CN111732908B - Integrated photovoltaic module packaging adhesive film - Google Patents

Integrated photovoltaic module packaging adhesive film Download PDF

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Publication number
CN111732908B
CN111732908B CN202010758671.XA CN202010758671A CN111732908B CN 111732908 B CN111732908 B CN 111732908B CN 202010758671 A CN202010758671 A CN 202010758671A CN 111732908 B CN111732908 B CN 111732908B
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protruding
hole
cube
cubes
shaped structure
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CN111732908A (en
Inventor
童伟
吕松
黄宝玉
吴丰华
吴斌
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Changzhou Sveck New Material Technology Co ltd
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Changzhou Sveck New Material Technology Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
    • C09J129/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/049—Protective back sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
    • H01L31/056—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means the light-reflecting means being of the back surface reflector [BSR] type
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C08K2003/3045—Sulfates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/52—PV systems with concentrators

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Photovoltaic Devices (AREA)

Abstract

The invention provides an integrated photovoltaic module packaging adhesive film, which comprises the following components: from last structure reflection stratum, transition layer and the backplate that sets gradually down, the upper surface of structure reflection stratum is planar structure, the lower surface of structure reflection stratum is equipped with a plurality of protruding cubes, is equipped with at least one poroid structure on every cube, the upper surface of transition layer is filled poroid structure to fill the clearance between two adjacent cubes, the lower surface of transition layer is planar structure, the lower surface laminating of transition layer the upper surface of backplate. The advantages are that: the reflective layer and the backboard are firmly bonded, the method is simple and efficient, the backboard lamination process is reduced, and the method is suitable for large-scale popularization and application.

Description

Integrated photovoltaic module packaging adhesive film
Technical Field
The invention belongs to the technical field of photovoltaic industry, and particularly relates to an integrated photovoltaic module packaging adhesive film.
Background
At present, white EVA is usually selected as a back packaging adhesive film of the single-glass photovoltaic module to increase back reflection, so that the power of the single-glass module is improved. White EVA has some drawbacks: inorganic filler in the white EVA is uniformly distributed, so that the adhesion between the white EVA and the backboard and between the white EVA and the glass is reduced; white encapsulating films in the industry attempt to increase the inorganic filler content to achieve higher reflectivity, but too high inorganic content can result in delamination from the backsheet. In addition, the price of inorganic filler in white EVA is high, which limits the cost reduction.
Therefore, an integrated photovoltaic module packaging adhesive film is developed aiming at the problems.
Disclosure of Invention
The invention provides an integrated photovoltaic module packaging adhesive film which solves the problems.
In order to solve the technical problems, the invention provides an integrated photovoltaic module packaging adhesive film, which is sequentially provided with a structural reflecting layer, a transition layer and a back plate from top to bottom, wherein the upper surface of the structural reflecting layer is of a planar structure, the lower surface of the structural reflecting layer is provided with a plurality of protruding cubes, each cube is provided with at least one hole-shaped structure, the upper surface of the transition layer is filled with the hole-shaped structure and fills a gap between two adjacent cubes, the lower surface of the transition layer is of a planar structure, and the lower surface of the transition layer is attached to the upper surface of the back plate.
As a preferable scheme of the integrated photovoltaic module packaging adhesive film, the thickness of the structural reflecting layer is 50-150 mu m, the structural reflecting layer is made of inorganic filler and resin, the mass percent of the inorganic filler is 30-65%, the mass percent of the resin is 35-70%, and the inorganic filler is any one or more of titanium dioxide, lithopone, barium sulfate and calcium carbonate white particles; the resin is any one or a mixture of more of modified EVA resin, modified PO resin, modified PVB resin and modified PE resin.
As a preferable scheme of the integrated photovoltaic module packaging adhesive film, the plurality of protruding cubes are arranged periodically, the protruding cubes are provided with a plurality of first protruding cubes and a plurality of second protruding cubes, and the first protruding cubes and the second protruding cubes are alternately arranged.
As a preferred scheme of the integrated photovoltaic module packaging adhesive film, the first protruding cube is provided with at least one first hole-shaped structure, the second protruding cube is provided with at least one second hole-shaped structure, the first hole-shaped structure is divided into a first left hole and a first right hole, the left side and the right side of the first protruding cube extend to the inside of the first protruding cube, the aperture of the first left hole is gradually reduced from the left side to the right side of the first protruding cube, the first right hole extends from the right side to the left side of the first protruding cube to the inner center of the first protruding cube, the aperture of the first right hole is gradually reduced from the right side to the left side of the first protruding cube, the center line of the first left hole and the center line of the first right hole are on the same straight line, the second hole-shaped structure is divided into a second left hole and a second right hole, the left side of the second left Kong Zi of the second protruding cube extends to the right side of the inside of the second protruding cube, the aperture of the second left hole gradually reduces from the left side to the right side of the second protruding cube, the second right hole extends from the right side to the left side of the second protruding cube to the inner center of the second protruding cube, the aperture of the second right hole gradually reduces from the right side to the left side of the second protruding cube, the center line of the second left hole and the center line of the second right hole are on the same straight line, and the upper surface of the transition layer fills the first hole-shaped structure and the second hole-shaped structure and fills the gap between the first protruding cube and the second protruding cube.
As a preferable scheme of the integrated photovoltaic module packaging adhesive film, the convex cubes are provided with a plurality of first convex cubes and a plurality of second convex cubes, wherein the first convex cubes are arranged on the edge of the lower surface of the structural reflecting layer, and the second convex cubes are arranged in the center of the lower surface of the structural reflecting layer.
As a preferable scheme of the integrated photovoltaic module packaging adhesive film, the first protruding cube is provided with a plurality of first grooves, the second protruding cube is provided with a plurality of second grooves, and the upper surface of the transition layer is filled with the first grooves and the second grooves and fills gaps between two adjacent cubes.
As a preferable scheme of the integrated photovoltaic module packaging adhesive film, the widths of the first protruding cube and the second protruding cube are 5-20 microns, the height of the first protruding cube is 15-20 microns, the height of the second protruding cube is 5-18 microns, the height of the first protruding cube is larger than the height of the second protruding cube, and the distance between two adjacent protruding cubes is 20-60 microns.
As a preferable scheme of the integrated photovoltaic module packaging adhesive film, the cross section of the first protruding cube is rectangular, and the cross section of the second protruding cube is also rectangular.
As a preferred scheme of the integrated photovoltaic module packaging adhesive film, the thickness of the transition layer is 100-200 mu m, the transition layer consists of mixed resin, antioxidant, cross-linking agent and silane coupling agent, the mass fraction of the mixed resin is 80-93%, the mass fraction of the antioxidant is 1-5%, the mass fraction of the cross-linking agent is 0.5-3%, the mass fraction of the silane coupling agent is 5.5-12%, and the mixed resin is obtained by mixing EVA resin and PO resin according to any proportion, wherein the molar content of vinyl acetate in the EVA resin is 20-50%; the mol content of alpha olefin in the PO resin is 10% -40%, the antioxidant is any one or more of beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) octadecyl propionate, tri (4-nonylphenol) phosphite and tri (2, 4-di-tert-butylphenyl) phosphite, the cross-linking agent comprises a curing agent and a co-cross-linking agent, and the curing agent comprises cumene peroxide, di-tert-butyl peroxide, dicumyl hydroperoxide, 2, 5-dimethyl-2, 5-di-tert-butyl hexane peroxide, 4-di (tert-amyl peroxy) n-butyl valerate, tert-butyl peroxy-2-ethylhexyl carbonate and 3, 3-di (tert-butyl peroxy) ethyl butyrate; the auxiliary cross-linking agent comprises any one or a mixture of a plurality of triallyl isocyanurate, ethoxylated trimethylolpropane trimethacrylate, triallyl cyanurate, propoxylated trimethylolpropane trimethacrylate and diethylene glycol dimethacrylate, and the silane coupling agent is at least one of vinyl triethoxysilane, vinyl trimethoxysilane, vinyl t-butylperoxy silane, vinyl triacetoxy silane and vinyl tri (beta-methoxyethoxy) silane.
As a preferable scheme of the integrated photovoltaic module packaging adhesive film, the thickness of the back plate is 100-200 mu m.
Compared with the prior art, the integrated photovoltaic module packaging adhesive film provided by the invention has the following advantages:
(1) Compared with the traditional white EVA, the reflective layer has the advantages that the whole thickness is thin, the consumption of inorganic filler is reduced, the proportion of the inorganic filler in the reflective layer is higher, the reflectivity is higher, and the power improvement on the component is more excellent;
(2) Through the structural design of the lower surface of the structural reflecting layer, the combination of longitudinal grasping and transverse insertion is realized, the bonding force with the transition layer is increased, and the reflecting layer of the high inorganic seasoning is firmly bonded with the backboard;
(3) The invention is simple and efficient, can reduce the back plate lamination process, and is suitable for large-scale popularization and application.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. Wherein,
Fig. 1 is a schematic longitudinal sectional view of an integrated photovoltaic module packaging film according to the present invention in embodiment 1;
FIG. 2 is a schematic view of another angle of a vertical cross section of an integrated photovoltaic module packaging film according to the present invention in embodiment 1;
FIG. 3 is a schematic longitudinal cross-sectional view of an integrated photovoltaic module packaging film according to the present invention in example 2;
Fig. 4 is a schematic structural diagram of the lower surface of the structural reflective layer in embodiment 2 of an integrated photovoltaic module packaging film of the present invention.
Wherein: 1 is a structural reflecting layer, 11 is a first convex cube, 12 is a second convex cube, 13 is a first hole-shaped structure, 14 is a first groove, 15 is a second groove, 2 is a transition layer, and 3 is a back plate.
Detailed Description
In order that the above-recited objects, features and advantages of the present invention will become more apparent, a more particular description of the invention will be rendered by reference to specific embodiments thereof.
First, reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic can be included in at least one implementation of the invention. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments.
In the following, the present invention will be described in detail by using a schematic structural diagram, etc., and in order to facilitate the description, the schematic diagram showing an integrated packaging film structure of a photovoltaic module is not partially enlarged according to a general scale, and the schematic diagram is merely an example, which should not limit the scope of the present invention. In addition, the three-dimensional space of length, width and depth should be included in actual fabrication.
The integrated photovoltaic module packaging adhesive film is characterized in that a structural reflecting layer 1, a transition layer 2 and a back plate 3 are sequentially arranged from top to bottom as shown in figures 1 and 3. The following sequentially describes the above structure:
1. The upper surface of the structural reflecting layer 1 is a planar structure, the lower surface of the structural reflecting layer 1 is provided with a plurality of protruding cubes, each cube is provided with at least one hole-shaped structure, the thickness of the structural reflecting layer 1 is 50-150 mu m, the material of the structural reflecting layer 1 is inorganic filler and resin, the mass percent of the inorganic filler is 30-65%, the mass percent of the resin is 35-70%, and the inorganic filler is any one or a plurality of titanium dioxide, lithopone, barium sulfate and calcium carbonate white particles; the resin is any one or a mixture of more of modified EVA resin, modified PO resin, modified PVB resin and modified PE resin.
The structural reflective layer 1 has two forms:
First kind: as shown in fig. 1 and 2, the plurality of protruding cubes are arranged periodically, the protruding cubes have a plurality of first protruding cubes 11 and a plurality of second protruding cubes 12, and the first protruding cubes 11 are alternately arranged with the second protruding cubes 12. The first protruding cube 11 is provided with at least one first hole-shaped structure 13, the second protruding cube 12 is provided with at least one second hole-shaped structure (not shown), the first hole-shaped structure 13 is divided into a first left hole (not shown) and a first right hole (not shown), the left side and the right side of the first protruding cube 11 of the first left Kong Zidi extend to the inside of the first protruding cube 11, the aperture of the first left hole is gradually reduced from the left side and the right side of the first protruding cube 11 to the inner center of the first protruding cube 11, the aperture of the first right hole is gradually reduced from the right side and the left side of the first protruding cube 11, the center line of the first left hole and the center line of the first right hole are on the same straight line, the second hole-shaped structure is divided into a second left hole (not shown) and a second right hole (not shown), the left side and right side of the second protruding cube 12 extends to the inside of the second protruding cube 12, the aperture of the first left hole-shaped structure is gradually reduced from the right side and the right side of the second protruding cube 11, the aperture of the second left hole-shaped structure is gradually reduced from the right side and the second protruding cube 12 to the inner center line of the second protruding cube 12, and the first hole-shaped structure is gradually reduced from the left side and the right side of the second protruding cube 12 is gradually reduced from the right side of the second protruding cube 12 to the second hole-side of the second protruding cube 12, and the inner side of the second hole-shaped structure is gradually reduced from the right side of the second protruding cube 12 to the second hole-side of the second protruding cube 12, and the second hole-shaped structure is filled between the left side and the right hole-shaped structure is gradually reduced from the left side to the right side of the second hole-side hole-shaped structure is gradually reduced to the right side and the right side of the second hole 3. The height difference and the gaps are generated between the protruding cubes which are alternately arranged, so that a plurality of longitudinal channels are formed in the process of connecting the protruding cubes with the transition layer 2, the connection between the protruding cubes and the transition layer 2 is more compact, the adhesive force is increased, and when the hole-shaped structures are filled with raw materials of the transition layer 2 through the structures of a plurality of hole-shaped structures and the left holes and the right holes which are not communicated but have the same central line, the transverse connection is formed, and the adhesive force is increased.
Second kind: as shown in fig. 3 and 4, the raised cubes have a plurality of first raised cubes 11 disposed at the edge of the lower surface of the structural reflective layer 1 and a plurality of second raised cubes 12 disposed at the center of the lower surface of the structural reflective layer 1. The first raised cubes 11 are provided with a plurality of first grooves 14, the second raised cubes 12 are provided with a plurality of second grooves 15, and the upper surfaces of the transition layers 2 are filled with the first grooves 14 and the second grooves 15 and the gaps between the adjacent two cubes. Through this kind of both sides height, the protruding cube of centre low for the border and the central point that the easiest separation have different tie coat, reuse the clearance between the protruding cube, thereby make in the connection process with transition layer 2, form a plurality of vertical passageways, be convenient for make the connection between them more inseparable, increase the bonding force, when making transition layer 2 raw materials fill poroid structure through a plurality of recesses, form horizontal connection, increased the bonding force.
In the above two structures, the widths of the first protruding cube 11 and the second protruding cube 12 are 5-20 μm, the height of the first protruding cube 11 is 15-20 μm, the height of the second protruding cube 12 is 5-18 μm, the height of the first protruding cube 11 is larger than the height of the second protruding cube 12, and the distance between two adjacent protruding cubes is 20-60 μm. The cross section of the first raised cube 11 is rectangular and the cross section of the second raised cube 12 is also rectangular.
2. The upper surface of the transition layer 2 is filled with a hole-shaped structure, gaps between two adjacent cubes are filled, and the lower surface of the transition layer 2 is of a plane structure. The thickness of the transition layer 2 is 100-200 mu m, the transition layer 2 is composed of mixed resin, antioxidant, cross-linking agent and silane coupling agent, the mass fraction of the mixed resin is 80-93%, the mass fraction of the antioxidant is 1-5%, the mass fraction of the cross-linking agent is 0.5-3%, the mass fraction of the silane coupling agent is 5.5-12%, the mixed resin is obtained by mixing EVA resin and PO resin according to any proportion, wherein the mol content of vinyl acetate in the EVA resin is 20-50%; the mol content of alpha olefin in PO resin is 10% -40%, the antioxidant is any one or more of beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) octadecyl propionate, tri (4-nonylphenol) phosphite and tri (2, 4-di-tert-butylphenyl) phosphite, the cross-linking agent comprises a curing agent and a co-cross-linking agent, the curing agent comprises cumene peroxide, di-tert-butyl peroxide, dicumyl hydroperoxide, 2, 5-dimethyl-2, 5-di-tert-butyl hexane peroxide, n-butyl 4, 4-di (tert-amyl peroxy) valerate, tert-butyl peroxy-2-ethylhexyl carbonate and ethyl 3, 3-di (tert-butyl peroxy) butyrate; the auxiliary cross-linking agent comprises any one or a mixture of a plurality of triallyl isocyanurate, ethoxylated trimethylolpropane trimethacrylate, triallyl cyanurate, propoxylated trimethylolpropane trimethacrylate and diethylene glycol dimethacrylate, and the silane coupling agent is at least one of vinyl triethoxysilane, vinyl trimethoxysilane, vinyl t-butylperoxy silane, vinyl triacetoxy silane and vinyl tri (beta-methoxyethoxy) silane.
3. The lower surface of the transition layer 2 is adhered to the upper surface of the backboard 3, and the thickness of the backboard 3 is 100-200 μm.
The preparation method of the integrated photovoltaic module packaging adhesive film shown in fig. 1 and 3 comprises the following steps:
1. fully mixing resin and inorganic filler, and then co-extruding and granulating by a double-screw extruder to prepare master batch;
2. Adding master batch and resin into a mixer, fully mixing for 5-10 min, loading into an extrusion hopper, carrying out tape casting through a single screw or a double screw, extruding through a rubber roller with a structure on the surface and a smooth rubber roller, and cooling to obtain a structural reflecting layer 1;
3. Adding the mixed resin, the antioxidant, the cross-linking agent and the silane coupling agent into a mixer, fully mixing for 5-15 min, extruding and casting by a single screw to coat the lower surface of the structure of the structural reflecting layer 1, and compounding with the backboard 3 by a rubber roller;
5. And the integrated high-reflection photovoltaic module packaging adhesive film is obtained after trimming, rolling and packaging processes.
For specific embodiments, please see examples 1-5 below:
Example 1
As shown in figure 1, the integrated photovoltaic module packaging adhesive film is sequentially provided with a structural reflecting layer 1, a transition layer 2 and a back plate 3 from top to bottom, wherein the upper surface of the structural reflecting layer 1 is of a planar structure, the thickness of the structural reflecting layer 1 is 50 mu m, the structural reflecting layer 1 is made of inorganic filler and resin, the inorganic filler is 30% by mass, the resin is 70% by mass, and the inorganic filler is titanium dioxide and lithopone; the resin is modified EVA resin and modified PO resin. The lower surface of the structural reflective layer 1 is periodically arranged by a plurality of protruding cubes, the protruding cubes have a plurality of first protruding cubes 11 and a plurality of second protruding cubes 12, and the first protruding cubes 11 are alternately arranged with the second protruding cubes 12. As shown in fig. 2, the first protruding cube 11 is provided with at least one first hole-shaped structure 13, the second protruding cube 12 is provided with at least one second hole-shaped structure, the first hole-shaped structure 13 is divided into a first left hole and a first right hole, the left side and the right side of the first left Kong Zidi protruding cube 11 extend into the first protruding cube 11, the aperture of the first left hole is gradually reduced from the left side and the right side of the first protruding cube 11 to form a lateral cone shape, the first right hole extends from the right side and the left side of the first protruding cube 11 to the inner center of the first protruding cube 11, the aperture of the first right hole is gradually reduced from the right side and the left side of the first protruding cube 11, forming a lateral cone shape, wherein the center line of the first left hole and the center line of the first right hole are on the same straight line, the second hole-shaped structure is divided into a second left hole and a second right hole, the left side and the right side of the second left Kong Zidi two convex cubes 12 extend into the inside of the second convex cube 12, the aperture of the second left hole is gradually reduced from the left side to the right side of the second convex cube 12 to form a lateral cone shape, the right side and the left side of the second right Kong Zidi two convex cubes 12 extend into the center of the inside of the second convex cube 12, the aperture of the second right hole is gradually reduced from the right side to the left side of the second convex cube 12 to form a lateral cone shape, the center line of the second left hole and the center line of the second right hole are on the same straight line, the upper surface of the transition layer 2 fills the first 13 and second 13 hole structures and fills the gap between the first 11 and second 12 raised cubes. The width of the first protruding cube 11 and the second protruding cube 12 are 5 μm, the height of the first protruding cube 11 is 15 μm, the height of the second protruding cube 12 is 5 μm, the height of the first protruding cube 11 is larger than the height of the second protruding cube 12, and the distance between two adjacent protruding cubes is 20 μm. The cross section of the first raised cube 11 is rectangular and the cross section of the second raised cube 12 is also rectangular. The upper surface of the transition layer 2 is filled with a hole-shaped structure, gaps between two adjacent cubes are filled, and the lower surface of the transition layer 2 is of a plane structure. The thickness of the transition layer 2 is 100 mu m, the transition layer 2 is composed of mixed resin, antioxidant, cross-linking agent and silane coupling agent, the mass fraction of the mixed resin is 80%, the mass fraction of the antioxidant is 5%, the mass fraction of the cross-linking agent is 3%, the mass fraction of the silane coupling agent is 12%, the mixed resin is obtained by mixing EVA resin and PO resin according to any proportion, wherein the mol content of vinyl acetate in the EVA resin is 20%; the mol content of alpha olefin in PO resin is 10%, antioxidant is beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) octadecyl propionate, tri (4-nonylphenol) phosphite is mixed, cross-linking agent comprises curing agent and auxiliary cross-linking agent, and curing agent comprises cumene peroxide and di-tert-butyl peroxide; the auxiliary cross-linking agent comprises triallyl isocyanurate and ethoxylated trimethylol propane trimethacrylate which are mixed, and the silane coupling agent is vinyl triethoxysilane and vinyl trimethoxysilane. The lower surface of the transition layer 2 is bonded to the upper surface of the back plate 3, and the thickness of the back plate 3 is 100 μm.
Example 2
As shown in FIG. 3, the integrated photovoltaic module packaging adhesive film is provided with a structural reflecting layer 1, a transition layer 2 and a back plate 3 in sequence from top to bottom, wherein the upper surface of the structural reflecting layer 1 is of a planar structure, the thickness of the structural reflecting layer 1 is 50 mu m, the structural reflecting layer 1 is made of inorganic filler and resin, the inorganic filler is 30% by mass, the resin is 70% by mass, and the inorganic filler is titanium dioxide and lithopone; the resin is modified EVA resin and modified PO resin. The lower surface of the structural reflective layer 1 has a plurality of first protruding cubes 11 and a plurality of second protruding cubes 12, the first protruding cubes 11 being disposed at the edges of the lower surface of the structural reflective layer 1, and the second protruding cubes 12 being disposed at the center of the lower surface of the structural reflective layer 1. As shown in fig. 4, a plurality of first grooves 14 are provided on the first protruding cubes 11, a plurality of second grooves 15 are provided on the second protruding cubes 12, and the upper surface of the transition layer 2 fills the first grooves 14 and the second grooves 15 and fills the gaps between the adjacent two cubes. The width of the first protruding cube 11 and the second protruding cube 12 are 5 μm, the height of the first protruding cube 11 is 15 μm, the height of the second protruding cube 12 is 5 μm, the height of the first protruding cube 11 is larger than the height of the second protruding cube 12, and the distance between two adjacent protruding cubes is 20 μm. The cross section of the first raised cube 11 is rectangular and the cross section of the second raised cube 12 is also rectangular. The upper surface of the transition layer 2 is filled with a hole-shaped structure, gaps between two adjacent cubes are filled, and the lower surface of the transition layer 2 is of a plane structure. The thickness of the transition layer 2 is 200 mu m, the transition layer 2 is composed of mixed resin, antioxidant, cross-linking agent and silane coupling agent, the mass fraction of the mixed resin is 80%, the mass fraction of the antioxidant is 5%, the mass fraction of the cross-linking agent is 3%, the mass fraction of the silane coupling agent is 12%, the mixed resin is obtained by mixing EVA resin and PO resin according to any proportion, wherein the mol content of vinyl acetate in the EVA resin is 20%; the mol content of alpha olefin in PO resin is 10%, antioxidant is beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) octadecyl propionate, tri (4-nonylphenol) phosphite is mixed, cross-linking agent comprises curing agent and auxiliary cross-linking agent, and curing agent comprises cumene peroxide and di-tert-butyl peroxide; the auxiliary cross-linking agent comprises triallyl isocyanurate and ethoxylated trimethylol propane trimethacrylate which are mixed, and the silane coupling agent is vinyl triethoxysilane and vinyl trimethoxysilane. The lower surface of the transition layer 2 is bonded to the upper surface of the back plate 3, and the thickness of the back plate 3 is 100 μm.
Example 3
As shown in figure 1, the integrated photovoltaic module packaging adhesive film is sequentially provided with a structural reflecting layer 1, a transition layer 2 and a back plate 3 from top to bottom, wherein the upper surface of the structural reflecting layer 1 is of a planar structure, the lower surface of the structural reflecting layer 1 is provided with a plurality of protruding cubes, each cube is provided with at least one hole-shaped structure, the thickness of the structural reflecting layer 1 is 100 mu m, the structural reflecting layer 1 is made of inorganic filler and resin, the mass percentage of the inorganic filler is 55%, the mass percentage of the resin is 45%, and the inorganic filler is lithopone and barium sulfate; the resin is a modified PO resin and a modified PVB resin. The lower surface of the structural reflective layer 1 has a plurality of first protruding cubes 11 and a plurality of second protruding cubes 12, and the first protruding cubes 11 and the second protruding cubes 12 are alternately arranged. As shown in fig. 2, the first protruding cube 11 is provided with at least one first hole-like structure 13, the second protruding cube 12 is provided with at least one second hole-like structure, the first hole-like structure 13 is divided into a first left hole and a first right hole, the left side and the right side of the first left Kong Zidi protruding cube 11 extend into the interior of the first protruding cube 11, the aperture of the first left hole is gradually reduced from the left side and the right side of the first protruding cube 11, the first right hole extends from the right side and the left side of the first protruding cube 11 to the inner center of the first protruding cube 11, the aperture of the first right hole is gradually reduced from the right side and the left side of the first protruding cube 11, the center line of the first left hole and the center line of the first right hole are on the same straight line, the second hole-shaped structure is divided into a second left hole and a second right hole, the left side and the right side of the second left Kong Zidi two convex cubes 12 extend into the inside of the second convex cubes 12, the aperture of the second left hole gradually reduces from the left side to the right side of the second convex cubes 12, the right side and the left side of the second right Kong Zidi two convex cubes 12 extend into the center of the inside of the second convex cubes 12, the aperture of the second right hole gradually reduces from the right side to the left side of the second convex cubes 12, the center line of the second left hole and the center line of the second right hole are on the same straight line, the upper surface of the transition layer 2 is filled with the first hole-shaped structure 13 and the second hole-shaped structure, and fills the gap between the first raised cube 11 and the second raised cube 12. The width of the first protruding cube 11 and the second protruding cube 12 are 15 μm, the height of the first protruding cube 11 is 18 μm, the height of the second protruding cube 12 is 15 μm, the height of the first protruding cube 11 is greater than the height of the second protruding cube 12, and the distance between two adjacent protruding cubes is 40 μm. The cross section of the first raised cube 11 is rectangular and the cross section of the second raised cube 12 is also rectangular. The upper surface of the transition layer 2 is filled with a hole-shaped structure, gaps between two adjacent cubes are filled, and the lower surface of the transition layer 2 is of a plane structure. The thickness of the transition layer 2 is 150 mu m, the transition layer 2 is composed of mixed resin, antioxidant, cross-linking agent and silane coupling agent, the mass fraction of the mixed resin is 90%, the mass fraction of the antioxidant is 2%, the mass fraction of the cross-linking agent is 1.5%, the mass fraction of the silane coupling agent is 6.5%, the mixed resin is obtained by mixing EVA resin and PO resin according to any proportion, wherein the molar content of vinyl acetate in the EVA resin is 30%; the mol content of alpha olefin in PO resin is 30%, the antioxidant is at least two of beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) octadecyl propionate and tri (2, 4-di-tert-butylphenyl) phosphite, the cross-linking agent comprises a curing agent and a co-cross-linking agent, and the curing agent comprises dicumyl hydroperoxide and 2, 5-dimethyl-2, 5-di-tert-butyl hexane peroxide; the auxiliary cross-linking agent comprises triallyl cyanurate, trimethylolpropane trimethacrylate and mixed silane coupling agent, wherein the silane coupling agent is vinyl tert-butylsilane triperoxide and vinyl triacetoxy silane. The lower surface of the transition layer 2 is attached to the upper surface of the back plate 3, and the thickness of the back plate 3 is 150 μm.
Example 4
According to the integrated photovoltaic module packaging adhesive film, as shown in fig. 1, a structural reflecting layer 1, a transition layer 2 and a back plate 3 are sequentially arranged from top to bottom, the upper surface of the structural reflecting layer 1 is of a planar structure, the thickness of the structural reflecting layer 1 is 150 mu m, the structural reflecting layer 1 is made of inorganic filler and resin, the inorganic filler is 65% by mass, the resin is 35% by mass, and the inorganic filler is mixed with white particles of barium sulfate and calcium carbonate; the resin is modified PVB resin and modified PE resin. The lower surface of the structural reflective layer 1 has a plurality of protruding cubes arranged periodically, the protruding cubes having a plurality of first protruding cubes 11 and a plurality of second protruding cubes 12, the first protruding cubes 11 being alternately arranged with the second protruding cubes 12. As shown in fig. 2, the first protruding cube 11 is provided with at least one first hole-like structure 13, the second protruding cube 12 is provided with at least one second hole-like structure, the first hole-like structure 13 is divided into a first left hole and a first right hole, the left side and the right side of the first left Kong Zidi protruding cube 11 extend into the interior of the first protruding cube 11, the aperture of the first left hole is gradually reduced from the left side and the right side of the first protruding cube 11, the first right hole extends from the right side and the left side of the first protruding cube 11 to the inner center of the first protruding cube 11, the aperture of the first right hole is gradually reduced from the right side and the left side of the first protruding cube 11, the center line of the first left hole and the center line of the first right hole are on the same straight line, the second hole-shaped structure is divided into a second left hole and a second right hole, the left side and the right side of the second left Kong Zidi two convex cubes 12 extend into the inside of the second convex cubes 12, the aperture of the second left hole gradually reduces from the left side to the right side of the second convex cubes 12, the right side and the left side of the second right Kong Zidi two convex cubes 12 extend into the center of the inside of the second convex cubes 12, the aperture of the second right hole gradually reduces from the right side to the left side of the second convex cubes 12, the center line of the second left hole and the center line of the second right hole are on the same straight line, the upper surface of the transition layer 2 is filled with the first hole-shaped structure 13 and the second hole-shaped structure, and fills the gap between the first raised cube 11 and the second raised cube 12. The width of the first protruding cube 11 and the second protruding cube 12 are both 20 μm, the height of the first protruding cube 11 is 20 μm, the height of the second protruding cube 12 is 18 μm, the height of the first protruding cube 11 is greater than the height of the second protruding cube 12, and the distance between two adjacent protruding cubes is 60 μm. The cross section of the first raised cube 11 is rectangular and the cross section of the second raised cube 12 is also rectangular. The upper surface of the transition layer 2 is filled with a hole-shaped structure, gaps between two adjacent cubes are filled, and the lower surface of the transition layer 2 is of a plane structure. The thickness of the transition layer 2 is 200 mu m, the transition layer 2 is composed of mixed resin, antioxidant, cross-linking agent and silane coupling agent, the mass fraction of the mixed resin is 93%, the mass fraction of the antioxidant is 1%, the mass fraction of the cross-linking agent is 0.5%, the mass fraction of the silane coupling agent is 5.5%, the mixed resin is obtained by mixing EVA resin and PO resin according to any proportion, wherein the molar content of vinyl acetate in the EVA resin is 50%; the molar content of alpha olefin in the PO resin is 40%, the antioxidant is a mixture of tri (4-nonylphenol) phosphite ester and tri (2, 4-di-tert-butylphenyl) phosphite ester, the cross-linking agent comprises a curing agent and a co-cross-linking agent, and the curing agent comprises n-butyl 4, 4-di (tert-amyl peroxy) valerate and tert-butyl peroxy-2-ethylhexyl carbonate; the auxiliary cross-linking agent comprises a mixture of trimethylolpropane trimethacrylate and diethylene glycol dimethacrylate, and the silane coupling agent is vinyltriacetoxy silane and vinyltris (beta-methoxyethoxy) silane. The lower surface of the transition layer 2 is bonded to the upper surface of the back plate 3, and the thickness of the back plate 3 is 200 μm.
Example 5
According to the integrated photovoltaic module packaging adhesive film, as shown in fig. 3, a structural reflecting layer 1, a transition layer 2 and a back plate 3 are sequentially arranged from top to bottom, the thickness of the structural reflecting layer 1 is 150 mu m, the structural reflecting layer 1 is made of inorganic filler and resin, the inorganic filler is 65% by mass, the resin is 35% by mass, and the inorganic filler is mixed by barium sulfate and calcium carbonate white particles; the resin is modified PVB resin and modified PE resin. The lower surface of the structural reflective layer 1 has a plurality of first protruding cubes 11 and a plurality of second protruding cubes 12, the first protruding cubes 11 being disposed at the edges of the lower surface of the structural reflective layer 1, and the second protruding cubes 12 being disposed at the center of the lower surface of the structural reflective layer 1. As shown in fig. 4, a plurality of first grooves 14 are provided on the first protruding cubes 11, a plurality of second grooves 15 are provided on the second protruding cubes 12, and the upper surface of the transition layer 2 fills the first grooves 14 and the second grooves 15 and fills the gaps between the adjacent two cubes. The width of the first protruding cube 11 and the second protruding cube 12 are both 20 μm, the height of the first protruding cube 11 is 20 μm, the height of the second protruding cube 12 is 18 μm, the height of the first protruding cube 11 is greater than the height of the second protruding cube 12, and the distance between two adjacent protruding cubes is 60 μm. The cross section of the first raised cube 11 is rectangular and the cross section of the second raised cube 12 is also rectangular. The upper surface of the transition layer 2 is filled with a hole-shaped structure, gaps between two adjacent cubes are filled, and the lower surface of the transition layer 2 is of a plane structure. The thickness of the transition layer 2 is 200 mu m, the transition layer 2 is composed of mixed resin, antioxidant, cross-linking agent and silane coupling agent, the mass fraction of the mixed resin is 93%, the mass fraction of the antioxidant is 1%, the mass fraction of the cross-linking agent is 0.5%, the mass fraction of the silane coupling agent is 5.5%, the mixed resin is obtained by mixing EVA resin and PO resin according to any proportion, wherein the molar content of vinyl acetate in the EVA resin is 50%; the molar content of alpha olefin in the PO resin is 40%, the antioxidant is at least two of tris (4-nonylphenol) phosphite ester and tris (2, 4-di-tert-butylphenyl) phosphite ester, the cross-linking agent comprises a curing agent and a co-cross-linking agent, and the curing agent comprises tert-butyl peroxy-2-ethylhexyl carbonate and ethyl 3, 3-di (tert-butylperoxy) butyrate; the auxiliary cross-linking agent comprises a mixture of trimethylolpropane trimethacrylate and diethylene glycol dimethacrylate, and the silane coupling agent is vinyltriacetoxy silane and vinyltris (beta-methoxyethoxy) silane. The lower surface of the transition layer 2 is bonded to the upper surface of the back plate 3, and the thickness of the back plate 3 is 200 μm.
The adhesive films of examples 1 to 5 and comparative example 1 were tested for performance, and in the same condition of other materials, solar modules were prepared and tested by passing through a solar module laminator, vacuum-pumping at 145 ℃ for 6min, and lamination for 10min, and the test results are shown in the following table 1, and comparative example 1 is a sewakey EVA white film:
It will be appreciated by those skilled in the art that one of the features or objects of the invention is that: the integrated photovoltaic module packaging adhesive film provided by the invention has the advantages of high reflectivity, firm adhesion between the reflecting layer and the backboard, simplicity, high efficiency, reduction of backboard lamination procedures, and suitability for large-scale popularization and application.
It should be noted that the above embodiments are only for illustrating the technical solution of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solution of the present invention may be modified or substituted without departing from the spirit and scope of the technical solution of the present invention, which is intended to be covered in the scope of the claims of the present invention.

Claims (6)

1. An integrated photovoltaic module packaging adhesive film, which is characterized by comprising: the upper surface of the structural reflecting layer is of a planar structure, the lower surface of the structural reflecting layer is provided with a plurality of raised cubes, each cube is provided with at least one hole-shaped structure, the upper surface of the transition layer is filled with the hole-shaped structure and fills a gap between two adjacent cubes, the lower surface of the transition layer is of a planar structure, the lower surface of the transition layer is attached to the upper surface of the backboard, the structural reflecting layer is made of inorganic filler and resin, the inorganic filler accounts for 30-65% by mass, the resin accounts for 35-70% by mass,
The plurality of protruding cubes are arranged periodically, the protruding cubes are provided with a plurality of first protruding cubes and a plurality of second protruding cubes, the first protruding cubes and the second protruding cubes are alternately arranged,
The first protruding cube is provided with at least one first hole-shaped structure, the second protruding cube is provided with at least one second hole-shaped structure, the first hole-shaped structure is divided into a first left hole and a first right hole, the left side and the right side of the first protruding cube extend to the inside of the first protruding cube, the aperture of the first left hole is gradually reduced from the left side and the right side of the first protruding cube, the first right hole extends from the right side and the left side of the first protruding cube to the inner center of the first protruding cube, the aperture of the first right hole is gradually reduced from the right side and the left side of the first protruding cube, the center line of the first left hole and the center line of the first right hole are on the same straight line, the second hole-shaped structure is divided into a second left hole and a second right hole, the aperture of the second left hole Kong Zi extends from the left side and the right side of the second protruding cube to the inside of the second protruding cube, the aperture of the first hole-shaped structure is gradually reduced from the right side and the center line of the second protruding cube, the second hole-shaped structure is gradually reduced from the left side and the right side of the second protruding cube, the second hole-shaped structure is gradually reduced from the right side and the center line of the second protruding cube to the second hole-shaped structure,
The width of the first protruding cube and the width of the second protruding cube are 5-20 mu m, the height of the first protruding cube is 15-20 mu m, the height of the second protruding cube is 5-18 mu m, the height of the first protruding cube is larger than the height of the second protruding cube, and the distance between two adjacent protruding cubes is 20-60 mu m.
2. An integrated photovoltaic module packaging adhesive film, which is characterized by comprising: the upper surface of the structural reflecting layer is of a planar structure, the lower surface of the structural reflecting layer is provided with a plurality of raised cubes, each cube is provided with at least one hole-shaped structure, the upper surface of the transition layer is filled with the hole-shaped structure and fills a gap between two adjacent cubes, the lower surface of the transition layer is of a planar structure, the lower surface of the transition layer is attached to the upper surface of the backboard, the structural reflecting layer is made of inorganic filler and resin, the inorganic filler accounts for 30-65% by mass, the resin accounts for 35-70% by mass,
The first protruding cube is provided with at least one first hole-shaped structure, the second protruding cube is provided with at least one second hole-shaped structure, the first hole-shaped structure is divided into a first left hole and a first right hole, the left side and the right side of the first protruding cube extend to the inside of the first protruding cube, the aperture of the first left hole is gradually reduced from the left side and the right side of the first protruding cube, the first right hole extends from the right side and the left side of the first protruding cube to the inner center of the first protruding cube, the aperture of the first right hole is gradually reduced from the right side and the left side of the first protruding cube, the center line of the first left hole and the center line of the first right hole are on the same straight line, the second hole-shaped structure is divided into a second left hole and a second right hole, the aperture of the second left hole Kong Zi extends from the left side and the right side of the second protruding cube to the inside of the second protruding cube, the aperture of the first hole-shaped structure is gradually reduced from the right side and the center line of the second protruding cube, the second hole-shaped structure is gradually reduced from the left side and the right side of the second protruding cube, the second hole-shaped structure is gradually reduced from the right side and the center line of the second protruding cube to the second hole-shaped structure,
The convex cubes are provided with a plurality of first convex cubes and a plurality of second convex cubes, the first convex cubes are arranged at the edge of the lower surface of the structural reflecting layer, the second convex cubes are arranged at the center of the lower surface of the structural reflecting layer,
The first protruding cube is provided with a plurality of first grooves, the second protruding cube is provided with a plurality of second grooves, the upper surface of the transition layer is filled with the first grooves and the second grooves and the gaps between the two adjacent cubes are filled,
The width of the first protruding cube and the width of the second protruding cube are 5-20 mu m, the height of the first protruding cube is 15-20 mu m, the height of the second protruding cube is 5-18 mu m, the height of the first protruding cube is larger than the height of the second protruding cube, and the distance between two adjacent protruding cubes is 20-60 mu m.
3. An integrated photovoltaic module packaging film according to claim 1 or 2, wherein: the thickness of the structural reflecting layer is 50-150 mu m, and the inorganic filler is any one or a mixture of more of titanium dioxide, lithopone, barium sulfate and calcium carbonate white particles; the resin is any one or a mixture of more of modified EVA resin, modified PO resin, modified PVB resin and modified PE resin.
4. An integrated photovoltaic module packaging film according to claim 1 or 2, wherein: the cross section of the first protruding cube is rectangular, and the cross section of the second protruding cube is also rectangular.
5. An integrated photovoltaic module packaging film according to claim 1 or 2, wherein: the thickness of the transition layer is 100-200 mu m, the transition layer is composed of mixed resin, antioxidant, cross-linking agent and silane coupling agent, the mass fraction of the mixed resin is 80-93%, the mass fraction of the antioxidant is 1-5%, the mass fraction of the cross-linking agent is 0.5-3%, the mass fraction of the silane coupling agent is 5.5-12%, the mixed resin is obtained by mixing EVA resin and PO resin according to any proportion, wherein the molar content of vinyl acetate in the EVA resin is 20-50%; the mol content of alpha olefin in the PO resin is 10% -40%, the antioxidant is any one or more of beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) octadecyl propionate, tri (4-nonylphenol) phosphite and tri (2, 4-di-tert-butylphenyl) phosphite, the cross-linking agent comprises a curing agent and a co-cross-linking agent, and the curing agent comprises cumene peroxide, di-tert-butyl peroxide, dicumyl hydroperoxide, 2, 5-dimethyl-2, 5-di-tert-butyl hexane peroxide, 4-di (tert-amyl peroxy) n-butyl valerate, tert-butyl peroxy-2-ethylhexyl carbonate and 3, 3-di (tert-butyl peroxy) ethyl butyrate; the auxiliary cross-linking agent comprises any one or a mixture of a plurality of triallyl isocyanurate, ethoxylated trimethylolpropane trimethacrylate, triallyl cyanurate, propoxylated trimethylolpropane trimethacrylate and diethylene glycol dimethacrylate, and the silane coupling agent is at least one of vinyl triethoxysilane, vinyl trimethoxysilane, vinyl t-butylperoxy silane, vinyl triacetoxy silane and vinyl tri (beta-methoxyethoxy) silane.
6. An integrated photovoltaic module packaging film according to claim 1 or 2, wherein: the thickness of the backboard is 100-200 mu m.
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