CN111725283B

CN111725283B - Display module, display screen assembly and electronic equipment

Info

Publication number: CN111725283B
Application number: CN202010576081.5A
Authority: CN
Inventors: 张弓
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-06-22
Filing date: 2020-06-22
Publication date: 2023-06-30
Anticipated expiration: 2040-06-22
Also published as: CN111725283A

Abstract

The application discloses a display module, display screen subassembly and electronic equipment relates to structural design technical field. In the display module, the display layer is used for displaying information; the auxiliary layer and the display layer are arranged in a stacked mode, and a pixel driving circuit is arranged in the auxiliary layer and used for driving the display layer to display information; the pressure sensing layer is formed inside the auxiliary layer and is used for sensing pressure for deforming the pressure sensing layer. The application sets up the forced induction layer in the auxiliary layer that contains pixel drive circuit, and the forced induction layer can sense the pressure that the display layer of display module assembly received through deformation for display module assembly has the pressure and feels the touch-control function, can replace entity function button, improves electron device's screen ratio.

Description

Display module, display screen assembly and electronic equipment

Technical Field

The application relates to the technical field of structural design, in particular to a display module, a display screen assembly and electronic equipment.

Background

The requirements on the screen occupation ratio of electronic devices such as mobile phones and tablet personal computers are higher and higher, and the display occupation ratio of the screen is further improved, so that the edges of the display screen occupy the positions of physical function keys such as volume control, screen-extinguishing control and the like on the periphery of the original electronic device after being bent. And then the schemes of replacing entity function keys such as volume control, screen-off control and the like are needed.

Disclosure of Invention

The technical problem to be solved by the application is to provide a display module, a display screen assembly and electronic equipment.

In order to solve the technical problems, the adopted technical scheme is as follows: a display module, comprising:

a display layer for displaying information;

the auxiliary layer is arranged in a lamination manner with the display layer, and a pixel driving circuit is arranged in the auxiliary layer and used for driving the display layer to display information; and

and the pressure sensing layer is formed inside the auxiliary layer and is used for sensing the pressure for deforming the pressure sensing layer.

In order to solve the technical problems, the adopted technical scheme is as follows: a display screen assembly comprises the display module and a display screen cover plate, wherein the display screen cover plate covers the display layer.

In order to solve the technical problems, the adopted technical scheme is as follows: an electronic device comprises the display screen assembly, and further comprises a shell, wherein the display screen assembly is arranged on the shell.

By adopting the technical scheme, the beneficial effects that have are: the application sets up the forced induction layer in the auxiliary layer that contains pixel drive circuit, and the forced induction layer can sense the pressure that the display layer of display module assembly received through deformation for display module assembly has the pressure and feels the touch-control function, can replace entity function button, improves electron device's screen ratio.

Drawings

Fig. 1 discloses a schematic diagram of a partial structure splitting of an electronic device in an embodiment of the present application;

FIG. 2 is a schematic diagram of an axial structure of an electronic device according to an embodiment of the present disclosure;

FIG. 3 is a schematic front view of the overall structure of an electronic device according to an embodiment of the present disclosure;

FIG. 4 is a schematic diagram of a display assembly according to an embodiment of the present disclosure;

FIG. 5 is a schematic diagram of a portion of a display layer according to an embodiment of the present disclosure;

FIG. 6 is a schematic diagram of a portion of a display layer according to an embodiment of the present disclosure;

FIG. 7 is a schematic diagram of a portion of a display assembly according to an embodiment of the present disclosure;

FIG. 8 is a schematic diagram of a portion of a Wheatstone bridge circuit in a pressure sensing layer according to an embodiment of the present application;

FIG. 9 is a schematic diagram of a display assembly according to another embodiment of the present disclosure;

FIG. 10 is a schematic diagram of a display assembly according to another embodiment of the present disclosure;

FIG. 11 is a schematic diagram of a display assembly according to another embodiment of the present disclosure;

FIG. 12 is a schematic view showing the structural separation of the housing according to an embodiment of the present application;

FIG. 13 is a schematic diagram of an electronic device according to another embodiment of the present disclosure;

FIG. 14 is a schematic view of the overall structure of an electronic device according to yet another embodiment of the present application;

FIG. 15 is a schematic diagram of the electronic device from another perspective in the embodiment of FIG. 14;

FIG. 16 is a schematic diagram of a disassembled structure of the electronic device in the embodiment of FIG. 14;

FIG. 17 is a schematic diagram illustrating a side view of a display cover plate according to an embodiment of the present disclosure;

FIG. 18 is a schematic diagram illustrating a side view of a display module according to an embodiment of the present disclosure;

fig. 19 discloses a schematic structural diagram of an electronic device according to an embodiment of the present application.

Detailed Description

The invention is described in further detail below with reference to the drawings and examples. It is specifically noted that the following examples are only for illustrating the present invention, but do not limit the scope of the present invention. Likewise, the following examples are only some, but not all, of the examples of the present invention, and all other examples, which a person of ordinary skill in the art would obtain without making any inventive effort, are within the scope of the present invention.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the invention. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

As used herein, "electronic equipment" (which may also be referred to as a "terminal" or "mobile terminal" or "electronic device") includes, but is not limited to, devices configured to receive/transmit communication signals via a wireline connection, such as via a public-switched telephone network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface, such as for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal. A communication terminal configured to communicate through a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal", or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellites or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; a PDA that can include a radiotelephone, pager, internet/intranet access, web browser, organizer, calendar, and/or a Global Positioning System (GPS) receiver; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. The mobile phone is the electronic equipment provided with the cellular communication module.

It should be noted that, the electronic device in the embodiments of the present application is mainly directed to a display screen that can be used as a touch panel. For example, part or all of the display interface of the display screen can input signals through contacts, hands and the like, and control the operation of the electronic equipment and the picture display of the display screen.

Referring to fig. 1, fig. 2 and fig. 3 together, fig. 1 discloses a schematic diagram of a partial structure of an electronic device in an embodiment of the present application, fig. 2 discloses a schematic diagram of an axial structure of the electronic device in an embodiment of the present application, and fig. 3 discloses a schematic diagram of an overall structure of the electronic device in an embodiment of the present application. It should be noted that the electronic device 000 may be any of a number of electronic devices including, but not limited to, mobile phones or smart phones (e.g., iPhone-based (TM) -based phones), portable gaming devices (e.g., nintendo DS (TM) -PlayStation Portable (TM) -Gameboy Advance TM, -iPhone (TM)), portable internet devices, personal digital assistants, audio players, other media players, music recorders, video recorders, other media recorders, data storage devices, radios, medical devices, vehicle transportation equipment, calculators, programmable remote controls, pagers, desktop computers, printers, internet access computers, handheld devices, moving picture experts group (MPEG-1 or MPEG-2) audio layer 3 (MP 3) players, portable medical devices, other wearable devices requiring charging (e.g., devices such as electronic bracelets, electronic necklaces, head Mounted Devices (HMDs) of electronic devices or smart watches), and digital cameras and combinations thereof.

In some cases, electronic device 000 may perform a variety of functions (e.g., playing music, displaying video, storing pictures, and receiving and sending phone calls).

Next, the electronic device 000 is taken as an example of a mobile phone. The electronic device 000 includes, but is not limited to, the following structures: display screen assembly 400 and housing 800. The display assembly 400 is embedded in the housing 800 for displaying information.

Specifically, the display assembly 400 may include a display cover 401 and a display module 402. The display panel cover 401 is fastened to the housing 800, and encloses a receiving space 900, where the receiving space 900 is used for receiving electronic components, such as a motherboard, a battery, etc., inside the electronic device 000. The display module 402 is disposed in the accommodating space 900 and is attached to the surface of the display panel cover 401, for displaying information.

In an embodiment, the display panel cover 401 may be made of a transparent material such as glass or resin, which is not limited herein. The display panel 401 is used for protecting the display module 402 and electronic components inside the electronic device 000. The display panel 401 can prevent the display module 402 from being damaged. The user can view the screen displayed on the display layer 110 through the display cover 401. In one embodiment, the display module 402 may be a flexible display screen such as an OLED flexible display screen.

In some embodiments, the electronic device 000 is primarily directed to a display screen having a four-, three-, or two-sided curved configuration. The display screen is provided with at least two adjacent bending parts on the bending side, and the corner positions formed by the adjacent bending parts are also required to be bent connecting part structures. Referring to fig. 2, the display cover 401 may include a main cover portion 403 and a side cover portion 404. The bead plate portion 404 is provided at the edge of the main plate portion 403. The side cover portion 404 is bent from the edge of the cover portion 403 toward the housing 800, and the display module 402 is attached to the side cover portion 404 to form a bent portion.

Referring to fig. 4, a schematic structure of a display assembly 400 according to an embodiment of the present application is disclosed. The display assembly 400 may include a display cover 401, a display layer 110, an auxiliary layer 405, and a pressure sensitive layer 120. The display layer 110 and the auxiliary layer 405 are stacked to form the display module 402. The display panel 401 is stacked with the display layer 110, and the display layer 110 is located between the display panel 401 and the auxiliary layer 405. The pressure sensitive layer 120 is disposed within the auxiliary layer 405.

It will be appreciated that pressing the display cover 401 by a user via touch (e.g., via a finger, stylus, etc.) causes the display cover 401 to deform such that the display layer 110, the auxiliary layer 405, and the pressure sensitive layer 120 undergo corresponding amounts of deformation. The deformation of the pressure sensing layer 120 causes the resistance of the pressure sensing layer 120 to change, and the pressure is measured by detecting the resistance change amount of the pressure sensing layer 120, namely the pressure determines the deformation amount, and the deformation amount determines the resistance value of the sensor. The pressure is detected by reading the resistance value. The electronic device 000 responds accordingly to the magnitude of the input pressure. Such as controlling the operation of the electronic device 000, controlling the display of information by the display layer 110, etc.

Specifically, the display layer 110 is a main structure for displaying a picture in the display assembly 400. Referring to fig. 5 and fig. 6, fig. 5 discloses a schematic diagram of a portion of the display layer 110 according to an embodiment of the present application, and fig. 6 discloses a schematic diagram of a portion of the display layer 110 according to an embodiment of the present application. The display layer 110 may include a plurality of rows of pixel units 111. Each pixel unit 111 is formed of a plurality of sub-pixels 112. The sub-pixels 112 include R pixels, G pixels, and B pixels. Each pixel unit 111 may include one of an R pixel, a G pixel, and a B pixel. In some embodiments, some pixel units 111 may include only one or two sub-pixels 112 of R pixels, G pixels, and B pixels, which are not particularly limited herein.

It is understood that in the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.

In one embodiment, the display cover 401 forms virtual keys on an outer surface opposite the pressure sensitive layer 120. The pressure sensing layer 120 is capable of receiving pressure information pressed by a user at virtual keys in the display cover 401. Specifically, the virtual key is formed on the area of the display panel cover 401 opposite to the pressure sensing layer 120, that is, the orthographic projection area of the pressure sensing layer 120 on the display panel cover 401. This area is not visible as an independent separate area from the outer surface of the electronic device 000, but is part of the entire display cover 401. Nor does this region form a protrusion or depression. In one embodiment, virtual keys may be formed at any location on the main cover portion 403, such as a center region, edge, etc. Virtual keys may also be formed on bead plate portion 404.

In one embodiment, virtual keys may be formed in bead plate portion 404. The virtual keys may include at least one of a power key, a voice adjust key, or a home key, although the virtual keys may be a free line key such as a trigger key, etc., and the virtual keys may be others, without limitation. With the above structure, the electronic device 000 can reduce the setting of the physical keys, even without setting the physical keys, so as to improve the screen occupation ratio of the electronic device 000.

In one embodiment, virtual keys may be formed in the main cover portion 403. The virtual keys may include at least one of a return key, a menu key, or a home key. The virtual keys may be other as well, and are not so limited.

It can be appreciated that when the user presses the area of the display panel 401 corresponding to the virtual key, the pressure sensing layer 120 in the electronic device 000 receives the pressing force of the user on the display panel 401 through the display panel 401 or the display panel 401 and the intermediate layer between the display panel 401 and the pressure sensing layer 120, so as to complete the corresponding instruction input according to the pressing force, and further control the electronic device 000.

Referring to fig. 7, a schematic diagram of a portion of a display assembly 400 according to an embodiment of the present application is disclosed. The display panel assembly 400 includes a pressure sensing layer 120, a flexible substrate layer 130, a first buffer layer 140, a polysilicon layer 150, a first gate insulating layer 160, a first gate layer 170, a second gate insulating layer 180, a second buffer layer 190, a third gate insulating layer 200, a second gate layer 210, an insulating layer 220, a first source/drain layer 230, a second source/drain layer 240, a passivation layer 250, a planarization layer 260, a pixel isolation layer 270, a flexible encapsulation layer 280, and a display panel cover plate 401.

Specifically, the flexible substrate layer 130, the first buffer layer 140, the first gate insulating layer 160, the second gate insulating layer 180, the second buffer layer 190, the insulating layer 220, the passivation layer 250, the planarization layer 260, the pixel isolation layer 270, the flexible encapsulation layer 280, and the display panel cover 401 are sequentially stacked.

The polysilicon layer 150 is disposed between the first buffer layer 140 and the first gate insulating layer 160 such that a portion of the first buffer layer 140 is in contact with the polysilicon layer 150 and a portion is in contact with the first gate insulating layer 160. So that a portion of the first gate insulating layer 160 is in contact with the polysilicon layer 150 and a portion is in contact with the first buffer layer 140.

The first gate layer 170 is disposed between the first gate insulating layer 160 and the second gate insulating layer 180 such that a portion of the first gate insulating layer 160 is in contact with the first gate layer 170 and a portion is in contact with the second gate insulating layer 180. Such that a portion of the second gate insulating layer 180 is in contact with the first gate layer 170 and a portion is in contact with the first gate insulating layer 160. The forward projection area of the first gate layer 170 on the flexible substrate layer 130 is contained within the forward projection area of the polysilicon layer 150 on the flexible substrate layer 130.

The third gate insulating layer 200 and the second gate layer 210 are stacked, and the third gate insulating layer 200 and the second gate layer 210 are disposed between the second buffer layer 190 and the insulating layer 220. The orthographic projection area of the third gate insulating layer 200 on the flexible substrate layer 130 coincides with the orthographic projection area of the second gate layer 210 on the flexible substrate layer 130. Or, the orthographic projection area of the second gate layer 210 on the flexible substrate layer 130 is included in the orthographic projection area of the third gate insulating layer 200 on the flexible substrate layer 130. A portion of the second buffer layer 190 is in contact with the third gate insulating layer 200 and a portion is in contact with the insulating layer 220. A portion of the insulating layer 220 is in contact with the second gate layer 210 and a portion is in contact with the second buffer layer 190, and a forward projection region of the second gate layer 210 on the flexible substrate layer 130 is included in a forward projection region of the polysilicon layer 150 on the flexible substrate layer 130.

The first source/drain layer 230 is disposed between the insulating layer 220 and the passivation layer 250 such that a portion of the insulating layer 220 is in contact with the first source/drain layer 230 and a portion is in contact with the passivation layer 250. So that a portion of the passivation layer 250 is in contact with the first source and drain layer 230 and a portion is in contact with the insulating layer 220.

The second source/drain layer 240 is disposed between the insulating layer 220 and the passivation layer 250 such that a portion of the insulating layer 220 is in contact with the second source/drain layer 240 and a portion is in contact with the passivation layer 250. So that a portion of the passivation layer 250 is in contact with the second source and drain layer 240 and a portion is in contact with the insulating layer 220.

The first source/drain layer 230 and the second source/drain layer 240 are respectively connected to the polysilicon layer 150 via holes.

The pressure sensitive layer 120 is disposed between the second buffer layer 190 and the insulating layer 220 such that a portion of the second buffer layer 190 is in contact with the pressure sensitive layer 120 and a portion is in contact with the insulating layer 220. Such that a portion of the insulating layer 220 is in contact with the pressure sensing layer 120 and a portion is in contact with the second buffer layer 190. In an embodiment, the pressure sensing layer 120 may include an oxide layer 121, a fourth gate insulating layer 122, and a third gate layer 123. The oxide layer 121, the fourth gate insulating layer 122, and the third gate layer 123 are sequentially stacked. A portion of the second buffer layer 190 is in contact with the oxide layer 121 and a portion is in contact with the insulating layer 220. A portion of the insulating layer 220 is in contact with the third gate layer 123 and a portion is in contact with the second buffer layer 190.

The terms "first," "second," "third," and the like in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", and "a third" may explicitly or implicitly include at least one such feature.

In one embodiment, the orthographic projection area of the oxide layer 121 on the flexible substrate layer 130, the orthographic projection area of the fourth gate insulating layer 122 on the flexible substrate layer 130, and the orthographic projection area of the third gate layer 123 on the flexible substrate layer 130 are completely coincident with each other.

In one embodiment, the pixel units 111 in the display layer 110 are arranged on the same layer as the pixel isolation layer 270.

In an embodiment, the planarization layer 260 may include a first planarization layer 261 and a second planarization layer 262. The passivation layer 250, the first planarization layer 261, the second planarization layer 262, and the pixel isolation layer 270 are sequentially stacked.

In one embodiment, the pixel units 111 and the portions of the upper surface of the second planarization layer 262 that are not covered by the pixel units 111 are covered by the pixel isolation layer 270.

In one embodiment, the flexible substrate layer 130, the first buffer layer 140, the first gate insulating layer 160, the second gate insulating layer 180, the second buffer layer 190, the insulating layer 220, the passivation layer 250, and the planarization layer 260 constitute the auxiliary layer 405 described above. The polysilicon layer 150, the first gate layer 170, the third gate insulating layer 200, the second gate layer 210, the first source drain layer 230, and the second source drain layer 240 constitute a gate driving circuit, and the gate driving circuit is formed in the auxiliary layer 405. It will be understood that the data line circuit is also disposed in the auxiliary layer 405, and the gate driving circuit and the data line circuit may form a pixel driving circuit.

In one embodiment, the third gate insulating layer 200 and the fourth gate insulating layer 122 are a unitary structure. In one embodiment, the second gate layer 210 and the third gate layer 123 are integrally formed.

It will be appreciated that with the above structure, the pressure sensing layer 120 is applied to realize the function of a pressure sensor, and the virtual key of the display panel cover 401 is pressed by a finger, a stylus, or the like, so that the display panel cover 401 is locally deformed, and the flexible packaging layer 280, the pixel isolation layer 270, the flat layer 260, the passivation layer 250, the insulating layer 220, the pressure sensing layer 120, and other layers have corresponding deformation amounts, so that the pressing force can be detected. And then, the corresponding instruction input is completed according to the magnitude of the pressing force, and the electronic device 000 is further controlled.

In one embodiment, please refer to fig. 8, which discloses a schematic diagram of a portion of the wheatstone bridge circuit in the pressure sensing layer 120 according to one embodiment of the present application. The pressure sensing layer 120 is internally provided with a wheatstone bridge circuit 124 for detecting resistance change caused by deformation of the oxide layer 121, and pressure measurement is realized by detecting the corresponding resistance change amount of the oxide layer 121, that is, the pressure determines the deformation amount of the oxide layer 121, and the deformation amount of the oxide layer 121 determines the resistance value. By reading out the resistance value, the pressure sensing layer 120 detects the pressure.

Specifically, the wheatstone bridge circuit 124 is configured to detect whether a user presses a virtual key touching the display screen cover 401, so as to realize the detection of the pressing of the virtual key and achieve the effect of pressing the corresponding key.

In one embodiment, the wheatstone bridge circuit 124 includes 4 resistors 125 connected to each other to form four legs. Resistor 125 is connected to a galvo 126. The wheatstone bridge circuit 124 is a device composed of 4 resistors 125 for measuring the resistance value of the last resistor 125 (i.e., the resistance of the oxide layer 121) in the case where the resistance value of 3 resistors 125 is known. The 4 resistors 125 form a square. A galvanometer 126 connects the two opposing junctions.

The wheatstone bridge circuit 124 (also known as a single arm bridge circuit) is an instrument that can accurately measure resistance. The general wheatstone bridge resistances R1, R2, R3, R4 may be called four legs of the bridge, with the galvanometer 126 being used to check the current in the leg in which it is located.

The wheatstone bridge circuit 124 is balanced when no current is passed through the galvo 126. At equilibrium, the resistance values of the four arms satisfy a simple relationship with which the resistance can be measured. When the ammeter shows no current passing, the wheatstone bridge circuit 124 is in an equilibrium state, i.e., r1·r2=r3·r4.

The wheatstone bridge circuit 124 is in an unbalanced state when a current is passed through the galvanometer 126 for measuring small changes in the resistance value. For example, a resistance strain gauge (formed by sticking a resistance wire in a grid shape between two thin paper or plastic films) is stuck to an object, when the pressure-sensitive layer 120 is deformed, the strain gauge is deformed, the resistance of the strain gauge is changed from Rx when the bridge is balanced to rx+Δr, at this time, the current Ig passing through the galvanometer 126 is also changed, Δr is measured from the relationship between Ig and Δr, and then the deformation amount of the object is calculated from the relationship between Δr and solid deformation.

It will be appreciated that the deformation of the pressure sensing layer 120 causes the resistance 125 in the wheatstone bridge circuit 124 to change, and the pressure is measured by detecting the corresponding change in the resistance 125, i.e. the magnitude of the pressure determines the magnitude of the deformation, which determines the magnitude of the resistance in the wheatstone bridge circuit 124. The galvanometer 126 is used for detecting current change caused by deformation caused by the user pressing the virtual key on the cover plate, and further obtains resistance value change through current change, so as to realize pressure detection.

Referring to fig. 9, a schematic structure of a display assembly 400 according to another embodiment of the present application is disclosed. The orthographic projection area of the pressure sensing layer 120 on the flexible substrate layer 130 overlaps the orthographic projection area of the second source/drain layer 240 on the flexible substrate layer 130. Alternatively, the orthographic projection area of the pressure sensing layer 120 on the flexible substrate layer 130 is included in the orthographic projection area of the second source drain layer 240 on the flexible substrate layer 130.

Referring to fig. 10, a schematic structure of a display assembly 400 according to another embodiment of the present application is disclosed. The orthographic projection area of the pressure sensing layer 120 on the flexible substrate layer 130 overlaps the orthographic projection area of the first source/drain layer 230 on the flexible substrate layer 130. Alternatively, the orthographic projection area of the pressure sensing layer 120 on the flexible substrate layer 130 is included in the orthographic projection area of the first source drain layer 230 on the flexible substrate layer 130.

Referring to fig. 11, a schematic structure of a display screen assembly 400 according to another embodiment of the present application is disclosed. The display panel assembly 400 includes a pressure sensing layer 120, a flexible substrate layer 130, a first buffer layer 140, a polysilicon layer 150, a first gate insulating layer 160, a first gate layer 170, a second gate insulating layer 180, a second buffer layer 190, a third gate insulating layer 200, a second gate layer 210, an insulating layer 220, a first source/drain layer 230, a second source/drain layer 240, a passivation layer 250, a planarization layer 260, a pixel isolation layer 270, a flexible encapsulation layer 280, a display panel cover plate 401, a third source/drain layer 290, a fourth source/drain layer 300, an organic light emitting layer 310, an anode layer 320, a fifth source/drain layer 330, a first oxide layer 340, a fifth gate insulating layer 350, a fourth gate layer 360, and a sixth source/drain layer 370.

For the names described above and below, "first buffer layer", "second buffer layer" and "buffer layer" may be converted to each other, for example, "first buffer layer" may also be referred to as "second buffer layer" and may also be referred to as "buffer layer".

For the names described above and below, the "first oxide layer" and the "oxide layer" may be converted to each other, for example, the "first oxide layer" may also be referred to as the "oxide layer".

For the names described above and below, "first gate insulating layer", "second gate insulating layer", "third gate insulating layer", "fourth gate insulating layer", "fifth gate insulating layer", and "gate insulating layer" may be converted to each other, for example, "first gate insulating layer" may also be referred to as "second gate insulating layer" and may also be referred to as "gate insulating layer".

For the names described above and below, "first gate layer", "second gate layer", "third gate layer", "fourth gate layer" and "gate layer" may be converted to each other, for example, "first gate layer" may also be referred to as "second gate layer" and may also be referred to as "gate layer".

For the above and below-described names, "first source-drain layer", "second source-drain layer", "third source-drain layer", "fourth source-drain layer", "fifth source-drain layer", "sixth source-drain layer" and "source-drain layer" may be converted to each other, for example, "first source-drain layer" may also be referred to as "second source-drain layer" and may also be referred to as "source-drain layer".

Specifically, the flexible substrate layer 130, the first buffer layer 140, the first gate insulating layer 160, the second gate insulating layer 180, the second buffer layer 190, the insulating layer 220, the passivation layer 250, the planarization layer 260, the pixel isolation layer 270, the flexible encapsulation layer 280, and the display panel cover 401 are disposed using the technical scheme described in the above embodiments.

The third source-drain layer 290 is disposed between the first and second planarization layers 261 and 262 such that a portion of the first planarization layer 261 is in contact with the third source-drain layer 290 and a portion is in contact with the second planarization layer 262. So that a portion of the second planarization layer 262 is in contact with the third source/drain layer 290 and a portion is in contact with the first planarization layer 261.

The third source drain layer 290 is connected to the first source drain layer 230 via holes.

The fourth source-drain layer 300 is disposed between the first and second planarization layers 261 and 262 such that a portion of the first planarization layer 261 is in contact with the fourth source-drain layer 300 and a portion is in contact with the second planarization layer 262. So that a portion of the second planarization layer 262 is in contact with the fourth source-drain layer 300 and a portion is in contact with the first planarization layer 261.

The fourth source/drain layer 300 is connected to the second source/drain layer 240 via.

The organic light emitting layer 310 and the anode layer 320 are stacked, and the anode layer 320 is disposed on a side of the second planarization layer 262 remote from the flexible substrate layer 130. The pixel units 111 in the display layer 110 are arranged in the same layer as the anode layer 320.

The pixel isolation layer 270 covers the pixel unit 111, the anode layer 320, and the portions of the upper surface of the second planarization layer 262 that are not covered by the pixel unit 111 and the anode layer 320. And the portion of the pixel isolation layer 270 contacting the anode layer 320 is partially formed with a via hole, and the organic light emitting layer 310 is positioned on the pixel isolation layer 270 and partially penetrates the via hole of the pixel isolation layer 270 to be connected with the anode layer 320. The pixel isolation layer 270 and the organic light emitting layer 310 are provided with a flexible encapsulation layer 280, and the display panel cover plate 401 is disposed on the flexible encapsulation layer 280.

The first oxide layer 340, the fifth gate insulating layer 350, and the fourth gate layer 360 are sequentially stacked. The first oxide layer 340, the fifth gate insulating layer 350, and the fourth gate layer 360 are each disposed between the second buffer layer 190 and the insulating layer 220 such that a portion of the second buffer layer 190 is in contact with the first oxide layer 340 and a portion is in contact with the insulating layer 220. So that a portion of the insulating layer 220 is in contact with the fourth gate layer 360, a portion of the first oxide layer 340 is in contact with the second buffer layer 190, and a portion of the portion not covered by the fifth gate insulating layer 350 and the fourth gate layer 360. In an embodiment, the orthographic region of the fourth gate layer 360 on the flexible substrate layer 130 coincides with the orthographic region of the fifth gate insulating layer 350 on the flexible substrate layer 130, or the orthographic region of the fourth gate layer 360 on the flexible substrate layer 130 is included in the orthographic region of the fifth gate insulating layer 350 on the flexible substrate layer 130. In an embodiment, the forward projection region of fifth gate insulating layer 350 on flexible substrate layer 130 is contained within the forward projection region of first oxide layer 340 on flexible substrate layer 130.

The fifth source-drain layer 330 is disposed between the insulating layer 220 and the passivation layer 250 such that a portion of the insulating layer 220 is in contact with the fifth source-drain layer 330 and a portion is in contact with the passivation layer 250. So that a portion of the passivation layer 250 is in contact with the fifth source and drain layer 330 and a portion is in contact with the insulating layer 220. The fifth source/drain layer 330 is connected to the second source/drain layer 240, and the fifth source/drain layer 330 is connected to the first oxide layer 340 via.

The sixth source-drain layer 370 is disposed between the insulating layer 220 and the passivation layer 250 such that a portion of the insulating layer 220 is in contact with the sixth source-drain layer 370 and a portion is in contact with the passivation layer 250. So that a portion of the passivation layer 250 is in contact with the sixth source and drain layer 370 and a portion is in contact with the insulating layer 220. The sixth source/drain layer 370 is connected to the first oxide layer 340 via.

In one embodiment, the orthographic projection area of the pressure sensing layer 120 on the flexible substrate layer 130 is included in the orthographic projection area of the second source drain layer 240 on the flexible substrate layer 130.

As can be appreciated, the polysilicon layer 150, the first gate layer 170, the insulating layer 220, the second gate layer 210, the first source/drain layer 230, the second source/drain layer 240, the third source/drain layer 290, the fourth source/drain layer 300, the fifth source/drain layer 330, the first oxide layer 340, the fifth gate insulating layer 350, the fourth gate layer 360, and the sixth source/drain layer 370 constitute a pixel driving circuit.

In an embodiment, referring to fig. 1 and fig. 12 together, fig. 12 discloses a schematic diagram of a split structure of a housing 800 according to an embodiment of the present application. The housing 800 may include a center 801 and a rear cover 802. The rear cover 802 and the display cover 401 are respectively fastened to two opposite sides of the middle frame 801. In one embodiment, the rear cover 802 may include a main rear cover 803 and a folded edge 804. The bent edge 804 is disposed around the main rear cover 803 and is bent toward the center frame 801. The bending edge 804 of the edge circumference of the main rear cover 803 is connected with the edge of the middle frame 801 in a matching way. By arranging the rear cover 802 (namely, the battery cover) to adopt a four-side bending structure, the whole electronic equipment 000 is more round and has the appearance effect of cobbles.

Referring to fig. 7, 9, 10 and 11, the present application sets the pressure sensing layer 120 in the auxiliary layer 405 including the pixel driving circuit, and the pressure sensing layer 120 and a part of the structure in the pixel driving circuit are arranged in the same layer and/or are arranged in an overlapping manner by orthographic projection on the flexible substrate layer 130, so that the spare space of the pixel driving circuit is utilized.

In one embodiment, please refer to fig. 13, which discloses a schematic structure of an electronic device 000 according to another embodiment of the present application. The hidden mark 113 may be disposed at a position on the display layer 110 corresponding to the virtual key, that is, at a bending position corresponding to the bending portion, where the orthographic projection of the hidden mark 113 on the display screen cover 401 is located at the virtual key or around the virtual key, and is displayed when the display screen cover 401 receives a touch.

It will be appreciated that with the above structure, the display cover 401 does not have a physical key from the exterior of the electronic device 000 nor a convex or concave structure on the opposite exterior surface of the virtual key. The setting of the hidden mark 113 can enable the screen to display the position of the virtual key as long as the user introduces the virtual key according to the using method of the specification and touches or presses the virtual key at the nearby position, so that the user can quickly find the pressing position of the virtual key, and meanwhile the using interestingness of the virtual key is increased.

In one embodiment, when the virtual key is a sound adjusting member, the hidden mark 113 is a bar shape. It is understood that with the above structure, the volume up key and the volume down key can be integrated, and the user can press the virtual key to adjust the volume while sliding up and down, and the volume is increased while pressing the up slide, and the volume is decreased while pressing the down slide. By adopting the structure, the user can find the virtual key rapidly, and the interestingness and mystery of the virtual key are increased.

In one embodiment, the hidden identifier 113 is an indicator light that lights up when a touch is received at a virtual key. By adopting the structure, the position of the virtual key can be reminded to the user in a mode that the screen is locally brighter as long as the user presses the periphery of the virtual key, so that the user can quickly find the virtual key.

In one embodiment, hidden indicator 113 is located in a position corresponding to bead plate portion 404. With the above structure, the display layer 110 extends to the edge of the electronic device 000, so as to further increase the screen ratio, and the pressure sensing layer 120 is disposed on the side of the electronic device 000 to better conform to the use habit of the user.

The above structure is adopted in the application, so that the electronic device 000 reduces the setting of the entity keys and even does not need to set the entity keys. The pressure sensing layer 120 disposed inside the electronic device 000 can sense pressure information of a virtual key area pressed by a user on the surface of the display screen cover plate 401, further complete different instructions according to the pressure information, and realize corresponding functions, so that the flat duty ratio of the display screen assembly 400 and the electronic device 000 is further increased.

Referring to fig. 14, 15 and 16, fig. 14 is a schematic overall structure of an electronic device 000 according to another embodiment of the present application, fig. 15 is a schematic structural diagram of the electronic device 000 according to another view angle of the embodiment of fig. 14, and fig. 16 is a schematic split structural diagram of the electronic device 000 according to the embodiment of fig. 14. The electronic device 000 includes, but is not limited to: the display screen assembly 400, the support 10, the package assembly 20, the camera module 30, the circuit board 40, the battery 50, and the functional device 60. The functional device 60 may include a socket, a speaker, a sensor, etc., and the functional device 60 is not listed herein, as will be understood by those skilled in the art. It should be noted that the terms "comprising" and "having," and any variations thereof, in the embodiments of the present application are intended to cover non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may alternatively include other steps or elements not listed or inherent to such process, method, article, or apparatus.

The electronic device 000 in this embodiment is a surround screen structure. Specifically, the diagonally hatched positions in fig. 14 and 15 are indicated as display areas of the display screen of the electronic device 000. The display assembly 400 in this embodiment includes a display cover 401 and a display module 402.

Referring to fig. 17 and fig. 18, fig. 17 discloses a schematic side view of a display panel 401 according to an embodiment of the present application, and fig. 18 discloses a schematic side view of a display module 402 according to an embodiment of the present application. The display module 402 may be adhesively connected to the display panel cover 401 by an optical adhesive. The display module 402 may be an OLED flexible display or an AMOLED (Active-matrix organic light-emitting diode) flexible display. The display module 402 includes a first display unit 406, a second display unit 407, a third display unit 408, and a fourth display unit 409.

In an embodiment, the first display portion 406 and the third display portion 408 are disposed opposite to each other, the first display portion 406 and the third display portion 408 are both in a planar structure, and the first display portion 406 is parallel to the third display portion 408. Of course, in some other embodiments, the first display portion 406 and the third display portion 408 may be non-parallel, such as disposed at a certain angle, which will not be described herein again in detail. The second display portion 407 has an arc-shaped structure and is used to connect the first display portion 406 and the third display portion 408. The fourth display portion 409 is also of an arc-shaped structure, and is integrally extended with the second display portion 407 at two opposite sides of the first display portion 406. The fourth display portion 409 and the second display portion 407 extend in the same direction as the first display portion 406. A display gap 410 is formed between the third display portion 408 and the fourth display portion 409.

In an embodiment, the hidden mark 113 may be disposed on the second display portion 407 and/or the fourth display portion 409.

The display screen cover 401 is covered on the outer surface of the display module 402 for displaying. In this embodiment, the shape of the inner surface of the display panel cover 401 is adapted to the outer surface of the display module 402, and is adhered to the outer surface of the display module 402 by transparent optical cement. The display panel cover 401 includes a first cover portion 411, a second cover portion 412, a third cover portion 413, and a fourth cover portion 414 that are integrally formed. The first cover part 411, the second cover part 412, the third cover part 413 and the fourth cover part 414 are connected to form an accommodating space for accommodating the display module 402.

The first cover plate portion 411 and the third cover plate portion 413 are disposed opposite to each other, the second cover plate portion 412 has an arc structure and is used for connecting the first cover plate portion 411 and the third cover plate portion 413, the fourth cover plate portion 414 has an arc structure and extends integrally with the second cover plate portion 412 on two opposite sides of the first cover plate portion 411, and the fourth cover plate portion 414 and the second cover plate portion 412 extend towards the same side of the first cover plate portion 411. The first cover plate 411, the second cover plate 412, the third cover plate 413 and the fourth cover plate 414 are respectively and correspondingly arranged on the outer surfaces of the first display 406, the second display 407, the third display 408 and the fourth display 409. A cover gap 415 is formed between the third cover portion 413 and the fourth cover portion 414, and the cover gap 415 corresponds to the display gap 410 of the display module 402.

In an embodiment, the virtual keys described in the above embodiments may be disposed at the second cover plate portion 412 and/or the fourth cover plate portion 414.

In an embodiment, referring to fig. 16, the support member 10 is disposed on an inner surface of the display screen assembly 400, the shape of the outer surface of the support member 10 is adapted to the inner surface of the display screen assembly 400, and abuts against the inner surface of the display screen assembly 400, and the support member 10 is used for supporting the display module 402 from the inner surface of the display screen assembly 400.

When the support member 10 is assembled, the support member 10 can be slightly deformed by extrusion, and after the support member is inserted into the display screen assembly 400, the support member 10 is tightly attached to the back surface of the display screen assembly 400 due to the resilience force after the support member is deformed. The back of the display screen assembly 400 is completely supported by the supporting member 10, which is beneficial to the subsequent assembly of other components and structural members in the electronic equipment 000, and can prevent the damage of the other components and structural members in the electronic equipment 000 to the screen.

In one embodiment, the display assembly 400 is assembled with the support 10 in a state similar to an incomplete collar. The components of the circuit board 40, the battery 50, the camera module 30, the functional device 60, etc. inside the electronic apparatus 000 cannot be assembled in a conventional manner. The embodiment of the application designs an auxiliary fixing plate structure, which is used for assembling a circuit board 40, a battery 50, a camera module 30, a functional device 60 and the like into a component assembly. The component assembly may be plugged into the interior of the support member 10 by an end plug of the display screen assembly 400.

The package assembly 20 covers the cover gap 415 of the display cover 401 and the opening at the opposite ends of the display cover 401.

The display screen cover plate 401 and the packaging assembly 20 enclose together to form an accommodating space, the circuit board 40 and the camera module 30 are arranged in the accommodating space, and the camera module 30 is arranged corresponding to the cover plate gap 415 of the display screen cover plate 401 and can collect light through the packaging assembly 20. The circuit board 40 is electrically connected to the display assembly 400 and the camera module 30, respectively. The auxiliary fixing plate is disposed in the accommodating space and is used for auxiliary fixing the circuit board 40, the camera module 30, the battery 50, the functional device 60, and the like.

Optionally, the package assembly 20 includes a package plate 23, a first end cap 21, and a second end cap 22. The package plate 23 covers the cover gap 415 of the display cover 401, and the first end cover 21 and the second end cover 22 cover the openings of the opposite ends of the display cover 401. The camera modules 30 are disposed corresponding to the package board 23, where the number of the camera modules 30 may be one or more.

Of course, in this embodiment, the specific holes or structures on the end cover are not limited, and those skilled in the art can change the combination mode according to the design requirement. The first end cover 21 and the second end cover 22 can be assembled in the whole machine, and can be fixed by screws, buckles, interference and the like. After the first end cover 21 and the second end cover 22 are assembled, the whole machine is assembled. According to the technical scheme, through a novel assembly mode, the whole assembly mode of the glass cover plate surrounding screen is realized, the whole appearance expressive force of the surrounding screen effect can be realized, and the scratch-resistant advantage of the glass cover plate and the appearance expressive effect of glass are ensured.

The display screen cover plate structure made of glass materials is designed in the embodiment, and has the characteristics of high strength, good scratch resistance and the like. The display screen cover plate 401 of the surrounding screen is made of glass, so that the display screen cover plate 401 cannot be bent and deformed after being molded. After the display screen cover plate 401 is molded, the flexible display module 402 is attached to the display screen cover plate 401 through OCA glue, so that the display screen assembly 400 is formed. It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicators are correspondingly changed.

Referring to fig. 19, a schematic diagram of the structural components of an electronic device 000 according to an embodiment of the present application is disclosed, where the electronic device 000 may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (i.e. the display screen assembly 400 in the above embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980, and a power source 990. Wherein, the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960, and the wifi module 970 are respectively connected to the processor 980; the power supply 990 is used to supply power to the entire electronic device 000.

Specifically, RF circuitry 910 is used to send and receive signals; memory 920 is used to store data instruction information; the input unit 930 is used for inputting information, and may specifically include a touch panel 931 and other input devices 932 such as operation keys; the display unit 940 may include a display panel 941, etc.; the sensor 950 includes an infrared sensor, a laser sensor, etc., for detecting a user proximity signal, a distance signal, etc.; a speaker 961 and a microphone 962 are coupled to the processor 980 by an audio circuit 960 for receiving and transmitting audio signals; the wifi module 970 is configured to receive and transmit wifi signals, and the processor 980 is configured to process data information of the electronic device 000. The foregoing description is only a partial embodiment of the present invention, and is not intended to limit the scope of the present invention, and all equivalent devices or equivalent processes using the descriptions and the drawings of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the present invention.

Claims

1. A display module, comprising:

a display layer for displaying information, the display layer including a curved portion;

the auxiliary layer is arranged in a lamination manner with the display layer, a pixel driving circuit is arranged in the auxiliary layer and used for driving the display layer to display information, the auxiliary layer comprises a flexible substrate layer, a first buffer layer, a second gate insulating layer, a third gate insulating layer, a second buffer layer, an insulating layer, a passivation layer and a flat layer which are sequentially arranged in a lamination manner, the pixel driving circuit comprises a second gate layer, a third gate layer and a polysilicon layer which are sequentially arranged in a lamination manner and are mutually insulated, the second gate layer is positioned between the display layer and the third gate layer, the polysilicon layer is arranged between the first buffer layer and the second gate insulating layer, the second gate layer is arranged between the second buffer layer and the insulating layer, a forward projection area of the second gate layer on the flexible substrate layer is contained in a forward projection area of the polysilicon layer on the flexible substrate layer, the third gate layer is arranged between the second gate insulating layer and the third gate layer, and the third gate layer is arranged in a forward projection area of the polysilicon layer on the flexible substrate layer; and

The pressure sensing layer is formed inside the auxiliary layer and corresponds to the bending part, and is used for sensing pressure for enabling the pressure sensing layer to deform, the pressure sensing layer and the second grid layer are arranged on the same layer, the pressure sensing layer is arranged between the second buffer layer and the insulating layer, the pressure sensing layer comprises an oxide layer, a first grid insulating layer and a first grid layer which are sequentially stacked, and the oxide layer is used for sensing pressure for enabling the oxide layer to deform.

2. The display module of claim 1, wherein a side of the oxide layer away from the first gate insulating layer is in contact with the second buffer layer, and a side of the first gate layer away from the first gate insulating layer is in contact with the insulating layer.

3. The display module of any one of claims 1-2, further comprising a pixel isolation layer and a flexible encapsulation layer, wherein the passivation layer, the planarization layer, the pixel isolation layer, and the flexible encapsulation layer are sequentially stacked, and wherein the display layer comprises a pixel unit, and wherein the pixel unit is disposed on the same layer as the pixel isolation layer.

4. A display module according to any one of claims 1-2, wherein a wheatstone bridge circuit is arranged in the pressure sensing layer, the wheatstone bridge circuit being used for detecting resistance change information caused by deformation of the oxide layer.

5. The display module of any one of claims 1-2, wherein a hidden mark is disposed at a position of the display layer corresponding to the pressure sensing layer, and the hidden mark is configured to be displayed when the position of the display layer corresponding to the pressure sensing layer is deformed.

6. The display module of claim 1, wherein the pixel driving circuit further comprises:

a fourth gate insulating layer, which is stacked on the second gate layer, is disposed between the second buffer layer and the insulating layer, and is in contact with the second buffer layer on a side of the fourth gate insulating layer away from the second gate layer, wherein a forward projection area of the second gate layer on the flexible substrate layer coincides with a forward projection area of the fourth gate insulating layer on the flexible substrate layer, or the forward projection area of the second gate layer on the flexible substrate layer is included in the forward projection area of the fourth gate insulating layer on the flexible substrate layer;

The first source-drain electrode layer is arranged between the insulating layer and the passivation layer and is connected with the polycrystalline silicon layer through hole; and

the second source-drain electrode layer is arranged between the insulating layer and the passivation layer and is connected with the through hole of the polycrystalline silicon layer.

7. The display module of claim 6, wherein the orthographic projection area of the pressure sensing layer on the flexible substrate layer overlaps with the orthographic projection area of the first source drain layer on the flexible substrate layer or the orthographic projection area of the pressure sensing layer on the flexible substrate layer is contained within the orthographic projection area of the first source drain layer on the flexible substrate layer.

8. The display module assembly of any one of claims 6-7, wherein the pixel drive circuit further comprises a first oxide layer, a fifth gate insulating layer, and a fourth gate layer, all disposed in a stacked order, the first oxide layer, the fifth gate insulating layer, and the fourth gate layer being disposed in a same layer as the pressure sensing layer.

9. The display module of claim 8, wherein the pixel driving circuit further comprises:

the third source-drain electrode layer is arranged between the insulating layer and the passivation layer, is connected with the second source-drain electrode layer and is connected with the first oxide layer via hole; and

The fourth source-drain electrode layer is arranged between the insulating layer and the passivation layer and is connected with the first oxide layer via hole;

the first oxide layer, the fifth gate insulating layer and the fourth gate layer are arranged between the second buffer layer and the insulating layer, one side of the first oxide layer, which is far away from the fifth gate insulating layer, is in contact with the second buffer layer, one side of the fourth gate layer, which is far away from the fifth gate insulating layer, is in contact with the insulating layer, and a forward projection area of the fourth gate layer on the flexible substrate layer is overlapped with a forward projection area of the fifth gate insulating layer on the flexible substrate layer;

or, the orthographic projection area of the fourth gate layer on the flexible substrate layer is contained in the orthographic projection area of the fifth gate insulating layer on the flexible substrate layer, and the orthographic projection area of the fifth gate insulating layer on the flexible substrate layer is contained in the orthographic projection area of the first oxide layer on the flexible substrate layer.

10. A display module according to claim 3, wherein the display layer comprises a pixel unit, the pixel unit and the pixel isolation layer are arranged on the same layer, the display module further comprises a flexible packaging layer, an organic light-emitting layer and an anode layer, the anode layer is arranged on one side of the flat layer far away from the flexible substrate layer, the pixel isolation layer covers the pixel unit, the anode layer and the part of the flat layer which is not covered by the pixel unit and the anode layer, the part of the pixel isolation layer, which is contacted with the anode layer, is provided with a through hole, the organic light-emitting layer is positioned on the pixel isolation layer and is connected with the anode layer by penetrating through the through hole, and the flexible packaging layer is arranged on the pixel isolation layer and the organic light-emitting layer.

11. A display screen assembly comprising the display module of any one of claims 1-10, and a display screen cover sheet overlaying the display layer.

12. The display screen assembly of claim 11, wherein the display layer is provided with a hidden mark corresponding to the position of the pressure sensing layer, the hidden mark is used for displaying when the position of the display layer corresponding to the pressure sensing layer is deformed, the display screen cover plate is provided with a virtual key, the virtual key is formed on the display screen cover plate in a region right opposite to the pressure sensing layer, and the pressure sensing layer is used for sensing the pressure applied to the display screen cover plate at the virtual key.

13. An electronic device comprising the display assembly of any of claims 11-12, the electronic device further comprising a housing, the display assembly disposed on the housing.