爱道 | Noise-reducing and radiation-proof earphone |
| CN210274472U (en) * | 2019-10-12 | 2020-04-07 | 江西联创宏声电子股份有限公司 | Earphone set |
| CN212486747U (en) * | 2020-06-15 | 2021-02-05 | 江西联创宏声电子股份有限公司 | Earphone set |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113382332A (en) * | 2021-05-14 | 2021-09-10 | 江西联创宏声电子股份有限公司 | Earphone set |
| CN113709612A (en) * | 2021-08-03 | 2021-11-26 | 江西联创宏声电子股份有限公司 | In-ear earplug and earphone |
| CN113709612B (en) * | 2021-08-03 | 2024-03-26 | 江西联创宏声电子股份有限公司 | In-ear earplug and earphone |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111770405B (en) | 2024-07-26 |
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