CN111757650A - Modular structure of cloud computing power server - Google Patents

Modular structure of cloud computing power server Download PDF

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Publication number
CN111757650A
CN111757650A CN202010653630.4A CN202010653630A CN111757650A CN 111757650 A CN111757650 A CN 111757650A CN 202010653630 A CN202010653630 A CN 202010653630A CN 111757650 A CN111757650 A CN 111757650A
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CN
China
Prior art keywords
water
cooling
board
plate
cooling plate
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Application number
CN202010653630.4A
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Chinese (zh)
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CN111757650B (en
Inventor
郑宏杰
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Shijiazhuang Yingbo Intelligent Technology Co ltd
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Shijiazhuang Yingbo Intelligent Technology Co ltd
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Priority to CN202010653630.4A priority Critical patent/CN111757650B/en
Publication of CN111757650A publication Critical patent/CN111757650A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds

Abstract

The invention provides a modular structure of a cloud computing power server, and belongs to the technical field of water-cooling heat dissipation equipment. Cloud computing power server's modular structure, including first water-cooling board, computing power board, second water-cooling board and chassis, computing power board sets up and constitutes module group between first water-cooling board and second water-cooling board, second water-cooling board and computing power board pass through the screw fixation on first water-cooling board, first water-cooling board fixed mounting makes second water-cooling board and computing power board unsettled set up on the chassis, be equipped with a plurality of groups module group on the chassis. According to the invention, the first water cooling plate is arranged on the chassis, and the force calculation plate and the second water cooling plate are arranged on the first water cooling plate, so that the second water cooling plate and the force calculation plate are in a suspended state relative to the chassis, and vibration is generated during transportation or operation, so that the whole vibration is completely transferred to the first water cooling plate, and the force calculation plate cannot be damaged due to the fact that staggered torsion is formed among the first water cooling plate, the second water cooling plate and the force calculation plate.

Description

Modular structure of cloud computing power server
Technical Field
The invention belongs to the technical field of water-cooling heat dissipation equipment, and particularly relates to a modular structure of a cloud computing power server.
Background
At present, a water-cooling heat dissipation device in a cloud computing power server comprises a computing power plate and a module structure formed by water-cooling plates arranged on two sides of the computing power plate, and when a plurality of groups of water-cooling heat dissipation devices are combined together, the plurality of groups of water-cooling heat dissipation devices are clamped together and fixed through a fixing and clamping frame.
The problem that above structure exists is, in transport or transportation, mutual extrusion between a plurality of groups water-cooling heat abstractor causes the damage of calculation board chip easily.
Disclosure of Invention
The invention provides a modular structure of a cloud computing power server, and aims to solve the problem that computing board chips are easily damaged due to extrusion in the carrying process of the cloud computing power server.
In order to achieve the purpose, the technical solution of the invention is as follows:
the utility model provides a modular structure of power server is calculated to cloud, includes first water-cooling board, calculates power board, second water-cooling board and chassis, calculate power board setting and constitute module group between first water-cooling board and second water-cooling board, second water-cooling board and calculate power board pass through the screw fixation on first water-cooling board, and first water-cooling board fixed mounting makes second water-cooling board and calculation power board unsettled set up on the chassis, be equipped with a plurality of groups module group on the chassis.
Preferably, the chassis comprises a supporting plate and a fixing frame arranged on the supporting plate, the module group is arranged on the supporting plate, and two ends of the first water cooling plate are connected with the fixing frame through screws.
Preferably, the water separator further comprises a water separator, the water separator comprises a first-stage water inlet pipe and a first-stage water outlet pipe, a water inlet nozzle connected with the first water-cooling plate and the second water-cooling plate is arranged on the first-stage water inlet pipe, a water outlet nozzle connected with the first water-cooling plate and the second water-cooling plate is arranged on the first-stage water outlet pipe, and screw holes used for being connected with the first water-cooling plate are further formed in the first-stage water inlet pipe and the first-stage water outlet pipe.
Preferably, the first water-cooling plate is provided with a screw hole connected with the water separator, a first water inlet and a first water outlet, the first water-cooling plate is connected with the first-stage water inlet pipe and the first-stage water outlet pipe through screws, and a sealing ring is arranged at the joint of the first water inlet and the first-stage water inlet pipe and the joint of the first water outlet and the first-stage water outlet pipe; and a second water inlet and a second water outlet are arranged on the second water cooling plate, and the second water inlet and the second water outlet are connected with the first-stage water inlet pipe and the first-stage water outlet pipe through hoses.
Preferably, the water cooling device further comprises a tray, wherein the tray is arranged above the module group and is connected with the first water cooling plate.
Preferably, a power supply and a controller are placed on the tray, and the power supply and the controller are connected with the force calculation board.
Preferably, a heat radiation fan is connected to the rear of each module group.
The invention has the beneficial effects that:
1. according to the invention, the first water cooling plate is arranged on the chassis, and the force calculation plate and the second water cooling plate are arranged on the first water cooling plate, so that the second water cooling plate and the force calculation plate are in a suspended state relative to the chassis. The second water cooling plate is in flexible connection with the first-stage water distributor through a hose, and vibrates when in transportation or operation, so that the whole vibration is completely transferred to the first water cooling plate, and the force calculating plate cannot be damaged due to staggered torsion formed among the first water cooling plate, the second water cooling plate and the force calculating plate.
2. The cloud computing power server is installed on the chassis in a modularized mode, batch production and machining are facilitated, and maintenance is convenient.
Drawings
Fig. 1 is a schematic structural view of the present invention.
FIG. 2 is a schematic diagram of a cloud computing power server component.
Fig. 3 is a schematic structural diagram of a primary water inlet pipe.
Fig. 4 is a schematic view of the structure of the tray of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components in a specific posture (as shown in the drawings), the cloud motion condition, etc., and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the technical solutions in the embodiments of the present invention may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination of technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 1 to 3, a modular structure of a cloud computing power server includes a first water-cooling plate 10, a computing power plate 20, a second water-cooling plate 30 and a chassis 40, where the computing power plate 20 is disposed between the first water-cooling plate 10 and the second water-cooling plate 30 to form a module group, the second water-cooling plate 30 and the computing power plate 20 are fixed on the first water-cooling plate 10 through screws, the first water-cooling plate 10 is fixedly mounted on the chassis 40 through screws, so that the second water-cooling plate 30 and the computing power plate 20 are suspended on the chassis 40, and the chassis 40 is provided with a plurality of module groups.
According to the invention, the first water-cooling plate 10 is arranged on the chassis 40, and the force calculation plate 20 and the second water-cooling plate 30 are arranged on the first water-cooling plate 10, so that the second water-cooling plate 30 and the force calculation plate 20 are in a suspended state relative to the chassis. When the force calculating plate is transported or operated, the vibration is generated, so that the whole vibration is completely transferred to the first water cooling plate, and the force calculating plate cannot be damaged due to the fact that staggered torsion is formed among the first water cooling plate, the second water cooling plate and the force calculating plate.
Preferably, the chassis 40 includes a supporting plate 41 and a fixing frame 42 disposed on the supporting plate, the module group is disposed on the supporting plate, and two ends of the first water-cooling plate are connected to the fixing frame through screws.
Preferably, the water separator 50 is further included, the water separator 50 includes a first-stage water inlet pipe 51 and a first-stage water outlet pipe 52, the first-stage water inlet pipe 51 is provided with a water inlet nozzle 511 connected with the first water-cooling plate 10, a water inlet nozzle 512 connected with the second water-cooling plate 30, a screw hole 513 connected with the first water-cooling plate, and a water inlet nozzle 514 connected with the second-stage water separator; a water outlet nozzle connected with the first water cooling plate 10 and the second water cooling plate 30 and a water outlet nozzle 521 connected with the secondary water separator are arranged on the primary water outlet pipe 52; and screw holes used for being connected with the first water cooling plate are further formed in the first-stage water inlet pipe and the first-stage water outlet pipe. Preferably, the first water cooling plate 10 is provided with a screw hole 11 connected with the water separator, a first water inlet 12 and a first water outlet 13, the first water cooling plate is connected with the first-stage water inlet pipe and the first-stage water outlet pipe through screws, and a sealing ring is arranged at the joint of the first water inlet and the first-stage water inlet pipe and the joint of the first water outlet and the first-stage water outlet pipe; and a second water inlet 31 and a second water outlet 32 are arranged on the second water cooling plate, and the second water inlet 31 and the second water outlet 32 are connected with a first-level water inlet pipe 51 and a first-level water outlet pipe 52 through hoses. This application is installed the water knockout drum on first water-cooling board, has both given the water knockout drum mounted position, has played the firm effect of enhancement again to first water-cooling board. In addition, it should be noted that the first water-cooling plate may also be configured to be connected with the water separator through a hose according to specific situations.
Fig. 3 is a structural diagram of the first-stage water inlet pipe 51, the first-stage water inlet pipe is provided with a water inlet nozzle 511 connected with the first water cooling plate, a water inlet nozzle 512 connected with the second water cooling plate, a joint of the first water inlet 12 on the first water cooling plate 10 and the first-stage water inlet pipe, and a joint of the first water outlet and the first-stage water outlet pipe is provided with a sealing ring. The first water cooling plate is connected with the first-stage water inlet pipe and the first-stage water outlet pipe through screws in a hard connection sealing mode, and meanwhile, the fixing reinforcing function is achieved. The first water cooling plate is arranged on the chassis, so that the second water cooling plate and the force calculation plate are in a suspended state relative to the chassis. The second water-cooling plate is in flexible connection with the first-level water separator through the hose, so that when vibration occurs in the transportation or operation process, the whole vibration can be completely transferred to the first water-cooling plate, staggered torsion force cannot be formed among the first water-cooling plate, the second water-cooling plate and the force calculating plate, and the circuit board is damaged.
Referring to fig. 4, several module groups and water dividers 20 may be placed on the chassis. The tray 60 is placed above the module group, and the tray 60 is arranged above the module group and connected with the first water cooling plate, so that the effect of stabilizing the first water cooling plate is further achieved. Preferably, a power supply, a controller and the like are placed on the tray, and the power supply and the controller are connected with the force calculation board. Preferably, a heat radiation fan is connected to the rear of each module group.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, or direct or indirect cloud applications in other related fields, which are made by using the contents of the present specification and the accompanying drawings, are included in the scope of the present invention.

Claims (7)

1. The utility model provides a modular structure of power server is calculated to cloud, its characterized in that, includes first water-cooling board, calculates power board, second water-cooling board and chassis, calculate power board setting and constitute the module group between first water-cooling board and second water-cooling board, second water-cooling board passes through the screw fixation with calculating power board on first water-cooling board, and first water-cooling board fixed mounting makes second water-cooling board and calculation power board unsettled set up on the chassis, be equipped with a plurality of groups module group on the chassis.
2. The modular structure of the cloud computing power server as claimed in claim 1, wherein the chassis comprises a supporting plate and a fixing frame arranged on the supporting plate, the module group is arranged on the supporting plate, and two ends of the first water-cooling plate are connected with the fixing frame through screws.
3. The modular structure of the cloud computing power server as claimed in claim 1, further comprising a water separator, wherein the water separator comprises a first-stage water inlet pipe and a first-stage water outlet pipe, a water inlet nozzle connected with the first water cooling plate and the second water cooling plate is arranged on the first-stage water inlet pipe, a water outlet nozzle connected with the first water cooling plate and the second water cooling plate is arranged on the first-stage water outlet pipe, and screw holes used for being connected with the first water cooling plate are further arranged on the first-stage water inlet pipe and the first-stage water outlet pipe.
4. The modular structure of the cloud computing power server as claimed in claim 3, wherein the first water-cooling plate is provided with a screw hole connected with the water separator, a first water inlet and a first water outlet, the first water-cooling plate is connected with the first-stage water inlet pipe and the first-stage water outlet pipe through screws, and a sealing ring is arranged at the joint of the first water inlet and the first-stage water inlet pipe and the joint of the first water outlet and the first-stage water outlet pipe; and a second water inlet and a second water outlet are arranged on the second water cooling plate, and the second water inlet and the second water outlet are connected with the first-stage water inlet pipe and the first-stage water outlet pipe through hoses.
5. The modular structure of the cloud computing power server of claim 1, further comprising a tray disposed above the module group and connected to the first water-cooled plate.
6. The modular structure of the cloud computing power server as claimed in claim 1, wherein a power supply and a controller are placed on the tray, and the power supply and the controller are connected with the computing power board.
7. The modular structure of the cloud computing power server as claimed in claim 1, wherein a heat dissipation fan is connected behind each set of modules.
CN202010653630.4A 2020-07-08 2020-07-08 Modular structure of cloud computing power server Active CN111757650B (en)

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Application Number Priority Date Filing Date Title
CN202010653630.4A CN111757650B (en) 2020-07-08 2020-07-08 Modular structure of cloud computing power server

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Application Number Priority Date Filing Date Title
CN202010653630.4A CN111757650B (en) 2020-07-08 2020-07-08 Modular structure of cloud computing power server

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CN111757650A true CN111757650A (en) 2020-10-09
CN111757650B CN111757650B (en) 2022-03-15

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007234791A (en) * 2006-02-28 2007-09-13 Fuji Electric Retail Systems Co Ltd Electronic apparatus cooling device
CN203369018U (en) * 2013-06-04 2013-12-25 佳承精工股份有限公司 Multi-piece type water-cooling radiator structure
CN107567248A (en) * 2017-09-08 2018-01-09 中微冷却技术（深圳）有限公司 Liquid-cooling heat radiator
CN207706065U (en) * 2017-12-20 2018-08-07 卧龙电气集团辽宁荣信电气传动有限公司 A kind of high power water cooling power cell
CN110780722A (en) * 2019-11-29 2020-02-11 深圳杰微芯片科技有限公司 Water-cooling heat dissipation ore digging machine

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007234791A (en) * 2006-02-28 2007-09-13 Fuji Electric Retail Systems Co Ltd Electronic apparatus cooling device
CN203369018U (en) * 2013-06-04 2013-12-25 佳承精工股份有限公司 Multi-piece type water-cooling radiator structure
CN107567248A (en) * 2017-09-08 2018-01-09 中微冷却技术（深圳）有限公司 Liquid-cooling heat radiator
CN207706065U (en) * 2017-12-20 2018-08-07 卧龙电气集团辽宁荣信电气传动有限公司 A kind of high power water cooling power cell
CN110780722A (en) * 2019-11-29 2020-02-11 深圳杰微芯片科技有限公司 Water-cooling heat dissipation ore digging machine

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