CN111732933B - High-strength high-hardness epoxy modified MS sealant and preparation method thereof - Google Patents
High-strength high-hardness epoxy modified MS sealant and preparation method thereof Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J187/00—Adhesives based on unspecified macromolecular compounds, obtained otherwise than by polymerisation reactions only involving unsaturated carbon-to-carbon bonds
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G81/00—Macromolecular compounds obtained by interreacting polymers in the absence of monomers, e.g. block polymers
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
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Abstract
The invention discloses a high-strength high-hardness epoxy modified MS sealant and a preparation method thereof, wherein the epoxy modified MS sealant comprises silane modified polyether polymer, polyoxypropylene ether glycol, calcium carbonate, silicon dioxide, an ultraviolet absorbent, a light stabilizer, vinyl trimethoxy silane, N- (beta-aminoethyl) -gamma-aminopropyl trimethoxy silane and dibutyltin dilaurate; the silane modified polyether polymer comprises the following components of difunctional polyether amine, low molecular weight epoxy resin, epoxy silane and an epoxy accelerator, wherein polyether amine and a low molecular weight epoxy resin monomer are adopted to react, and finally, the epoxy silane is used for sealing the end, so that the performance of the original MS polymer is kept, and the body strength, the hardness and the water resistance of the MS polymer are improved.
Description
Technical Field
The invention relates to the technical field of sealant preparation, in particular to a high-strength high-hardness epoxy modified MS sealant and a preparation method thereof.
Background
Silane modified polyether polymer (MS polymer), also called silane terminated polyether polymer, is a polymer with polyether as main chain and siloxane terminated ends at two ends, and is called MS glue for short for preparing high-performance environment-friendly sealant with the polymer as main resin. Because the sealant has the advantages and the merits of silicone sealant and polyurethane sealant, the sealant has the advantages of excellent weather resistance, durability, high deformation displacement resistance, good cohesiveness, paintability, environmental friendliness, low stain, low viscosity, excellent workability and the like, and has attracted more and more attention in the domestic construction industry, and has been popularized and applied more and more in the industrial fields, such as automobile manufacturing, rail transit, container manufacturing, equipment manufacturing, electronic and electrical fields and the like. The MS polymer has lower strength compared with epoxy glue, polyurethane glue and acrylic glue due to the molecular structure of the MS polymer, so that the application field of the MS polymer is limited; meanwhile, the MS glue has poor water resistance, and the phenomena of bonding failure and poor bonding can occur in a humid environment, so that the use effect is seriously influenced.
At present, the mainstream synthetic route of the modified silane polyether polymer mainly comprises the following steps: 1. one-step method, polyether polyol reacts with isocyanate silane under the action of catalyst to carry out silane end capping to prepareA modified silane polyether polymer; 2. the two-step synthesis route of the Japanese Brillouin: allyl polyether alcohol, hydroxyl-terminated polyether and the like are used as raw materials, and methylene dihalide (H) is used as a raw material2CX2) Taking caustic alkali as a catalyst as a chain extender, and preparing an allyl-terminated polyether intermediate through a chain extension reaction; then in the presence of a platinum catalyst, reacting the refined intermediate with methyldimethoxysilane through end-silylation reaction to prepare a silane modified polyether polymer; 3. firstly, synthesizing polyurethane prepolymer, and then utilizing various types of secondary amino propyl trimethoxy (or triethoxy) silane to carry out end capping to form silane end-capped polyether polymer. In conclusion, the Japanese Brillouin synthesis route has high requirements on equipment and complex process, and the prepared middle-low modulus polymer has surface stickiness after being prepared into the sealant and is easy to adsorb dust; and the other two synthetic routes lead in isocyanate groups, so that the prepared sealant has poor weather resistance and is easy to yellow.
Disclosure of Invention
The invention aims to provide a high-strength high-hardness epoxy modified MS sealant and a preparation method thereof, so as to solve the problems in the background technology.
In order to achieve the purpose, the invention adopts the technical scheme that: the high-strength high-hardness epoxy modified MS sealant comprises, by weight, 600-800 parts of a silane modified polyether polymer, 250-300 parts of polyoxypropylene ether glycol, 600-700 parts of calcium carbonate, 20-30 parts of silicon dioxide, 3-10 parts of an ultraviolet absorbent, 2-8 parts of a light stabilizer, 10-20 parts of vinyl trimethoxy silane, 5-15 parts of N- (beta-aminoethyl) -gamma-aminopropyl trimethoxy silane and 5-10 parts of dibutyltin dilaurate;
the silane modified polyether polymer comprises, by weight, 440-1500 parts of difunctional polyether amine, 100 parts of low molecular weight epoxy resin, 115-130 parts of epoxy silane and 15-60 parts of an epoxy accelerator.
The main chain of the difunctional polyether amine is a polyether structure, the active functional group at the tail end is a polymer of difunctional amino, the number average molecular weight is one or more of 200-5000, and the preferred number average molecular weight is 1000, 2000 or 3000; the low molecular weight epoxy resin is one or more of neopentyl glycol diglycidyl ether, 1, 4-butanediol diglycidyl ether, 1, 2-cyclohexanedimethanol diglycidyl ether, polypropylene glycol diglycidyl ether and ethylene glycol diglycidyl ether.
As a further optimization, the epoxy silane is one or more of 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane and epoxy silane oligomer.
As a further optimization, the epoxy accelerator is 2,4, 6-tris (dimethylaminomethyl) phenol, namely DMP-30.
As a further optimization, the polyoxypropylene ether glycol number average molecular weight is 3000.
As a further optimization, the silica is a hydrophobic fumed silica.
As a further optimization, the ultraviolet absorbent is Tinuvin 326; the light stabilizer is a hindered amine light stabilizer Tinuvin 770.
The invention also provides a preparation method of the high-strength high-hardness epoxy modified MS sealant, which comprises the steps of firstly preparing the silane modified polyether polymer, including S1) adding the polyether amine into a reaction kettle, starting stirring, and slowly heating to 50-60 ℃; s2) slowly adding low molecular weight epoxy resin (taking 1, 4-butanediol diglycidyl ether as an example) dropwise into the reaction kettle for addition reaction, wherein the reaction temperature is 50-60 ℃, and the reaction time is 2-3 h; s3) slowly adding epoxy silane (3-glycidyl ether oxypropyl trimethoxy silane) dropwise, reacting at 70-90 ℃ for 2-3 h; s4), slowly adding DMP-30, reacting at 70-90 ℃ for 10-20 min; s4) carrying out vacuum degassing for 15-20min under the pressure of not less than-0.09 MPa to obtain a colorless transparent epoxy resin block silane modified polyether polymer; wherein the S2 reaction is shown below:
the S3 reaction is shown below:
adding the silane modified polyether polymer, the polyoxypropylene ether glycol, the calcium carbonate, the silicon dioxide, the ultraviolet absorbent and the light stabilizer into a planetary stirrer, heating to 100-110 ℃, and stirring in vacuum for 1-3 hours; cooling to below 50 deg.C, adding vinyltrimethoxysilane and N- (beta-aminoethyl) -gamma-aminopropyltrimethoxysilane, and vacuum stirring for 20-30 min; adding dibutyltin dilaurate, and stirring for 20-30min in vacuum to obtain the high-strength high-hardness epoxy modified MS sealant.
As a further optimization, the reaction vessel was sealed after adding the polyetheramine in S1, and the air in the reaction vessel was replaced with dry nitrogen gas 3 times.
The invention adopts polyether amine, low molecular weight epoxy resin and epoxy silane as raw materials to form a novel modified silane polyether polymer which has an epoxy resin block in a polyether chain and is moisture-curable at the end-capped by the epoxy silane at two ends; due to the introduction of epoxy groups, the bulk strength of the polymer is remarkably increased under the condition of keeping the advantages of the original MS polymer, and meanwhile, the cross-linking density of the cured polymer is increased, the water vapor transmission rate is reduced, and the water resistance of the colloid is increased.
Compared with the prior art, the invention has the beneficial effects that: according to the invention, on the basis of the original modified silane polyether polymer structure, an epoxy structure block is adopted, a secondary amino group is introduced between siloxane and a polyether structure, after siloxane is hydrolyzed, crosslinked and cured, the body strength is greatly improved due to the introduction of the secondary amino group and the epoxy chain segment, the crosslinking density is higher, and the water vapor permeability is obviously reduced, so that the service life of the colloid in a humid environment is prolonged, and the application field and the application range of the modified silane polyether sealant are widened.
Detailed Description
The following are specific examples of the present invention and further describe the technical solutions of the present invention, but the present invention is not limited to these examples.
Example 1
A high-strength high-hardness epoxy modified MS sealant is prepared by firstly preparing silane modified polyether polymer, adding 495 parts of difunctional polyether amine with the number average molecular weight of 1000 into a dry 2L reaction kettle, sealing the reaction kettle, replacing air in the reaction kettle for 3 times by dry nitrogen, starting stirring, and slowly heating to 50-60 ℃; slowly dripping 100 parts of 1, 4-butanediol diglycidyl ether for addition reaction, and controlling the reaction temperature at 50-60 ℃ for 2 hours; then slowly adding 128 parts of 3-glycidyl ether oxypropyltrimethoxysilane dropwise, and reacting at the temperature of 70-90 ℃ for 3 hours; slowly adding 15 parts of DMP-30, and controlling the reaction temperature at 70-90 ℃; reacting for 15 min; vacuum degassing for 15min under the pressure of more than or equal to-0.09 MPa to obtain the colorless and transparent silane modified polyether polymer with the epoxy resin block.
Adding 700 parts of the silane modified polyether polymer, 300 parts of polyoxypropylene ether glycol, 650 parts of calcium carbonate, 20 parts of hydrophobic fumed silica, 5 parts of Tinuvin326 and 5 parts of Tinuvin770 into a 5L planetary stirrer, heating to 100-110 ℃, and stirring in vacuum for 2 hours; and then cooling to below 50 ℃, adding 15 parts of vinyl trimethoxy silane and 10 parts of N- (beta-aminoethyl) -gamma-aminopropyl trimethoxy silane, continuing to stir in vacuum for 20min, then adding 6 parts of dibutyltin dilaurate, and stirring in vacuum for 20min to obtain the high-strength high-hardness epoxy modified MS sealant.
Example 2
A high-strength high-hardness epoxy modified MS sealant is prepared by firstly preparing a silane modified polyether polymer, adding 990 parts of difunctional polyether amine with the number average molecular weight of 2000 into a dry 2L reaction kettle, sealing the reaction kettle, replacing air in the reaction kettle for 3 times by dry nitrogen, starting stirring, and slowly heating to 50-60 ℃; slowly dripping 100 parts of polypropylene glycol diglycidyl ether for addition reaction, controlling the reaction temperature at 50-60 ℃ for 2 hours; then slowly adding 123 parts of 3-glycidyl ether oxypropyltrimethoxysilane dropwise, and reacting at the temperature of 70-90 ℃ for 3 hours; slowly adding 40 parts of DMP-30, and controlling the reaction temperature at 70-90 ℃; reacting for 15 min; vacuum degassing for 15min under the pressure of more than or equal to-0.09 MPa to obtain the colorless and transparent silane modified polyether polymer with the epoxy resin block.
Adding 700 parts of the silane modified polyether polymer, 300 parts of polyoxypropylene ether glycol, 650 parts of calcium carbonate, 20 parts of hydrophobic fumed silica, 5 parts of Tinuvin326 and 5 parts of Tinuvin770 into a 5L planetary stirrer, heating to 100-110 ℃, and stirring in vacuum for 2 hours; and then cooling to below 50 ℃, adding 15 parts of vinyl trimethoxy silane and 10 parts of N- (beta-aminoethyl) -gamma-aminopropyl trimethoxy silane, continuing to stir in vacuum for 20min, then adding 6 parts of dibutyltin dilaurate, and stirring in vacuum for 20min to obtain the high-strength high-hardness epoxy modified MS sealant.
Example 3
A high-strength high-hardness epoxy modified MS sealant is prepared by firstly preparing a silane modified polyether polymer, adding 1500 parts of difunctional polyetheramine with the number average molecular weight of 3000 into a dry 2L reaction kettle, sealing the reaction kettle, replacing air in the reaction kettle for 3 times by dry nitrogen, starting stirring, and slowly heating to 50-60 ℃; slowly dripping 100 parts of ethylene glycol diglycidyl ether for addition reaction, controlling the reaction temperature at 50-60 ℃ for 2 hours; then slowly dripping 122 parts of 3-glycidyl ether oxypropyltrimethoxysilane, and reacting at the temperature of 70-90 ℃ for 3 hours; slowly adding 60 parts of DMP-30, and controlling the reaction temperature at 70-90 ℃; reacting for 15 min; vacuum degassing for 15min under the pressure of more than or equal to-0.09 MPa to obtain the colorless and transparent silane modified polyether polymer with the epoxy resin block.
Adding 700 parts of the silane modified polyether polymer, 300 parts of polyoxypropylene ether glycol, 650 parts of calcium carbonate, 20 parts of hydrophobic fumed silica, 5 parts of Tinuvin326 and 5 parts of Tinuvin770 into a 5L planetary stirrer, heating to 100-110 ℃, and stirring in vacuum for 2 hours; and then cooling to below 50 ℃, adding 15 parts of vinyl trimethoxy silane and 10 parts of N- (beta-aminoethyl) -gamma-aminopropyl trimethoxy silane, continuing to stir in vacuum for 20min, then adding 6 parts of dibutyltin dilaurate, and stirring in vacuum for 20min to obtain the high-strength high-hardness epoxy modified MS sealant.
Example 4
A high-strength high-hardness epoxy modified MS sealant is prepared by firstly preparing a silane modified polyether polymer, adding 440 parts of difunctional polyether amine with the number average molecular weight of 1000 into a dry 2L reaction kettle, sealing the reaction kettle, replacing air in the reaction kettle for 3 times by dry nitrogen, starting stirring, and slowly heating to 50-60 ℃; slowly dripping 100 parts of 1, 2-cyclohexanedimethanol diglycidyl ether for addition reaction, and controlling the reaction temperature at 50-60 ℃ for 2 hours; then slowly dropwise adding 115 parts of 3-glycidyl ether oxypropyltrimethoxysilane, and reacting at the temperature of 70-90 ℃ for 3 hours; slowly adding 15 parts of DMP-30, and controlling the reaction temperature at 70-90 ℃; reacting for 15 min; vacuum degassing for 15min under the pressure of more than or equal to-0.09 MPa to obtain the colorless and transparent silane modified polyether polymer with the epoxy resin block.
Adding 700 parts of the silane modified polyether polymer, 300 parts of polyoxypropylene ether glycol, 650 parts of calcium carbonate, 20 parts of hydrophobic fumed silica, 5 parts of Tinuvin326 and 5 parts of Tinuvin770 into a 5L planetary stirrer, heating to 100-110 ℃, and stirring in vacuum for 2 hours; and then cooling to below 50 ℃, adding 15 parts of vinyl trimethoxy silane and 10 parts of N- (beta-aminoethyl) -gamma-aminopropyl trimethoxy silane, continuing to stir in vacuum for 20min, then adding 6 parts of dibutyltin dilaurate, and stirring in vacuum for 20min to obtain the high-strength high-hardness epoxy modified MS sealant. Comparative example: STP-E30 from Wacker Chemicals was selected as the modified silane polyether MS polymer.
The high strength, high hardness epoxy modified MS sealants prepared in examples 1 through 4 were tested against the modified silane polyether MS polymer of Wacker chemistry, STP-E30, and the experimental data are shown in the following table,
| example 1 | Example 2 | Example 3 | Example 4 | Comparative example | |
| Tensile strength/MPa | 8 | 7 | 6.8 | 7.5 | 2.5 |
| Hardness ShoreD | 55 | 50 | 42 | 53 | 20 |
| Water-immersion adhesion/MPa | 6.3 | 5.4 | 4.8 | 6.1 | 0.8 |
The test standard is referred to GB/T531.1-2008 vulcanized rubber or thermoplastic rubber indentation hardness test method part I: shore durometer (shore hardness); measuring the tensile stress strain performance of GB/T528-2009 vulcanized rubber or thermoplastic rubber; GB/T13477.9-2002 test method for building sealants part 9, determination of tensile adhesion after immersion in water.
According to the data, compared with the similar sealant STP-E30, the high-strength and high-hardness epoxy modified MS sealant prepared by the invention has better tensile strength, hardness and water-soaking adhesion, so that the service life of the sealant in a humid environment can be prolonged, and the application field and the application range of the modified silane polyether sealant can be widened.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Claims (8)
1. The high-strength high-hardness epoxy modified MS sealant is characterized by comprising, by weight, 600-800 parts of a silane modified polyether polymer, 250-300 parts of polyoxypropylene ether glycol, 600-700 parts of calcium carbonate, 20-30 parts of silicon dioxide, 3-10 parts of an ultraviolet absorbent, 2-8 parts of a light stabilizer, 10-20 parts of vinyl trimethoxy silane, 5-15 parts of N- (beta-aminoethyl) -gamma-aminopropyl trimethoxy silane and 5-10 parts of dibutyltin dilaurate;
440-1500 parts of difunctional polyether amine, 100 parts of low molecular weight epoxy resin, 115-130 parts of epoxy silane and 15-60 parts of epoxy accelerator; the difunctional polyetheramine has a number average molecular weight of 1000, 2000, or 3000; the low molecular weight epoxy resin is 1, 4-butanediol diglycidyl ether; the structural formula of the silane modified polyether polymer is as follows:
2. the high strength high hardness epoxy modified MS sealant according to claim 1, wherein the epoxy silane is one or more of 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, and epoxy silane oligomer.
3. The high strength, high hardness epoxy modified MS sealant according to claim 1, wherein the epoxy accelerator is 2,4, 6-tris (dimethylaminomethyl) phenol.
4. The high strength, high hardness epoxy modified MS sealant according to claim 1, wherein the polyoxypropylene ether glycol number average molecular weight is 3000.
5. The high strength, high hardness epoxy modified MS sealant according to claim 1, wherein the silica is hydrophobic fumed silica.
6. The preparation method of the high-strength high-hardness epoxy modified MS sealant according to any one of claims 1 to 5, characterized by comprising the following steps of adding the silane modified polyether polymer, the polyoxypropylene ether glycol, the calcium carbonate, the silica, the ultraviolet absorber and the light stabilizer into a planetary mixer, heating to 100-110 ℃, and stirring in vacuum for 1-3 h; cooling to below 50 deg.C, adding vinyltrimethoxysilane and N- (beta-aminoethyl) -gamma-aminopropyltrimethoxysilane, and vacuum stirring for 20-30 min; adding dibutyltin dilaurate, and stirring for 20-30min in vacuum to obtain the high-strength high-hardness epoxy modified MS sealant.
7. The method for preparing the high-strength high-hardness epoxy modified MS sealant according to claim 6, wherein the method for preparing the silane modified polyether polymer comprises the following steps,
s1) adding polyetheramine into a reaction kettle, starting stirring, and slowly heating to 50-60 ℃;
s2) slowly dripping low molecular weight epoxy resin into the reaction kettle for addition reaction at the reaction temperature of 50-60 ℃ for 2-3 h;
s3) slowly adding the epoxy silane dropwise, wherein the reaction temperature is 70-90 ℃, and the reaction time is 2-3 h;
s4), slowly adding DMP-30, reacting at 70-90 ℃ for 10-20 min;
s4) is degassed for 15-20min under the pressure of not less than-0.09 MPa to obtain the colorless and transparent silane modified polyether polymer with epoxy resin block.
8. The method for preparing the high-strength high-hardness epoxy modified MS sealant is characterized in that the reaction kettle is sealed after the polyether amine is added into S1, and the air in the reaction kettle is replaced by dry nitrogen for 3 times.
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| CN112552870B (en) * | 2020-12-29 | 2022-08-02 | 烟台信友新材料有限公司 | High-strength high-hardness UV/moisture dual-curing MS glue and preparation method thereof |
| CN113025253B (en) * | 2021-03-17 | 2022-05-20 | 广州市白云化工实业有限公司 | Single-component silane modified polyether sealant and preparation method and application thereof |
| CN114874735B (en) * | 2022-06-16 | 2023-11-24 | 上海岐海防腐工程技术有限公司 | Single-component epoxy modified silane polymer sealant and preparation method thereof |
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