CN111714974A - Filter equipment and semiconductor processing equipment - Google Patents
Filter equipment and semiconductor processing equipment Download PDFInfo
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- CN111714974A CN111714974A CN202010515631.2A CN202010515631A CN111714974A CN 111714974 A CN111714974 A CN 111714974A CN 202010515631 A CN202010515631 A CN 202010515631A CN 111714974 A CN111714974 A CN 111714974A
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- filter element
- inner chamber
- semiconductor processing
- dust
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- 238000001914 filtration Methods 0.000 claims abstract description 62
- 238000006243 chemical reaction Methods 0.000 claims abstract description 54
- 239000011148 porous material Substances 0.000 claims abstract description 11
- 238000007789 sealing Methods 0.000 claims description 26
- 238000003825 pressing Methods 0.000 claims description 21
- 230000000149 penetrating effect Effects 0.000 claims description 9
- 238000005086 pumping Methods 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 239000000725 suspension Substances 0.000 claims 3
- 239000000428 dust Substances 0.000 abstract description 58
- 238000000034 method Methods 0.000 abstract description 24
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 22
- 229910052710 silicon Inorganic materials 0.000 abstract description 22
- 239000010703 silicon Substances 0.000 abstract description 22
- 230000008569 process Effects 0.000 abstract description 20
- 239000007789 gas Substances 0.000 description 24
- 235000012431 wafers Nutrition 0.000 description 19
- 238000004140 cleaning Methods 0.000 description 18
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 13
- 229910002804 graphite Inorganic materials 0.000 description 11
- 239000010439 graphite Substances 0.000 description 11
- 229910021419 crystalline silicon Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000009434 installation Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000012535 impurity Substances 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 4
- 230000003749 cleanliness Effects 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000010248 power generation Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
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- 238000012986 modification Methods 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
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- 239000012495 reaction gas Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a filtering device and semiconductor processing equipment, the filtering device is used for the semiconductor processing equipment, the filtering device comprises a shell (100) and a filter element (200), wherein: the casing (100) has first inner chamber (110), entry (120) and export (130), filter core (200) set up in first inner chamber (110), entry (120) with first inner chamber (110) intercommunication, filter core (200) have second inner chamber (210), export (130) with second inner chamber (210) intercommunication, a plurality of filtration pores have been seted up to filter core (200), first inner chamber (110) with second inner chamber (210) pass through the filtration pore intercommunication. The scheme can solve the problem that the dust amount in the reaction chamber is large in the silicon wafer processing process.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a filtering device and semiconductor processing equipment.
Background
The photovoltaic power generation system is a novel power generation system which directly converts solar radiation energy into electric energy by utilizing the photovoltaic effect of a solar cell piece material. Solar cells, also known as photovoltaic cells, are the core devices in photovoltaic power generation systems. Currently, the most mature and commercially valuable solar cell with the widest market applications is the crystalline silicon solar cell. The reflection loss rate of sunlight on the surface of the crystal silicon is as high as about 35%, and the final conversion efficiency of the solar cell is seriously influenced. In order to improve the conversion efficiency, i.e. reduce the reflection of sunlight from the surface of crystalline silicon and increase the refractive index of sunlight, one or more layers of silicon dioxide or silicon oxynitride or silicon nitride antireflection films are often deposited on the surface of crystalline silicon. The antireflection film not only can reduce the emission of sunlight on the surface of crystalline silicon, but also can play a role in passivating and protecting the surface of the crystalline silicon. Plasma Enhanced Chemical Vapor Deposition (PECVD) equipment adopts a plasma enhanced Chemical Vapor Deposition technology, makes reaction gas generate glow discharge by using a radio frequency electric field under the condition of low pressure, ionizes the plasma, and promotes the generation of reactive groups, so that silane and ammonia gas can react at a lower temperature (200-450 ℃), the complexity of the process is reduced, the service life of a crystalline silicon solar cell is effectively prevented from being attenuated, and the method is widely applied to evaporation of an antireflection film on the surface of the crystalline silicon solar cell.
At present, PECVD equipment easily generates dust in the process of processing a silicon wafer, dust scale is formed on a vacuum pipeline and a vacuum component after long-time work, particularly, compared with a PERC (Passivated Emitter and reactor Cell) battery technology, the process gas quantity of a back passivation process needs to be increased greatly, so that the dust quantity in a reaction chamber is larger, the problem that a graphite boat and the silicon wafer are polluted by the dust is caused, the cleaning frequency of the graphite boat exceeds the cleaning capacity of field equipment, and the reject ratio of the silicon wafer polluted by the dust is larger; meanwhile, in the process of vacuumizing the reaction chamber, the dry pump is often stuck, and a large amount of dust causes the blockage of a vacuum pipeline, so that the dust is poured into the reaction chamber.
Disclosure of Invention
The invention discloses a filtering device and semiconductor processing equipment, which can solve the problem that the dust amount in a reaction chamber is large in the silicon wafer processing process.
In order to solve the problems, the invention adopts the following technical scheme:
the embodiment of the invention discloses a filtering device, which is used for semiconductor processing equipment and comprises a shell and a filter element, wherein:
the casing has first inner chamber, entry and export, the filter core set up in first inner chamber, the entry with first inner chamber intercommunication, the filter core has the second inner chamber, the export with second inner chamber intercommunication, a plurality of filtration pores have been seted up to the filter core, first inner chamber with the second inner chamber passes through filtration pore intercommunication.
The embodiment of the invention discloses semiconductor processing equipment which comprises a reaction chamber, a vacuum pipeline, an air extracting device and the filtering device, wherein one end of the vacuum pipeline is communicated with the reaction chamber, the other end of the vacuum pipeline is communicated with an inlet, and the air extracting device is communicated with an outlet; or the like, or, alternatively,
the inlet is communicated with the reaction chamber, one end of the vacuum pipeline is communicated with the outlet, and the other end of the vacuum pipeline is communicated with the air extracting device.
The technical scheme adopted by the invention can achieve the following beneficial effects:
in the filtering device and the semiconductor processing equipment disclosed by the embodiment of the invention, the filtering device can better filter dust in gas, and in the process of vacuumizing the reaction chamber, the dust in the reaction chamber is pumped into the filtering device along with air and then is filtered by the filtering device, so that a large amount of dust in the reaction chamber is filtered to the filtering device, thus the dust in the reaction chamber is less, the problem that a graphite boat and a silicon wafer are polluted by the dust is avoided, the cleaning times of the graphite boat are further reduced, the cleaning capacity of the field equipment can meet the cleaning times of the graphite boat, the pollution degree of the silicon wafer can be relieved, and the reject ratio of the silicon wafer is reduced; simultaneously, the dust is filtered to filter equipment department, avoids a large amount of dust to get into the dry pump to prevent that the dead situation of card from often appearing in the dry pump, avoid the harm of dry pump, thereby improve the life of dry pump, reduce the maintenance duration and the cost of dry pump.
Meanwhile, the dust is filtered to the position of the filtering device, so that the situation that a large amount of dust blocks the vacuum pipeline can be avoided, the dust in the vacuum pipeline is prevented from flowing back into the reaction chamber, the dust in the reaction chamber is less, and the cleanliness and the service life of the vacuum pipeline and the vacuum components are improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the background art of the present invention, the drawings needed to be used in the embodiments or the background art will be briefly described below, and it is obvious for those skilled in the art to obtain other drawings without any inventive exercise.
FIG. 1 is a schematic structural diagram of a filtering apparatus according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view of a disclosed filter assembly according to an embodiment of the present invention;
FIG. 3 is an exploded view of a filtration device according to an embodiment of the present invention;
fig. 4 is a schematic partial structural diagram of a semiconductor processing apparatus according to an embodiment of the present invention.
Description of reference numerals:
100-shell, 110-first inner cavity, 120-inlet, 130-outlet, 140-mounting flange;
200-filter element, 210-second lumen;
300-a filter element through rod;
400-cartridge platen;
500-a mounting frame;
600-a first lifting ring;
710-a sealing cover plate, 720-a sealing ring and 730-a second hanging ring;
800-vacuum pipe;
900-air extractor.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
Referring to fig. 1 to 4, a filtering apparatus for a semiconductor processing device according to an embodiment of the present invention includes a housing 100 and a filter element 200.
Wherein the housing 100 is a base member of the filtering apparatus, the housing 100 can provide a mounting base for other components of the filtering apparatus, and the housing 100 has a first inner cavity 110, an inlet 120 and an outlet 130. Specifically, the shape of the casing 100 may be a cylindrical shape, a square cylindrical shape, or other shapes, which is not limited in the embodiment of the present invention. The inlet 120 and the outlet 130 may be formed on the casing 100, or may be formed by extending the opening on the casing 100, or the inlet 120 and the outlet 130 may be formed on the casing 100 in other manners, which is not limited in the embodiment of the present invention.
The filter core 200 can separate the dust in the gas, or set up reaction material in the filter core 200, use reaction material and dust fully to contact to make reaction material and dust fully react, thereby reduce the dust content in the gas, so that gas is comparatively clean, and then protect filter equipment low reaches equipment, so that low reaches equipment can normally work. Specifically, after the gas flows through the filter element 200, dust thereof is blocked by the filter element 200, and the clean gas passes through the filter element 200. Generally, the filter element 200 can be of various types, such as an activated carbon filter element, a corrugated filter element, a folded microporous filter element, and the like, and the filter element 200 in the embodiment of the present invention is an air filter element, and the structure and material of the air filter element are not limited. The dust filtering principle of the filter element 200 is known in the art, and for brevity of text, it will not be described herein again.
In the present embodiment, the filter element 200 is disposed in the first inner cavity 110, and the inlet 120 is communicated with the first inner cavity 110, so that gas can enter the first inner cavity 110 through the inlet 120. Filter core 200 has second inner chamber 210, a plurality of filtration pores have been seted up to filter core 200, generally speaking, a plurality of filtration pores can be seted up at the lateral wall of filter core 200, first inner chamber 110 passes through the filtration pore intercommunication with second inner chamber 210, so that the gas in the first inner chamber 110 passes through the filtration pore and gets into second inner chamber 210, and at the in-process that gas passes through the filtration pore, gas is filtered, the dust that carries in the gas adsorbs at filter core 200, thereby avoid the dust to continue to get into second inner chamber 210 along with gas, and then realize gas filtration's effect. The outlet 130 communicates with the second inner chamber 210 so that the gas filtered in the second inner chamber 210 flows out of the housing 100 through the outlet 130.
In a specific working process, gas containing impurities (e.g., dust) firstly enters the first inner cavity 110 through the inlet 120, the gas in the first inner cavity 110 can enter the second inner cavity 210 through the plurality of filter holes of the filter element 200, when the gas containing impurities passes through the filter holes, the impurities carried in the gas are filtered, so that the content of the impurities in the gas entering the second inner cavity 210 is smaller, the gas in the second inner cavity 210 is cleaner, and the clean gas finally flows out of the housing 100 through the outlet 130, thereby completing the whole filtering process of the gas.
The filtering device disclosed by the embodiment of the invention can better filter dust in gas, and in the process of vacuumizing the reaction chamber, the dust in the reaction chamber is pumped into the filtering device along with air and then is filtered by the filtering device, so that a large amount of dust in the reaction chamber is filtered to the filtering device, and thus, the dust in the reaction chamber is less, the problem that a graphite boat and a silicon wafer are polluted by dust is avoided, the cleaning frequency of the graphite boat is further reduced, the cleaning capacity of field equipment can meet the cleaning frequency of the graphite boat, the pollution degree of the silicon wafer can be relieved, and the reject ratio of the silicon wafer is reduced; simultaneously, the dust is filtered to filter equipment department, avoids a large amount of dust to get into the dry pump to prevent that the dead situation of card from often appearing in the dry pump, avoid the harm of dry pump, thereby improve the life of dry pump, reduce the maintenance duration and the cost of dry pump.
Meanwhile, the dust is filtered to the position of the filtering device, so that the situation that a large amount of dust blocks the vacuum pipeline can be avoided, the dust in the vacuum pipeline is prevented from flowing back into the reaction chamber, the dust in the reaction chamber is less, and the cleanliness and the service life of the vacuum pipeline and the vacuum components are improved.
As described above, the filter element 200 is disposed in the first inner cavity 110, and specifically, the filter device may further include a filter element penetrating rod 300, a filter element pressing plate 400 and a mounting frame 500, the mounting frame 500 is disposed in the first inner cavity 110, the mounting frame 500 may be clamped, bonded or screwed to an inner wall of the first inner cavity 110, a first end of the filter element penetrating rod 300 is connected to the mounting frame 500, the filter element 200 is sleeved on the filter element penetrating rod 300, the filter element pressing plate 400 is connected to a second end of the filter element penetrating rod 300, and the filter element 200 is sandwiched between the filter element pressing plate 400 and the inner wall of the first inner cavity 110. In this embodiment, the filter element 200 is stably installed in the first inner cavity 110 through the filter element penetrating rod 300, the filter element pressing plate 400 and the installation frame 500, the installation method is simple and reliable, the stability of the filter element 200 after installation is good, the filter element 200 is prevented from shaking in the first inner cavity 110, and the installation method can facilitate installation of the filter device among people. Meanwhile, the space occupied by the mounting structure in the first inner cavity 110 or the second inner cavity 210 is small, and the size of the filter element 200 can be set to be large, so that the size of the filter element 200 is large, and the filter element 200 with the large size can further improve the dust filtering effect of the filter device.
The filter element pressing plate 400 can be connected with the second end in various ways, such as welding or clamping, in an alternative embodiment, the second end can be provided with a first threaded portion, the filter element pressing plate 400 can be provided with a first threaded hole, the first threaded hole and the first threaded portion can be in threaded fit, that is, the filter element pressing plate 400 is connected with the second end in a threaded manner, the connection mode is a detachable connection mode, and in the subsequent use process, the filter element pressing plate 400 can be detached to replace, maintain or clean the filter element 200, so that the operation of workers is facilitated.
Of course, the filter element pressing plate 400 may also be provided with a through hole, and the first thread part passes through the through hole to be in threaded fit with the nut. This kind of connected mode also is detachable connected mode, makes things convenient for staff's later stage to change, maintain or wash filter core 200, improves filter equipment's installability and maintainability.
During replacement or cleaning of the filter cartridge 200, the filter cartridge press plate 400 is removed from the first interior cavity 110, and replacement or cleaning of the filter cartridge 200 is performed. In order to facilitate a worker to take out the filter element pressing plate 400 from the first inner cavity 110, optionally, a first hanging ring 600 may be disposed on a side of the filter element pressing plate 400 away from the filter element 200, the first hanging ring 600 may provide a stress position for the filter element pressing plate 400, and the worker may move the filter element pressing plate 400 through the first hanging ring 600, specifically, the worker may take out the filter element pressing plate 400 from the first inner cavity 110 in a hanging manner, or move the filter element pressing plate 400 from outside the first inner cavity 110 into the first inner cavity 110 in a hanging manner, during the hanging process, the worker may manually hang the filter element pressing plate, or may hang the filter element pressing plate through other hanging devices, which is not limited in the embodiment of the present invention.
Optionally, first end can have second screw thread portion, and second screw hole, second screw thread portion and second screw hole screw-thread fit have been seted up to mounting bracket 500 to make filter core wear pole 300 can dismantle with mounting bracket 500 and link to each other, make things convenient for staff's later stage to change, maintain or wash filter core wear pole 300, improve filter equipment's maintainability.
As described above, in order to remove the filter cartridge 200 from the first inner cavity 110 during replacement, maintenance or cleaning of the filter cartridge 200, in an alternative embodiment, the housing 100 may be provided with a mounting opening, the mounting opening may be provided with the mounting flange 140, and the filter device may further include a sealing cover plate 710, wherein the sealing cover plate 710 is connected to the mounting flange 140 in a sealing manner. The mounting opening provides access to the filter cartridge 200 to facilitate removal of the filter cartridge 200 from the first interior chamber 110 by a worker, or to move the filter cartridge 200 from outside the first interior chamber 110 into the first interior chamber 110. Meanwhile, when the filtering device is normally used, the sealing cover plate 710 can seal the mounting opening, so that the filtering device can normally work, and the phenomenon that the filtering device cannot well operate due to the fact that the mounting opening is formed is avoided.
Specifically, the filter apparatus may further include a sealing ring 720, and the sealing cover 710 is sealingly connected to the mounting flange 140 via the sealing ring 720. The sealing ring 720 can better adapt to the gap between the sealing cover plate 710 and the mounting flange 140 through its own deformation, so that the gap can be better sealed, and the sealing effect between the sealing cover plate 710 and the mounting flange 140 is better.
In the process of replacing or cleaning the filter cartridge 200, the sealing cover plate 710 needs to be removed in a first step, so that a worker can remove the sealing cover plate 710 conveniently, and optionally, the filter device may further include a second hanging ring 730, and the second hanging ring 730 is disposed on a side of the sealing cover plate 710 facing away from the filter cartridge 200. The second lifting ring 730 can provide a stress position for the sealing cover plate 710, so that a worker can conveniently move the sealing cover plate 710 through the second lifting ring 730, and the worker can conveniently remove the sealing cover plate 710.
Because the filter element 200 needs to be cleaned regularly, in order to avoid rusting or corroding the filter element 200 after cleaning, in an optional embodiment, the filter element 200 may be a stainless steel filter element, which is difficult to rust after cleaning, and has better corrosion resistance, so as to prevent the filter element 200 from being corroded and damaged in the cleaning process, thereby improving the reliability of the filter element 200 and prolonging the service life of the filter element 200.
Based on the filtering device disclosed by the embodiment of the invention, the embodiment of the invention also discloses semiconductor processing equipment, and the disclosed semiconductor processing equipment comprises a reaction chamber, a vacuum pipeline 800, an air exhaust device 900 and the filtering device disclosed by any embodiment.
The reaction chamber is a place for processing the silicon wafer, that is, the silicon wafer can be processed in the reaction chamber, the structure of the reaction chamber, the principle and the processing process of the silicon wafer in the reaction chamber are known technologies, and the details are not repeated herein for the sake of brevity of text.
One end of the vacuum pipe 800 communicates with the reaction chamber so that the reaction chamber can be vacuumized through the vacuum pipe 800, and the other end of the vacuum pipe 800 communicates with the inlet 120 of the filtering device so that the dust in the reaction chamber enters the filtering device through the vacuum pipe 800, thereby filtering the dust in the reaction chamber to the filtering device. The air extractor 900 is communicated with the outlet 130, and the air extractor 900 extracts air from the reaction chamber to realize the vacuum-pumping operation of the reaction chamber.
In the embodiment of the present invention, the filtering device may be disposed between the reaction chamber and the pumping device 900, and the specific position of the filtering device is not limited. Specifically, the inlet 120 communicates with the reaction chamber, one end of the vacuum pipe 800 communicates with the outlet 130, and the other end communicates with the pumping device 900, so that the filtering device is disposed between the reaction chamber and the vacuum pipe 800. Of course, the vacuum pipe 800 may be at least two vacuum sub-pipes, and the filtering device may be disposed between the two vacuum sub-pipes. Furthermore, a plurality of filtering devices can realize multistage filtering undoubtedly, so that dust in the reaction chamber can be further reduced, and the problem of large dust amount in the reaction chamber in the silicon wafer processing process can be better solved.
In the semiconductor processing equipment disclosed by the embodiment of the invention, dust in the reaction chamber is pumped into the filtering device along with air, and then is filtered by the filtering device, so that a large amount of dust in the reaction chamber is filtered to the filtering device, the dust in the reaction chamber is less, the problem that the graphite boat and the silicon wafer are polluted by dust is avoided, the cleaning frequency of the graphite boat is further reduced, the cleaning capacity of the field equipment can meet the cleaning frequency of the graphite boat, the pollution degree of the silicon wafer can be relieved, and the reject ratio of the silicon wafer is reduced; meanwhile, the dust is filtered to the filtering device, so that a large amount of dust is prevented from entering the air extracting device 900, the situation that the air extracting device 900 is blocked easily is relieved, the damage to the air extracting device 900 is avoided, the service life of the air extracting device 900 is prolonged, and the maintenance time and the cost of the air extracting device 900 are reduced.
Meanwhile, the dust is filtered to the position of the filtering device, so that the situation that the vacuum pipeline 800 is blocked by a large amount of dust can be avoided, the dust in the vacuum pipeline 800 is prevented from flowing back into the reaction chamber, the dust in the reaction chamber is less, and the cleanliness and the service life of the vacuum pipeline 800 and the vacuum components are improved.
Specifically, vacuum pipe 800 can communicate with entry 120 through first levogyration calliper, and first levogyration calliper is connected reliably, and first levogyration calliper has locking effect, avoids using that vacuum pipe 800 becomes flexible with entry 120 and leads to vacuum pipe 800 and entry 120's being connected unreliable for a period of time, and then makes vacuum pipe 800 be connected reliable and stable with filter equipment to make reaction chamber can the evacuation operation steadily.
Similarly, the air exhaust device 900 can also be communicated with the outlet 130 through the second left-handed caliper, the second left-handed caliper is reliably connected, and the second left-handed caliper has a looseness-proof effect, so that the problem that the connection between the air exhaust device 900 and the outlet 130 is unreliable due to the looseness of the outlet 130 and the air exhaust device 900 in a period of use is avoided, and further, the connection between the air exhaust device 900 and the filtering device is stable and reliable, so that the reaction chamber can be stably vacuumized.
In order to more quickly extract the dust in the reaction chamber, in an alternative implementation, the extraction device 900 is a high-extraction-speed dry pump, and particularly, the extraction speed of the high-extraction-speed dry pump can be 900m3H to 1200m3And H, the dry pump with higher pumping speed can finish the vacuumizing operation of the reaction chamber in shorter time, and the vacuumizing time of the reaction chamber is reduced, so that the process time of the silicon wafer is reduced, the semiconductor processing equipment can process more silicon wafers in shorter time, and the productivity of the semiconductor processing equipment is improved.
Specifically, the semiconductor processing equipment can be solar cell processing equipment, so that in the processing process of the solar cell, less dust is generated by the solar cell processing equipment, the solar cell can be reliably processed by the solar cell processing equipment, and more dust is prevented from being generated by the solar cell processing equipment.
In the above embodiments of the present invention, the difference between the embodiments is mainly described, and different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (13)
1. A filter arrangement for a semiconductor processing apparatus, comprising a housing (100) and a filter cartridge (200), wherein:
the casing (100) has first inner chamber (110), entry (120) and export (130), filter core (200) set up in first inner chamber (110), entry (120) with first inner chamber (110) intercommunication, filter core (200) have second inner chamber (210), export (130) with second inner chamber (210) intercommunication, a plurality of filtration pores have been seted up to filter core (200), first inner chamber (110) with second inner chamber (210) pass through the filtration pore intercommunication.
2. The filter device according to claim 1, further comprising a filter element penetrating rod (300), a filter element pressing plate (400) and a mounting frame (500), wherein the mounting frame (500) is arranged in the first inner cavity (110), a first end of the filter element penetrating rod (300) is connected with the mounting frame (500), the filter element (200) is sleeved on the filter element penetrating rod (300), the filter element pressing plate (400) is connected with a second end of the filter element penetrating rod (300), and the filter element (200) is clamped between the filter element pressing plate (400) and the inner wall of the first inner cavity (110).
3. The filter apparatus of claim 2, wherein the second end has a first threaded portion, and the cartridge platen (400) defines a first threaded aperture that is in threaded engagement with the first threaded portion; or the like, or, alternatively,
the filter element pressing plate (400) is provided with a through hole, and the first thread part penetrates through the through hole to be in threaded fit with the nut.
4. A filter device as claimed in claim 2, characterized in that the side of the filter insert pressure plate (400) facing away from the filter insert (200) is provided with a first suspension ring (600).
5. The filter device of claim 2, wherein the first end has a second threaded portion, and the mounting bracket (500) defines a second threaded aperture, the second threaded portion being in threaded engagement with the second threaded aperture.
6. The filtering apparatus according to claim 1, wherein the housing (100) defines a mounting opening, the mounting opening is provided with a mounting flange (140), and the filtering apparatus further comprises a sealing cover plate (710), and the sealing cover plate (710) is connected to the mounting flange (140) in a sealing manner.
7. The filter device according to claim 6, further comprising a sealing ring (720), wherein the sealing cover plate (710) is sealingly connected to the mounting flange (140) via the sealing ring (720).
8. The filter device according to claim 6, characterized in that it further comprises a second suspension ring (730), said second suspension ring (730) being arranged on the side of the sealing cover plate (710) facing away from the filter insert (200).
9. A filter device as claimed in claim 1, wherein the filter element (200) is a stainless steel filter element.
10. A semiconductor processing apparatus, comprising a reaction chamber, a vacuum pipe (800), a gas exhaust device (900) and the filtering device of any one of claims 1 to 9, wherein one end of the vacuum pipe (800) is communicated with the reaction chamber, the other end is communicated with the inlet (120), and the gas exhaust device (900) is communicated with the outlet (130); or the like, or, alternatively,
the inlet (120) is communicated with the reaction chamber, one end of the vacuum pipeline (800) is communicated with the outlet (130), and the other end of the vacuum pipeline is communicated with the air extracting device (900).
11. The semiconductor processing apparatus according to claim 10, wherein the vacuum line (800) communicates with the inlet (120) via a first left-hand clamp and the gas evacuation device (900) communicates with the outlet (130) via a second left-hand clamp.
12. The semiconductor processing apparatus according to claim 10, wherein the gas-withdrawal device (900) is a dry pump and the dry pump has a pumping speed of 900m3H to 1200m3/H。
13. The semiconductor processing apparatus of claim 10, wherein the semiconductor processing apparatus is a solar cell processing apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010515631.2A CN111714974A (en) | 2020-06-08 | 2020-06-08 | Filter equipment and semiconductor processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010515631.2A CN111714974A (en) | 2020-06-08 | 2020-06-08 | Filter equipment and semiconductor processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111714974A true CN111714974A (en) | 2020-09-29 |
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ID=72566251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010515631.2A Pending CN111714974A (en) | 2020-06-08 | 2020-06-08 | Filter equipment and semiconductor processing equipment |
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| Country | Link |
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| CN (1) | CN111714974A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114146505A (en) * | 2021-11-29 | 2022-03-08 | 北京北方华创微电子装备有限公司 | Filter device and semiconductor process equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10159775A1 (en) * | 2001-12-05 | 2003-06-18 | Osram Opto Semiconductors Gmbh | Exhaust gas purification system comprises exhaust gas purification unit, process pump connected to exhaust gas purification unit, and filter system connected to pump |
| CN102808165A (en) * | 2012-08-09 | 2012-12-05 | 北京七星华创电子股份有限公司 | Dust adsorber |
| CN104624001A (en) * | 2013-11-13 | 2015-05-20 | 中国科学院沈阳科学仪器股份有限公司 | Vacuum filter suitable for complex working medium |
| CN204898067U (en) * | 2015-08-31 | 2015-12-23 | 英利能源（中国）有限公司 | PECVD manufacturing equipment cavity with air -bleed system |
| CN107051123A (en) * | 2017-01-04 | 2017-08-18 | 重庆启甲科技有限公司 | A kind of mounting structure of filter core and support plate |
-
2020
- 2020-06-08 CN CN202010515631.2A patent/CN111714974A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10159775A1 (en) * | 2001-12-05 | 2003-06-18 | Osram Opto Semiconductors Gmbh | Exhaust gas purification system comprises exhaust gas purification unit, process pump connected to exhaust gas purification unit, and filter system connected to pump |
| CN102808165A (en) * | 2012-08-09 | 2012-12-05 | 北京七星华创电子股份有限公司 | Dust adsorber |
| CN104624001A (en) * | 2013-11-13 | 2015-05-20 | 中国科学院沈阳科学仪器股份有限公司 | Vacuum filter suitable for complex working medium |
| CN204898067U (en) * | 2015-08-31 | 2015-12-23 | 英利能源（中国）有限公司 | PECVD manufacturing equipment cavity with air -bleed system |
| CN107051123A (en) * | 2017-01-04 | 2017-08-18 | 重庆启甲科技有限公司 | A kind of mounting structure of filter core and support plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114146505A (en) * | 2021-11-29 | 2022-03-08 | 北京北方华创微电子装备有限公司 | Filter device and semiconductor process equipment |
| CN114146505B (en) * | 2021-11-29 | 2023-08-18 | 北京北方华创微电子装备有限公司 | Filtering device and semiconductor process equipment |
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Application publication date: 20200929 |