CN111710944A - Multilayer self-packaged ultra-wideband impedance transformation balun band-pass filter - Google Patents
Multilayer self-packaged ultra-wideband impedance transformation balun band-pass filter Download PDFInfo
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- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
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Abstract
The invention discloses a multilayer self-packaged ultra-wideband impedance transformation balun band-pass filter, which comprises a top layer metal grounding plate, a middle and upper layer strip transmission line, a middle and lower layer strip transmission line and a bottom layer metal grounding plate which are sequentially arranged from top to bottom; the top layer metal grounding plate is connected with the middle and upper layer strip transmission line through the first metal column, the top layer metal grounding plate is connected with the middle and lower layer strip transmission line through the second metal column and the third metal column, and the middle and lower layer strip transmission line is connected with the bottom layer metal grounding plate through the fourth metal column and the fifth metal column.
Description
Technical Field
The invention relates to the technical field of microwave passive devices, in particular to a multilayer self-packaged ultra-wideband impedance transformation balun band-pass filter.
Background
In a traditional single-port differential filtering antenna feed system, a filter, a balun and an impedance matching network are indispensable functional elements. The matching network is used for converting the impedance of the output end of the balun into the input impedance required by the differential antenna, but the feeding scheme in the form has many defects, such as large overall size of the circuit, energy loss caused by cascade connection, high complexity of system design, and limited performance of each functional component. Therefore, the balun filter with the impedance conversion function can well solve the problems, not only has the performance parameters of the balun filter, but also can effectively realize the impedance conversion from a single port to a balanced port, thereby simplifying the design complexity of a system and improving the working performance.
Document 1[ w.feng and w.che, "Wideband balun filter based on adaptive circuit," in IEEE MTT-S int.microw.symp.dig., jun.2012, pp.1-3 ] proposes a novel Wideband balun filter based on a symmetric four-port differential circuit, and utilizes a pair of open-circuit coupling lines to realize the differential mode suppression and the improvement of in-band balance of the balun filter.
Document 2[ e. -y.jung and h. -y.hwang, "a balun-BPF using a dual mode ringer, IEEE microww.wireless company.lett., vol.17, No.9, pp.652-654, sep.2007.] proposes a balun bandpass filter based on a dual mode ring resonator, which is implemented by symmetrically placing output ports on the dual mode ring resonator and using its inherent anti-phase characteristic.
Document 3[ l.yang, w. -w.choi, and k. -w.tam, "Compact-wideband filter and its quality-Yagi antipenna application," in proc.int.symp.antenna-nasPropag. (ISAP), nov.2015pp.1-3 ] implements a balun bandpass filter with ultra-wideband response by using excited resonance modes of microstrip-slotline resonators through a slotline structure.
Although the balun bandpass filters described above can achieve good performance, these designs are limited to a fixed port impedance of 50 ohms, and therefore it is more challenging to design and achieve a good performance impedance transforming balun bandpass filter. The invention provides a novel impedance transformation balun band-pass filter with ultra-wideband performance by using multilayer Liquid Crystal Polymer (LCP) circuit technology.
Disclosure of Invention
The purpose of the invention is as follows: the invention aims to solve the technical problem of providing a multilayer self-packaged ultra-wideband impedance transformation balun band-pass filter aiming at the defects of the prior art.
In order to solve the technical problem, the invention discloses a multilayer self-packaged ultra-wideband impedance transformation balun band-pass filter which comprises four layers from top to bottom, wherein a top layer metal grounding plate (1), a middle upper layer strip transmission line (3), a middle lower layer left strip transmission line (4), a middle lower layer right strip transmission line (5) and a bottom layer metal grounding plate (2) are sequentially arranged, the middle lower layer left strip transmission line (4) and the middle lower layer right strip transmission line (5) belong to the same layer, and a certain interval is formed between the middle lower layer left strip transmission line (4) and the middle lower layer right strip transmission line (5);
the top layer metal grounding plate (1) is connected with the middle upper layer strip transmission line (3) through a first metal column (36), the top layer metal grounding plate (1) is connected with the middle lower layer left strip transmission line (4) through a second metal column (47), the top layer metal grounding plate (1) is connected with the middle lower layer right strip transmission line (5) through a third metal column (58), the middle lower layer left strip transmission line (4) is connected with the bottom layer metal grounding plate (2) through a fourth metal column (42), and the middle lower layer right strip transmission line (5) is connected with the bottom layer metal grounding plate (2) through a fifth metal column (52).
Furthermore, the middle and upper layer strip transmission line (3) comprises a first edge (3a), a second edge (3b) and a third edge (3c), wherein the first edge (3a) and the second edge are vertically connected, the second edge and the third edge are vertically connected, the third edge and the third edge are of a U-shaped structure, and the first edge (3b) of the middle and upper layer strip transmission line (3) is connected with the first metal column (36).
Furthermore, the middle-lower layer left strip transmission line (4) is of a 'several' type structure and comprises a first edge (4a), a second edge (4b) vertically connected with the first edge, a third edge (4c) vertically connected with the second edge, a fourth edge (4d) vertically connected with the third edge, a fifth edge (4e) vertically connected with the fourth edge, and a sixth edge (4f) vertically connected with the fifth edge, wherein the sixth edge (4f) and the first edge (4a) are respectively connected to the second metal column (47) and the fourth metal column (42).
Furthermore, the right strip transmission line (5) of the middle and lower layers is of a 'several' type structure and comprises a first edge (5a), a second edge (5b) vertically connected with the first edge, a third edge (5c) vertically connected with the second edge, a fourth edge (5d) vertically connected with the third edge, a fifth edge (5e) vertically connected with the fourth edge, and a sixth edge (5f) vertically connected with the fifth edge, wherein the sixth edge (5f) and the first edge (5a) are respectively connected to the third metal column (58) and the fifth metal column (52).
Furthermore, the middle and lower layer left strip transmission line (4) and the middle and lower layer right strip transmission line (5) belong to the same layer and are separated by a gap (g2), and the middle and lower layer left strip transmission line (4) and the middle and lower layer right strip transmission line (5) are bilaterally symmetrical about the central line of the gap (g 2).
Furthermore, an input port feeder (6) connected with the first metal column, a first output port feeder (7) connected with the second metal column, and a second output port feeder (8) connected with the third metal column are respectively arranged on the top metal ground plate (1).
Has the advantages that: compared with the prior art, the technical scheme of the invention has the following beneficial technical effects:
(1) the circuit structure of the invention is simple, the LCP multilayer circuit technology can be used for realizing circuit packaging, the processing and integration are convenient, and the production cost is low.
(2) The circuit function of the invention is integrated, and the self-packaged ultra-wideband impedance transformation balun band-pass filter is realized by using LCP multilayer circuit technology. The designed balun band-pass filter can realize ultra-wide band Chebyshev and other ripple responses and high-impedance transformation of 50-200 omega between a single port and a balanced port.
(3) According to the invention, the broadband coupling strip line is adopted, so that ultra-wideband performance response is realized, and the three-order Chebyshev equivalent ripple response with an impedance transformation function has high selectivity and ultra-wideband characteristics.
Drawings
The foregoing and/or other advantages of the invention will become further apparent from the following detailed description of the invention when taken in conjunction with the accompanying drawings.
Fig. 1 is a schematic perspective view of a multi-layer self-packaged ultra-wideband impedance transformation balun bandpass filter according to the present invention.
Figure 2 is a schematic representation of the dimensions of the top layer structure of example 1.
Fig. 3 is a schematic diagram showing the dimensions of the intermediate-upper structure of example 1.
Fig. 4 is a schematic diagram of the dimensions of the intermediate-lower structure of example 1.
Fig. 5 is a schematic size diagram of the substructure of example 1.
Fig. 6 is a schematic diagram of the circuit layered structure of embodiment 1.
Fig. 7 is an S-parameter theory and simulation diagram of example 1.
Fig. 8 is a phase difference and amplitude difference diagram of example 1.
Fig. 9 is a schematic circuit diagram.
In the figure, a top metal ground plate 1, a bottom metal ground plate 2, a middle upper layer strip transmission line 3, a middle lower layer strip transmission line 4, a middle lower layer strip transmission line 5, an input port feeder 6, a first output port feeder 7, a second output port feeder 8, a first metal pillar 36, a second metal pillar 47, a third metal pillar 58, a fourth metal pillar 42 and a fifth metal pillar 52.
Detailed Description
Referring to fig. 1, 2, 3, and 4, a multilayer self-packaged ultra-wideband impedance transformation balun bandpass filter includes a top metal ground plate 1, a middle-upper layer strip transmission line 3, a middle-lower layer strip transmission line 4, a middle-lower layer strip transmission line 5, and a bottom metal ground plate 2, which are sequentially disposed from top to bottom; the top layer metal grounding plate 1 is connected with the middle upper layer strip transmission line 3 through the first metal column 36, the top layer metal grounding plate 1 is connected with the middle lower layer strip transmission line 4 through the second metal column 47, the top layer metal grounding plate 1 is connected with the middle lower layer strip transmission line 5 through the third metal column 58, the middle lower layer strip transmission line 4 is connected with the bottom layer metal grounding plate 2 through the fourth metal column 42, and the middle lower layer strip transmission line 5 is connected with the bottom layer metal grounding plate 2 through the fifth metal column 52;
the middle and upper layer strip transmission line 3 comprises a first side 3a, a second side 3b vertically connected with the first side and a third side 3c vertically connected with the second side which are sequentially connected end to end, and is of a U-shaped structure;
the middle-lower layer left strip transmission line 4 is of a 'n' type structure and comprises a first edge 4a, a second edge 4b vertically connected with the first edge, a third edge 4c vertically connected with the second edge, a fourth edge 4d vertically connected with the third edge, a fifth edge 4e vertically connected with the fourth edge and a sixth edge 4f vertically connected with the fifth edge, wherein the sixth edge 4f and the first edge 4a are respectively connected to a second metal column 47 and a fourth metal column 42;
the middle-lower layer right strip transmission line 5 is of a 'few' type structure and comprises a first edge 5a, a second edge 5b vertically connected with the first edge, a third edge 5c vertically connected with the second edge, a fourth edge 5d vertically connected with the third edge, a fifth edge 5e vertically connected with the fourth edge, and a sixth edge 5f vertically connected with the fifth edge, wherein the sixth edge 5f and the first edge 5a are respectively connected to the third metal column 58 and the fifth metal column 52.
The first side 3a of the middle and upper layer strip transmission line 3 is connected with the first metal column 36;
the middle and lower layer left strip transmission line 4 and the middle and lower layer right strip transmission line 5 are symmetrical left and right about the center line of the gap g 2.
And an input port feeder 6 connected with the first metal column, a first output port feeder 7 connected with the second metal column and a second output port feeder 8 connected with the third metal column are respectively arranged on the top layer metal ground plate 1.
A self-packaged multilayer ultra-wideband impedance transformation balun band-pass filter is composed of four metal layers, wherein the top layer and the bottom layer are grounding layers, and the middle two layers are inner stripline circuit layers. The top layer metal grounding plate 1 and the bottom layer metal grounding plate 2 provide an inherent electromagnetic shielding environment, the strip lines of the middle upper layer and the middle lower layer are designed on the LCP core film in the middle, all side walls of the circuit are covered with conductive silver paste for realizing the complete electromagnetic shielding boundary condition, and the top layer metal grounding plate 1 is provided with a coplanar waveguide input port 6, a first output port 7 and a second output port 8 so that the multilayer self-packaging circuit is connected with the external environment. On the basis of the Marchand balun circuit principle, an LCP multi-layer technology is adopted, and by means of excellent electromagnetic performance of LCP, a self-packaged ultra-wideband impedance transformation balun band-pass filter, ultra-wideband Chebyshev and other ripple responses and 50-200 ohm impedance transformation between a single port and a balanced port are achieved.
The circuit of the present invention is fabricated by utilizing multilayer LCP circuit technology to form the desired multilayer circuit structure, as shown in fig. 6, with the top and bottom layers being two metal ground layers and the middle upper and middle lower layers being striplines designed on an LCP core film. The self-packaging of the circuit is realized by covering the circuit wall with conductive silver paste. LCP is a size stability height, radioresistance, microwave-resistant, and LCP base plate will keep stable dielectric constant and extremely low loss in very wide frequency to LCP is compared the quality lighter, the performance is more excellent, the cost is lower as compared with traditional material as the circuit structure that the basic material designed, can greatly improve system integration level, realize the miniaturization of device. The designed balun band-pass filter circuit has the advantages of simple structure, small volume, light weight, low insertion loss, wide pass band and impedance transformation, and is suitable for modern wireless communication systems.
The present invention will be described in further detail with reference to examples.
Example 1:
the structure of a multilayer self-packaged ultra-wideband impedance transformation balun band-pass filter is shown in fig. 1, the size of a top layer structure is shown in fig. 2, the size of a middle upper layer structure is shown in fig. 3, the size of a middle lower layer structure is shown in fig. 4, the size of a bottom layer structure is shown in fig. 5, fig. 6 is a schematic diagram of a circuit layered structure of embodiment 1, an S parameter theory and simulation diagram of embodiment 1 is shown in fig. 7, a phase difference and amplitude difference diagram of embodiment 1 is shown in fig. 8, and a circuit schematic diagram is shown in fig. 9. This design circuit all adopts multilayer LCP circuit technique to from the design of dress form and manufacturing, the dielectric constant of the LCP core membrane that adopts and adhesion membrane is 3.0, and the corner cut loss is 0.0025.
With reference to fig. 2, 3, 4, and 5, the dimensional parameters of the balance filter are as follows: w1＝1.7mm，W2＝0.4mm，W3＝0.4mm，W4＝0.1mm，L1＝9.9mm，L2＝23.3mm，L3＝9.9mm，L4＝2.6mm，L5＝2.4mm，L6＝14.8mm，L7＝21mm，g1＝0.2mm，g20.2mm and 0.6 mm. The waveguide length corresponding to the multilayer balun band-pass filter is 0.23 lambdag×0.4λgWherein λ isgThe center frequency is the guided wave wavelength corresponding to 2 GHz.
The LCP core film with the thickness of 100um is adhered with the middle-upper layer strip transmission line and the middle-lower layer strip transmission line through an upper LCP adhesive film and a lower LCP adhesive film with the thickness of 50 um. The whole circuit consists of four metal layers, the top layer and the bottom layer are two metal grounding plates, and the middle upper layer and the middle lower layer are strip lines designed between the LCP core film and the adhesive film and positioned between the two metal grounding plates; the self-packaging of the circuit is realized by laying conductive silver paste around the circuit wall so as to achieve the full electromagnetic shielding function.
The balance filter of the embodiment is modeled and simulated in electromagnetic simulation software sonnet. Fig. 7 is a graph of S-parameter theoretical simulation test of the balun bandpass filter in this example, and fig. 8 is a graph of phase difference and amplitude difference of the balun bandpass filter in this example, and it can be seen from the graph that the balun bandpass filter exhibits chebyshev third-order response, the passband center frequency is 2GHz, the 3dB relative bandwidth is 125%, the return loss is better than 16dB, the insertion loss in the frequency range of 0.95GHz to 3GHz is less than 3.5dB, the 180 ° phase difference error value is within 3.5 °, and the amplitude difference is within 0.4 dB. The proposed circuit design has many advantages, including impedance transformation and ultra-wideband performance, self-packaged all-electromagnetic shielding, small size and light weight.
Referring to fig. 9, a schematic circuit diagram is shown, where port 1 corresponds to input port 6 in fig. 1, port 2 corresponds to second output port 8 in fig. 1, and port 3 corresponds to first output port 7 in fig. 1. The two quarter-wave transmission lines correspond to a first side 3a, a second side 3b perpendicularly connected to the first side, and a third side 3c perpendicularly connected to the second side in fig. 3. The two extended transmission lines correspond to the third side 4c, the fourth side 4d perpendicularly connected to the third side, the fifth side 4e perpendicularly connected to the fourth side, the sixth side 4f perpendicularly connected to the fifth side, wherein the sixth side 4f, the third side 5c, the fourth side 5d perpendicularly connected to the third side, the fifth side 5e perpendicularly connected to the fourth side, the sixth side 5f perpendicularly connected to the fifth side, and wherein the sixth side 5 f.
The present invention provides a method and a concept for a multi-layer self-packaged ultra-wideband impedance-transforming balun bandpass filter, and a method and a way for implementing the technical solution are many, and the above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered as the protection scope of the present invention. All the components not specified in the present embodiment can be realized by the prior art.
Claims (6)
1. The multilayer self-packaged ultra-wideband impedance transformation balun band-pass filter is characterized by comprising four layers from top to bottom, wherein a top layer metal grounding plate (1), a middle upper layer strip transmission line (3), a middle lower layer left strip transmission line (4), a middle lower layer right strip transmission line (5) and a bottom layer metal grounding plate (2) are sequentially arranged, the middle lower layer left strip transmission line (4) and the middle lower layer right strip transmission line (5) belong to the same layer, and a certain interval is formed between the middle lower layer left strip transmission line (4) and the middle lower layer right strip transmission line (5);
the top layer metal grounding plate (1) is connected with the middle upper layer strip transmission line (3) through a first metal column (36), the top layer metal grounding plate (1) is connected with the middle lower layer left strip transmission line (4) through a second metal column (47), the top layer metal grounding plate (1) is connected with the middle lower layer right strip transmission line (5) through a third metal column (58), the middle lower layer left strip transmission line (4) is connected with the bottom layer metal grounding plate (2) through a fourth metal column (42), and the middle lower layer right strip transmission line (5) is connected with the bottom layer metal grounding plate (2) through a fifth metal column (52).
2. The multilayer self-packaged ultra-wideband impedance transformation balun bandpass filter according to claim 1, characterized in that the middle and upper layer strip transmission line (3) comprises a first side (3a), a second side (3b) vertically connected with the first side, and a third side (3c) vertically connected with the second side, which are connected in sequence end to end, and are in a U-shaped structure, wherein the first side (3a) of the middle and upper layer strip transmission line (3) is connected with the first metal pillar (36).
3. The multilayer self-packaged ultra-wideband impedance transformation balun bandpass filter according to claim 1 or 2, characterized in that the left strip transmission line (4) of the middle and lower layers is of a "few" type structure, and comprises a first side (4a), a second side (4b) vertically connected with the first side, a third side (4c) vertically connected with the second side, a fourth side (4d) vertically connected with the third side, a fifth side (4e) vertically connected with the fourth side, and a sixth side (4f) vertically connected with the fifth side, wherein the sixth side (4f) and the first side (4a) are respectively connected to the second metal pillar (47) and the fourth metal pillar (42).
4. The multilayer self-packaged ultra-wideband impedance transformation balun bandpass filter according to claim 1 or 2, characterized in that the right strip transmission line (5) of the middle and lower layers is of a "few" type structure, and comprises a first side (5a), a second side (5b) vertically connected with the first side, a third side (5c) vertically connected with the second side, a fourth side (5d) vertically connected with the third side, a fifth side (5e) vertically connected with the fourth side, and a sixth side (5f) vertically connected with the fifth side, wherein the sixth side (5f) and the first side (5a) are respectively connected to the third metal pillar (58) and the fifth metal pillar (52).
5. The filter of claim 1 or 2, characterized in that the middle and lower layer left strip transmission line (4) and the middle and lower layer right strip transmission line (5) belong to the same layer and are separated by a gap (g2), and the middle and lower layer left strip transmission line (4) and the middle and lower layer right strip transmission line (5) are symmetrical left and right about the center line of the gap (g 2).
6. A filter according to claim 1 or 2, characterized in that the top layer metal ground plate (1) is provided with an input port feed line (6) connected to the first metal pillar, a first output port feed line (7) connected to the second metal pillar, and a second output port feed line (8) connected to the third metal pillar, respectively.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112701431A (en) * | 2020-12-15 | 2021-04-23 | 电子科技大学 | Filter and wireless communication system |
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| US20020126019A1 (en) * | 2001-03-08 | 2002-09-12 | Murata Manufacturing Co., Ltd. | Mixer and converter using same |
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| US20200076041A1 (en) * | 2018-08-31 | 2020-03-05 | Innovation Sound Technology Co., Ltd. | Lumped circuit balance converter applied to double-sided parallel lines |
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2020
- 2020-06-02 CN CN202010488932.0A patent/CN111710944B/en active Active
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| US20020126019A1 (en) * | 2001-03-08 | 2002-09-12 | Murata Manufacturing Co., Ltd. | Mixer and converter using same |
| US20200076041A1 (en) * | 2018-08-31 | 2020-03-05 | Innovation Sound Technology Co., Ltd. | Lumped circuit balance converter applied to double-sided parallel lines |
| CN110492209A (en) * | 2019-08-16 | 2019-11-22 | 南京智能高端装备产业研究院有限公司 | A kind of encapsulation ultra wide band balance filter certainly based on multilayer LCP circuit engineering |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112701431A (en) * | 2020-12-15 | 2021-04-23 | 电子科技大学 | Filter and wireless communication system |
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