CN111715590B - Cleaning method of evaporation equipment in electronic industry - Google Patents
Cleaning method of evaporation equipment in electronic industry Download PDFInfo
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- CN111715590B CN111715590B CN202010580860.2A CN202010580860A CN111715590B CN 111715590 B CN111715590 B CN 111715590B CN 202010580860 A CN202010580860 A CN 202010580860A CN 111715590 B CN111715590 B CN 111715590B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/14—Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
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Abstract
The invention relates to a cleaning method of evaporation equipment in the electronic industry, which can effectively clean large residual films by carrying out high-pressure water cleaning on the evaporation equipment, and can further clean the residual films by carrying out sand blasting cleaning; and finally, high-pressure ultrasonic cleaning and high-pressure megasonic cleaning are adopted, so that small particle impurities attached to the evaporation equipment during evaporation operation can be effectively removed, the cleaning time is short, the cleaning effect is good, and the energy consumption is low. The invention has high cleaning efficiency, does not need long-time soaking treatment and has good cleaning effect; even if the evaporation equipment with the residual film thickness exceeding 1mm is cleaned, the residual film layer can be removed in a short time, and the removing effect is good; the cleaning liquid is water, so that the pollution is low, and the energy is saved and the environment is protected.
Description
Technical Field
The invention relates to a cleaning method of evaporation equipment in the electronic industry, and belongs to the technical field of cleaning in the electronic industry.
Background
The organic light emitting layer in the OLED display is usually prepared by vacuum evaporation technology, i.e. in a vacuum chamber, the evaporation material in a crucible is heated to evaporate and deposit on the target substrate. In the organic vapor deposition process, organic matters adsorbed on the surface are gradually accumulated to form particles after the anti-sticking plate is used for a period of time, so that the anti-sticking plate needs to be disassembled and cleaned regularly. The existing cleaning method is mainly used for removing the glass substrate by soaking pure pyrrolidone and other organic solvents, the cleaned anti-sticking plate has a plurality of residual organic matters (visible through a microscope ultraviolet lamp) which are invisible to naked eyes, and the glass substrate is scrapped after the anti-sticking plate is arranged in equipment to form particles.
In the existing evaporation process, the organic mask plate and the metal mask plate after evaporation are required to be cleaned by different medicaments and equipment, and the method has the advantages of large medicament consumption, high cost, high production cost and low production efficiency. In the prior patent (patent publication No. CN104614933A), a metal mask plate coated with organic substances and a metal layer is directly placed in an organic mask plate cleaning machine, and the metal layer of the mask plate is cleaned by cleaning the organic substances between the mask strips and the metal layer to achieve the purpose of directly peeling off the metal layer.
This method does not solve the following problems in actual production: 1) the cleaning efficiency is low, and the soaking is usually needed for more than 6 hours; 2) in the case of some vapor deposition equipment with a thick residual film layer, the cleaning is particularly difficult, and particularly, the cleaning is particularly difficult when the film thickness reaches more than 1 mm.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a cleaning method of evaporation equipment in the electronic industry, and the specific technical scheme is as follows:
a cleaning method of evaporation equipment in the electronic industry comprises the following steps:
step one, cleaning a region where a residual film on the surface of evaporation equipment is located by using a high-pressure water gun, and performing spray cleaning on the region where the residual film is located by using the high-pressure water gun under the pressure of 150-;
step two, performing sand blasting treatment on the evaporation equipment subjected to spray cleaning by a high-pressure water gun in the step one, wherein the particle size of a sand blasting medium is 100-140 meshes, and the pressure of used compressed air is 1.25-1.33 MPa;
and step three, performing high-pressure ultrasonic cleaning and high-pressure megasonic cleaning on the vapor deposition equipment subjected to sand blasting in the step two by using an ultrasonic and megasonic cleaning device.
According to the further optimization of the technical scheme, the ultrasonic and megasonic cleaning device comprises a cleaning tank, a sound-absorbing partition plate is arranged inside the cleaning tank, a gap area is arranged between the lower end of the sound-absorbing partition plate and the bottom of the cleaning tank, two sides of the sound-absorbing partition plate are hermetically connected with the side wall of the cleaning tank, the inside of the cleaning tank is divided into an ultrasonic cleaning area and a megasonic cleaning area by the sound-absorbing partition plate, and the ultrasonic cleaning area and the megasonic cleaning area are communicated through the gap area; the megasonic cleaning device comprises a megasonic cleaning area, a first support plate and a second support plate, wherein the megasonic cleaning area is internally provided with a megasonic vibrating plate and a first mesh groove positioned above the megasonic vibrating plate, and the side wall of the megasonic cleaning area is provided with the first support plate for supporting the first mesh groove; the ultrasonic cleaning device comprises an ultrasonic cleaning area, a cleaning tank, a first screen groove, a second screen groove, a first support plate, sound absorption flat plates and a sound pressure meter, wherein the ultrasonic cleaning area is internally provided with an ultrasonic vibration plate and the second screen groove above the ultrasonic vibration plate; a sealing cover for sealing the ultrasonic cleaning area and the megasonic cleaning area is arranged at the notch of the cleaning tank, a first through hole communicated with the ultrasonic cleaning area and a second through hole communicated with the megasonic cleaning area are arranged at the sealing cover, the first through hole is arranged right above the second mesh groove, the second through hole is arranged right above the first mesh groove, and a first hole plug for plugging the first through hole and a second hole plug for plugging the second through hole are arranged above the sealing cover; the cleaning tank is filled with cleaning liquid, a first air pressure area is arranged in a region between the liquid level of the cleaning liquid and the sealing cover in the ultrasonic cleaning area, and a second air pressure area is arranged in a region between the liquid level of the cleaning liquid and the sealing cover in the megasonic cleaning area.
In a further optimization of the above technical scheme, a first exhaust valve communicated with the first air pressure area, a first air pressure gauge for measuring an air pressure value at the first air pressure area, a second exhaust valve communicated with the second air pressure area, and a second air pressure gauge for measuring an air pressure value at the second air pressure area are installed above the sealing cover.
According to the further optimization of the technical scheme, a first safety valve communicated with the first air pressure area is installed above the sealing cover, and a second safety valve communicated with the second air pressure area is also installed above the sealing cover.
According to the technical scheme, the ultrasonic cleaning area and the megasonic cleaning area are both provided with air-entrapping pressurization devices outside, each air-entrapping pressurization device comprises a one-way valve, an air valve and a booster pump, the output end of each one-way valve is communicated with the first air pressure area or the second air pressure area, the input end of each one-way valve is communicated with one end of each air valve, and the other end of each air valve is communicated with the output end of each booster pump.
According to the further optimization of the technical scheme, the input end of the booster pump is communicated with the carbon dioxide gas cylinder.
According to the further optimization of the technical scheme, the cleaning solution is one of ultrapure water, deionized water, double distilled water, RO pure water and distilled water.
According to the further optimization of the technical scheme, the carbon dioxide is pressurized and input into the ultrasonic cleaning area or the megasonic cleaning area by using the gas-adding pressurizing device.
In the further optimization of the technical scheme, carbon dioxide is dissolved in the cleaning liquid in the ultrasonic cleaning area, and the air pressure at the first air pressure area is 223.35-251.55 kPa; carbon dioxide is dissolved in the cleaning liquid in the megasonic cleaning area, and the air pressure at the second air pressure area is 267.15-285.65 kPa; the sound pressure measured by the sound pressure meter is 2.6 +/-0.1W/cm2The megasonic frequency is 1.3 +/-0.02 MHz.
The invention has the beneficial effects that:
1) the large residual films can be effectively cleaned by firstly carrying out high-pressure water washing on the evaporation equipment, and the residual films can be further cleaned by carrying out sand blasting cleaning; and finally, high-pressure ultrasonic cleaning and high-pressure megasonic cleaning are adopted, so that small particle impurities attached to the evaporation equipment during evaporation operation can be effectively removed, the cleaning time is short, the cleaning effect is good, and the energy consumption is low.
2) The cleaning efficiency is high, long-time soaking treatment is not needed, and the cleaning effect is good; even if the evaporation equipment with the residual film thickness exceeding 1mm is cleaned, the residual film layer can be removed in a short time, and the removing effect is good; the cleaning liquid is water, so that the pollution is low, and the energy is saved and the environment is protected.
Drawings
FIG. 1 is a schematic view of an ultrasonic and megasonic cleaning apparatus of the present invention with cleaning fluid;
FIG. 2 is a schematic view of the ultrasonic and megasonic cleaning apparatus of the present invention shown without cleaning fluid;
FIG. 3 is a schematic view of the construction of the sound-absorbing panel of the present invention;
FIG. 4 is a schematic view of an ultrasonic cleaning zone and a megasonic cleaning zone at atmospheric pressure;
FIG. 5 is a schematic structural view of a control plate B2 in example 8;
FIG. 6 is a schematic structural view of a control plate B3 in example 9;
FIG. 7 is a schematic view showing the structure of a control panel B4 in example 10;
FIG. 8 is a schematic view of an ultrasonic cleaning zone and a megasonic cleaning zone under normal pressure in example 11;
FIG. 9 is a schematic view of an ultrasonic cleaning zone and a megasonic cleaning zone under normal pressure in example 12;
FIG. 10 is a graph of sound pressure versus time for examples 7-11;
FIG. 11 is a graph comparing sound pressure with time for each of examples 7, 9, 10, 12, and 14;
FIG. 12 is a graph of cleaning effect versus cleaning time at different frequencies;
fig. 13 is a graph showing the relationship between the air pressure at the first air pressure region and the air pressure at the second air pressure region and the weight loss rate.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it is to be noted that, unless otherwise specified, "a plurality" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1
The evaporation equipment in the electronic industry is a metal mask plate or an evaporation cooling plate. In the embodiment, the evaporation cooling plate is cleaned to be a uniform sample, and the thickness of the residual film layer on the surface of the subsequent evaporation cooling plate is 1.2 mm; and when the thickness of the residual film layer exceeds 1.2mm, processing the residual film layer by adopting a milling machine with the processing precision of 0.01mm until the thickness of the residual film layer reaches 1.2 mm. The evaporation cooling plate with the residual film thickness of 1.2mm is simply called a sample plate X.
Example 2
The cleaning method of the evaporation equipment in the electronic industry comprises the following steps:
step one, cleaning the area where the residual films on the surface of the sample plate X are located by using a high-pressure water gun, and spraying and cleaning the area where the residual films are located by using the high-pressure water gun under the pressure of 150-;
secondly, performing sand blasting treatment on the sample plate X subjected to spray cleaning by a high-pressure water gun in the step one, wherein the particle size of a sand blasting medium is 100-140 meshes, and the pressure of used compressed air is 1.25-1.33 MPa;
and step three, performing high-pressure ultrasonic cleaning and high-pressure megasonic cleaning on the sample plate X subjected to sand blasting in the step two (the evaporation cooling plate subjected to sand blasting is simply called DL plate) by using an ultrasonic and megasonic cleaning device.
Example 3
As shown in fig. 1 and 2, the ultrasonic and megasonic cleaning apparatus includes a cleaning tank 1, a sound-absorbing partition plate 2 is disposed inside the cleaning tank 1, a clearance zone 4 is disposed between the lower end of the sound-absorbing partition plate 2 and the tank bottom of the cleaning tank 1 (the distance between the lower end of the sound-absorbing partition plate 2 and the tank bottom of the cleaning tank 1 is more than 12cm, which is the clearance zone 4), two sides of the sound-absorbing partition plate 2 are hermetically connected with the side wall of the cleaning tank 1, the inside of the cleaning tank 1 is divided into an ultrasonic cleaning zone 20 and a megasonic cleaning zone 30 by the sound-absorbing partition plate 2, and the ultrasonic cleaning zone 20 and the megasonic cleaning zone 30 are communicated through the clearance zone; a megasonic vibration plate 31 and a first mesh groove 32 positioned above the megasonic vibration plate 31 are arranged in the megasonic cleaning area 30, and a first support plate 33 for supporting the first mesh groove 32 is installed on the side wall of the megasonic cleaning area 30; the ultrasonic cleaning device is characterized in that an ultrasonic vibration plate 21 and a second mesh groove 22 located above the ultrasonic vibration plate 21 are arranged inside the ultrasonic cleaning area 20, a second support plate 23 used for supporting the second mesh groove 22 is installed on the side wall of the ultrasonic cleaning area 20, sound absorption flat plates 25 horizontally arranged are arranged inside the ultrasonic cleaning area 20 in a staggered mode, the length direction of each sound absorption flat plate 25 is parallel to the height direction of each sound absorption partition plate 2, the sound absorption flat plates 25 are all arranged between the ultrasonic vibration plate 21 and the groove bottom of the cleaning groove 1, and a sound pressure meter 24 is installed between the ultrasonic vibration plate 21 and the groove bottom of the second mesh groove 22; a sealing cover 3 for sealing the ultrasonic cleaning area 20 and the megasonic cleaning area 30 is mounted at the notch of the cleaning tank 1, the sealing cover 3 is hermetically connected with the notch of the cleaning tank 1, the upper end of the sound-absorbing partition plate 2 is hermetically connected with the sealing cover 3, a first through hole 301 communicated with the ultrasonic cleaning area 20 and a second through hole 302 communicated with the megasonic cleaning area 30 are arranged at the sealing cover 3, the first through hole 301 is arranged right above the second mesh groove 22, the second through hole 302 is arranged right above the first mesh groove 32, and a first hole plug 5 for plugging the first through hole 301 and a second hole plug 6 for plugging the second through hole 302 are arranged above the sealing cover 3; the cleaning tank 1 is filled with cleaning liquid, a first air pressure region 26 is arranged in a region between the liquid level of the cleaning liquid in the ultrasonic cleaning region 20 and the sealing cover 3, a second air pressure region 34 is arranged in a region between the liquid level of the cleaning liquid in the megasonic cleaning region 30 and the sealing cover 3, the first through hole 301 is communicated with the first air pressure region 26, and the second through hole 302 is communicated with the second air pressure region 34.
Wherein, the ultrasonic cleaning area 20 performs ultrasonic cleaning on the DL board, and the megasonic cleaning area 30 performs megasonic cleaning on the DL board. The first mesh groove 32 and the second mesh groove 22 can be made of acid and alkali resistant polytetrafluoroethylene materials, so that even if the subsequent DL plate collides with the first mesh groove 32 and the second mesh groove 22, the DL plate is not damaged; the surfaces of the first and second wire grooves 32 and 22 have a large number of mesh holes. The ultrasonic vibrating plate 21 and the megasonic vibrating plate 31 both belong to conventional accessories in the field of ultrasonic cleaning and megasonic cleaning at present, and for example, related ultrasonic and megasonic cleaning accessories of Shenzhen super-technology Limited can be selected.
Further, a first exhaust valve 27 communicated with the first air pressure area 26, a first air pressure gauge 28 for measuring the air pressure value at the first air pressure area 26, a second exhaust valve 35 communicated with the second air pressure area 34, and a second air pressure gauge 36 for measuring the air pressure value at the second air pressure area 34 are arranged above the cover 3.
Further, air-entrapping and pressurizing devices are arranged outside the ultrasonic cleaning area 20 and the megasonic cleaning area 30, each air-entrapping and pressurizing device comprises a one-way valve 71, an air valve 72 and a pressurizing pump 73, an output end of the one-way valve 71 is communicated with the first air pressure area 26 or the second air pressure area 34, an input end of the one-way valve 71 is communicated with one end of the air valve 72, and the other end of the air valve 72 is communicated with an output end of the pressurizing pump 73. Wherein, the input end of the booster pump 73 is communicated with the carbon dioxide gas cylinder.
By starting the booster pump 73, the booster pump 73 can pressurize and convey carbon dioxide in an external carbon dioxide gas cylinder to the first pressure area 26 and the second pressure area 34 for pressurization and inflation, so that the first pressure area 26 and the second pressure area 34 become high pressure areas (the pressure is greater than the atmospheric pressure), and the first pressure area 26 and the second pressure area 34 are independent of each other; after pressurization and inflation, carbon dioxide is firstly dissolved in the cleaning liquid and quickly changed into a saturated solution, but the carbon dioxide is continuously dissolved in the cleaning liquid along with the increase of the air pressure; finally, the air pressure at the first air pressure zone 26 is 223.35-251.55kPa, and the air pressure at the second air pressure zone 34 is 267.15-285.65 kPa. The air pressure at the first and second air pressure areas 26, 34 is stabilized by the action of the check valve 71.
Further, a first safety valve 29 communicated with the first air pressure area 26 is installed above the cover 3, and a second safety valve 37 communicated with the second air pressure area 34 is also installed above the cover 3. When the air pressure at the first air pressure zone 26 reaches a set limit value, the first safety valve 29 is opened for pressure relief. Similarly, when the air pressure in the second air pressure region 34 reaches a set limit value, the second relief valve 37 is opened to release the pressure.
Further, the cleaning solution is one of ultrapure water, deionized water, double distilled water, RO pure water and distilled water. Wherein, the carbon dioxide is pressurized and input into the ultrasonic cleaning area 20 or the megasonic cleaning area 30 by utilizing the gas-adding and pressurizing device.
When the cleaning is finished, the air pressure at the first air pressure area 26 is balanced with the external atmospheric pressure by opening the first emptying valve 27, so that the subsequent opening of the first hole plug 5 is facilitated. Similarly, by opening the second evacuation valve 35, the air pressure in the second air pressure region 34 is balanced with the external atmospheric pressure, which is beneficial to opening the second hole plug 6 subsequently.
Further, a blow-down valve 7 is installed below the cleaning tank 1, and a blow-down hole communicated with the input end of the blow-down valve 7 is formed in the tank bottom of the cleaning tank 1. When the cleaning liquid in the cleaning tank 1 needs to be drained, the cleaning liquid in the cleaning tank 1 is drained by opening the drain valve 7.
In the ultrasonic cleaning process, strong cavitation and vibration generated by ultrasonic waves are utilized to strip, drop and loosen stains on the surface of a workpiece; after the stains on the surface of the DL board are cleaned by ultrasonic waves, a part of residual particles can be cleaned; due to the adoption of the pressurization design, the adoption of the pressurization technology in the ultrasonic cleaning process is not beneficial to improving the cleaning efficiency because the cavitation is reduced; in order to eliminate the defect, the invention adopts the mode that carbon dioxide is synchronously input while pressurization, a large amount of carbon dioxide is dissolved in water, the cavitation effect is accelerated in the ultrasonic vibration process, bubbles generated by cavitation can be more rapidly burst and accelerated to rub, so that the small-particle-size area of a stain area can be loosened through air vortex and more violent impact, the follow-up megasonic cleaning can be completed in a short time, and the cleaning time is shortened.
Megasonic frequencies are generally considered to be between 750kHz and 3 MHz. For current practical applications, frequencies above about 750kHz, above 1MHz, or above 1.5MHz are used. The frequency of megasonic cleaning adopted by the invention is selected to be 1.3 +/-0.02 MHz.
When the megasonic plate 31 is started to perform megasonic cleaning in the megasonic cleaning region 30, the ultrasonic cleaning region 20 and the megasonic cleaning region 30 form a communicating vessel structure, and the vibrating sonic is also synchronously transmitted to the ultrasonic cleaning region 20 along with the cleaning liquid; due to the existence of the sound-absorbing partition board 2, the ultrasonic cleaning area 20 and the megasonic cleaning area 30 can be independent from each other, and the interference is obviously reduced. The sound-absorbing partition board 2 can absorb a large amount of vibration sound waves, so that the sound wave energy transmitted to the ultrasonic cleaning area 20 is quickly attenuated, and the sound energy is further absorbed by the sound-absorbing flat plate 25, and finally the sound energy frequency of the area near the second mesh groove 22 is 52 +/-0.5 kHz; the sound absorbing flat plates 25 are arranged in 15 blocks in a staggered manner, and can attenuate sound energy transmitted from the megasonic cleaning area 30 to the maximum in an effective space.
Due to the constant attenuation, the acoustic energy transmitted to the area near the second mesh groove 22 is rapidly reduced, wherein the acoustic energy frequency is 52 +/-0.5 kHz, and the frequency can be measured through the sound pressure contrast nearby. At this time, if the fluctuation is not large, the ultrasonic vibration plate 21 does not need to be started; if the sound pressure fluctuation is too large (the fluctuation amplitude exceeds 0.6W/cm)2) Then, the ultrasonic vibration plate 21 can be started, but the ultrasonic vibration plate 21 does not need full load operation at the moment, and only needs to be started for compensation, wherein the compensation is carried out by two to three tenths of the rated power; for example, the rated power of the ultrasonic vibrating plate 21 is 5.5kW, and then the ultrasonic vibrating plate is opened by only 550W. The ultrasonic vibrating plate 21 operating at low power can compensate the sound energy in the area near the second mesh groove 22, so that the sound energy requirement of the ultrasonic frequency of 52 +/-0.5 kHz is met. The sound pressure meter 24 is used to measure the sound pressure in the vicinity. JY-J1 type instruments can be selected.
The height difference between the liquid level of the cleaning liquid in the ultrasonic cleaning zone 20 and the liquid level of the cleaning liquid in the megasonic cleaning zone 30 is in dynamic balance all the time. Because the pressurizing treatment is adopted in the megasonic cleaning process, the cleaning time can be obviously shortened; the ultrasonic cleaning zone 20 is pressurized and cleaned synchronously in the megasonic cleaning zone 30 to avoid overlarge liquid level difference; the ultrasonic cleaning area 20 is cleaned by pressurizing, so that in order to ensure the cleaning effect, the loss caused by pressurizing ultrasonic cleaning can be compensated by pressurizing and conveying carbon dioxide, and the cleaning effect of the megasonic cleaning area 30 can be synchronously improved by conveying carbon dioxide to the megasonic cleaning area 30, so that the cleaning time is further shortened.
The process of high pressure ultrasonic cleaning and high pressure megasonic cleaning of the DL plate using the ultrasonic and megasonic cleaning apparatus is as follows:
1) firstly, the DL board is put into the second mesh groove 22 through the first through hole 301, and a long handle clamp can be adopted to assist in putting in the silicon slice; filling a cleaning solution into the cleaning tank 1, wherein the cleaning solution in the embodiment is preferably deionized water; stopping filling the cleaning liquid after the cleaning liquid submerges the silicon wafer at the second screen groove 22; the first through hole 301 is blocked by the first hole plug 5, and the first through hole is fixed by adopting bolt connection and sealed by a rubber ring.
2) And the DL plate is roughly washed in an ultrasonic washing area 20 at the ultrasonic frequency of 52 +/-0.5 kHz and is subjected to ultrasonic treatment for 13 minutes, and the sound pressure measured by a sound pressure meter 24 is 2.6 +/-0.1W/cm2. The large particles on the surface of the DL plate can be removed preliminarily by adopting ultrasonic cleaning, so that a stain area is loosened, and subsequent megasonic cleaning is facilitated.
3) The DL plate is subjected to ultrasonic cleaning in the ultrasonic cleaning area 20 to be a rough cleaning process, the DL plate after the rough cleaning is transferred to the first net groove 32 at the megasonic cleaning area 30, meanwhile, a new DL plate can be put into the second net groove 22 of the ultrasonic cleaning area 20 again, the megasonic vibration plate 31 is started, the frequency is 1.3 +/-0.02 MHz, and the megasonic cleaning lasts for 13 minutes. Because a large amount of sound waves are transmitted to the ultrasonic cleaning area 20 in the megasonic cleaning process, the ultrasonic vibration plate 21 does not need to be started most of the time of the ultrasonic cleaning area 20, and the total operation time of the ultrasonic vibration plate 21 is not more than 85 seconds in the process of 13 minutes of megasonic cleaning.
4) After megasonic cleaning, taking out the DL plate subjected to megasonic cleaning at the first mesh groove 32, washing the DL plate subjected to megasonic cleaning by using ultrapure water, and detecting that the residual number of particle groups on the surface of the cleaned DL plate is less than or equal to 0.27/cm by adopting a microscopic observation method2. Then the DL plate which is cleaned by ultrasonic at the second mesh groove 22 is cleanedAnd transferred to the first wire pit 32; and adding a new DL plate to be cleaned at the position of the first empty mesh groove 32, and repeating the steps in a cycle.
Example 4
Carrying out high-pressure ultrasonic cleaning on a sample plate X in an ultrasonic and megasonic cleaning device in embodiment 3, and then carrying out high-pressure megasonic cleaning, wherein the cleaning process is the same as that of embodiment 3, the time of the high-pressure ultrasonic cleaning and the time of the high-pressure megasonic cleaning are both 60 minutes, and the weight loss rate of the cleaned sample plate X is 2.97-3.21 per thousand; the weight loss ratio is a ratio between the mass difference of the sample plate X before and after cleaning and the mass of the sample plate X before cleaning. Sampling a sample plate X by a mechanical cleaning method, wherein the estimated weight loss rate is 5.63-5.97 per mill; that is, theoretically, the residual film layer on the sample plate X is completely removed, and the weight loss rate can reach 5.63 to 5.97%.
Example 5
And ultrasonically cleaning the sample plate X in an ultrasonic cleaning machine at the ultrasonic frequency of 52 +/-0.5 kHz for 100 minutes by using deionized water as a cleaning solution, wherein the weight loss rate of the cleaned sample plate X is 0.73-0.89 per thousand. The ultrasonic cleaner adopts CX type equipment produced by Shenzhen Shenxin Chun science and technology development Limited.
Example 6
And (3) carrying out megasonic cleaning on the sample plate X in a megasonic cleaning machine at the megasonic frequency of 1.3 +/-0.02 MHz, wherein the cleaning solution is deionized water, the megasonic cleaning is carried out for 60 minutes, and the weight loss rate of the cleaned sample plate X is 1.53-1.68 per thousand. The megasonic cleaner adopts ZX type equipment produced by Shenzhen, Fuxin science and technology development Limited.
By comparative analysis of examples 4 to 6, it can be seen that: the sample plate X is firstly subjected to high-pressure ultrasonic cleaning and then subjected to high-pressure megasonic cleaning, the cleaning effect is good, the weight loss rate after cleaning exceeds more than half of the estimated value, and the cleaning effect is better than that of ultrasonic cleaning and megasonic cleaning which are independently performed.
Example 7
In example 3, the sound absorbing flat plate 25 and the sound absorbing partition plate 2 are both made of a sound absorbing plate, and the thickness of the sound absorbing flat plate 25 is smaller than that of the sound absorbing partition plate 2. As shown in fig. 3, the sound-absorbing plate includes a reflection plate 61, a metal box 62 and a volcanic rock plate 63, wherein the front surface of the reflection plate 61 is a mirror surface, one side of the metal box 62 is fixedly connected with the back surface of the reflection plate 61, the other side of the metal box 62 is fixedly connected with the back surface of the volcanic rock plate 63, and the front surface of the volcanic rock plate 63 is of a corrugated structure; the inside of the metal case 62 is filled with sound absorbing cotton 621. The sound-absorbing partition board 2 is a sound-absorbing board, the mirror surface of the sound-absorbing board is located in the ultrasonic cleaning area 20, and the corrugated structure is located in the megasonic cleaning area 30. The sound absorbing plate 25 is a sound absorbing plate having a mirror surface facing upward and a corrugated structure facing downward.
The sound-absorbing board adopting the structure has good attenuation effect on sound waves. Only with this acoustic panel can stable acoustic energy be generated at the ultrasonic cleaning zone 20. As shown in fig. 4, the cleaning tank 1 is filled with a cleaning solution (deionized water), and since the first hole plug 5 and the second hole plug 6 are opened, the liquid levels at the ultrasonic cleaning zone 20 and the megasonic cleaning zone 30 are flush, and the liquid level at the ultrasonic cleaning zone 20 is higher than the sound pressure gauge 24; the megasonic plate 31 is started, the frequency is 0.85 plus or minus 0.01MHz, and the sound pressure measured by the sound pressure meter 24 is 0.82 plus or minus 0.06W/cm2. When the ultrasonic vibration plate 21 is turned on and the megasonic vibration plate 31 is turned off, and the ultrasonic frequency is 35 + -0.5 kHz, the sound pressure measured by the sound pressure meter 24 is 0.82 + -0.06W/cm2。
In this embodiment, the volcanic rock plate 63 is made by splicing and bonding a plurality of volcanic rock plates, and the volcanic rock plates are made of square volcanic rock blocks with an average porosity of more than 51% through surface treatment.
Example 8
For the sake of convenience of distinction, the sound-absorbing panel in example 7 is labeled B1, i.e., B1.
If the sound-absorbing board No. B1 in example 7 was replaced with the control board B2. In the present embodiment, the structure of the comparison board B2 differs from the sound-absorbing board No. B1 in embodiment 7 in that: the comparative plate B2 was composed of the same metal case 62 as in example 7, the sound-absorbing wool 621 filled therein, and the volcanic rock plate 63 and the reflection plate 61 were not provided, as shown in fig. 5.
If the flat sound-absorbing panel 25 and the sound-absorbing partition panel 2 in FIG. 4 are both made of the reference board B2. In FIG. 10, the symbol "B2" representsThe curve of (a) is a schematic diagram showing the variation of the sound pressure measured by the sound pressure meter 24 with time in the present embodiment. The sound absorption effect is limited because the comparison board B2 only has the sound absorption cotton 621 for absorbing sound; and the surface of the metal case 62 is not a mirror surface. Therefore, as can be seen from FIG. 10, the sound pressure measured by the sound pressure meter 24 is always 1.8W/cm because of the limited sound absorbing effect of the control board B22This results in the ultrasonic frequency of the ultrasonic cleaning zone 20 being significantly higher than 35 ± 0.5 kHz; and the sound pressure change of the ultrasonic cleaning area 20 fluctuates sharply with the change of time, which is not favorable for long-term ultrasonic operation.
Example 9
If the sound-absorbing board No. B1 in example 7 was replaced with the control board B3. In the present embodiment, the structure of the comparison board B3 differs from the sound-absorbing board No. B1 in embodiment 1 in that: the reflection plate 61 at the sound-absorbing plate No. B1 was replaced with a volcanic rock plate 63 having the same structure as in example 4; that is, in the control board B3, two volcanic rock plates 63 are provided as shown in fig. 6.
If the flat sound-absorbing panel 25 and the sound-absorbing partition panel 2 in FIG. 4 are both made of the reference board B3. In fig. 10, the curve denoted by "B3" is a schematic diagram of the change of the sound pressure measured by the sound pressure meter 24 with time in the present embodiment. Since the comparison board B3 is not provided with the reflection plate 61, but is provided with the volcanic rock plate 63 at the reflection plate 61, although the sound absorption effect is significantly improved; as can be seen from FIG. 10, the sound pressure measured by the sound pressure meter 24 was always not higher than 0.41W/cm because the sound absorption effect of the control board B3 was very good2This results in the ultrasonic frequency of the ultrasonic cleaning zone 20 being significantly below 35 kHz; moreover, the reflecting plate 61 is not arranged, so that the sound wave propagation at the ultrasonic cleaning area 20 cannot be propagated in order, and the sound pressure change of the ultrasonic cleaning area 20 fluctuates sharply along with the change of time, so that the cleaning effect of each wafer cannot be guaranteed for the cleaning of large batches of semiconductor silicon wafers, the cleaning effect is unstable, and the cleaning is not beneficial to the large-batch cleaning.
Example 10
If the sound-absorbing board No. B1 in example 7 was replaced with the control board B4. In the present embodiment, the structure of the comparison board B4 differs from the sound-absorbing board No. B1 in embodiment 1 in that: the reflection plate 61 is not provided at the sound-absorbing plate No. B4, as shown in fig. 7.
If the flat sound-absorbing panel 25 and the sound-absorbing partition panel 2 in FIG. 4 are both made of the reference board B4. In fig. 10, the curve denoted by "B4" is a schematic diagram of the change of the sound pressure measured by the sound pressure meter 24 with time in the present embodiment. Since the reference plate B4 was not provided with the reflection plate 61, the sound pressure value was already very close to that of the sound-absorbing plate No. B1 in example 7; however, since there is no concentrated reflection, the sound pressure value of the ultrasonic cleaning area 20 must be lower than that of the same position at the ultrasonic cleaning area 20 in example 7; and according to the fluctuation amplitude of the curve, the fluctuation amplitude of the embodiment is larger than that of the embodiment 7; however, the curve fluctuation tendency of this example is gentle compared to examples 8 and 9.
Example 11
If the sound-absorbing flat plates 25 in example 7 are arranged vertically, the spacing between the adjacent sound-absorbing flat plates 25 is the same as that in example 7; the thickness of the sound-absorbing flat plate 25 is also the same as that in example 7. As shown in fig. 8.
In fig. 10, the curve represented by "example 11" is a schematic diagram of the change of the sound pressure measured by the sound pressure meter 24 with time in this example. Since the sound absorbing flat plate 25 is vertically disposed, the sound waves near the tonometer 24 are disordered and the sound pressure value is significantly higher than that of example 7; this means that the sound absorbing flat plate 25 is vertically disposed, and the second mesh groove 22 cannot obtain a stable sound wave, and the cleaning effect becomes unstable.
Example 12
The sound pressure meter 24 in embodiment 7 is provided with a first reference sound pressure meter 24a on one side and a second reference sound pressure meter 24b on the other side, as shown in fig. 9. In example 9, if the sound pressure in example 9 is measured by using the reference tonometer one 24a, the change with time is schematically shown as a curve corresponding to "24 a" in fig. 11; from the comparison of the curve corresponding to "24 a" with the curve in "example 9", it can be seen that: one more volcanic rock plate 63 is provided so that the sound pressure near the sound-absorbing partition plate 2 is smaller, and the fluctuation range of the sound pressure measured by the first tonometer 24a is very large and disordered.
In example 10, if the sound pressure in example 10 is measured by using the second reference sound pressure meter 24b, the change of the sound pressure with time is schematically shown as a curve corresponding to "24 b" in fig. 11; from the comparison of the curve corresponding to "24 b" with the curve in "example 10", it can be seen that: the sound pressure value can be improved by arranging the mirror surface. Since the surface roughness of the metal case 62 is <0.8um, the surface roughness of the mirror surface is 0.02 to 0.16, and the smaller the surface roughness, the sound pressure value of example 7 is also approximated. The variation with time of the sound pressure value measured with reference to the second sound pressure gauge 24b is also large in fluctuation range and disordered because the farther the sound-absorbing partition plate 2 is, in addition, the larger the surface roughness, the weaker the sound wave reflection.
Therefore, a reflection plate 61 is required to be arranged at the ultrasonic cleaning area 20, the mirror surface of the sound absorption plate is positioned at the ultrasonic cleaning area 20, the corrugated structure is positioned at the megasonic cleaning area 30, the sound absorption plate is adopted by the sound absorption flat plate 25, the mirror surface of the sound absorption plate is arranged upwards, and the corrugated structure is arranged downwards; the ultrasonic cleaning zone 20 can obtain stable sound energy through the arrangement.
Example 13
The method for performing surface treatment on the volcanic rock block in the embodiment 7 comprises the following steps: soaking a tetragonal volcanic rock block with the side length of 5-6 cm in a silane coupling agent for 30min, then spin-drying in a centrifuge, centrifuging at the rotation speed of 900-80 ℃ at 950r/min for 3-4min, then drying at the rotation speed of 300-350r/min at 75-80 ℃ for 1-2h, and cooling to obtain a crude product; then soaking the crude product in water repellent aqueous solution for 12-15min, then spin-drying in a centrifuge, centrifuging for 6-8min at the rotation speed of 900 plus materials 950r/min, then drying at the rotation speed of 300 plus materials 350r/min at the drying temperature of 85-90 ℃ for 2-3h, and cooling to obtain a finished product; wherein the water repellent aqueous solution is prepared by mixing a water repellent and water according to the mass ratio of 1: 13.6.
The finished product is the volcanic rock block with finished surface treatment, and the average porosity of the finished product is 43-47%. The water repellent is 98 type water repellent of Zhengzhou Qiongyue chemical product limited company, has good penetration crystallinity, and is easy to form dense hydrophobicAn aqueous layer. Centrifugal drying is carried out at the rotation speed of 900-2(ii) a If the rotating speed during spin-drying is too low, the void ratio is obviously reduced, the void ratio is not higher than 41 percent, the sound absorption effect is also influenced, and the sound pressure value is at least increased by 0.13W/cm under the same condition2. Drying at low speed (the rotating speed is 300-; if the rotation speed is too low, the drying time is not affected much, but the void ratio is decreased.
Example 14
In this example, compared with example 7, in this example, the volcanic rock masses were not subjected to the surface treatment, that is, the surface treatment process of example 13 was not performed, and a control plate B5 was obtained; if the flat sound-absorbing panel 25 and the sound-absorbing partition panel 2 in fig. 4 are both made of the reference panel B5, the curve represented by "B5" in fig. 11 is a graph showing the change of sound pressure with time measured by the sound pressure meter 24 in this embodiment. Since the volcanic rock blocks are not subjected to surface treatment in the comparison board B5, the micropores on the surfaces of the volcanic rock blocks do not contain a hydrophobic layer, and it can be known from FIG. 11 that if hydrophobic treatment is not adopted, the sound absorption effect is affected; meanwhile, with the prolonging of the ultrasonic time, the sound absorption effect can fluctuate continuously, and the stability is poor.
Example 15
Since the source of sonic energy in the ultrasonic cleaning zone 20 is primarily dependent on the megasonic cleaning zone 30, the ultrasonic cleaning zone 20 and the megasonic cleaning zone 30 are cleaned simultaneously, and the cleaning time in the ultrasonic cleaning zone 20 and the megasonic cleaning zone 30 needs to be equal and as short as possible to avoid wasting energy. Although within a certain range, the longer the time for cleaning at the ultrasonic cleaning zone 20, the shorter the cleaning time at the subsequent megasonic cleaning zone 30; however, the cleaning time in the megasonic cleaning zone 30 is too short due to too long cleaning time in the ultrasonic cleaning zone 20, and thus the cleaning time in the ultrasonic cleaning zone 20 and the cleaning time in the megasonic cleaning zone 30 cannot be synchronized.
Fig. 12 is a graph of cleaning effectiveness versus cleaning time for different megasonic cleaning frequencies. In this example, both the ultrasonic and megasonic cleaning systems of example 7 were used. The same batch of sample plates X with the same film thickness or the same film thickness are adopted, the megasonic frequencies of the megasonic vibration plate 31 are respectively 1.1MHz, 1.2MHz, 1.3MHz, 1.5MHz and 1.8MHz, and the sample plates are cleaned under different frequencies; in the cleaning process, the cleaning time is set in sequence according to the gradient, and the weight loss rate is calculated after the cleaning is finished. As can be seen from fig. 12:
1) the higher the weight loss rate along with the extension of the cleaning time, the better the cleaning effect is; finally, the weight loss rate reaches the limit and tends to balance.
2) The megasonic frequency is 1.1-1.5MHz, the weight loss rate is increased along with the increase of the megasonic frequency, namely the cleaning effect is improved along with the increase of the megasonic frequency.
3) When the megasonic frequency is 1.3MHz and 1.5MHz, the final cleaning effect is better than that of 1.3MHz along with 1.5MHz, but the increasing amplitude is limited; 1.3MHz is preferred for energy consumption and other reasons; the washing time is selected from 12 to 16 minutes, preferably 13 minutes.
4) Comparing two curves of the megasonic frequency at 1.5MHz and 1.8MHz, although the cleaning effect of the megasonic frequency at 1.8MHz is better than that of the megasonic frequency at 1.5MHz in the early period (the first 10 minutes); but at a later stage (a period after 10 minutes) the cleaning effect at the megasonic frequency of 1.8MHz is lower than the cleaning effect at the megasonic frequency of 1.5MHz, but only slightly higher than the cleaning effect at the megasonic frequency of 1.3 MHz.
5) As can be seen from fig. 12: preferably, the megasonic frequency is 1.3MHz and the cleaning time is 13 minutes.
Example 16
Based on example 7, the air pressure at the first air pressure zone and the air pressure at the second air pressure zone were continuously changed, and other parameters were not changed, for example, the megasonic frequency was still 1.3 ± 0.02 MHz. The finally measured air pressure at the first air pressure area and the air pressure at the second air pressure area are plotted against the weight loss ratio, as shown in fig. 13. In FIG. 13, the curve "ultrasonic" is the same as in example 7 except that the air pressure at the first air pressure zone is changed; the "megasonic" curve is a curve in which the air pressure is changed only at the second air pressure region, and the remaining parameters are the same as those of example 7.
In this example, 35 sample plates X were selected, and the thickness of the residual film layer in each sample plate X was 1.2 mm. The measurement is continued under new test conditions by replacing the new sample plate X after each measurement. For example, in the case where only the pressure value at the first pressure zone was changed, the pressure at the first pressure zone was 208.35kPa for the 1 st test, and the weight loss rate of the 1 st sample panel X after cleaning in the ultrasonic and megasonic cleaning apparatus was 1.95% o; the air pressure at the first air pressure area in the 2 nd test is 213.35kPa, and the weight loss rate of the 2 nd sample plate X after being cleaned in an ultrasonic and megasonic cleaning device is 2.1 per thousand; the 1 st sample plate X was not used in the 2 nd test and was subsequently cleaned in an ultrasonic and megasonic cleaning apparatus to ensure that each set of tests was independent of each other and to reduce experimental errors due to accumulation. As can be seen from fig. 13:
1) and when the air pressure at the first air pressure area is 223.35-251.55kPa or the air pressure at the second air pressure area is 267.15-285.65kPa, the weight loss rate reaches 2.97-3.21 per thousand, and the weight loss rate is much higher than that obtained by only carrying out ultrasonic cleaning or megasonic cleaning.
2) Although the pressure at the first air pressure area is in the period of 251.55-265.55kPa and the weight loss rate is also in the interval of 2.97-3.21 per thousand, the pressure at the period is much higher than 223.35-251.55kPa, and the energy consumption of the air-entrapping pressurization device is high; therefore, the gas pressure at the first gas pressure zone is preferably 223.35-251.55 kPa. Although the air pressure at the second air pressure area is in the period of 285.65-302.55kPa and the weight loss rate is also in the interval of 2.97-3.21 permillage, the air pressure at the period is much higher than 267.15-285.65kPa, and the energy consumption of the air-entrapping pressurization device is high; therefore, the air pressure at the second air pressure zone is preferably 267.15-285.65 kPa.
3) After the air pressure at the second air pressure area reaches 285.65kPa, when the air pressure at the second air pressure area becomes large, the excessive pressure indicates that the amount of the carbon dioxide which is injected into the megasonic cleaning area 30 is more, and under the condition that the megasonic frequency is not increased any more, the excessive carbon dioxide can interfere the cleaning effect of the high-speed micro water flow at the megasonic cleaning area 30 on the residual film layer; however, as the amount of carbon dioxide continues to increase until the "cavitation" effect in the megasonic cleaning zone 30 dominates, the cleaning effect is improved over before.
In the above embodiment, the evaporation cooling plate is first subjected to high-pressure water washing and sand blasting cleaning, and finally, the ultrasonic and megasonic cleaning device is used for high-pressure ultrasonic cleaning and high-pressure megasonic cleaning. The sound energy of the ultrasonic cleaning area 20 mainly comes from the megasonic cleaning area 30, and the ultrasonic cleaning and the megasonic cleaning are carried out synchronously, which is beneficial to energy conservation and consumption reduction; ultrasonic cleaning is performed first and then megasonic cleaning is performed, which is helpful for improving the cleaning effect. Compared with the ultrasonic cleaning only, the ultrasonic and megasonic cleaning device can clean residual particles in a short time (13 minutes), and has good cleaning effect. Compared with the cleaning only by megasonic, the cleaning time of the invention is short, and the energy can be saved by more than 41.7%. Even if the existing ultrasonic cleaning machine and the megasonic cleaning machine are used together, the cleaning time is doubled, and the ultrasonic cleaning machine needs additional energy, so that the ultrasonic cleaning machine and the megasonic cleaning machine are used together, and the energy consumption is 55.6 percent more than that of the ultrasonic and megasonic cleaning device.
Wherein, carry out high pressure water washing to the coating by vaporization cooling plate and can effectively clear up the incomplete membrane of bold, carry out the sandblast clearance and can further clear up the incomplete membrane, adopt high-pressure ultrasonic cleaning earlier then high pressure megasonic cleaning at last, can effectively clear away the adnexed tiny particle impurity of coating by vaporization equipment when the coating by vaporization operation (being less than 0.2 mu m's particle), the particle group remains the number and is less than or equal to 0.27/cm2。
The invention has high cleaning efficiency, does not need long-time soaking treatment and has good cleaning effect; even if the evaporation equipment with the residual film thickness exceeding 1mm is cleaned, the residual film layer can be removed in a short time, and the removing effect is good; the cleaning liquid is water, so that the pollution is low, and the energy is saved and the environment is protected.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (8)
1. A cleaning method of evaporation equipment in the electronic industry is characterized by comprising the following steps:
step one, cleaning a region where a residual film on the surface of evaporation equipment is located by using a high-pressure water gun, and performing spray cleaning on the region where the residual film is located by using the high-pressure water gun under the pressure of 150-;
step two, performing sand blasting treatment on the evaporation equipment subjected to spray cleaning by a high-pressure water gun in the step one, wherein the particle size of a sand blasting medium is 100-140 meshes, and the pressure of used compressed air is 1.25-1.33 MPa;
thirdly, performing high-pressure ultrasonic cleaning and high-pressure megasonic cleaning on the vapor deposition equipment subjected to sand blasting in the second step by using an ultrasonic and megasonic cleaning device;
the ultrasonic and megasonic cleaning device comprises a cleaning tank, wherein a sound-absorbing partition plate is arranged inside the cleaning tank, a clearance area is arranged between the lower end of the sound-absorbing partition plate and the bottom of the cleaning tank, two sides of the sound-absorbing partition plate are hermetically connected with the side wall of the cleaning tank, the inside of the cleaning tank is divided into an ultrasonic cleaning area and a megasonic cleaning area by the sound-absorbing partition plate, and the ultrasonic cleaning area and the megasonic cleaning area are communicated through the clearance area; the megasonic cleaning device comprises a megasonic cleaning area, a first support plate and a second support plate, wherein the megasonic cleaning area is internally provided with a megasonic vibrating plate and a first mesh groove positioned above the megasonic vibrating plate, and the side wall of the megasonic cleaning area is provided with the first support plate for supporting the first mesh groove; the ultrasonic cleaning device comprises an ultrasonic cleaning area, a cleaning tank, a first screen groove, a second screen groove, a first support plate, sound absorption flat plates and a sound pressure meter, wherein the ultrasonic cleaning area is internally provided with an ultrasonic vibration plate and the second screen groove above the ultrasonic vibration plate; a sealing cover for sealing the ultrasonic cleaning area and the megasonic cleaning area is arranged at the notch of the cleaning tank, a first through hole communicated with the ultrasonic cleaning area and a second through hole communicated with the megasonic cleaning area are arranged at the sealing cover, the first through hole is arranged right above the second mesh groove, the second through hole is arranged right above the first mesh groove, and a first hole plug for plugging the first through hole and a second hole plug for plugging the second through hole are arranged above the sealing cover; the cleaning tank is filled with cleaning liquid, a first air pressure area is arranged in a region between the liquid level of the cleaning liquid and the sealing cover in the ultrasonic cleaning area, and a second air pressure area is arranged in a region between the liquid level of the cleaning liquid and the sealing cover in the megasonic cleaning area.
2. The cleaning method of the evaporation equipment in the electronic industry according to claim 1, wherein the cleaning method comprises the following steps: and a first exhaust valve communicated with the first air pressure area, a first air pressure meter for measuring the air pressure value at the first air pressure area, a second exhaust valve communicated with the second air pressure area and a second air pressure meter for measuring the air pressure value at the second air pressure area are arranged above the sealing cover.
3. The cleaning method of the evaporation equipment in the electronic industry according to claim 2, wherein the cleaning method comprises the following steps: and a first safety valve communicated with the first air pressure area is arranged above the sealing cover, and a second safety valve communicated with the second air pressure area is also arranged above the sealing cover.
4. The cleaning method of the evaporation equipment in the electronic industry according to claim 1, wherein the cleaning method comprises the following steps: the ultrasonic cleaning device is characterized in that air-entrapping and pressurizing devices are arranged outside the ultrasonic cleaning area and the megasonic cleaning area and comprise one-way valves, air valves and booster pumps, the output ends of the one-way valves are communicated with the first air pressure area or the second air pressure area, the input ends of the one-way valves are communicated with one ends of the air valves, and the other ends of the air valves are communicated with the output ends of the booster pumps.
5. The cleaning method of evaporation equipment in the electronic industry according to claim 4, wherein the cleaning method comprises the following steps: and the input end of the booster pump is communicated with the carbon dioxide gas cylinder.
6. The cleaning method of the evaporation equipment in the electronic industry according to claim 1, wherein the cleaning method comprises the following steps: the cleaning liquid is one of ultrapure water, deionized water, double distilled water, RO pure water and distilled water.
7. The cleaning method of evaporation equipment in the electronic industry according to claim 5, wherein the cleaning method comprises the following steps: and (3) pressurizing and inputting carbon dioxide into the ultrasonic cleaning area or the megasonic cleaning area by using the gas-adding pressurizing device.
8. The cleaning method of evaporation equipment in the electronic industry according to claim 7, wherein the cleaning method comprises the following steps: the cleaning liquid in the ultrasonic cleaning area is dissolved with carbon dioxide, and the air pressure at the first air pressure area is 223.35-251.55 kPa; carbon dioxide is dissolved in the cleaning liquid in the megasonic cleaning area, and the air pressure at the second air pressure area is 267.15-285.65 kPa; the sound pressure measured by the sound pressure meter is 2.6 +/-0.1W/cm2The megasonic frequency is 1.3 +/-0.02 MHz.
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