CN111725140B - Multi-chip package and manufacturing method thereof - Google Patents
Multi-chip package and manufacturing method thereof Download PDFInfo
- Publication number
- CN111725140B CN111725140B CN202010616944.7A CN202010616944A CN111725140B CN 111725140 B CN111725140 B CN 111725140B CN 202010616944 A CN202010616944 A CN 202010616944A CN 111725140 B CN111725140 B CN 111725140B
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- Prior art keywords
- chip
- semiconductor
- manufacturing
- semiconductor chips
- chips
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 238000004806 packaging method and process Methods 0.000 claims abstract description 18
- 239000004065 semiconductor Substances 0.000 claims description 92
- 239000012815 thermoplastic material Substances 0.000 claims description 16
- 230000000712 assembly Effects 0.000 claims description 15
- 238000000429 assembly Methods 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 11
- 238000005520 cutting process Methods 0.000 claims description 7
- 230000001154 acute effect Effects 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 238000007731 hot pressing Methods 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000005553 drilling Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims description 2
- 230000010354 integration Effects 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 230000014509 gene expression Effects 0.000 description 3
- 239000004831 Hot glue Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06541—Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
- H01L2225/06544—Design considerations for via connections, e.g. geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010616944.7A CN111725140B (en) | 2020-07-01 | 2020-07-01 | Multi-chip package and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010616944.7A CN111725140B (en) | 2020-07-01 | 2020-07-01 | Multi-chip package and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111725140A CN111725140A (en) | 2020-09-29 |
CN111725140B true CN111725140B (en) | 2022-06-07 |
Family
ID=72570638
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010616944.7A Active CN111725140B (en) | 2020-07-01 | 2020-07-01 | Multi-chip package and manufacturing method thereof |
Country Status (1)
Country | Link |
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CN (1) | CN111725140B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112466760B (en) * | 2020-12-03 | 2022-07-05 | 大连圣博达科技有限公司 | Semiconductor device with decoupling structure and manufacturing method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990066529A (en) * | 1998-01-30 | 1999-08-16 | 구본준 | Chip size package and its manufacturing method |
CN1913149A (en) * | 2005-05-11 | 2007-02-14 | 英飞凌科技股份公司 | Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor device |
CN101553923A (en) * | 2006-10-10 | 2009-10-07 | 泰塞拉公司 | Edge connect wafer level stacking |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8513789B2 (en) * | 2006-10-10 | 2013-08-20 | Tessera, Inc. | Edge connect wafer level stacking with leads extending along edges |
KR100997787B1 (en) * | 2008-06-30 | 2010-12-02 | 주식회사 하이닉스반도체 | Stacked semiconductor package and method of manufacturing the same |
-
2020
- 2020-07-01 CN CN202010616944.7A patent/CN111725140B/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990066529A (en) * | 1998-01-30 | 1999-08-16 | 구본준 | Chip size package and its manufacturing method |
CN1913149A (en) * | 2005-05-11 | 2007-02-14 | 英飞凌科技股份公司 | Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor device |
CN101553923A (en) * | 2006-10-10 | 2009-10-07 | 泰塞拉公司 | Edge connect wafer level stacking |
Also Published As
Publication number | Publication date |
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CN111725140A (en) | 2020-09-29 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20220512 Address after: 528400 floor 1, building 1, No. 27, Jinyi South Road, Dongxing community, Dongfeng Town, Zhongshan City, Guangdong Province (residence declaration) Applicant after: Zhongshan Youdi Intelligent Technology Co.,Ltd. Address before: Room 707, block a, Rongsheng Times International Plaza, 9 Beiyuan street, Licheng District, Jinan City, Shandong Province Applicant before: Ji Nannan knows Information technology Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A Multi Chip Packaging and Its Manufacturing Method Granted publication date: 20220607 Pledgee: Zhongshan Rural Commercial Bank Co.,Ltd. Dongfeng Branch Pledgor: Zhongshan Youdi Intelligent Technology Co.,Ltd. Registration number: Y2024980022223 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20220607 Pledgee: Zhongshan Rural Commercial Bank Co.,Ltd. Dongfeng Branch Pledgor: Zhongshan Youdi Intelligent Technology Co.,Ltd. Registration number: Y2024980022223 |