CN111756879B - Under-screen camera shooting assembly and corresponding terminal equipment - Google Patents

Under-screen camera shooting assembly and corresponding terminal equipment Download PDF

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Publication number
CN111756879B
CN111756879B CN201910241353.3A CN201910241353A CN111756879B CN 111756879 B CN111756879 B CN 111756879B CN 201910241353 A CN201910241353 A CN 201910241353A CN 111756879 B CN111756879 B CN 111756879B
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China
Prior art keywords
screen
under
camera
area
layer
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CN201910241353.3A
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CN111756879A (en
Inventor
吴旭东
景燎
刘思远
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Ningbo Sunny Opotech Co Ltd
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Ningbo Sunny Opotech Co Ltd
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Priority to CN201910241353.3A priority Critical patent/CN111756879B/en
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to EP20778870.4A priority patent/EP3951758A4/en
Priority to PCT/CN2020/076574 priority patent/WO2020192337A1/en
Priority to US17/599,194 priority patent/US20220196890A1/en
Priority to PCT/CN2020/076575 priority patent/WO2020192338A1/en
Priority to US17/599,185 priority patent/US12075150B2/en
Priority to US17/599,220 priority patent/US11678554B2/en
Priority to EP20776698.1A priority patent/EP3952268A4/en
Priority to PCT/CN2020/076573 priority patent/WO2020192336A1/en
Priority to EP20778412.5A priority patent/EP3952260A4/en
Publication of CN111756879A publication Critical patent/CN111756879A/en
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0264Details of the structure or mounting of specific components for a camera module assembly
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0266Details of the structure or mounting of specific components for a display module assembly
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/81Anodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The application provides a subassembly of making a video recording under screen includes: the display area of the organic light emitting diode display screen comprises an under-screen camera area and a non-under-screen camera area; wherein the pixel density of the under-screen image pickup region is set smaller than the pixel density of the non-under-screen image pickup region; and the optical axis of the camera module is vertical to the surface of the organic light-emitting diode display screen, and the camera module is positioned at the rear end of the camera area under the screen. The application also provides corresponding terminal equipment. This application can improve the light transmissivity in the region of making a video recording under the screen through the pixel density that reduces the region of making a video recording under the screen to the screen can needn't dodge the formation of image light path of the module of making a video recording through the trompil, in order to keep the completeness of display screen, wherein make a video recording under the screen region and the non-screen region of making a video recording can constitute complete picture jointly, really realizes the display effect of full-face screen.

Description

Under-screen camera shooting assembly and corresponding terminal equipment
Technical Field
The application relates to optical imaging technology and display technology, in particular to an under-screen camera assembly and a corresponding terminal device.
Background
In order to meet the camera shooting requirements of customers, electronic terminals including mobile phones generally have a camera shooting function. Therefore, the existing mobile phone terminal generally has a front-back camera module, and the front camera module is usually arranged on the same side of the display screen and used for meeting the self-photographing functions of a user. However, as the screen occupation ratio becomes larger, higher and higher requirements are also placed on the arrangement of the front camera.
In order to reduce the influence of the camera on the screen occupation ratio and realize the full-screen, different manufacturers develop various solutions from different angles. One technical direction is: arrange leading camera module at the cell-phone top frame, form the bang screen or the water droplet screen that are close to the full screen. The other technical direction is as follows: adopt telescopic camera module group so that hide and use the camera. When shooting is needed, the camera can be controlled to extend out of the shell of the mobile phone (or other electronic equipment) for shooting; after shooting, the camera retracts into the shell of the mobile phone (or other electronic equipment). However, when the camera is continuously extended or retracted and extends relative to the mobile phone (or other electronic devices), the camera is easily damaged by external impact, and is difficult to replace.
In the last months, some manufacturers have introduced an under-screen imaging scheme, commonly known as "punch screen". The technology comprises the following steps: and drilling a through hole or a blind hole on the display screen, and placing the front camera module at the through hole or behind the blind hole. The technology can omit a motor for stretching and retracting, and is beneficial to improving the reliability of products. However, in this technology, the "punched" position of the display screen cannot be used for displaying, so that the visual impact is insufficient, and the user experience still needs to be further improved.
On the other hand, in the field of display technology, an Organic Light Emitting Diode display screen (i.e., an OLED screen, wherein the OLED is an abbreviation of Organic Light-Emitting Diode) emits Light without a backlight, and the OLED screen is transparent to some extent. However, unlike glass, resin, etc. lens materials, the OLED screen has complex microstructures inside, which include a large number of light emitting structures fabricated on a substrate based on, for example, a semiconductor process, and corresponding microcircuit structures for controlling the light emitting structures. The complex microstructure inside the screen causes the light transmittance of the OLED screen to be far smaller than that of lens materials such as glass and resin. If set up leading the camera module in the rear end of current OLED screen, the OLED screen (though it has certain light transmissivity) still can form the shelter from leading the camera module, can't form images.
In conclusion, consumers are thirsty to seek a solution of a full screen, however, in the prior art, both the bang screen, the water drop screen, the 'punching screen' and the telescopic proactive scheme have respective defects. Therefore, there is an urgent need in the current market for an under-screen camera solution that can truly realize a full screen.
Disclosure of Invention
The present invention aims to provide a solution that overcomes at least one of the drawbacks of the prior art.
According to an aspect of the present invention, there is provided an under-screen camera assembly, comprising: organic light emitting diode display screen and module of making a video recording. The display area of the organic light emitting diode display screen comprises an under-screen camera area and a non-under-screen camera area; wherein the pixel density of the under-screen image pickup region is set smaller than the pixel density of the non-under-screen image pickup region. The optical axis of the camera module is perpendicular to the surface of the organic light-emitting diode display screen, and the camera module is located at the rear end of the camera area under the screen.
Wherein the pixel pitch of the under-screen image pickup region is set to be greater than the pixel pitch of the non-under-screen image pickup region, wherein the pixel pitch is a pitch between light emitting structures of adjacent pixels of the organic light emitting diode display panel.
Wherein, the organic light emitting diode display screen includes: a cathode layer, an electron injection layer, an electron transport layer, a light emitting layer, a hole transport layer, a hole injection layer, a buffer layer and an anode; wherein the light emitting layers are isolated to form a plurality of the pixels.
Wherein, in the under-screen image pickup region, the cathode layer has a light-passing groove at a position corresponding to the gap between the pixels.
The organic light emitting diode display screen also comprises a back plate film, and a light through groove is formed in the position, corresponding to the gap between the pixels, of the back plate film in the lower image pickup area of the screen.
Wherein, in the under-screen image pickup region, the anode is fabricated based on a nanowire process, and the anode is attached to the buffer layer.
The organic light-emitting diode display screen further comprises a TFT layer, wherein in the under-screen image pick-up region, the TFT layer is provided with a plurality of TFT switch units, and each TFT switch unit is positioned right below the light-emitting structure of the corresponding pixel.
Wherein, in the under-screen image pickup region, the TFT layer further has a plurality of contacts, and each contact is located at a gap between adjacent pixels.
Wherein the nano wire is a nano silver wire.
Wherein, camera module still includes under the screen: the first control unit is used for controlling the under-screen camera shooting area and the non-under-screen camera shooting area to display images in the non-working state of the camera shooting module; and controlling the display function of the shooting area under the screen to be closed under the working state of the shooting module.
The under-screen camera module further comprises a second control unit, wherein the second control unit is used for compensating the brightness of the under-screen camera area when the under-screen camera area and the non-under-screen camera area display images.
The under-screen camera shooting assembly further comprises a second control unit, wherein the second control unit is used for compensating display parameters of the under-screen camera shooting area when the under-screen camera shooting area and the non-under-screen camera shooting area display images, so that the displayed images are in smooth transition between the under-screen camera shooting area and the non-under-screen camera shooting area.
And the pixel size of the under-screen image pickup area is the same as that of the non-under-screen image pickup area.
According to another aspect of the application, a terminal device is further provided, and the terminal device comprises any one of the under-screen camera assemblies.
The camera module is used as a front camera module of the terminal equipment, and the organic light emitting diode display screen is used as a display panel on the front side of the terminal equipment.
Compared with the prior art, the application has at least one of the following technical effects:
1. this application can improve the regional light transmissivity of making a video recording under the screen through the pixel density that reduces the regional of making a video recording under the screen to the screen can needn't dodge the formation of image light path of the module of making a video recording through the trompil, with the completeness that keeps the display screen.
2. In the application, the under-screen camera area and the non-under-screen camera area (also referred to as the under-screen non-camera area) can jointly form a complete picture, and the display effect of the full screen is really realized.
3. The utility model provides a subassembly of making a video recording under screen is particularly suitable for being used for the smart mobile phone, and the module of making a video recording in the subassembly of making a video recording under this screen is particularly suitable for the leading module of making a video recording as the smart mobile phone.
4. This application can set up the light-passing groove through the pixel clearance to cathode layer and/or backplate film and improve the regional luminousness of making a video recording under the screen in the display screen to the quantity of light entering that makes the module of making a video recording satisfies the requirement of formation of image, has still avoided cathode layer and/or backplate film to be thin simultaneously, helps guaranteeing OLED's performance and yield.
5. According to the application, the ITO can be replaced by the nano silver wires (or other nano wires) to serve as the anode layer, and the transmittance is improved.
6. This application can set up the contact on TFT layer in the clearance position between the pixel, helps avoiding passing through the incident light in pixel clearance like this and is blockked more.
7. According to the method and the device, the brightness (and/or other display parameters) of the under-screen camera area can be compensated, so that the under-screen camera area can be well integrated into the surrounding non-under-screen camera area, the image displayed on the screen can be complete and continuous, and users can obtain extremely shocking visual enjoyment.
Drawings
Exemplary embodiments are illustrated in referenced figures of the drawings. The embodiments and figures disclosed herein are to be regarded as illustrative rather than restrictive.
FIG. 1 illustrates a cross-sectional schematic view of an underscreen camera assembly of one embodiment of the present application;
FIG. 2 shows a schematic top view of the OLED display of FIG. 1;
FIG. 3 shows a schematic diagram of a circuit structure of a single pixel in an embodiment of the present application;
fig. 4 is a schematic cross-sectional view of an organic light emitting diode display panel according to an embodiment of the present application, showing a single pixel in an off-screen image pickup region.
Detailed Description
For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that the detailed description is merely illustrative of exemplary embodiments of the present application and does not limit the scope of the present application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.
It should be noted that the expressions first, second, etc. in this specification are used only to distinguish one feature from another feature, and do not indicate any limitation on the features. Thus, a first body discussed below may also be referred to as a second body without departing from the teachings of the present application.
In the drawings, the thickness, size, and shape of an object have been slightly exaggerated for convenience of explanation. The figures are purely diagrammatic and not drawn to scale.
It will be further understood that the terms "comprises," "comprising," "includes," "including," "has," "including," and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Moreover, when a statement such as "at least one of" appears after a list of listed features, the entirety of the listed features is modified rather than modifying individual elements in the list. Furthermore, when describing embodiments of the present application, the use of "may" mean "one or more embodiments of the present application. Also, the term "exemplary" is intended to refer to an example or illustration.
As used herein, the terms "substantially," "about," and the like are used as terms of table approximation and not as terms of table degree, and are intended to account for inherent deviations in measured or calculated values that will be recognized by those of ordinary skill in the art.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
FIG. 1 shows a schematic cross-sectional view of an underscreen camera assembly of an embodiment of the present application. Referring to fig. 1, the under-screen camera module includes an organic light emitting diode display screen 100 (i.e., an OLED screen) and a camera module 200 located at a rear end of the organic light emitting diode display screen 100. The optical axis ax of the camera module 200 is substantially perpendicular to the surface 101 of the oled display 100. Here, the "rear end" refers to an end of the imaging optical path of the camera module 200 close to the image side. The camera module 200 is located at the rear end of the under-screen camera area 120 of the oled display 100. The off-screen camera area 120 is an area of the oled display 100 adapted to the camera module 200. Further, fig. 2 shows a schematic top view of the organic light emitting diode display panel of fig. 1. Referring to fig. 2, the display area of the organic light emitting diode display screen includes an off-screen image pickup area 120 and a non-off-screen image pickup area 110. The under-screen camera area 120 may be circular and may be sized to fit the size of the camera module 200. The off-screen capture area 120 may be surrounded by the non-off-screen capture area 110. In this embodiment, the pixel density of the under-screen imaging region 120 (sometimes referred to as PPI in the industry, which is collectively referred to as Pixels Per inc) is set to be smaller than the pixel density of the non-under-screen imaging region 110, so as to improve the light transmittance of the under-screen imaging region 120. Therefore, the imaging light path of the camera module can be avoided by punching the screen, and the display screen can be kept complete. Moreover, since the light-emitting structure and the corresponding microcircuit can be reserved, the image display can be performed in the under-screen image pickup area 120 when the image pickup module is not used. The off-screen camera area 120 and the non-off-screen camera area 110 can jointly form a complete picture, and the display effect of a full screen is really realized. The subassembly of making a video recording under the screen of this embodiment is particularly suitable for being used for the smart mobile phone, and the module of making a video recording in the subassembly of making a video recording under this screen is particularly suitable for the leading module of making a video recording as the smart mobile phone.
Further, in an embodiment of the present application, a pixel pitch of the under-screen image capturing region 120 is set to be greater than a pixel pitch of the non-under-screen image capturing region 110, wherein the pixel pitch is a pitch between light emitting structures of adjacent pixels of the organic light emitting diode display panel 100. To better understand the essence of the present embodiment, the following describes the specific structure of the organic light emitting diode display panel with reference to the drawings. Fig. 3 shows a schematic circuit diagram of a single pixel in an embodiment of the present application. Referring to fig. 3, in this embodiment, the oled display 100 sequentially includes, from the back end to the front end (from top to bottom in fig. 3): a cathode layer 131, an electron injection layer 132, an electron transport layer 133, a light emitting layer 134, a hole transport layer 135, a hole injection layer 136, a buffer layer 137, and an anode 138. In this embodiment, the organic light emitting diode display panel 100 emits light from the anode 138 side. The anode 138 is thus located at the front end and the cathode layer 131 at the rear end. The front end refers to one end, close to an object, in an imaging light path of the camera module, and the rear end refers to one end, close to an image, in the imaging light path of the camera module. In fabricating the organic light emitting diode display panel 100, an anode 138, a buffer layer 137, a hole injection layer 136, a hole transport layer 135, a light emitting layer 134, an electron transport layer 133, an electron injection layer 132, and a cathode layer 131 may be sequentially fabricated on a substrate 140. The cover plate 141 may be further formed on the upper surface of the cathode layer 131. It should be noted that in other embodiments of the present application, the oled display 100 may emit light from the cathode layer 131 side, where the cathode layer 131 is located at the front end and the anode 138 is located at the rear end. In this embodiment, the non-under-screen image capture area 110 and the under-screen image capture area 120 may both have the above structure, but the microstructure inside the under-screen image capture area 120 may be specially designed to improve the light transmittance. In the under-screen imaging region 120 of the present embodiment, for a single pixel, the light-emitting layer 134 may be formed in a groove, for example, when a lower layer structure of the light-emitting layer 134 is formed, the lower layer structure may be formed as a groove, the light-emitting layer 134 is formed at the bottom of the groove, and the depth of the groove is greater than the height of the light-emitting layer 134. And sidewalls of the groove may be inclined and sidewalls of the pixel isolation layer may be formed on the basis of the sidewalls of the groove. In the case of the display panel emitting light from the anode, the lower layer structure of the light emitting layer 134 may be the electron transport layer 133, and in the case of the display panel emitting light from the cathode, the lower layer structure of the light emitting layer 134 may be the hole transport layer 135. Further, the light emitting layer 134 may be separated by a buffer layer 137 for the entire screen, thereby forming a plurality of the pixels. The buffer layer 137 may be insulating. Buffer layer 137 may prevent hole transport to the organic/metal cathode interface from causing quenching of light. The buffer layer 137 has a higher light transmittance than the light emitting structure. The gaps between the pixels are mainly composed of the cathode layer 131 and the buffer layer 137. In this embodiment, the pixel pitch of the under-screen image capture region 120 is increased (for example, the pixel pitch of the under-screen image capture region is set to be greater than the pixel pitch of the non-under-screen image capture region), so that more light can pass through the gap between the pixels (mainly composed of the cathode layer 131 with a relatively large light transmittance, the buffer layer 137, and the anode 138), and thus the light incident amount of the image capture module at the rear end of the under-screen image capture region is increased, and the image capture module can capture an image through the organic light emitting diode display screen. It should be noted that although in the above embodiments, the gap between the pixels includes the cathode layer 131 and the buffer layer 137, the present application is not limited thereto, for example, in another embodiment of the present application, the gap between the pixels may include only the buffer layer 137, and may also include the cathode layer 131, the buffer layer 137, and the anode 138 (which may also be referred to as an anode layer). However, in any case, the light transmittance at the gap position between the pixels (which means the entire light transmittance of the screen from the upper surface to the lower surface) is greater than the light transmittance at the pixel light emitting structure position (which means the entire light transmittance of the screen from the upper surface to the lower surface).
Further, in one embodiment of the present application, in the under-screen image pickup region, a position of the cathode layer corresponding to the gap between the pixels has a light passing groove. Herein, the inter-pixel gap may be understood as a gap between light emitting structures of adjacent pixels. In this embodiment, the cathode layer has a light-passing groove, which can further increase the light transmittance of the gap between the light-emitting structures of the adjacent pixels. Specifically, the cathode layer material of the organic light emitting diode display screen is generally an alloy with active properties (low work function, easy electron release), the light transmittance of the organic light emitting diode display screen is relatively low, it is difficult to improve the transmittance by changing the cathode material, a certain transmittance can be improved by thinning the cathode material, but the performance and yield of the organic light emitting diode display screen are affected by the cathode which is too thin. In this embodiment, set up the light-passing groove in order to promote the transmissivity at the cathode layer that corresponds to the position in pixel clearance, can promote the regional luminousness of making a video recording under the screen under the prerequisite of assurance performance and yield.
Further, in an embodiment of the present application, the oled display panel further includes a back plate film, and a light-passing groove is formed in a position of the back plate film corresponding to the gap between the pixels in the under-panel imaging region. Herein, the inter-pixel gap may be understood as a gap between light emitting structures of adjacent pixels. In this embodiment, the back plate film has a light-passing groove, so that the light transmittance of the gap between the light-emitting structures of the adjacent pixels can be further increased.
Further, in one embodiment of the present application, in the under-screen image pickup region, the anode is fabricated based on a nanowire process (refer to the description of patent document CN 201510069596.5), and the anode is attached to the buffer layer. In the prior art, the anode of the organic light emitting diode display screen is usually ITO conductive glass. It is made up by using several methods of sputtering and evaporation plating to coat a layer of indium tin oxide (commonly known as ITO) film for making circuit conduction. In order to improve the light transmittance, a nano conductive structure such as a nano silver wire may be used instead of ITO to improve the transmittance. A nano-silver wire is a conductive wire of nanometer scale that can be used to make ultra-small circuits. In addition to having excellent conductivity, it also has excellent light transmittance due to a size effect of a nanometer scale. For example, at 10nm, the haze of the nanowires is only 0.2% (the higher the haze, the lower the film gloss and transparency), and the nanowires also have bending resistance and are more suitable for high light transmittance and flexible organic light emitting diode screens.
Further, fig. 4 is a schematic cross-sectional view illustrating an off-screen image pickup area of an organic light emitting diode display panel including a TFT layer according to an embodiment of the present application. Referring to fig. 4, in the present application, the organic light emitting diode display panel further includes a TFT layer (the TFT is collectively called a Thin Film Transistor, and may be called a Thin Film Transistor). In the under-screen image pickup region, the TFT layer includes a TFT switching unit 150, a storage capacitor 152, and a contact 153 (sometimes referred to as an auxiliary electrode or as a contact region). And each of the TFT switching units 150 may correspond to a pixel (or it may be understood that each of the TFT switching units 150 corresponds to a light emitting structure 130, and the TFT switching units 150 may be regarded as control structures of the corresponding pixels). The TFT switching unit 150 may be located directly below its corresponding light emitting structure 130. In other words, the TFT switching unit 150 may overlap or partially overlap with its corresponding light emitting structure 130 in a top view. And the corresponding contacts 153 of the TFT switching unit 150 are arranged at the gap positions 160 between the adjacent pixels. In other words, the contacts are arranged directly below the gap between adjacent light emitting structures. In the TFT layer, the contact 153 is usually used to electrically connect with the light emitting structure located on the upper layer or the conductive layer on the upper surface of the TFT unit, so the structure above the contact is usually simple, for example, a groove (or referred to as a via) may be formed above the contact, and the groove is used to attach the conductive nanowire 157c and/or the cathode 131 of the light emitting structure 130 (based on the groove, the cathode 131 may be conducted with the contact 153 through the conductive nanowire 157c, or the cathode 131 may be directly contacted with the contact 153 to conduct the two). The recess may be filled with the material of the cap plate 141, and since the cap plate 141 may be formed of a material having high light transmittance, the contact 153 and a region corresponding to the recess above the contact have good light transmittance. Arrange contact 153 in the clearance position between adjacent pixel, can avoid seeing through the incident light in pixel clearance by blockking more to promote the whole luminousness of screen, promote the light inlet volume of the module of making a video recording. Further, still referring to fig. 4, in the present embodiment, the TFT switching unit 150 includes a gate electrode 151, a source electrode 155, and a drain electrode 156, wherein the gate electrode 151 has a buffer layer 154a and a channel groove 154b thereon. Wherein the buffer layer 154a may also cover the storage capacitor 152. In this embodiment, the drain electrode 156 and the source electrode 155 are both located on the upper surface of the channel groove 154b, wherein the drain electrode 156 may be located on the right side, the source electrode 155 may be located on the left side, and the gap therebetween may be filled with the second buffer layer 158. The material of the third buffer layer 154 may be identical to that of the second buffer layer 158. Note that the channel groove 154b may be turned on when the gate electrode 151 is applied with an on signal, and the channel groove 154b is insulated when the gate electrode 151 is not applied with an on signal. The drain electrode 156 and the source electrode 155 may be formed of a multi-layer structure, but these details may be completely consistent with the prior art, and are irrelevant to the subject matter of the present application, and thus will not be described herein. In this embodiment, the top of the TFT switching unit 150 may have a conductive layer, so that the TFT switching unit 150 is electrically connected to the light emitting structure 130. The conductive layer on top of the TFT switching unit 150 may be an ITO layer. In a preferred embodiment, the ITO layer may be replaced with conductive nanowires to further enhance light transmittance. Specifically, top surfaces of the drain 156 and the source 155 are connected to the nanowires 157a and 157b, and the drain 156 and the source 155 are separated from the light emitting structure 130 above by a third buffer layer 159. The anode 138 of the light emitting structure 130 may be in communication with the nanowire 157b through the via 138a, and further in communication with the source 155. Note that a specific internal structure of the light emitting structure 130 is not shown in fig. 4, and in this embodiment, the light emitting structure 130 may include a hole injection layer 136, a hole transport layer 135, a light emitting layer 134, an electron transport layer 133, and an electron injection layer 132 (refer to fig. 3). In addition, the light emitting structure may further include a buffer layer 137 (refer to fig. 3) between the anode 138 and the hole injection layer 136. In this embodiment, the light emitting structures 130 of the adjacent pixels may be separated by the pixel defining layer 160. The pixel defining layer 160 may be made of an organic material having a good light transmittance. The top of the light emitting structure 130 may be further covered with an insulating layer to form a cap plate 141. In this embodiment, the transmittance of the external incident light can be improved by designing the contact position of the TFT layer.
Further, in an embodiment of the present application, the under-screen camera module further includes: the first control unit is used for controlling the under-screen camera shooting area and the non-under-screen camera shooting area to display images in the non-working state of the camera shooting module; and controlling the display function of the shooting area under the screen to be closed under the working state of the shooting module. In a region where the display function is turned off (for example, an under-screen image pickup region), the light-emitting layer of each pixel does not emit light, and thus stray light from the display screen does not affect image pickup at the time of image pickup by the module. When shooting, the non-under-screen shooting area can display images completely; it is also possible that no image is displayed in the peripheral area surrounding the under-screen image pickup area (i.e., the light-emitting layers of the pixels in the peripheral area do not emit light), and the image is displayed in the remaining portion. For example, when the camera module under the screen is applied to a smart phone, when the smart phone calls a front camera, the first control unit can close the display function of the camera area under the screen in the screen (i.e., the camera area under the screen is not lighted), so that the external light can penetrate through the camera area under the screen and be received by the front camera. Because the light transmittance of the screen can be improved by improving the camera shooting area, the light entering amount of the front camera can reach the standard of effective imaging. Meanwhile, the non-under-screen shooting area of the screen can still work so as to display the picture shot by the front camera, so as to better take a picture (for example, a human face image is displayed by the non-under-screen shooting area when a self-timer shot is taken) or take a video (for example, a corresponding image is displayed by the non-under-screen shooting area when a video conference is carried out). In this embodiment, the first control unit may be disposed in an operating system or an application of a mobile phone (or other terminal devices), or may be implemented as a part of a display driving circuit.
Further, in an embodiment of the present application, the under-screen image capturing assembly further includes a second control unit, which is configured to compensate brightness of the under-screen image capturing area when the under-screen image capturing area and the non-under-screen image capturing area both display images. In this embodiment, in order to increase the light-entering amount of the camera module, the pixel density of the under-screen image capture region (sometimes referred to as PPI in the industry, which is collectively referred to as Pixels Per inc) is set to be smaller than the pixel density of the non-under-screen image capture region. Note that in the present application, the reason why the pixel density of the off-screen imaging region is set to be relatively low is to increase the pixel pitch, and therefore, the light-emitting surface per unit area in the off-screen imaging region may be reduced, which may cause a decrease in luminance of the off-screen imaging region (that is, the luminance of the off-screen imaging region is lower than that of the non-off-screen imaging region). If the brightness of the under-screen camera area is not compensated, the brightness of the front camera module position may be significantly low although an image can be displayed when the whole screen is displayed, and the position (the front camera module position) may form a dark spot (i.e. form a block with brightness significantly lower than that of the surrounding area) when the front camera module position is compared with the surrounding non-under-screen camera area. Such dark spots may be visually noticeable to the user, thereby affecting the user experience. Based on the above analysis, it can be seen that the second control unit is used to compensate the brightness of the off-screen image capturing region in the present embodiment, so that the dark spots caused by the increase of the pixel pitch of the off-screen image capturing region can be eliminated or suppressed. Here, the compensation for the brightness may be a software-level compensation, for example, an adaptive adjustment at an operating system level or an application level of the mobile phone (or other terminal device). For example, the brightness of the under-screen image pickup area is increased in a software adjustment mode so as to be consistent with the surrounding non-under-screen image pickup area, and therefore dark spots in the under-screen image pickup area are eliminated or suppressed. In this way, the user can see a complete screen and a complete and continuous image displayed on the screen, and very shocking visual enjoyment is obtained. Of course, the brightness of the under-screen image pickup region may be compensated for by the display driving circuit. Note that in another embodiment of the present application, it is also possible to achieve the luminance per unit area of the under-screen image pickup region being equal to the luminance per unit area of other regions (i.e., non-under-screen image pickup regions) by using TFTs (i.e., thin film transistor switches below the light-emitting layer of each pixel) in the under-screen image pickup region, thereby achieving the compensation of the luminance of the under-screen image pickup region. I.e. the second control unit may be implemented at the hardware level of the display screen.
Further, it is noted that since the under-screen imaging region makes many improvements for increasing the transmittance, there may be other differences in the display effect than the non-under-screen imaging region in addition to the brightness. For example, since the off-screen imaging region is improved by a large amount to increase the transmittance, other display parameters such as the contrast of the off-screen imaging region may be changed, and a boundary may be formed between the off-screen imaging region and the non-off-screen imaging region due to the change. If such boundaries are easily noticed by the human eye, the displayed image may be incomplete and discontinuous, and the visual effect of the full screen may be compromised. Based on the above analysis, in an embodiment of the present application, the under-screen image capturing assembly further includes a second control unit, configured to compensate display parameters of the under-screen image capturing area when the under-screen image capturing area and the non-under-screen image capturing area both display images, so that the displayed images are smoothly transitioned between the under-screen image capturing area and the non-under-screen image capturing area, so that the under-screen image capturing area and the non-under-screen image capturing area can form a complete and continuous picture, and there is no boundary that is easily noticed by naked eyes between the under-screen image capturing area and the non-under-screen image capturing area in the picture. The compensation of the display parameters of the under-screen camera area may be a software-level compensation, for example, an adaptive adjustment at an operating system level or an application level of a mobile phone (or other terminal device). Of course, the display parameters of the under-screen image pickup region may be compensated for in the display driving circuit. The display parameters may include brightness, contrast.
Further, in an embodiment of the present application, a pixel size of the under-screen image pickup region is the same as a pixel size of the non-under-screen image pickup region. The pixel size herein refers to the size of the light emitting structure. Under the design, the under-screen camera shooting area and the non-under-screen camera shooting area can share a plurality of manufacturing processes and manufacturing equipment, and the improvement of the production efficiency and the improvement of the yield are facilitated. It should be noted that in other embodiments of the present application, the pixel size of the under-screen image capturing region and the pixel size of the non-under-screen image capturing region may also be different. The pixel density of the image pickup area under the screen is reduced, so that the distance between pixels can be improved, and the transmittance of the image pickup area under the screen is improved.
Further, in an embodiment of the present application, there is also provided a terminal device, which includes the under-screen camera module described in any of the foregoing embodiments. The camera module can be used as a front camera module of the terminal equipment, and the organic light emitting diode display screen can be used as a display panel on the front side of the terminal equipment.
Pixel density (PPI) herein is sometimes also referred to as display density.
The above description is only a preferred embodiment of the present application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.

Claims (12)

1. Subassembly of making a video recording under screen, its characterized in that includes:
the display area of the organic light emitting diode display screen comprises an under-screen camera area and a non-under-screen camera area; wherein the pixel density of the under-screen image pickup region is set smaller than the pixel density of the non-under-screen image pickup region; and
the optical axis of the camera module is vertical to the surface of the organic light-emitting diode display screen, and the camera module is positioned at the rear end of the camera area under the screen; the camera module is a front camera for imaging;
the organic light-emitting diode display screen comprises a TFT layer, wherein in the under-screen image pick-up area, the TFT layer is provided with a plurality of TFT switch units, and each TFT switch unit is positioned right below the light-emitting structure of the corresponding pixel; and in the under-screen image pickup region, the TFT layer further has a plurality of contacts, and each contact is located at a gap between adjacent pixels;
in the under-screen image pickup area, a cathode layer and a nanowire serving as an anode are respectively arranged on the upper surface and the lower surface of each pixel, the cathode layer and the nanowire extend to and contact with a gap between adjacent pixels, and a light-passing groove is formed in the position of the cathode layer corresponding to the gap between the pixels;
grooves serving as through holes are formed in the contacts of the TFT layer, and the nanowires and/or the cathode layer are attached to the inclined side walls of the grooves;
the upper surface of the cathode layer is covered with a light transmissive material to form a cover plate, and the same material as the cover plate fills the grooves and covers the nanowires attached to the inclined sidewalls of the grooves and/or the upper surface of the cathode layer.
2. The under-screen camera assembly according to claim 1, wherein a pixel pitch of the under-screen camera area is set to be larger than a pixel pitch of the non-under-screen camera area, wherein the pixel pitch is a pitch between light emitting structures of adjacent pixels of the organic light emitting diode display screen.
3. The video camera module of claim 1, wherein the oled display comprises: the cathode layer, the electron injection layer, the electron transport layer, the light emitting layer, the hole transport layer, the hole injection layer, the buffer layer and the anode; wherein the light emitting layers are isolated to form a plurality of the pixels.
4. The under-screen image capturing assembly according to claim 3, wherein the OLED display further comprises a back plate film having light passing grooves at positions corresponding to the gaps between the pixels in the under-screen image capturing area.
5. The underscreen camera assembly according to claim 3, wherein in the underscreen camera region, the anode is fabricated based on a nanowire process and the anode is attached to the buffer layer.
6. The assembly of claim 5, wherein the nanowires are silver nanowires.
7. The underscreen camera assembly of claim 1, further comprising: the first control unit is used for controlling the under-screen camera shooting area and the non-under-screen camera shooting area to display images in the non-working state of the camera shooting module; and controlling the display function of the shooting area under the screen to be closed under the working state of the shooting module.
8. The underscreen camera assembly of claim 1, further comprising a second control unit configured to compensate for brightness of the underscreen camera region when both the underscreen camera region and the non-underscreen camera region display images.
9. The assembly of claim 1, further comprising a second control unit configured to compensate display parameters of the under-screen image capture area when the under-screen image capture area and the non-under-screen image capture area both display images, so that the displayed images transition smoothly between the under-screen image capture area and the non-under-screen image capture area.
10. The off-screen camera assembly of claim 1, wherein a pixel size of the off-screen camera area is the same as a pixel size of the non-off-screen camera area.
11. Terminal device, characterized in that it comprises an underscreen camera module according to any one of claims 1 to 10.
12. The terminal device according to claim 11, wherein the camera module is a front camera module of the terminal device, and the organic light emitting diode display screen is a display panel on a front surface of the terminal device.
CN201910241353.3A 2019-03-28 2019-03-28 Under-screen camera shooting assembly and corresponding terminal equipment Active CN111756879B (en)

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CN201910241353.3A CN111756879B (en) 2019-03-28 2019-03-28 Under-screen camera shooting assembly and corresponding terminal equipment
PCT/CN2020/076573 WO2020192336A1 (en) 2019-03-28 2020-02-25 Under-display camera assembly and corresponding terminal device
US17/599,194 US20220196890A1 (en) 2019-03-28 2020-02-25 Under-display camera assembly and corresponding terminal device
PCT/CN2020/076575 WO2020192338A1 (en) 2019-03-28 2020-02-25 Under-display camera assembly and corresponding terminal device
US17/599,185 US12075150B2 (en) 2019-03-28 2020-02-25 Under-screen camera assembly and corresponding terminal device
US17/599,220 US11678554B2 (en) 2019-03-28 2020-02-25 Under-display camera assembly and corresponding terminal device
EP20778870.4A EP3951758A4 (en) 2019-03-28 2020-02-25 Under-display camera assembly and corresponding terminal device
PCT/CN2020/076574 WO2020192337A1 (en) 2019-03-28 2020-02-25 Under-screen camera assembly and corresponding terminal device
EP20778412.5A EP3952260A4 (en) 2019-03-28 2020-02-25 Under-display camera assembly and corresponding terminal device
EP20776698.1A EP3952268A4 (en) 2019-03-28 2020-02-25 Under-screen camera assembly and corresponding terminal device

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