CN111725270A - Flexible display panel and preparation method thereof - Google Patents
Flexible display panel and preparation method thereof Download PDFInfo
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- CN111725270A CN111725270A CN202010513520.8A CN202010513520A CN111725270A CN 111725270 A CN111725270 A CN 111725270A CN 202010513520 A CN202010513520 A CN 202010513520A CN 111725270 A CN111725270 A CN 111725270A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Abstract
The application discloses flexible display panel includes: a substrate; a planarization layer disposed on the substrate; the pixel defining layer is arranged on the flat layer to define a pixel opening; a light emitting device disposed within the opening; a first encapsulation layer disposed on the light emitting device and the pixel defining layer, wherein the first encapsulation layer disposed on the pixel defining layer forms a recess in the opening; a color filter layer filling the recess, wherein a top surface of the color filter layer is flush with a top surface of the first encapsulation layer; and the second packaging layer is arranged on the color filter layer and the first packaging layer. The flexible display panel of the embodiment of the application can avoid the use of the traditional optical filter with the thickness of more than 100 microns, can integrally thin the thickness of the flexible display panel and effectively improves the flexibility and outdoor visibility of the flexible display panel.
Description
Technical Field
The application relates to the field of display panels, in particular to a flexible display panel and a preparation method thereof.
Background
Compared with the traditional Liquid Crystal Display (LCD), the Organic Light Emitting Diode (OLED) device has the advantages of Light weight, wide viewing angle, fast response time, low temperature resistance, high luminous efficiency and the like, so that the OLED device is always considered as a next-generation novel display technology in the display industry, and particularly, the OLED device can be made into a flexible display screen capable of being bent on a flexible substrate, which is a great advantage of the OLED device.
The current flexible OLED display panel mainly includes a substrate, a thin film transistor layer, and an OLED light emitting layer, and uses a thin film encapsulation structure to achieve an encapsulation effect. In addition, in order to enable the flexible OLED display panel to display normal brightness even in a strong light environment, a polarizing layer is usually formed on the thin film encapsulation structure, and the thickness of the polarizing layer is generally greater than 100 micrometers (μm).
Therefore, when the flexible OLED display panel is subjected to a bending test, the polarizing layer is positioned on the outermost layer of the flexible OLED display panel, and therefore the flexible OLED display panel can bear the maximum bending stress. Due to the thickness characteristics of the polarizing layer, there is a risk of peeling or cracking, and once the polarizing layer is not subjected to bending stress and peeling or cracking occurs, the function of the flexible OLED display panel is affected.
Therefore, there is a need to develop a new flexible display panel using OLED devices to overcome the drawbacks of the prior art.
Disclosure of Invention
The embodiment of the application provides a flexible display panel, includes:
a substrate;
a planarization layer disposed on the substrate;
the pixel defining layer is arranged on the flat layer to define a pixel opening;
a light emitting device disposed within the opening;
a first encapsulation layer disposed on the light emitting device and the pixel defining layer, wherein the first encapsulation layer disposed on the pixel defining layer forms a recess in the opening;
a color filter layer filling the recess, wherein a top surface of the color filter layer is flush with a top surface of the first encapsulation layer; and
and the second packaging layer is arranged on the color filter layer and the first packaging layer.
In some embodiments, the substrate is a flexible substrate and the material of the pixel defining layer is an opaque material.
In some embodiments, the light emitting device is a red light emitting device, a green light emitting device, or a blue light emitting device.
In some embodiments, the color filter layer is a red color filter layer, a green color filter layer, or a blue color filter layer, and the color filter layer has the same color as the light emitted by the light emitting device.
In some embodiments, the first encapsulation layer and the second encapsulation layer comprise an inorganic material having water and oxygen barrier properties.
The embodiment of the present application further provides a method for manufacturing a flexible display panel, including:
providing a substrate and a flat layer arranged on the substrate;
forming a pixel defining layer on the flat layer to define a pixel opening;
forming a light emitting device in the opening;
forming a first encapsulation layer on the light emitting device and the pixel defining layer, wherein the first encapsulation layer disposed on the pixel defining layer forms a recess in the opening;
forming a color filter layer to fill the recess, wherein a top surface of the color filter layer is flush with a top surface of the first encapsulation layer; and
and forming a second packaging layer on the color filter layer and the first packaging layer.
In the flexible display panel and the manufacturing method thereof provided by the embodiment of the application, the adopted color filter layer has a flattening effect and has the effect of the traditional optical filter, so that the use of the traditional optical filter with the thickness of more than 100 micrometers can be avoided, the thickness of the flexible display panel can be integrally thinned, and the flexibility and the outdoor visibility of the flexible display panel are effectively improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 to 5 are schematic cross-sectional views illustrating a method for manufacturing a flexible display panel according to a first embodiment of the invention.
Fig. 6 is an enlarged view of the area 500 in fig. 5 to illustrate the visibility improvement effect of the flexible display panel of the present invention under bright light.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Fig. 1 to fig. 5 are schematic cross-sectional views illustrating a method for manufacturing a flexible display panel according to a first embodiment of the present invention.
As shown in fig. 1, a substrate 100 is provided, on which an interlayer dielectric layer 110 and a planarization layer 120 are sequentially disposed. Active devices such as thin film transistors (not shown) may be disposed at appropriate locations within the interlayer dielectric layer 110 to control the subsequently formed light emitting devices. The substrate 100 is a flexible substrate. The material of the flexible substrate is not limited in this application, and is, for example, an organic polymer. As an example, the organic polymer may be one of Polyimide (PI), Polyimide Adhesive (PA), Polycarbonate (PC), Polyethersulfone (PES), Polyethylene Terephthalate (PET), Polyethylene naphthalate (PEN), polymethyl methacrylate (PMMA), and Cyclic Olefin Copolymer (COC).
Next, an anode layer 140 is formed on the planarization layer 120. A pixel defining layer 130 is formed on the anode layer 140. The pixel defining layer 130 may be made of a high light-shielding negative photoresist material, such as a light-shielding material applied to a black matrix (black matrix), and is patterned and formed on the planarization layer 120 by, for example, a photolithography process. As shown in fig. 1, a pixel defining layer 130 is formed on the planarization layer 120, and the pixel defining layer 130 forms pixel openings 150a, 150b, and 150 c. The bottom of the openings corresponds to the anode layer 140. As shown in fig. 2, a red light emitting layer 160a, a green light emitting layer 160b, and a blue light emitting layer 160c are formed on the anode layer 140 exposed in the openings 150a, 150b, and 150c of the structure shown in fig. 1 by vapor deposition using a mask (mask) having an appropriate pattern. Next, a cathode layer 170 is formed on the pixel defining layers 130 and the red, green and blue light emitting layers 160a, 160b and 160c respectively located in the openings 150a, 150b and 150c by evaporation. Next, a first encapsulation layer 180 is deposited on the cathode layer 170 by using a Chemical Vapor Deposition (CVD), an Atomic Layer Deposition (ALD), a Physical Vapor Deposition (PVD), or other coating methods.
Here, the red light Emitting Layer 160a, the green light Emitting Layer 160b, and the blue light Emitting Layer 160c are, for example, Organic Light Emitting Diode (OLED) light Emitting layers, and include film layers such as a Hole Injection Layer (HIL), a Hole Transport Layer (HTL), an electroluminescent Layer (EML), an Electron Transport Layer (EHL), and an Electron Injection Layer (EIL), which are sequentially stacked. The first encapsulation layer 180 is an inorganic material film with water and oxygen barrier properties, and the material of the inorganic material film is, for example, one or more combinations of silicon oxide (SiOx), silicon nitride (SiNx), or silicon oxynitride (SiON). Thus, OLED light emitting devices emitting light of different colors, such as a red OLED light emitting device formed in the opening 150a, a green OLED light emitting device formed in the opening 150b, and a blue OLED light emitting device formed in the opening 150a, are formed in the openings 150a, 150b, and 150 c.
As shown in fig. 2, the first encapsulation layer 180 and the cathode layer 170 are both compliant films formed on the pixel defining layer 130 and the openings 150a, 150b, and 150c therebetween. Thus, a recess 180a, 180b, 180c is formed in one of the openings 150a, 150b, 150c in the first packaging layer 180 between two pixel openings.
As shown in fig. 3, a first color filter layer 190a with a first color is then deposited into the first recess 180a by coating (coating) or printing (printing) and fills the first recess 180 a. The top surface of the formed first color filter layer 190a is flush with the top surface of the adjacent first encapsulation layer 180, and the first color filter layer 190a is, for example, a red filter layer, which has the same color as the light emitted by the underlying light emitting device, and is made of, for example, a red color filter material.
As shown in fig. 4, the process shown in fig. 3 may be repeated twice to form a second color filter layer 190b in the second recess 180b and a third color filter layer 190c in the third recess 180 c. Similar to the first color filter layer 190a, the second color filter layer 190b and the third color filter layer 190c, top surfaces of the second color filter layer 190b and the third color filter layer 190c are flush with top surfaces of the adjacent first package layers 180, respectively, and the second color filter layer 190b has the same color as light emitted by the underlying light emitting device, such as a green filter layer made of a green color filter material, and the third color filter layer 190c has the same color as light emitted by the underlying light emitting device, such as a blue filter layer made of a blue color filter material. In this way, the first color filter layer 190a formed in the first recess 180a, the second color filter layer 190b formed in the second recess 180b, and the third color filter layer 190c formed in the third recess 180c are deposited on the red light emitting layer 160a, the green light emitting layer 160b, and the blue light emitting layer 160c emitting the same color light, respectively.
As shown in fig. 5, a second packaging layer 200 is deposited on the first packaging layer 180, the first color filter layer 190a, the second color filter layer 190b and the third color filter layer 190b by Chemical Vapor Deposition (CVD), Atomic Layer Deposition (ALD) and other coating methodsOn the color filter layer 190 c. The second packaging layer 200 is an inorganic material film with water and oxygen barrier properties, and the material thereof is, for example, silicon oxide (SiOx), silicon nitride (SiNx) or aluminum oxide (Al)2O3) One or more combinations of (a). Here, since the first package layer 180, the first color filter layer 190a, the second color filter layer 190b, and the third color filter layer 190c form a flat top surface, the second package layer 200 is a flat film layer.
By the manufacturing method shown in fig. 1-5, the flexible display panel using the OLED light emitting device shown in fig. five can be obtained, which at least includes:
a substrate 100;
a planarization layer 120 disposed on the substrate 100;
a pixel defining layer 130 disposed on the planarization layer to define a pixel opening (e.g., one of the openings 150a, 150b, and 150 c);
a light emitting device (formed by the anode 140, the cathode 170 and one of the red light emitting layer 160a, the green light emitting layer 160b and the blue light emitting layer 160 c) disposed in the opening;
a first encapsulation layer 180 disposed on the light emitting device and the plurality of pixel defining layers 130, wherein the first encapsulation layer 180 disposed on the plurality of pixel defining layers 130 forms a recess (e.g., one of the recesses 180a, 180b, and 180c corresponding to one of the openings 150a, 150b, and 150 c) within the opening;
a color filter layer (one of the first color filter layer 190a, the second color filter layer 190b, and the third color filter layer 190 c) filling the recess, wherein a top surface of the color filter layer is flush with a top surface of the first encapsulation layer 180; and
a second encapsulation layer 200 disposed on the color filter layer and the first encapsulation layer 180.
Fig. 6 is an enlarged schematic view of the region 500 in fig. 5, which takes a red-light-emitting OLED device as an example, when the external natural light W enters the red-light-emitting device in the region 500, the red-light-emitting OLED device will filter the first color filter layer 190a to leave the red incident light R, and the red incident light R is reflected by the cathode 170 to generate a first reflected light R1 far away from the red-light-emitting device, and is reflected by the anode 160 to generate a second reflected light R2 far away from the red-light-emitting device, and the first reflected light R1 and the second reflected light R2 interfere in the air after leaving the red-light-emitting device, so that the brightness of the red-light-emitting OLED device is attenuated. Similarly, the green light emitting device and the blue light emitting device of the external natural light W, which are incident outside the area 500 shown in fig. 5, may also generate similar spectral filtering and reflected light interference phenomena, so as to reduce the reflection of the external light reflected to the outside of the light emitting devices, thereby improving the outdoor visibility of the flexible display panel of the present invention including the light emitting devices emitting different colors.
Thus, in the flexible display panel and the manufacturing method thereof of the embodiment, since the adopted color filter layer has the planarization effect and the effect of the traditional optical filter, the use of the traditional optical filter with the thickness of more than 100 micrometers can be avoided, the thickness of the flexible display panel can be integrally reduced, and the flexibility and the outdoor visibility of the flexible display panel are effectively improved.
The flexible display panel and the method for manufacturing the same provided by the invention are described in detail above. It should be understood that the exemplary embodiments described herein should be considered merely illustrative for facilitating understanding of the method of the present invention and its core ideas, and not restrictive. Descriptions of features or aspects in each exemplary embodiment should generally be considered as applicable to similar features or aspects in other exemplary embodiments. While the present invention has been described with reference to exemplary embodiments, various changes and modifications may be suggested to one skilled in the art. It is intended that the present invention cover the modifications and variations of this invention provided they come within the spirit and scope of the appended claims and their equivalents and improvements made thereto.
Claims (10)
1. A flexible display panel, comprising:
a substrate;
a planarization layer disposed on the substrate;
the pixel defining layer is arranged on the flat layer to define a pixel opening;
a light emitting device disposed within the opening;
a first encapsulation layer disposed on the light emitting device and the plurality of pixel defining layers, wherein the first encapsulation layer disposed on the plurality of pixel defining layers forms a recess in the opening;
a color filter layer filling the recess, wherein a top surface of the color filter layer is flush with a top surface of the first encapsulation layer; and
and the second packaging layer is arranged on the color filter layer and the first packaging layer.
2. The flexible display panel of claim 1, wherein the substrate is a flexible substrate and the material of the plurality of pixel definition layers is an opaque material.
3. The flexible display panel of claim 1, wherein the light emitting device is a red light emitting device, a green light emitting device, or a blue light emitting device.
4. The flexible display panel of claim 3, wherein the color filter layer is a red color filter layer, a green color filter layer, or a blue color filter layer, and the color filter layer has the same color as the light emitted by the light emitting device.
5. The flexible display panel of claim 1, wherein the first encapsulation layer and the second encapsulation layer comprise an inorganic material having water and oxygen barrier properties.
6. A method for manufacturing a flexible display panel, comprising:
providing a substrate and a flat layer arranged on the substrate;
forming a pixel defining layer on the flat layer to define a pixel opening;
forming a light emitting device in the opening;
forming a first encapsulation layer on the light emitting device and the pixel defining layer, wherein the first encapsulation layer disposed on the pixel defining layer forms a recess in the opening;
forming a color filter layer to fill the recess, wherein a top surface of the color filter layer is flush with a top surface of the first encapsulation layer; and
and forming a second packaging layer on the color filter layer and the first packaging layer.
7. The method according to claim 6, wherein the substrate is a flexible substrate, and the pixel definition layers are made of an opaque material.
8. The method of manufacturing a flexible display panel according to claim 6, wherein the light emitting device is a red light emitting device, a green light emitting device, or a blue light emitting device.
9. The method according to claim 8, wherein the color filter layer is a red color filter layer, a green color filter layer, or a blue color filter layer, and the color filter layer has the same color as the light emitted from the light-emitting device.
10. The method of claim 6, wherein the first encapsulation layer and the second encapsulation layer comprise an inorganic material having water and oxygen barrier properties.
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