CN111723333A - Parameter derivation method for preparing BGA solder balls based on jet flow fracture method - Google Patents
Parameter derivation method for preparing BGA solder balls based on jet flow fracture method Download PDFInfo
- Publication number
- CN111723333A CN111723333A CN202010597055.0A CN202010597055A CN111723333A CN 111723333 A CN111723333 A CN 111723333A CN 202010597055 A CN202010597055 A CN 202010597055A CN 111723333 A CN111723333 A CN 111723333A
- Authority
- CN
- China
- Prior art keywords
- jet
- diameter
- jet flow
- relation
- parameter derivation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 38
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 25
- 238000009795 derivation Methods 0.000 title claims abstract description 14
- 238000012937 correction Methods 0.000 claims description 11
- 238000004806 packaging method and process Methods 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 9
- 239000012530 fluid Substances 0.000 claims description 5
- 230000035772 mutation Effects 0.000 claims description 5
- 238000011161 development Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000012797 qualification Methods 0.000 abstract description 4
- 238000009826 distribution Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000012536 packaging technology Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 241000282414 Homo sapiens Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
- G06F17/10—Complex mathematical operations
- G06F17/11—Complex mathematical operations for solving equations, e.g. nonlinear equations, general mathematical optimization problems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
- G06F17/10—Complex mathematical operations
- G06F17/15—Correlation function computation including computation of convolution operations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Data Mining & Analysis (AREA)
- Pure & Applied Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Optimization (AREA)
- Computational Mathematics (AREA)
- Mathematical Analysis (AREA)
- Algebra (AREA)
- Databases & Information Systems (AREA)
- Software Systems (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Operations Research (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computing Systems (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a parameter derivation method for preparing BGA solder balls based on a jet flow fracture method. The invention deduces the relationship among the flexible frequency, the jet pressure and the jet speed of the equipment in the process of preparing the solder balls, provides theoretical guidance for the production process of the BGA solder balls, can solve the problems of the balling rate and the diameter distribution of the BGA balls to a certain extent, improves the balling rate and the qualification rate of the produced BGA solder balls, and provides theoretical basis for the rapid development of the industry.
Description
Technical Field
The invention relates to the technical field of integrated circuit packaging material preparation, in particular to a parameter derivation method for preparing BGA solder balls based on a jet flow fracture method.
Background
Along with the increase of the demand degree of human beings on electronic information products, people can carry the electronic information products more conveniently, and the electronic products gradually develop towards convenience, intelligence and high performance. Since the 90 s of the 20 th century, along with the development of Integrated technology, the improvement of instruments and the use of deep submicron technology, LSI (Large-scale Integrated Circuit), VLSI (Very-Large-scale Integrated Circuit), ULSI (Ultra-Large-scale Integrated Circuit) and packaged products have appeared, and the performance of the packaged products has been rapidly improved. The traditional packaging form has difficulty in meeting the technical requirements of rapid development of electronic products. In order to ensure the packaging quality and the requirement of electronic products, a new packaging technology, namely BGA packaging, is developed. Because BGA package has many pins, characteristics such as small, makes the electronic product possess higher information transmission and data processing speed in less space. BGA packaging includes micro-electronic packaging technology of millimeter and micron level, and has been widely used since the beginning, including many electronic products such as computers, tablet computers, cameras and mobile phones. At present, the electronic packaging technology is rapidly developed, and the packaging form of the integrated circuit is developed towards the direction of three-dimensional packaging. The jet flow breaking method is that under the action of pressure, molten metal is made to pass through a nozzle to produce metal jet flow, the flow rate is controlled to make the jet flow keep laminar flow state, mechanical vibration with certain frequency is acted on the jet flow, and when the vibration frequency and amplitude are matched with the technological parameters of nozzle diameter, etc., the jet flow can be broken into uniform metal drops. The process is simple, easy to realize automatic control, short in flow, low in production cost, and uniform in size of the obtained metal particles, and is a precise solder ball preparation method with the greatest development prospect at present. However, in the process of producing BGA solder balls by a jet fracture method, due to the influence of a plurality of factors such as material superheat degree, interference frequency, jet pressure, jet speed and the like, the balling rate and diameter distribution of the BGA balls always have great problems, and in domestic enterprises for producing the BGA solder balls, the one-time qualification rate of the products before screening does not exceed 30%, so how to improve the qualification rate of the products becomes a main factor for restricting the development of the industry. The invention deduces the relationship among the disturbance frequency, the jet pressure and the jet speed of the equipment in the ball manufacturing process, and provides theoretical guidance for the production process of the BGA solder balls.
Disclosure of Invention
In view of the problems in the prior art, the invention discloses a parameter derivation method for preparing BGA solder balls based on a jet flow fracture method, which comprises the following steps:
the method comprises the following steps: setting the diameter of a target ball, and selecting the diameter of a corresponding crucible nozzle;
step two: deducing the relation between the interference frequency and the jet velocity;
step three: and deducing the relation between the jet velocity and the pressure, wherein the relation comprises a loss coefficient, a path loss and a kinetic energy correction coefficient based on a Bernoulli equation and a Darcy-Weisbach formula.
As a preferable scheme of the present invention, the relationship between the disturbance frequency and the jet velocity is derived in the second step, according to the unstable principle of the jet, when a deflection with a sufficiently large amplitude is loaded in the horizontal direction, the jet will uniformly break along with the period of the deflection, and according to the law of conservation of mass, the mass of the inner cylindrical jet of the wavelength before the jet breaks is equal to the mass of the spherical droplet after the jet breaks.
As a preferable scheme of the present invention, in the step one, the target sphere diameter is determined according to the packaging requirements, the target sphere diameter is in the range of 0.1mm to 0.8mm, and the diameter of the crucible nozzle is selected to be 1/2 of the target sphere diameter.
As a preferable scheme of the present invention, in the second step, a relationship between the disturbance frequency and the jet velocity is derived, according to:
According to the following steps: v ═ f λ; to obtain
Where ρ islIs the droplet density, d1Is the jet diameter, d2Is the droplet diameter, λ is the jet wavelength, f is the interference frequency, λ is the jet wavelength, ρsIs the density of solid spheres, d0Is the diameter of a solid sphere and v is the diameter of a shotThe flow velocity.
As a preferable scheme of the present invention, in the third step, the relationship between the jet velocity and the pressure is derived, the pressure applied to the liquid level of the crucible is set to be P2, the ambient pressure outside the crucible is set to be P0, and bernoulli equations are listed for surface 0 and surface 1:
simplifying to obtain:
loss along the way is hf，
For laminar flow, according to the Darcy-Weisbach equation
Obtaining:
hmfor the local loss due to the abrupt orifice,
and zeta is a loss coefficient, and according to the area ratio of the mutation pipe orifice, zeta is 0.4-0.6, and the following is obtained:
let P1-P0Finish, to give:
the fluid in the crucible nozzle is laminar, so α0And α1Substitute 2 into
Obtaining:
the jet velocity obtained by finishing is
The invention has the beneficial effects that: the invention deduces the relationship among the flexible frequency, the jet pressure and the jet speed of the equipment in the process of preparing the solder balls, provides theoretical guidance for the production process of the BGA solder balls, can solve the problems of the balling rate and the diameter distribution of the BGA balls to a certain extent, improves the balling rate and the qualification rate of the produced BGA solder balls, and provides theoretical basis for the rapid development of the industry.
Drawings
FIG. 1 is a schematic diagram of a derivation process of the present invention;
FIG. 2 is a schematic view of a crucible model of the present invention;
FIG. 3 is a diagram of a tin ball object of the present invention;
FIG. 4 is an XRD pattern of a solder ball according to the present invention;
FIG. 5 is a component diagram of the surface scanning of a solder ball according to the present invention.
Detailed Description
Example 1
As shown in fig. 1 to 5, the invention discloses a parameter derivation method for preparing a BGA solder ball based on a jet fracture method, which comprises the following steps:
the method comprises the following steps: setting the diameter of a target ball, and selecting the diameter of a corresponding crucible nozzle;
step two: deducing the relation between the interference frequency and the jet velocity;
step three: and deducing the relation between the jet velocity and the pressure, wherein the relation comprises a loss coefficient, a path loss and a kinetic energy correction coefficient based on a Bernoulli equation and a Darcy-Weisbach formula.
And deducing the relation between the interference frequency and the jet flow speed in the second step, wherein according to the unstable principle of the jet flow, when the deflection with large enough amplitude is loaded in the horizontal direction, the jet flow can be uniformly broken along with the period of the deflection, and according to the law of conservation of mass, the mass of the cylindrical jet flow in the wavelength before the jet flow is broken is equal to the mass of the spherical liquid drop after the jet flow is broken.
In the step one, the target ball diameter is determined according to the packaging requirement, the selected target ball diameter is 0.1mm, the selected crucible nozzle diameter is 0.05mm, and the solder ball material is Sn3Ag0.5Cu.
Deducing the relation between the interference frequency and the jet velocity in the second step according to the following steps:
According to the following steps: v ═ f λ; to obtain
Where ρ islIs the droplet density, d1Is the jet diameter, d2Is the diameter of a droplet ballλ is the jet wavelength, f is the interference frequency, λ is the jet wavelength, ρsIs the density of solid spheres, d0Is the solid sphere diameter and v is the jet velocity.
In the third step, the relation between the jet flow speed and the pressure is deduced, and the pressure applied to the liquid level of the crucible is set as P2The ambient pressure outside the crucible is P0The Bernoulli equation is listed for facet 0 and facet 1:
simplifying to obtain:
loss along the way is hf，
For laminar flow, according to the Darcy-Weisbach equation
Obtaining:
hmfor the local loss due to the abrupt orifice,
wherein zeta is a loss coefficient, and according to the area ratio of the mutation pipe orifice, zeta is 0.4, and the following is obtained:
let P1-P0Finish, to give:
the fluid in the crucible nozzle is laminar, so α0And α1Substitute 2 into
Obtaining:
the jet velocity obtained by finishing is
Example 2
As shown in fig. 1 to 5, the invention discloses a parameter derivation method for preparing a BGA solder ball based on a jet fracture method, which comprises the following steps:
the method comprises the following steps: setting the diameter of a target ball, and selecting the diameter of a corresponding crucible nozzle;
step two: deducing the relation between the interference frequency and the jet velocity;
step three: and deducing the relation between the jet velocity and the pressure, wherein the relation comprises a loss coefficient, a path loss and a kinetic energy correction coefficient based on a Bernoulli equation and a Darcy-Weisbach formula.
And deducing the relation between the interference frequency and the jet flow speed in the second step, wherein according to the unstable principle of the jet flow, when the deflection with large enough amplitude is loaded in the horizontal direction, the jet flow can be uniformly broken along with the period of the deflection, and according to the law of conservation of mass, the mass of the cylindrical jet flow in the wavelength before the jet flow is broken is equal to the mass of the spherical liquid drop after the jet flow is broken.
In the step one, the target ball diameter is determined according to the packaging requirement, the selected target ball diameter is 0.4mm, the selected crucible nozzle diameter is 0.2mm, and the solder ball material is Sn3Ag0.5Cu.
Deducing the relation between the interference frequency and the jet velocity in the second step according to the following steps:
According to the following steps: v ═ f λ; to obtain
Where ρ islIs the droplet density, d1Is the jet diameter, d2Is the droplet diameter, λ is the jet wavelength, f is the interference frequency, λ is the jet wavelength, ρsIs the density of solid spheres, d0Is the solid sphere diameter and v is the jet velocity.
In the third step, the relation between the jet flow speed and the pressure is deduced, and the pressure applied to the liquid level of the crucible is set as P2The ambient pressure outside the crucible is P0The Bernoulli equation is listed for facet 0 and facet 1:
simplifying to obtain:
loss along the way is hf，
For laminar flow, according to the Darcy-Weisbach equation
Obtaining:
hmfor the local loss due to the abrupt orifice,
wherein zeta is a loss coefficient, and according to the area ratio of the mutation pipe orifice, zeta is 0.5, and the following is obtained:
let P1-P0Finish, to give:
the fluid in the crucible nozzle is laminar, so α0And α1Substitute 2 into
Obtaining:
the jet velocity obtained by finishing is
Example 3
As shown in fig. 1 to 5, the invention discloses a parameter derivation method for preparing a BGA solder ball based on a jet fracture method, which comprises the following steps:
the method comprises the following steps: setting the diameter of a target ball, and selecting the diameter of a corresponding crucible nozzle;
step two: deducing the relation between the interference frequency and the jet velocity;
step three: and deducing the relation between the jet velocity and the pressure, wherein the relation comprises a loss coefficient, a path loss and a kinetic energy correction coefficient based on a Bernoulli equation and a Darcy-Weisbach formula.
And deducing the relation between the interference frequency and the jet flow speed in the second step, wherein according to the unstable principle of the jet flow, when the deflection with large enough amplitude is loaded in the horizontal direction, the jet flow can be uniformly broken along with the period of the deflection, and according to the law of conservation of mass, the mass of the cylindrical jet flow in the wavelength before the jet flow is broken is equal to the mass of the spherical liquid drop after the jet flow is broken.
In the step one, the target ball diameter is determined according to the packaging requirement, the selected target ball diameter is within the range of 0.8mm, the diameter of a nozzle of the crucible is 0.4mm, and the solder ball material is Sn3Ag0.5Cu.
Deducing the relation between the interference frequency and the jet velocity in the second step according to the following steps:
According to the following steps: v ═ f λ; to obtain
Where ρ islIs the droplet density, d1Is the jet diameter, d2Is the droplet diameter, λ is the jet wavelength, f is the interference frequency, λ is the jet wavelength, ρsIs the density of solid spheres, d0Is the solid sphere diameter and v is the jet velocity.
In the third step, the relation between the jet flow speed and the pressure is deduced, and the pressure applied to the liquid level of the crucible is set as P2The ambient pressure outside the crucible is P0The Bernoulli equation is listed for facet 0 and facet 1:
simplifying to obtain:
loss along the way is hf，
For laminar flow, according to the Darcy-Weisbach equation
Obtaining:
hmfor the local loss due to the abrupt orifice,
wherein zeta is a loss coefficient, and according to the area ratio of the mutation pipe orifice, zeta is 0.6, and the following is obtained:
let P1-P0Finish, to give:
the fluid in the crucible nozzle is laminar, so α0And α1Substitute 2 into
Obtaining:
the jet velocity obtained by finishing is
The working principle of the invention is as follows: the invention deduces the relation between the interference frequency and the jet velocity by setting the target ball diameter, selecting the corresponding crucible nozzle diameter, deducing the relation between the jet velocity and the pressure intensity based on Bernoulli equation and Darcy-Weisbach formula, including loss coefficient, on-way loss and kinetic energy correction coefficient, and providing theoretical guidance for the production process of the BGA solder ball.
Although the present invention has been described in detail with reference to the specific embodiments, the present invention is not limited to the above embodiments, and various changes and modifications without inventive changes may be made within the knowledge of those skilled in the art without departing from the spirit of the present invention.
Claims (5)
1. A parameter derivation method for preparing BGA solder balls based on a jet flow fracture method comprises the following steps:
the method comprises the following steps: setting the diameter of a target ball, and selecting the diameter of a corresponding crucible nozzle;
step two: deducing the relation between the interference frequency and the jet velocity;
step three: and deducing the relation between the jet velocity and the pressure, wherein the relation comprises a loss coefficient, a path loss and a kinetic energy correction coefficient based on a Bernoulli equation and a Darcy-Weisbach formula.
2. The method of claim 1, wherein the parameter derivation method comprises: and deducing the relation between the interference frequency and the jet flow speed in the second step, wherein according to the unstable principle of the jet flow, when the deflection with large enough amplitude is loaded in the horizontal direction, the jet flow can be uniformly broken along with the period of the deflection, and according to the law of conservation of mass, the mass of the cylindrical jet flow in the wavelength before the jet flow is broken is equal to the mass of the spherical liquid drop after the jet flow is broken.
3. The method of claim 1, wherein the parameter derivation method comprises: in the step one, the target sphere diameter is determined according to the packaging requirement, the target sphere diameter is in the range of 0.1 mm-0.8 mm, and the diameter of the crucible nozzle is selected to be 1/2 of the target sphere diameter.
4. The method of claim 1, wherein the parameter derivation method comprises: deducing the relation between the interference frequency and the jet velocity in the second step according to the following steps:
and
two equations to obtain
According to the following steps: v ═ f λ; to obtain
Where ρ islIs the droplet density, d1Is the jet diameter, d2Is the droplet diameter, λ is the jet wavelength, f is the interference frequency, λ is the jet wavelength, ρsIs the density of solid spheres, d0Is the solid sphere diameter and v is the jet velocity.
5. The method of claim 1, wherein the parameter derivation method comprises: in the third step, the relation between the jet flow speed and the pressure is deduced, and the pressure applied to the liquid level of the crucible is set as P2The ambient pressure outside the crucible is P0The Bernoulli equation is listed for facet 0 and facet 1:
simplifying to obtain:
loss along the way is hf，
For laminar flow, according to the Darcy-Weisbach equation
Obtaining:
hmfor the local loss due to the abrupt orifice,
and zeta is a loss coefficient, and according to the area ratio of the mutation pipe orifice, zeta is 0.4-0.6, and the following is obtained:
let P1-P0Finish, to give:
the fluid in the crucible nozzle is laminar, so α0And α1Substitute 2 into
Obtaining:
the jet velocity obtained by finishing is
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010597055.0A CN111723333A (en) | 2020-06-29 | 2020-06-29 | Parameter derivation method for preparing BGA solder balls based on jet flow fracture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010597055.0A CN111723333A (en) | 2020-06-29 | 2020-06-29 | Parameter derivation method for preparing BGA solder balls based on jet flow fracture method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111723333A true CN111723333A (en) | 2020-09-29 |
Family
ID=72569085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010597055.0A Pending CN111723333A (en) | 2020-06-29 | 2020-06-29 | Parameter derivation method for preparing BGA solder balls based on jet flow fracture method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111723333A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113560587A (en) * | 2021-08-12 | 2021-10-29 | 广州海普电子材料科技有限公司 | BGA tin ball smelting and rapid forming method |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1521008A (en) * | 1966-04-27 | 1968-04-12 | Monsanto Co | Process for forming shaped products from molten materials and products obtained by this process |
| CN1295340A (en) * | 2000-05-13 | 2001-05-16 | 陈志亨 | Tin ball producing process |
| CN101745763A (en) * | 2009-12-22 | 2010-06-23 | 北京有色金属研究总院 | High-efficiency preparation method of precise welded ball |
| CN102901548A (en) * | 2011-07-27 | 2013-01-30 | 恩德莱斯和豪瑟尔测量及调节技术分析仪表两合公司 | Method for determining a dosed, or metered, volume of an automatic peristaltic sample taker |
| CN104525958A (en) * | 2014-12-05 | 2015-04-22 | 浙江亚通焊材有限公司 | Device and method for using molten droplet spraying to prepare solder ball |
| CN105170980A (en) * | 2015-10-20 | 2015-12-23 | 江苏豪然喷射成形合金有限公司 | Method for establishing inclined twin-jet-nozzle scanning spray forming technological parameters |
| CN106568985A (en) * | 2016-10-31 | 2017-04-19 | 烟台科力博睿地震防护科技有限公司 | Method and system for determining relationship between refined throat size and gas-liquid velocity difference |
| CN110137091A (en) * | 2019-05-31 | 2019-08-16 | 河南机电职业学院 | A kind of tin ball nozzle and preparation method thereof |
| CN111046569A (en) * | 2019-12-18 | 2020-04-21 | 苏州热工研究院有限公司 | Cavitation water jet nozzle structure design method |
-
2020
- 2020-06-29 CN CN202010597055.0A patent/CN111723333A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1521008A (en) * | 1966-04-27 | 1968-04-12 | Monsanto Co | Process for forming shaped products from molten materials and products obtained by this process |
| CN1295340A (en) * | 2000-05-13 | 2001-05-16 | 陈志亨 | Tin ball producing process |
| CN101745763A (en) * | 2009-12-22 | 2010-06-23 | 北京有色金属研究总院 | High-efficiency preparation method of precise welded ball |
| CN102901548A (en) * | 2011-07-27 | 2013-01-30 | 恩德莱斯和豪瑟尔测量及调节技术分析仪表两合公司 | Method for determining a dosed, or metered, volume of an automatic peristaltic sample taker |
| CN104525958A (en) * | 2014-12-05 | 2015-04-22 | 浙江亚通焊材有限公司 | Device and method for using molten droplet spraying to prepare solder ball |
| CN105170980A (en) * | 2015-10-20 | 2015-12-23 | 江苏豪然喷射成形合金有限公司 | Method for establishing inclined twin-jet-nozzle scanning spray forming technological parameters |
| CN106568985A (en) * | 2016-10-31 | 2017-04-19 | 烟台科力博睿地震防护科技有限公司 | Method and system for determining relationship between refined throat size and gas-liquid velocity difference |
| CN110137091A (en) * | 2019-05-31 | 2019-08-16 | 河南机电职业学院 | A kind of tin ball nozzle and preparation method thereof |
| CN111046569A (en) * | 2019-12-18 | 2020-04-21 | 苏州热工研究院有限公司 | Cavitation water jet nozzle structure design method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113560587A (en) * | 2021-08-12 | 2021-10-29 | 广州海普电子材料科技有限公司 | BGA tin ball smelting and rapid forming method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106670452A (en) | Method for preparing spherical 3D printing powder through plasma shaping | |
| CN111723333A (en) | Parameter derivation method for preparing BGA solder balls based on jet flow fracture method | |
| CN111633215B (en) | Method for preparing superfine spherical aluminum powder by high-pressure atomization | |
| JP4171955B2 (en) | Method and apparatus for producing metal powder | |
| CN106609369A (en) | Method for realizing additive manufacturing through cold gas dynamic spray | |
| CN113560587A (en) | BGA tin ball smelting and rapid forming method | |
| KR101476726B1 (en) | Method for coating amorphous thin film | |
| US20060068087A1 (en) | Direct writing of metallic conductor patterns on insulating surfaces | |
| US4401609A (en) | Metal atomization | |
| KR20200079063A (en) | Manufacturing Method For Fe-based Metal Granulated Powder And Analyzing Method Using Distinct Element Method Particulate Material Dynamics Therefor | |
| JPH03502545A (en) | Method for spraying a melt and apparatus for using the method | |
| CN111558724A (en) | BGA solder ball preparation device and preparation process based on jet instability principle | |
| CN117182086A (en) | Method for improving alloy powder performance and morphology | |
| CN114016022A (en) | Narrow-gap powder feeding nozzle for high-speed laser cladding | |
| He et al. | Influence of powder flow on sidewall quality of solid parts in laser metal direct forming | |
| CN212102959U (en) | Water spraying device of disc pelletizer | |
| JP2580616B2 (en) | Method for producing spherical metal powder | |
| CN113072083A (en) | Preparation method and preparation device of spherical magnesium oxide | |
| Singer et al. | Atomization of liquid metals using twin roller technique | |
| US964805A (en) | Apparatus for producing cement. | |
| CA1040894A (en) | Method of manufacture of metallic powder | |
| CN115502389B (en) | Magnetic alloy/alumina ceramic composite powder for thermal spraying and preparation and application thereof | |
| JPH0128801B2 (en) | ||
| CN214640290U (en) | Supersonic resonance high-temperature alloy ceramic atomizing device | |
| JP3108607U (en) | Internal impact high-speed spray nozzle device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |