CN111710949A - Composite microwave load - Google Patents
Composite microwave load Download PDFInfo
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- CN111710949A CN111710949A CN202010700023.9A CN202010700023A CN111710949A CN 111710949 A CN111710949 A CN 111710949A CN 202010700023 A CN202010700023 A CN 202010700023A CN 111710949 A CN111710949 A CN 111710949A
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- load
- metal
- sealing sleeve
- microwave
- absorbing material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/24—Terminating devices
- H01P1/26—Dissipative terminations
- H01P1/262—Dissipative terminations the dissipative medium being a liquid or being cooled by a liquid
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Abstract
The invention discloses a composite microwave load, which comprises a metal substrate, a cooling liquid, a microwave absorbing material and a non-metal sealing sleeve, wherein the microwave absorbing material is arranged on the metal substrate; the non-metal sealing sleeve is arranged on the metal substrate, and a sealing area is formed between the non-metal sealing sleeve and the microwave absorbing material; the sealing area is communicated with the inside of the metal substrate, and the cooling liquid flows in the inside of the metal substrate and the sealing area and directly contacts with the microwave absorbing material. According to the composite microwave load, on the basis of dry load, the specific area containing the microwave absorbing material is sealed by using nonmetal, and then the microwave absorbing material is radiated by filling flowing cooling liquid in the sealed area, so that the maximum power bearing capacity of the load is greatly improved.
Description
Technical Field
The invention relates to the technical field of microwaves, in particular to a composite microwave load.
Background
Microwave loads are widely applied to the microwave field, and at present, the microwave loads are divided into dry loads and water loads. As shown in fig. 1, the dry load is a microwave absorbing material that uses solid microwave to absorb microwave, has a small standing wave coefficient, but has relatively poor power-bearing capability, and particularly uses a microwave absorbing material such as ferrite with a very low thermal conductivity; the water load generally adopts water as a microwave absorbing material, and has relatively higher power capacity, but the standing wave coefficient is larger, so that a proper microwave load is difficult to find in an ultrahigh-power microwave system requiring lower standing wave coefficient.
Disclosure of Invention
The invention aims to solve the technical problem that an ultrahigh-power microwave load with a lower standing wave coefficient is lacked in the prior art, and aims to provide a composite microwave load to solve the problem.
The invention is realized by the following technical scheme:
a composite microwave load comprises a metal substrate, a cooling liquid and a microwave absorbing material arranged on the metal substrate, wherein the cooling liquid is arranged in the metal substrate and cools the metal substrate; the non-metal sealing sleeve is arranged on the metal substrate, and a sealing area is formed between the non-metal sealing sleeve and the microwave absorbing material; the sealing area is communicated with the inside of the metal substrate, and the cooling liquid flows in the inside of the metal substrate and the sealing area and directly contacts with the microwave absorbing material.
When the microwave load is applied, the invention provides a design scheme of the microwave load, the area containing the microwave absorbing material is sealed by using a non-metal material, and then the sealed area is filled with cooling liquid, so that the cooling liquid and the microwave absorbing material are fully contacted to exchange heat, thereby improving the maximum bearing power of the load. The non-metal sealing sleeve and the metal substrate are connected together in a sealing mode (preventing cooling liquid from seeping), the sealing area formed by the non-metal sealing sleeve and the metal substrate is used as a cooling liquid flowing channel, the sealing area can be filled with the cooling liquid, the microwave absorbing material is completely coated, when the microwave load works, the microwave absorbing material can generate heat, when the cooling liquid flows, heat generated by the microwave absorbing material can be rapidly taken away, and the temperature of the microwave absorbing material is greatly reduced under the same power.
Different from the microwave load design in the prior art, the cooling liquid is not only used for radiating heat in the metal substrate, but also directly contacted with the microwave absorbing material, so that the self heat radiation efficiency of the microwave absorbing material can be greatly increased, the maximum power of the microwave load is increased, the structure is simple, and the realization is easy. Although there is a technology of dissipating heat from a metal substrate in the prior art, in the creative work of the applicant, the applicant finds that the efficiency of indirectly dissipating heat from a microwave absorbing material through the metal substrate is low, and therefore the heat is dissipated by using the technical scheme of the present application.
According to the invention, on the basis of dry load, a specific area containing the microwave absorbing material is sealed by using nonmetal, and then the microwave absorbing material is radiated by filling flowing cooling liquid in the sealed area, so that the maximum power bearing capacity of the load is greatly improved.
Furthermore, the non-metal sealing sleeve can be made of non-metal materials such as Teflon, ceramic, quartz or sapphire and the like.
Further, the cooling liquid is water.
When the invention is applied, the cooling liquid can adopt water, various oils or other liquids which can be used for heat dissipation; however, water is preferable, and when water is used as the cooling liquid, the water can be used as the cooling liquid and also as the microwave absorbing material, and by adjusting the parameters, the bearing power of the invention can be improved to the greatest extent on the premise of meeting the standing wave coefficient.
Further, when the microwave load is a partially sealed waveguide load, both ends of the non-metal sealing sleeve are disposed on the metal substrate, and the microwave absorbing material and the sealing region are located between the non-metal sealing sleeve and the metal substrate.
Further, when the microwave load is a partially sealed coaxial load, the metal substrate comprises a coaxial outer conductor and a coaxial inner conductor; one end of the non-metal sealing sleeve is arranged on the coaxial outer conductor, and the other end of the non-metal sealing sleeve is arranged on the coaxial inner conductor or the coaxial outer conductor; the microwave absorbing material and the sealing region are located between the non-metallic sealing sleeve and the coaxial outer conductor.
Further, when the microwave load is an integrally sealed waveguide load, the outer edges of the non-metal sealing sleeves are all arranged on the metal substrate; the non-metal sealing sleeve completely covers the whole waveguide port.
Further, when the microwave load is an integrally sealed coaxial load, the metal substrate comprises a coaxial outer conductor and a coaxial inner conductor; the non-metal sealing sleeve is arranged between the coaxial outer conductor and the coaxial inner conductor; the outer edge of the non-metal sealing sleeve is arranged on the coaxial outer conductor, and the inner edge of the non-metal sealing sleeve is arranged on the coaxial inner conductor; the non-metallic sealing sleeve completely covers the entire waveguide port.
Compared with the prior art, the invention has the following advantages and beneficial effects:
according to the composite microwave load, on the basis of dry load, the specific area containing the microwave absorbing material is sealed by using nonmetal, and then the microwave absorbing material is radiated by filling flowing cooling liquid in the sealed area, so that the maximum power bearing capacity of the load is greatly improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:
FIG. 1 is a schematic diagram of a prior art dry load configuration;
FIG. 2 is a schematic cross-sectional view of a composite load according to an embodiment of the present invention;
FIG. 3 is a schematic illustration of a waveguide load with partial sealing of the taper of an embodiment of the invention;
FIG. 4 is a schematic illustration of waveguide loading with various cross-sections partially sealed according to embodiments of the present invention;
FIG. 5 is a schematic view of a partial seal of a coaxial load without a taper according to an embodiment of the present invention;
FIG. 6 is a schematic illustration of coaxial loading of a portion of a sealing band taper according to an embodiment of the present invention;
FIG. 7 is a schematic view of an embodiment of the present invention showing the loading of an integrally sealed waveguide without a tapered surface;
FIG. 8 is a schematic view of an integrated sealing taper waveguide load according to an embodiment of the present invention;
FIG. 9 is a schematic view of the waveguide loading for integrally sealing various cross-sections according to an embodiment of the present invention;
FIG. 10 is a schematic view of an integral seal without a conical surface for coaxial loading according to an embodiment of the present invention;
FIG. 11 is a schematic illustration of the coaxial loading of an integral sealing band taper according to an embodiment of the present invention;
FIG. 12 is a schematic diagram of an overall electromagnetic simulation model of a microwave load according to an embodiment of the present invention;
FIG. 13 is a graph of the gain of S11 before modification by an embodiment of the present invention;
FIG. 14 is an enlarged view of a portion of the structure of the embodiment of the present invention before modification;
FIG. 15 is an enlarged view of a portion of a modified embodiment of the present invention;
FIG. 16 is a graph of the gain of S11 after modification according to an embodiment of the present invention;
FIG. 17 is a load temperature profile before modification of an embodiment of the present invention;
FIG. 18 is a graph of load temperature distribution after modification in accordance with an embodiment of the present invention.
Reference numbers and corresponding part names in the drawings:
1-metal substrate, 2-microwave absorbing material, 3-cooling liquid, 4-nonmetal sealing sleeve and 5-sealing area.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to examples and accompanying drawings, and the exemplary embodiments and descriptions thereof are only used for explaining the present invention and are not meant to limit the present invention.
Examples
As shown in fig. 2, the composite microwave load of the present invention includes a metal substrate 1, a cooling liquid 3, and a microwave absorbing material 2 disposed on the metal substrate 1, wherein the cooling liquid 3 is disposed inside the metal substrate 1 and cools the metal substrate 1, and further includes a non-metal sealing sleeve 4; the non-metal sealing sleeve 4 is arranged on the metal substrate 1, and a sealing area 5 is formed between the non-metal sealing sleeve 4 and the microwave absorbing material 2; the sealing region 5 communicates with the inside of the metal substrate 1, and the cooling liquid 3 flows inside the metal substrate 1 and in the sealing region 5 and directly contacts the microwave absorbing material 2.
In the implementation of the embodiment, a microwave load design scheme is provided, in which a region containing a microwave absorbing material is sealed by using a non-metal material, and then the sealed region is filled with a cooling liquid, so that the cooling liquid and the microwave absorbing material are in full contact to exchange heat, thereby improving the maximum load-bearing power of the load. The non-metal sealing sleeve and the metal substrate are connected together in a sealing mode (preventing cooling liquid from seeping), the sealing area formed by the non-metal sealing sleeve and the metal substrate is used as a cooling liquid flowing channel, the sealing area can be filled with the cooling liquid, the microwave absorbing material is completely coated, when the microwave load works, the microwave absorbing material can generate heat, when the cooling liquid flows, heat generated by the microwave absorbing material can be rapidly taken away, and the temperature of the microwave absorbing material is greatly reduced under the same power.
Different from the microwave load design in the prior art, the cooling liquid is not only used for radiating heat in the metal substrate, but also directly contacted with the microwave absorbing material, so that the self heat radiation efficiency of the microwave absorbing material can be greatly increased, the maximum power of the microwave load is increased, the structure is simple, and the realization is easy. Although there is a technology of dissipating heat from a metal substrate in the prior art, in the creative work of the applicant, the applicant finds that the efficiency of indirectly dissipating heat from a microwave absorbing material through the metal substrate is low, and therefore the heat is dissipated by using the technical scheme of the present application.
According to the invention, on the basis of dry load, a specific area containing the microwave absorbing material is sealed by using nonmetal, and then the microwave absorbing material is radiated by filling flowing cooling liquid in the sealed area, so that the maximum power bearing capacity of the load is greatly improved.
For further explanation of the working process of this embodiment, the non-metallic sealing sleeve 4 is made of teflon, ceramic, quartz or sapphire.
For further explanation of the operation of the present embodiment, water is used as the cooling liquid 2.
As shown in fig. 2 and fig. 3, to further illustrate the operation process of this embodiment, when the microwave load is a partially sealed waveguide load, both ends of the non-metal sealing sleeve 4 are disposed on the metal substrate 1, and the microwave absorbing material 2 and the sealing region 5 are located between the non-metal sealing sleeve 4 and the metal substrate 1.
In fig. 2, as an implementation of the present invention, a partially sealed waveguide load without a tapered surface is applied, and as can be seen from fig. 2, the original cooling fluid can directly contact the microwave absorbing material 2 and flow in the original cavity and the sealing area 5 to dissipate heat.
In fig. 3, as another implementation of the present invention, a partially tapered waveguide load is applied, and as can be seen from fig. 3, the present invention can be well matched to a tapered waveguide load.
As shown in fig. 4, the waveguide with the rectangular cross section, the waveguide with the elliptical cross section and the waveguide with the circular cross section are arranged from left to right in sequence, and as can be seen from fig. 4, the present invention can be applied to various partially sealed waveguide loads, and has strong adaptability.
As shown in fig. 5 and fig. 6, for further explaining the operation of the present embodiment, when the microwave load is a partially sealed coaxial load, the metal substrate 1 includes a coaxial outer conductor and a coaxial inner conductor; one end of the non-metal sealing sleeve 4 is arranged on the coaxial outer conductor, and the other end of the non-metal sealing sleeve 4 is arranged on the coaxial inner conductor or the coaxial outer conductor; the microwave absorbing material 2 and the sealing area 5 are located between the non-metallic gland 4 and the coaxial outer conductor.
In fig. 5, as another implementation of the present invention, a partially sealed non-tapered coaxial load is applied, in which the metal substrate 1 itself includes a coaxial inner conductor, and as can be seen from fig. 5, the present application is well suited to partially sealed non-tapered coaxial loads.
In fig. 6, as another implementation of the present invention, a coaxial load with a partial sealing band taper is applied, in which the metal substrate 1 itself includes a coaxial inner conductor, and as can be seen from fig. 5, the present application is well adapted to the coaxial load with a partial sealing band taper.
As shown in fig. 7 and 8, for further explaining the operation of the present embodiment, when the microwave load is an integrally sealed waveguide load, the outer edges of the non-metal sealing sleeve 4 are all disposed on the metal substrate 1; the non-metallic sealing sleeve 4 completely covers the whole waveguide port.
As shown in fig. 9, the waveguide with the rectangular cross section, the waveguide with the elliptical cross section and the waveguide with the circular cross section are arranged from left to right in sequence, and as can be seen from fig. 4, the present invention can be applied to various integrally sealed waveguide loads, and has strong adaptability.
As shown in fig. 10 and fig. 11, for further explaining the operation of the present embodiment, when the microwave load is an integrally sealed coaxial load, the metal substrate 1 includes a coaxial outer conductor and a coaxial inner conductor; the non-metal sealing sleeve 4 is arranged between the coaxial outer conductor and the coaxial inner conductor; the outer edge of the non-metal sealing sleeve 4 is arranged on the coaxial outer conductor, and the inner edge of the non-metal sealing sleeve 4 is arranged on the coaxial inner conductor; the non-metallic sealing sleeve 4 completely covers the entire waveguide port.
For further explanation of the working process of this embodiment, as shown in fig. 12 to 18, a 300kW dry load is taken as an example, the load adopts ferrite as an absorbing material and is divided into four identical absorbing units, the working frequency is 500MHz, fig. 12 is an overall electromagnetic simulation model of the load, and S11 reaches-64 dB, see fig. 13.
On the basis of the load, a ceramic sealing sleeve is adopted, and transformer oil is adopted as cooling liquid. The overall structure is unchanged, and the local change is shown in fig. 14 and 15. S11 with the composite load at 500MHz also reaches-57 dB, as shown in FIG. 16.
According to the electromagnetic simulation result, the absorption power of each absorption unit is different, the temperature distribution of the maximum power module is calculated during thermal simulation, the cooling medium is pure water, and the flow of the cooling liquid is 60L/min. The results of the calculations are compared in fig. 17 and 18:
the original maximum working temperature of the load reaches 181.36 ℃, the temperature rise is 161.36 ℃, the maximum working temperature of the composite load is 100.05 ℃, and the temperature rise is 80.05 ℃. The temperature is improved obviously.
It can be seen that, in this embodiment, by using the composite load, the temperature rise of the load during operation can be reduced to about 1/2 of the old structure under the same power (taking an absorbing material with thermal conductivity lower than 30W/m × K as an example, the lower the thermal conductivity, the more obvious the material effect), and the maximum load power can be doubled under the same temperature of the microwave absorbing material.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (7)
1. A composite microwave load comprises a metal substrate (1), a cooling liquid (3) and a microwave absorbing material (2) arranged on the metal substrate (1), wherein the cooling liquid (3) is arranged in the metal substrate (1) and cools the metal substrate (1), and the composite microwave load is characterized by further comprising a non-metal sealing sleeve (4); the non-metal sealing sleeve (4) is arranged on the metal substrate (1), and a sealing area (5) is formed between the non-metal sealing sleeve (4) and the microwave absorbing material (2); the sealing region (5) communicates with the inside of the metal substrate (1), and the cooling liquid (3) flows inside the metal substrate (1) and in the sealing region (5) and directly contacts the microwave absorbing material (2).
2. A composite microwave load according to claim 1, characterized in that the non-metallic sealing sleeve (4) is made of teflon, ceramic, quartz or sapphire.
3. A composite microwave load according to claim 1, characterized in that the cooling liquid (3) is water.
4. A composite microwave load according to claim 1, characterized in that when the microwave load is a partially sealed waveguide load, both ends of the non-metallic sealing sleeve (4) are arranged on the metal base plate (1), and the microwave absorbing material (2) and the sealing area (5) are located between the non-metallic sealing sleeve (4) and the metal base plate (1).
5. A composite microwave load according to claim 1, characterized in that, when the microwave load is a partially sealed coaxial load, the metal substrate (1) comprises a coaxial outer conductor and a coaxial inner conductor; one end of the non-metal sealing sleeve (4) is arranged on the coaxial outer conductor, and the other end of the non-metal sealing sleeve (4) is arranged on the coaxial inner conductor or the coaxial outer conductor; the microwave absorbing material (2) and the sealing area (5) are located between the non-metal sealing sleeve (4) and the coaxial outer conductor.
6. A composite microwave load according to claim 1, characterized in that when the microwave load is a totally enclosed waveguide load, the outer edges of the non-metallic sealing sleeve (4) are all arranged on the metal base plate (1); the non-metal sealing sleeve (4) completely covers the whole waveguide port.
7. A composite microwave load according to claim 1, characterized in that, when the microwave load is a hermetically sealed coaxial load, the metal base plate (1) comprises a coaxial outer conductor and a coaxial inner conductor; the non-metal sealing sleeve (4) is arranged between the coaxial outer conductor and the coaxial inner conductor; the outer edge of the non-metal sealing sleeve (4) is arranged on the coaxial outer conductor, and the inner edge of the non-metal sealing sleeve (4) is arranged on the coaxial inner conductor; the non-metal sealing sleeve (4) completely covers the whole waveguide port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010700023.9A CN111710949A (en) | 2020-07-20 | 2020-07-20 | Composite microwave load |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010700023.9A CN111710949A (en) | 2020-07-20 | 2020-07-20 | Composite microwave load |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111710949A true CN111710949A (en) | 2020-09-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010700023.9A Pending CN111710949A (en) | 2020-07-20 | 2020-07-20 | Composite microwave load |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111710949A (en) |
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2020
- 2020-07-20 CN CN202010700023.9A patent/CN111710949A/en active Pending
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