CN111739836A - Fixing mechanism for semiconductor chip processing - Google Patents
Fixing mechanism for semiconductor chip processing Download PDFInfo
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- CN111739836A CN111739836A CN202010634956.2A CN202010634956A CN111739836A CN 111739836 A CN111739836 A CN 111739836A CN 202010634956 A CN202010634956 A CN 202010634956A CN 111739836 A CN111739836 A CN 111739836A
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- mounting
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- rod
- moving block
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a fixing mechanism for processing a semiconductor chip, which comprises a base, a top plate, stand columns, mounting plates, fixing parts, a connecting plate and fixing rods, wherein the top end of the base is fixedly connected with the top plate; the mounting grooves are internally and respectively provided with a fixing piece, a connecting plate, mounting blocks, a push rod and a fixing rod, the fixing piece is of a rectangular frame structure, and the mounting blocks which are arranged in an L shape are fixedly welded at the four corners of the outer side of the fixing piece; the connecting plate is internally provided with an installation cavity, and a second sliding block, a push rod, a movable plate, a second motor and a second threaded rod are respectively arranged in the installation cavity. This fixed establishment is used in semiconductor chip processing, reasonable in design, convenient to use has the advantage of the adjustment of being convenient for.
Description
Technical Field
The invention belongs to the technical field of chip processing, and particularly relates to a fixing mechanism for processing a semiconductor chip.
Background
The semiconductor is a material with electric conductivity between a conductor and an insulator at normal temperature, and has wide application in radio, television and temperature measurement, for example, a diode is a device made of the semiconductor, the semiconductor is a material with controllable electric conductivity ranging from the insulator to the conductor, and a workbench is needed to process the chip in the process of processing the semiconductor chip.
But current workstation can't carry out effectual fixed to the position of chip, leads to when processing the chip, and the chip squints easily to cause machining error, and current workstation is not convenient for adjust, has reduced the practicality of workstation.
Disclosure of Invention
The present invention is directed to a fixing mechanism for semiconductor chip processing to solve the above-mentioned problems of the related art.
In order to achieve the purpose, the invention provides the following technical scheme: a fixing mechanism for processing a semiconductor chip comprises a base, a top plate, stand columns, mounting plates, fixing parts, a connecting plate and fixing rods, wherein the top end of the base is fixedly connected with the top plate;
the mounting grooves are internally and respectively provided with a fixing piece, a connecting plate, mounting blocks, a push rod and a fixing rod, the fixing piece is of a rectangular frame structure, and the mounting blocks which are arranged in an L shape are fixedly welded at the four corners of the outer side of the fixing piece;
an installation cavity is formed in the connecting plate, a second sliding block, a push rod, a movable plate, a second motor and a second threaded rod are arranged in the installation cavity respectively, the bottom end of the second motor is fixedly connected with the inner wall of the bottom end of the installation cavity, the top end of the second motor is connected with the bottom end of the second threaded rod, and one end, far away from the second motor, of the second threaded rod penetrates through the movable plate to be rotatably connected with the inner wall of the top end of the installation cavity;
the vertical column is provided with a groove for mounting the moving block, the moving block is provided with two groups in parallel relatively, two ends of the moving block are fixedly connected with first sliding blocks for adjusting the position of the moving block, the first sliding blocks are provided with a plurality of groups in parallel relatively, and one side of one group of the moving block, far away from the mounting plate, is fixedly provided with a first motor.
Preferably, the two ends of the movable plate are fixedly connected with second sliding blocks, the inner walls of the two sides of the connecting plate are provided with sliding grooves matched with the second sliding blocks, the movable plate is in threaded fit with a second threaded rod, one end of the push rod is fixedly connected with the movable plate, and one end of the push rod, far away from the movable plate, sequentially penetrates through the connecting plate and the fixing piece and is fixedly inserted on the fixing rod.
Preferably, connecting plate, dead lever and installation piece homogeneous phase are equipped with four groups relatively in parallel, the installation piece is through attacking screw fixed mounting on the mounting panel, and adjacent two sets of all be right angle structure between connecting plate, the dead lever and arrange, four groups connecting plate, dead lever enclose jointly and close out a set of spacing chamber that is used for injecing the chip position.
Preferably, the two ends of the mounting plate are fixedly connected with a first connecting rod and a second connecting rod respectively, one end, far away from the mounting plate, of the second connecting rod is provided with a jack matched with the rotating shaft, one end, far away from the mounting plate, of the first connecting rod is inserted into the other group of moving blocks, and bearings fixedly sleeved on the first connecting rod are embedded and mounted on the moving blocks.
Preferably, one end of the rotating shaft penetrates through the moving block to be connected with one end of the first motor, one end of the rotating shaft, which is far away from the first motor, is fixedly inserted into the inserting hole in the second connecting rod, and the moving block is embedded and installed with a bearing fixedly sleeved on the rotating shaft at the position where the rotating shaft is located.
Preferably, a motor casing is sleeved outside the first motor, one end of the motor casing is fixedly connected with the moving block, a power supply is fixedly installed at one end, far away from the moving block, of the motor casing, and the power supply is electrically connected with the first motor.
Preferably, the inner walls of the two sides of the groove are provided with moving grooves matched with the first sliding blocks, the moving grooves are relatively parallelly provided with a plurality of groups, the number of the moving grooves is consistent with that of the first sliding blocks, and the first sliding blocks are located in the moving grooves.
Preferably, still be equipped with first threaded rod in the shifting chute, first threaded rod bottom is passed the roof and is connected with the third motor top that is located the base inside, first threaded rod top is passed first slider and is connected with shifting chute top inner wall rotation, first threaded rod and first slider screw-thread fit.
The invention has the technical effects and advantages that: this fixed establishment is used in semiconductor chip processing, the second motor can drive the second threaded rod and rotate, screw-thread fit through second threaded rod and fly leaf, thereby make the fly leaf can promote the dead lever through the push rod and move towards the direction of chip, and then be convenient for prescribe a limit to the position of chip, one side fixed glue that the dead lever is close to spacing chamber has the silica gel pad, spacing chamber is convenient for prescribe a limit to the position of chip, first slider is located the shifting chute, thereby the movable block of being convenient for removes, and then be convenient for highly adjust the mounting panel, through first motor, a rotating shaft, the design of head rod and second connecting rod, thereby be convenient for adjust the orientation of mounting panel, this fixed establishment is used in semiconductor chip processing, and reasonable design, high durability and convenient use have the advantage of being convenient for adjust.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a perspective view of the mounting plate of the present invention;
FIG. 3 is a schematic view of the internal structure of the motor casing according to the present invention;
FIG. 4 is a schematic view of the internal structure of the connecting plate of the present invention;
figure 5 is a perspective view of the moving mass of the present invention.
In the figure: the device comprises a base 1, a top plate 2, a first threaded rod 3, a moving block 4, a rotating shaft 5, a motor shell 6, a moving groove 7, a vertical column 8, a mounting plate 9, a fixing part 10, a connecting plate 11, a mounting groove 12, a mounting block 13, a push rod 14, a fixing rod 15, a first connecting rod 16, a second connecting rod 17, a jack 18, a first sliding block 19, a bearing 20, a first motor 21, a power supply 22, a sliding groove 23, a second sliding block 24, a mounting cavity 25, a second threaded rod 26, a second motor 27, a movable plate 28 and a groove 29.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a fixing mechanism for processing a semiconductor chip, which comprises a base 1, a top plate 2, stand columns 8, mounting plates 9, fixing pieces 10, a connecting plate 11 and fixing rods 15, wherein the top end of the base 1 is fixedly connected with the top plate 2, the stand columns 8 are fixedly mounted at the positions of two ends of the upper end surface of the top plate 2, the stand columns 8 are oppositely arranged in parallel, the mounting plates 9 are mounted between the two sets of the stand columns 8, and the upper end surface of each mounting plate 9 is provided with a mounting groove 12;
the mounting groove 12 is internally provided with a fixing piece 10, a connecting plate 11, mounting blocks 13, a push rod 14 and a fixing rod 15 respectively, the fixing piece 10 is of a rectangular frame structure, and the mounting blocks 13 which are arranged in an L shape are fixedly welded at four corners of the outer side of the fixing piece 10, so that the fixing piece 10 is conveniently mounted on the mounting plate 9, and the mounting and dismounting of the fixing piece 10 are also convenient;
a mounting cavity 25 is formed in the connecting plate 11, a second slider 24, a push rod 14, a movable plate 28, a second motor 27 and a second threaded rod 26 are respectively arranged in the mounting cavity 25, the bottom end of the second motor 27 is fixedly connected with the inner wall of the bottom end of the mounting cavity 25, the top end of the second motor 27 is connected with the bottom end of the second threaded rod 26, and one end, far away from the second motor 27, of the second threaded rod 26 penetrates through the movable plate 28 to be rotatably connected with the inner wall of the top end of the mounting cavity 25;
the upright post 8 is provided with a groove 29 for mounting the moving block 4, the moving blocks 4 are arranged in two groups in parallel relatively, two ends of each moving block 4 are fixedly connected with a first sliding block 19 for adjusting the position of the moving block 4, the first sliding blocks 19 are arranged in parallel relatively, and a first motor 21 is fixedly mounted on one side, far away from the mounting plate 9, of one group of the moving blocks 4.
Specifically, both ends of the movable plate 28 are fixedly connected with second sliders 24, sliding grooves 23 matched with the second sliders 24 are formed in inner walls of two sides of the connecting plate 11, the movable plate 28 is in threaded fit with a second threaded rod 26, one end of the push rod 14 is fixedly connected with the movable plate 28, one end of the push rod 14, which is far away from the movable plate 28, sequentially penetrates through the connecting plate 11 and the fixing part 10 and is fixedly inserted on the fixing rod 15, the second motor 27 can drive the second threaded rod 26 to rotate, and the movable plate 28 can push the fixing rod 15 to move towards the chip through the threaded fit of the second threaded rod 26 and the movable plate 28, so that the position of the chip is conveniently limited.
Specifically, connecting plate 11, dead lever 15 and installation piece 13 homogeneous phase are equipped with four groups to the parallel, installation piece 13 is through attacking screw fixed mounting on mounting panel 9, and is adjacent two sets of all be right angle structure between connecting plate 11, the dead lever 15 and arrange, four groups connecting plate 11, dead lever 15 enclose jointly and close out a set of spacing chamber that is used for injecing the chip position, and dead lever 15 is close to one side fixed glue in spacing chamber and has the silica gel pad, and spacing chamber is convenient for inject the position of chip.
Specifically, the two ends of the mounting plate 9 are fixedly connected with a first connecting rod 16 and a second connecting rod 17 respectively, one end, away from the mounting plate 9, of the second connecting rod 17 is provided with a jack 18 matched with the rotating shaft 5, one end, away from the mounting plate 9, of the first connecting rod 16 is inserted into the other group of moving blocks 4, and bearings 20 fixedly sleeved on the first connecting rod 16 are embedded and mounted on the moving blocks 4, so that the mounting plate 9 can rotate conveniently.
Specifically, one end of the rotating shaft 5 penetrates through the moving block 4 to be connected with one end of the first motor 21, one end of the rotating shaft 5, which is far away from the first motor 21, is fixedly inserted into the insertion hole 18 on the second connecting rod 17, the moving block 4 is positioned at the position of the rotating shaft 5, is embedded with a bearing 20 fixedly sleeved on the rotating shaft 5, and the first motor 21 can drive the rotating shaft 5 to rotate.
Specifically, a motor casing 6 is sleeved on the outer side of the first motor 21, one end of the motor casing 6 is fixedly connected with the moving block 4, a power source 22 is fixedly installed at one end, far away from the moving block 4, of the motor casing 6, and the power source 22 is electrically connected with the first motor 21.
Specifically, the inner walls of the two sides of the groove 29 are provided with a plurality of groups of moving grooves 7 matched with the first sliding blocks 19, the moving grooves 7 are arranged in parallel, the number of the moving grooves 7 is the same as that of the first sliding blocks 19, and the first sliding blocks 19 are located in the moving grooves 7, so that the moving block 4 can move conveniently.
Specifically, still be equipped with first threaded rod 3 in the shifting chute 7, 3 bottoms of first threaded rod are passed roof 2 and are connected with the third motor top that is located base 1 inside, 3 tops of first threaded rod are passed first slider 19 and are connected with 7 top inner walls of shifting chute are rotated, first threaded rod 3 and 19 screw-thread fit of first slider.
Specifically, the fixing mechanism for processing the semiconductor chip firstly adjusts the size of the limit cavity correspondingly according to the size of the chip to make the size of the limit cavity similar to that of the chip, then the chip is placed in the mounting groove 12 from top to bottom, the chip is positioned between four groups of fixing rods 15, then the second motor 27 is started, the second motor 27 can drive the second threaded rod 26 to rotate, the movable plate 28 can push the fixing rods 15 to move towards the direction of the chip through the push rod 14 through the thread fit of the second threaded rod 26 and the movable plate 28, until one side of the fixing rod 15 close to the limit cavity is contacted with the chip, the purpose of limiting the position of the chip is further achieved, the third motor is started, the third motor can drive the first threaded rod 3 to rotate, through the thread fit of the first threaded rod 3 and the first slide block 19, the first threaded rod 3 can drive the moving block 4 to move upwards, thereby highly adjusting mounting panel 9, start first motor 21, first motor 21 can drive mounting panel 9, mounting 10 and chip through pivot 5 and overturn, this fixed establishment is used in semiconductor chip processing, reasonable in design, and convenient to use has the advantage of the adjustment of being convenient for.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (8)
1. The utility model provides a fixed establishment is used in semiconductor chip processing, includes base (1), roof (2), stand (8), mounting panel (9), mounting (10), connecting plate (11) and dead lever (15), its characterized in that: the top end of the base (1) is fixedly connected with a top plate (2), stand columns (8) are fixedly arranged at the positions of the two ends of the upper end surface of the top plate (2), two groups of the stand columns (8) are arranged in parallel relatively, an installation plate (9) is arranged between the two groups of the stand columns (8), and an installation groove (12) is formed in the upper end surface of the installation plate (9);
the mounting groove (12) is internally provided with a fixing piece (10), a connecting plate (11), a mounting block (13), a push rod (14) and a fixing rod (15) respectively, the fixing piece (10) is of a rectangular frame structure, and the mounting blocks (13) which are arranged in an L shape are fixedly welded at four corners of the outer side of the fixing piece (10);
a mounting cavity (25) is formed in the connecting plate (11), a second sliding block (24), a push rod (14), a movable plate (28), a second motor (27) and a second threaded rod (26) are respectively arranged in the mounting cavity (25), the bottom end of the second motor (27) is fixedly connected with the inner wall of the bottom end of the mounting cavity (25), the top end of the second motor (27) is connected with the bottom end of the second threaded rod (26), and one end, far away from the second motor (27), of the second threaded rod (26) penetrates through the movable plate (28) to be rotatably connected with the inner wall of the top end of the mounting cavity (25);
the vertical column (8) is provided with a groove (29) for mounting the moving block (4), the moving block (4) is provided with two groups in parallel relatively, two ends of the moving block (4) are fixedly connected with first sliding blocks (19) for adjusting the position of the moving block (4), the first sliding blocks (19) are provided with multiple groups in parallel relatively, and one side, away from the mounting plate (9), of one group of the moving block (4) is fixedly provided with a first motor (21).
2. The fixing mechanism for semiconductor chip processing according to claim 1, wherein: the improved structure of the bolt is characterized in that second sliding blocks (24) are fixedly connected to two ends of the movable plate (28), sliding grooves (23) matched with the second sliding blocks (24) are formed in inner walls of two sides of the connecting plate (11), the movable plate (28) is in threaded fit with the second threaded rod (26), one end of the push rod (14) is fixedly connected with the movable plate (28), and one end, far away from the movable plate (28), of the push rod (14) penetrates through the connecting plate (11) and the fixing piece (10) in sequence to be fixedly inserted into the fixing rod (15).
3. The fixing mechanism for semiconductor chip processing according to claim 1, wherein: connecting plate (11), dead lever (15) and installation piece (13) homogeneous phase are equipped with four groups to the parallel, installation piece (13) are through attacking screw fixed mounting on mounting panel (9), and are adjacent two sets of all be right angle structure between connecting plate (11), dead lever (15) and arrange, four groups connecting plate (11), dead lever (15) enclose jointly and close out a set of spacing chamber that is used for injecing the chip position.
4. The fixing mechanism for semiconductor chip processing according to claim 1, wherein: the mounting plate is characterized in that a first connecting rod (16) and a second connecting rod (17) are fixedly connected to the two ends of the mounting plate (9) respectively, one end, far away from the mounting plate (9), of the second connecting rod (17) is provided with a jack (18) matched with the rotating shaft (5), one end, far away from the mounting plate (9), of the first connecting rod (16) is inserted into the other moving block (4), and a bearing (20) fixedly sleeved on the first connecting rod (16) is embedded and installed on the moving block (4).
5. The fixing mechanism for semiconductor chip processing according to claim 4, wherein: one end of the rotating shaft (5) penetrates through the moving block (4) to be connected with one end of the first motor (21), one end, far away from the first motor (21), of the rotating shaft (5) is fixedly inserted into the insertion hole (18) formed in the second connecting rod (17), and the position, located on the rotating shaft (5), of the moving block (4) is provided with a bearing (20) which is fixedly sleeved on the rotating shaft (5).
6. The fixing mechanism for semiconductor chip processing according to claim 1, wherein: the motor casing (6) is sleeved on the outer side of the first motor (21), one end of the motor casing (6) is fixedly connected with the moving block (4), a power supply (22) is fixedly mounted at one end, far away from the moving block (4), of the motor casing (6), and the power supply (22) is electrically connected with the first motor (21).
7. The fixing mechanism for semiconductor chip processing according to claim 1, wherein: the inner walls of two sides of the groove (29) are provided with moving grooves (7) matched with the first sliding blocks (19), multiple groups of moving grooves (7) are arranged in parallel relatively, the number of the moving grooves (7) is consistent with that of the first sliding blocks (19), and the first sliding blocks (19) are located in the moving grooves (7).
8. The fixing mechanism for semiconductor chip processing according to claim 7, wherein: still be equipped with first threaded rod (3) in shifting chute (7), roof (2) and the third motor top that is located base (1) inside are passed to first threaded rod (3) bottom and are connected, first slider (19) are passed on first threaded rod (3) top and the inner wall rotation in shifting chute (7) top is connected, first threaded rod (3) and first slider (19) screw-thread fit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010634956.2A CN111739836A (en) | 2020-07-03 | 2020-07-03 | Fixing mechanism for semiconductor chip processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010634956.2A CN111739836A (en) | 2020-07-03 | 2020-07-03 | Fixing mechanism for semiconductor chip processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111739836A true CN111739836A (en) | 2020-10-02 |
Family
ID=72653140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010634956.2A Withdrawn CN111739836A (en) | 2020-07-03 | 2020-07-03 | Fixing mechanism for semiconductor chip processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111739836A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114643424A (en) * | 2021-04-25 | 2022-06-21 | 无锡市芯通电子科技有限公司 | Semiconductor chip scribing device convenient to adjust semiconductor chip cutting angle |
-
2020
- 2020-07-03 CN CN202010634956.2A patent/CN111739836A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114643424A (en) * | 2021-04-25 | 2022-06-21 | 无锡市芯通电子科技有限公司 | Semiconductor chip scribing device convenient to adjust semiconductor chip cutting angle |
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Application publication date: 20201002 |
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| WW01 | Invention patent application withdrawn after publication |